Electronic component separating device

Abstract

The utility model relates to an electronic component separating device which comprises a machining table, an installation frame is installed on the upper surface of the machining table through a fixed supporting plate, a translation mechanism is arranged in the installation frame, and a separating mechanism is arranged below the translation mechanism. The translation mechanism and the separation mechanism are matched with each other to extrude the electronic elements out of the packaging mold row by row; a bearing plate is slidably mounted on the upper surface of the machining table through a sliding supporting plate, two containing grooves are symmetrically formed in the surface of the bearing plate, and a plurality of discharging holes are evenly distributed in the containing grooves. A fixing plate is installed on the upper surface of the machining table. Stable and uniform support is provided for the packaging mold through the bearing plate, electronic elements are extruded out of the packaging mold row by row through cooperation of the translation mechanism and the separation mechanism, the pressure borne by the packaging mold is reduced, the situation that the packaging mold deforms can be effectively avoided, the service life of the packaging mold is prolonged, and the production efficiency is improved. And the condition that electronic components are damaged is avoided.

Description

Technical Field

[0001] This utility model relates to the field of electronic component technology, specifically to an electronic component separation device. Background Technology

[0002] Electronic components such as MELF or SMD are relatively small. During packaging, multiple simultaneous packaging processes are used. Multiple electronic components are placed in one packaging mold at the same time. Polymer material is poured into the mold cavity through the gate to encapsulate the chip of the electronic component located in the mold cavity. After packaging is completed, the packaged electronic component needs to be separated from the packaging mold.

[0003] Chinese patent CN213424937U discloses an electronic component separation device. This device separates components by placing a packaging mold on a support plate, turning off an electromagnet (which then stops holding the pressure plate), and allowing a torsion spring to push the pressure plate outwards, pressing the packaging mold down. A control panel activates a push-pull electromagnet, which pushes an extrusion plate downwards via a square plate. The downward-moving extrusion plate extrudes the packaged electronic components from the mold groove, thus completing the separation process. The entire operation requires no manual labor, is convenient and quick, reduces the workload of workers, and solves the problem that currently, workers typically separate packaged electronic components manually from the packaging mold, a time-consuming and labor-intensive process that places a heavy workload on workers.

[0004] When the above-mentioned patent is used, the packaging mold is only supported on both sides, and during the separation operation, all packaged electronic components are squeezed out at the same time. This causes the packaging mold to be subjected to a large force, which can easily lead to deformation. This not only reduces the service life of the packaging mold, but also causes the packaged electronic components to be squeezed and damaged when the packaging mold is deformed under pressure. Utility Model Content

[0005] The purpose of this invention is to provide an electronic component separation device that effectively solves the problems mentioned in the background art.

[0006] To achieve the above objectives, the present invention provides the following technical solution.

[0007] An electronic component separation device includes a processing table. A mounting frame is mounted on the upper surface of the processing table via a fixed support plate. A translation mechanism is disposed inside the mounting frame, and a separation mechanism is disposed below the translation mechanism. The translation mechanism and the separation mechanism cooperate to extrude electronic components row by row from a packaging mold. A carrier plate is slidably mounted on the upper surface of the processing table via a sliding support plate. Two placement grooves are symmetrically formed on the surface of the carrier plate, and multiple discharge holes are evenly distributed inside the placement grooves. A fixing plate is mounted on the upper surface of the processing table, and a first electric push rod is mounted on the outer surface of the fixing plate. The telescopic end of the first electric push rod is connected to the carrier plate.

[0008] Therefore, by placing the packaging mold in the placement groove and aligning the electronic components on it with the discharge holes, the carrier plate can provide stable and uniform support for the packaging mold. Furthermore, due to the cooperation of the translation mechanism and the separation mechanism, the electronic components are extruded row by row from the packaging mold, reducing the pressure on the packaging mold. This effectively prevents the packaging mold from deforming, improves its service life, and avoids damage to the electronic components.

[0009] Furthermore, the translation mechanism includes a first screw rotatably mounted inside the mounting frame, a nut seat mounted on the outer surface of the first screw, a servo motor mounted on the outer surface of the mounting frame, and the output shaft of the servo motor connected to the first screw.

[0010] Furthermore, the separation mechanism includes a second electric push rod installed on the lower surface of the nut seat. A horizontal plate is installed at the end of the telescopic end of the second electric push rod. Multiple extrusion blocks are arranged on the lower surface of the horizontal plate along its length direction, and the multiple extrusion blocks can correspond one-to-one with a row of discharge holes distributed along the Y-axis direction.

[0011] Furthermore, clamping plates are provided on both sides of the placement groove. A second screw is rotatably connected to the outer surface of the clamping plate, and the end of the second screw extends through to the outside of the support plate and is threadedly connected thereto. A first limiting rod is connected to both sides of the outer surface of the clamping plate, and the end of the first limiting rod slides through to the outside of the support plate.

[0012] Furthermore, both sides of the mounting frame are provided with sliding grooves, and both sides of the outer surface of the nut seat are provided with sliders, which are located in the sliding grooves and extend to the outside of the mounting frame.

[0013] Furthermore, a second limiting rod is installed on both sides of the upper surface of the horizontal plate, and the upper end of the second limiting rod slides through to the upper side of the slider.

[0014] Furthermore, a conveyor belt is installed on the upper surface of the processing table, and the conveyor belt is located below the support plate.

[0015] Compared with the prior art, the beneficial effects of this utility model are as follows.

[0016] 1. This utility model places the packaging mold in the placement groove and aligns the electronic components on it with the discharge hole. At this time, the carrier plate can provide stable and uniform support for the packaging mold. Furthermore, due to the cooperation of the translation mechanism and the separation mechanism, the electronic components are extruded from the packaging mold row by row, which reduces the pressure on the packaging mold. This effectively avoids deformation of the packaging mold, improves its service life, and prevents damage to the electronic components.

[0017] 2. This utility model uses a first electric push rod to drive the support plate to slide horizontally on the processing table, which allows the two placement slots to be switched back and forth. When one placement slot is being separated, the operator can put the packaging mold in or take it out on the other placement slot, thereby reducing the interruption time in the processing process, significantly improving processing efficiency, and the operator's hands do not need to reach under the separation mechanism, avoiding the risk of being pinched, thus improving safety. Attached Figure Description

[0018] Figure 1 This is a three-dimensional schematic diagram of the overall structure of this utility model;

[0019] Figure 2 This is a schematic diagram of the processing table in this utility model;

[0020] Figure 3 for Figure 2 Enlarged schematic diagram of the structure at point A in the middle;

[0021] Figure 4 This is a schematic diagram of the translation mechanism and separation mechanism in this utility model.

[0022] In the diagram: 1. Processing table; 101. Fixed support plate; 102. Mounting frame; 103. Sliding support plate; 104. Bearing plate; 105. Placement groove; 106. Discharge hole; 107. Fixed plate; 108. First electric push rod; 2. Translation mechanism; 201. First screw; 202. Nut seat; 203. Servo motor; 3. Separation mechanism; 301. Second electric push rod; 302. Horizontal plate; 303. Extrusion block; 4. Second screw; 401. Clamping plate; 402. First limiting rod; 5. Slide groove; 501. Slider; 6. Second limiting rod; 7. Conveyor belt. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0024] Please see Figures 1-4 This utility model provides an electronic component separation device, including a processing table 1. A mounting frame 102 is mounted on the upper surface of the processing table 1 via a fixed support plate 101. A translation mechanism 2 is disposed inside the mounting frame 102, and a separation mechanism 3 is disposed below the translation mechanism 2. The translation mechanism 2 and the separation mechanism 3 cooperate to extrude electronic components row by row from the packaging mold. A carrier plate 104 is slidably mounted on the upper surface of the processing table 1 via a sliding support plate 103. Two placement grooves 105 are symmetrically opened on the surface of the carrier plate 104, and multiple discharge holes 106 are evenly distributed inside the placement grooves 105. A fixed plate 107 is mounted on the upper surface of the processing table 1, and a first electric push rod 108 is mounted on the outer surface of the fixed plate 107. The telescopic end of the first electric push rod 108 is connected to the carrier plate 104.

[0025] During use, the operator places the packaging mold in the placement groove 105 and aligns the packaged electronic components with the discharge hole 106. At this time, the support plate 104 provides stable and uniform support for the packaging mold. Then, through the cooperation of the translation mechanism 2 and the separation mechanism 3, the electronic components are extruded row by row from the packaging mold, reducing the pressure on the packaging mold. This effectively prevents the packaging mold from deforming, improves its service life, and avoids damage to the electronic components.

[0026] Furthermore, since there are two placement slots 105, while one placement slot 105 is performing a separation operation, the operator can place and remove the packaging mold on the other placement slot 105. After the previous packaging mold completes the separation of electronic components, the next packaging mold can be immediately pushed to the bottom of the separation mechanism 3 for separation operation under the push of the first electric push rod 108. This reduces the interruption time in the processing process, significantly improves processing efficiency, and the operator's hands do not need to reach under the separation mechanism 3, avoiding the possibility of being pinched, thus improving safety.

[0027] Preferably, the translation mechanism 2 includes a first screw 201 rotatably mounted inside the mounting frame 102, a nut seat 202 mounted on the outer surface of the first screw 201, a servo motor 203 mounted on the outer surface of the mounting frame 102, and the output shaft of the servo motor 203 connected to the first screw 201.

[0028] When the servo motor 203 is started, it drives the first screw 201 to rotate. Since the nut seat 202 is limited by the inner wall of the mounting frame 102, the nut seat 202 can move horizontally along the length direction of the first screw 201.

[0029] Preferably, the separation mechanism 3 includes a second electric push rod 301 installed on the lower surface of the nut seat 202. A horizontal plate 302 is installed at the end of the telescopic end of the second electric push rod 301. A plurality of extrusion blocks 303 are arranged on the lower surface of the horizontal plate 302 along its length direction, and the plurality of extrusion blocks 303 can correspond one-to-one with a row of discharge holes 106 distributed along the Y-axis direction.

[0030] When the second electric push rod 301 is activated, its telescopic end drives the horizontal plate 302 to move downward, and then the packaged electronic components can be extruded from the packaging mold through the extrusion block 303. The extruded electronic components fall from the discharge hole 106.

[0031] After each row of electronic components is extruded, the horizontal plate 302 is moved horizontally a certain distance by the translation mechanism 2 to extrude the next row of electronic components, thereby achieving the purpose of extruding row by row.

[0032] Preferably, clamping plates 401 are provided on both sides of the interior of the placement groove 105. A second screw 4 is rotatably connected to the outer surface of the clamping plate 401, and the end of the second screw 4 passes through to the outside of the support plate 104 and is threadedly connected thereto. A first limiting rod 402 is connected to both sides of the outer surface of the clamping plate 401, and the end of the first limiting rod 402 slides through to the outside of the support plate 104.

[0033] To prevent the packaging mold from warping during the extrusion of electronic components, after placing the packaging mold in the placement groove 105, the second screw 4 can be turned. Since the clamping plate 401 is limited by the first limiting rod 402, it can be horizontally pressed against the side surface of the packaging mold under the drive of the threaded connection, thereby achieving the purpose of fixing, ensuring the stability of the packaging mold and avoiding warping.

[0034] Preferably, the two side walls of the mounting frame 102 are provided with sliding grooves 5, and the two sides of the outer surface of the nut seat 202 are provided with sliders 501, and the sliders 501 are located in the sliding grooves 5 and extend to the outside of the mounting frame 102.

[0035] By setting the groove 5 and the slider 501, the limiting effect on the nut seat 202 is further improved, making it more stable when moving. It also avoids the nut seat 202 and the first screw 201 being damaged or deformed due to the reaction force when the second electric push rod 301 drives the extrusion block 303 to extrude the electronic components.

[0036] Preferably, a second limiting rod 6 is installed on both sides of the upper surface of the horizontal plate 302, and the upper end of the second limiting rod 6 slides through to the upper side of the slider 501.

[0037] The second limiting rod 6 ensures that the horizontal plate 302 can rise and fall horizontally, preventing tilting. Furthermore, the slider 501 provides a limit for both the nut seat 202 and the horizontal plate 302, achieving two goals at once.

[0038] Preferably, a conveyor belt 7 is installed on the upper surface of the processing table 1, and the conveyor belt 7 is located below the support plate 104.

[0039] To facilitate the removal of the extruded electronic components from under the support plate 104, the conveyor belt 7 is configured so that the electronic components can be directly transported outward after falling onto the conveyor belt 7, making it convenient for material handling and collection.

[0040] All standard parts used in this utility model can be purchased from the market, and irregular parts can be customized according to the description and drawings. The specific connection methods of each part adopt conventional methods such as bolts, rivets, and welding that are mature in the prior art. The machinery, parts and equipment adopt conventional models in the prior art. In addition, the circuit connection adopts conventional connection methods in the prior art, which will not be described in detail here. The contents not described in detail in this specification belong to the prior art known to those skilled in the art.

[0041] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. An electronic component separation device, comprising a processing table (1), characterized in that: The upper surface of the processing table (1) is fitted with a mounting frame (102) via a fixed support plate (101). The mounting frame (102) is equipped with a translation mechanism (2), and a separation mechanism (3) is provided below the translation mechanism (2). The translation mechanism (2) and the separation mechanism (3) work together to extrude electronic components row by row from the packaging mold; The upper surface of the processing table (1) is slidably mounted with a bearing plate (104) via a sliding support plate (103). Two placement slots (105) are symmetrically opened on the surface of the bearing plate (104). Multiple discharge holes (106) are evenly distributed inside the placement slots (105). A fixing plate (107) is installed on the upper surface of the processing table (1), and a first electric push rod (108) is installed on the outer surface of the fixing plate (107). The end of the telescopic end of the first electric push rod (108) is connected to the bearing plate (104).

2. The electronic component separation device according to claim 1, characterized in that: The translation mechanism (2) includes a first screw (201) rotatably installed inside the mounting frame (102), a nut seat (202) is installed on the outer surface of the first screw (201), a servo motor (203) is installed on the outer surface of the mounting frame (102), and the output shaft of the servo motor (203) is connected to the first screw (201).

3. The electronic component separation device according to claim 2, characterized in that: The separation mechanism (3) includes a second electric push rod (301) installed on the lower surface of the nut seat (202). A horizontal plate (302) is installed at the end of the telescopic end of the second electric push rod (301). A plurality of extrusion blocks (303) are arranged on the lower surface of the horizontal plate (302) along its length direction, and the plurality of extrusion blocks (303) can correspond one-to-one with a row of discharge holes (106) distributed along the Y-axis direction.

4. The electronic component separation device according to claim 1, characterized in that: Both sides of the placement groove (105) are provided with clamping plates (401), and the outer surface of the clamping plate (401) is rotatably connected with a second screw (4), and the end of the second screw (4) passes through to the outside of the bearing plate (104) and is threadedly connected to it. Both sides of the outer surface of the clamping plate (401) are connected to a first limiting rod (402), and the end of the first limiting rod (402) slides through to the outside of the bearing plate (104).

5. The electronic component separation device according to claim 3, characterized in that: The mounting frame (102) has sliding grooves (5) on both sides of its side walls, and the nut seat (202) has sliders (501) on both sides of its outer surface. The sliders (501) are located in the sliding grooves (5) and extend to the outside of the mounting frame (102).

6. The electronic component separation device according to claim 5, characterized in that: A second limiting rod (6) is installed on both sides of the upper surface of the horizontal plate (302), and the upper end of the second limiting rod (6) slides through to the upper side of the slider (501).

7. The electronic component separation device according to claim 1, characterized in that: A conveyor belt (7) is installed on the upper surface of the processing table (1), and the conveyor belt (7) is located below the support plate (104).

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