Wafer transmission module adjusting device and semiconductor equipment
By designing an adjustment device for the wafer transfer module and utilizing the cooperation of the swing component and locking assembly, real-time height locking and precise positioning of the wafer transfer module were achieved, solving the problem of inaccurate positioning and improving equipment maintenance efficiency.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- CHONGQING XINLIAN MICROELECTRONICS CO LTD
- Filing Date
- 2025-05-27
- Publication Date
- 2026-05-05
AI Technical Summary
During the lifting process of the existing wafer transmission module, real-time position locking cannot be achieved, resulting in inaccurate positioning. This triggers the mandatory activation of the equipment safety protocol, necessitating the execution of a time-consuming vehicle height calibration test process, which results in a loss of effective equipment uptime.
A wafer transfer module adjustment device is designed, including a swing component, a constraint component, a locking component, and a linear motion component. Through the synchronous movement of the swing component and the locking function of the locking component, the height of the wafer transfer module can be locked in real time and accurately positioned. A high-precision distance detection component is also provided for real-time adjustment.
It improves the positioning accuracy of the wafer transmission module, eliminates the need for carrier height calibration and testing, reduces equipment maintenance time, and improves the effective operating efficiency of the equipment.
Smart Images
Figure CN224205611U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of semiconductor technology, and in particular to a wafer transfer module adjustment device and semiconductor equipment. Background Technology
[0002] For some semiconductor equipment, preventative maintenance (PM) is frequently required. For example, when performing preventative maintenance (PM) or handling malfunctions, the carrier handle of a lithography machine needs to be mechanically separated from the wafer handle. After maintenance, the wafer handle needs to be reinstalled. During this reinstallation process, the operator needs to lift the wafer handle to the top interlock device for fixation. However, this process presents the following technical problems:
[0003] The existing wafer transfer module lifting process usually involves manually determining the lifting height. However, during the lifting process, it is impossible to lock the wafer transfer module's position in real time, which can easily lead to inaccurate final position of the wafer transfer module. This systematic positioning deviation will trigger the device's safety protocol and require the execution of a vehicle height working calibration (HWCZ) test process that takes about 30 minutes, resulting in a significant loss of effective equipment uptime.
[0004] Therefore, based on the above-mentioned technical problems, there is a need for a wafer transfer module adjustment device and semiconductor equipment to ensure the positioning accuracy of the wafer transfer module. Utility Model Content
[0005] The purpose of this invention is to provide a wafer transmission module adjustment device and semiconductor equipment. The adjustment device can lock the adjustment height in real time to facilitate calibration of the positioning height and improve positioning accuracy.
[0006] This utility model provides a wafer transfer module adjustment device, including: a swing member, a constraint component, a locking component, and a linear motion component; the first end of the swing member is rotatably connected to the linear motion component, and the linear motion component is configured to move linearly; the constraint component is connected to the swing member, and the constraint component is used to constrain the second end of the swing member to move linearly along a first direction when the swing member rotates around the first end; the locking component is connected to the swing member to lock the position of the second end of the swing member along the first direction.
[0007] In the aforementioned wafer transfer module adjustment device, during actual adjustment, the second end of the oscillating component faces downwards, meaning the lower end of the oscillating component moves linearly along the first direction. The first end of the oscillating component faces upwards, meaning the upper end of the oscillating component is rotatably connected to the linear motion assembly. Therefore, when the oscillating component is driven to oscillate, the height of its lower end (second end) remains unchanged, while the upper end (first end) of the oscillating component rotates relative to the linear motion assembly, and its upper end (first end) moves linearly synchronously along the linear motion direction of the linear motion assembly. At this time, the upper end (first end) of the oscillating component synchronously drives the linear motion assembly to move linearly, thereby achieving height adjustment of the wafer transfer module.
[0008] When the horizontal position of the second end (lower end) of the swing component along the first direction is locked, the position of its first end (upper end) and the linear motion component along its linear motion direction is limited. At this time, the vertical position of the linear motion component is locked, that is, the vertical position of the wafer transfer module is locked. The adjustment device can lock the adjustment height in real time to facilitate the calibration of the positioning height and improve the positioning accuracy.
[0009] Optionally, the wafer transfer module adjustment device further includes an adjustment component connected to the oscillating member. The adjustment component is used to drive the oscillating member to move so that the first end of the oscillating member rotates relative to the linear motion component.
[0010] Optionally, the wafer transfer module adjustment device further includes a distance detection component, which is used to detect the linear motion distance of the linear motion component.
[0011] Optionally, the constraint component includes a rolling element and a constraint element;
[0012] The rolling element is rotatably disposed at the second end of the swinging element; the rolling element is also rotatably disposed at the constraint element, and when the rolling element rolls along the constraint element, it drives the second end of the swinging element to move linearly along the first direction.
[0013] Optionally, the rolling element is a gear, the constraint element is a rack, and the rolling element meshes with the constraint element.
[0014] Optionally, the locking assembly includes a locking member movably disposed on the swing member;
[0015] The locking member has a locked state and an unlocked state when it moves relative to the swinging member;
[0016] When the locking member is in the locked state, the locking member contacts the rolling member and prevents the rolling member from rotating relative to the swing member;
[0017] When the locking member is in the unlocked state, the locking member separates from the rolling member, so that the rolling member rotates relative to the swing member.
[0018] Optionally, the locking component further includes a drive unit connected to the locking member for driving the locking member to switch between the locked state and the locked state.
[0019] Optionally, when the wafer transfer module adjustment device includes a distance detection component, the distance detection component is communicatively or electrically connected to the drive component. The aforementioned adjustment device enables precise positioning of the wafer transfer module. Equipped with gears and racks, and a locking component, the adjustment device can achieve real-time detection of the adjustment position using a high-precision distance detection component (e.g., a pulsed laser rangefinder with an accuracy of 0.1 mm). The height corresponding to the linear motion component during the first HWCZ test is stored in the machine computer, and this height serves as the target position for the linear motion component. When reassembling the wafer transfer module, when the distance detection component detects that the linear motion component has reached the target position, the locking component locks the position of the linear motion component, thus eliminating the need for the HWCZ test step and improving adjustment efficiency.
[0020] Optionally, the driving element is an electromagnet.
[0021] This invention also provides a semiconductor device, which includes the wafer transfer module adjustment device described above.
[0022] In summary, the wafer transfer module adjustment device includes: a swing member, a constraint component, a locking component, and a linear motion component; the first end of the swing member is rotatably connected to the linear motion component, which is configured to move linearly; the constraint component is connected to the swing member and is used to constrain the second end of the swing member to move linearly along a first direction when the swing member rotates around the first end; the locking component is connected to the swing member and is used to lock the position of the second end of the swing member along the first direction.
[0023] With this configuration, in the actual adjustment process of the aforementioned wafer transfer module adjustment device, the second end of the oscillating element faces downwards, meaning the lower end of the oscillating element moves linearly along the first direction. The first end of the oscillating element faces upwards, meaning the upper end of the oscillating element is rotatably connected to the linear motion component. Therefore, when the oscillating element is driven to oscillate, the height of its lower end (second end) remains unchanged, while the upper end (first end) of the oscillating element rotates relative to the linear motion component, and its upper end (first end) moves linearly synchronously along the linear motion direction of the linear motion component. At this time, the upper end (first end) of the oscillating element synchronously drives the linear motion component to move linearly, thereby achieving the height adjustment of the wafer transfer module.
[0024] When the horizontal position of the second end (lower end) of the swing component along the first direction is locked, the position of its first end (upper end) and the linear motion component along its linear motion direction is limited. At this time, the vertical position of the linear motion component is locked, that is, the vertical position of the wafer transfer module is locked. The adjustment device can lock the adjustment height in real time to facilitate the calibration of the positioning height and improve the positioning accuracy. Attached Figure Description
[0025] Figure 1 This is a schematic diagram of the structure of a wafer transmission module adjustment device according to an embodiment of the present invention. Figure 1 ;
[0026] Figure 2 This is a schematic diagram of the structure of a wafer transmission module adjustment device according to an embodiment of the present invention. Figure 2 ;
[0027] Figure 3 This is a schematic diagram of the structure of a locking component according to an embodiment of the present invention. Figure 1 ;
[0028] Figure 4 This is a schematic diagram of the structure of a locking component according to an embodiment of the present invention. Figure 2 ;
[0029] Figure 5 This is a control block diagram of an embodiment of the present invention.
[0030] In the attached diagram:
[0031] 10-Swing component;
[0032] 20 - Constraint component; 21 - Rolling element; 22 - Constraint component;
[0033] 30 - Locking component; 31 - Locking element; 32 - Driving element; 33 - Mounting base;
[0034] 40 - Linear motion component;
[0035] 50 - Distance detection component; 51 - Signal terminal; 52 - Reflective layer;
[0036] 60 - Adjustment component; 61 - Adjustment rod; 62 - Rotating block; 63 - Handle;
[0037] a-First direction;
[0038] b - Second direction; Detailed Implementation
[0039] The wafer transfer module adjustment device and semiconductor equipment proposed in this utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments. The advantages and features of this utility model will become clearer from the following description. It should be noted that the drawings are all in a very simplified form and use non-precise proportions, and are only used to facilitate and clarify the illustration of the embodiments of this utility model.
[0040] As used in this invention, the singular forms “a,” “an,” and “the” include plural objects; the term “or” is generally used to mean “and / or”; the term “a number” is generally used to mean “at least one”; and the terms “at least two” or “more than” are generally used to mean “two or more”. Furthermore, the terms “first,” “second,” and “third” are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined with “first,” “second,” or “third” may explicitly or implicitly include one or at least two of that feature. Furthermore, the terms "installed," "connected," and "attached," as used in this utility model, and the term "set" on one element from another, should be interpreted broadly. They generally only indicate a connection, coupling, cooperation, or transmission relationship between the two elements, which can be direct or indirect through an intermediate element. They should not be construed as indicating or implying a spatial positional relationship between the two elements, meaning one element can be located inside, outside, above, below, or to one side of the other element, unless otherwise explicitly stated. Those skilled in the art can understand the specific meaning of these terms in this utility model according to the specific circumstances. Additionally, directional terms such as above, below, up, down, upward, downward, left, and right are used relative to exemplary embodiments as shown in the figures, with upward or up direction pointing towards the top of the corresponding figure, and downward or down direction pointing towards the bottom of the corresponding figure.
[0041] In this embodiment, a wafer transfer module adjustment device is provided, including: a swing component 10, a constraint component 20, a locking component 30, and a linear motion component 40;
[0042] The first end of the swing member 10 is used to be rotatably connected to the linear motion component 40, which is configured to move linearly.
[0043] The constraint component 20 is connected to the swing member 10, and the constraint component 20 is used to constrain the second end of the swing member 10 to move linearly along the first direction a when the swing member 10 rotates around the first end.
[0044] The locking component 30 is connected to the swing member 10 to lock the position of the second end of the swing member 10 along the first direction a.
[0045] Combination Figure 1 As shown, in this embodiment, the first direction a corresponds to the horizontal direction, and the second end of the swing member 10 ( Figure 1 The lower end of the swing member 10 is constrained to move horizontally along the first direction a.
[0046] In this embodiment, the linear motion component 40 is connected to the wafer transfer module, thereby driving the wafer transfer module to move linearly. The direction of movement of the linear motion component 40 is a second direction b, which is set at an angle to the first direction a. In this embodiment, the second direction b is perpendicular to the first direction a, and the second direction b is in a vertical state. Therefore, the linear motion component 40 can drive the wafer transfer module to perform vertical lifting and lowering movements to adjust the position of the wafer transfer module.
[0047] like Figure 1 As shown, during the actual adjustment process, the second end of the swing member 10 faces downwards, meaning the lower end of the swing member 10 moves horizontally along the first direction a. The first end of the swing member 10 faces upwards, meaning the upper end of the swing member 10 is rotatably connected to the linear motion assembly 40. Therefore, when the swing member 10 is driven to swing, the height of its lower end (second end) remains unchanged, while the upper end (first end) of the swing member 10 rotates relative to the linear motion assembly 40, and its upper end (first end) synchronously moves up and down along the motion direction of the linear motion assembly 40 (second direction b). At this time, the upper end (first end) of the swing member 10 synchronously drives the linear motion assembly 40 to move linearly along the second direction b, thereby realizing the height adjustment of the wafer transmission module.
[0048] In this embodiment, the locking component 30 is connected to the swing member 10 to lock the position of the second end of the swing member 10 along the first direction a.
[0049] Combination Figure 1 As shown, when the horizontal position of the second end (lower end) of the swing member 10 along the first direction a is locked, the position of its first end (upper end) and the position of the linear motion component 40 along the second direction b are limited. At this time, the vertical position of the linear motion component 40 is locked, that is, the vertical position of the wafer transfer module is locked. The adjustment device can lock the adjustment height in real time to facilitate the calibration of the positioning height and improve the positioning accuracy.
[0050] In this embodiment, the linear motion component 40 is used as an independent part for detachable connection with the wafer transfer module. In other alternative embodiments, the linear motion component 40 can serve as a platform to support the wafer transfer module, facilitating separation of the wafer transfer module from the linear motion component 40. In other alternative embodiments, the linear motion component 40 can be a detachable part of the wafer transfer module, such as a detachable part of the wafer transfer module's housing. Since the wafer transfer module can only move vertically on the equipment platform, the linear motion component 40 is naturally constrained to move vertically. In other alternative embodiments, the linear motion component 40 can be linearly mounted on the equipment housing, and the direction of movement of the linear motion component 40 should be consistent with the adjustment direction of the wafer transfer module.
[0051] In this embodiment, the first direction a and the second direction b are set to be perpendicular. In other alternative embodiments, the first direction a and the second direction b may form a non-right angle, and their specific directions can be adjusted based on actual driving requirements. Furthermore, in other alternative embodiments, the first direction a may form a certain angle with the horizontal direction, or the second direction b may form a certain angle with the vertical direction, and the specific orientation of the first direction a and the second direction b may be adjusted based on their driving requirements.
[0052] Furthermore, the constraint component 20 includes a rolling element 21 and a constraint element 22;
[0053] The rolling element 21 is rotatably disposed at the second end of the swinging element 10; the rolling element 21 is rolled along the constraint element 22, and when the rolling element 21 rolls along the constraint element 22, it drives the second end of the swinging element 10 to move linearly along the first direction a.
[0054] In this embodiment, the rotation axis of the rolling element 21 and the rotation axis of the first end of the oscillating element 10 are parallel and extend along a third direction. This third direction is perpendicular to the first direction a and the second direction b. In this embodiment, the third direction is... Figure 1 and Figure 2 It extends along a direction perpendicular to the paper.
[0055] Please continue to refer to this. Figure 1As shown, in this embodiment, the rolling element 21 is a gear, and the constraint element 22 is a rack. The upper surface of the constraint element 22 has teeth arranged along the first direction a. The rolling element 21 meshes with the constraint element 22, meaning the rolling element 21 is supported on the side of the constraint element 22 near the teeth and can mesh with the teeth along the tooth surface and roll along the first direction a. This causes a point on the second end (lower end) of the swing element 10 (the position intersecting the rotation axis of the rolling element 21) to move linearly along the first direction a. Because the swing element 10 is subjected to the gravity of the linear motion component 40, the rolling element 21 is naturally supported on the side of the constraint element 22 near the teeth. Through the meshing of the teeth of the rolling element 21 with the teeth of the constraint element 22, the rolling element 21 is constrained to roll along the tooth surface of the constraint element 22, thereby constraining the second end (lower end) of the swing element 10 to move linearly along the first direction a.
[0056] In other alternative embodiments, the rolling element 21 can be a roller or a rubber wheel with a smooth outer peripheral surface, and the constraint element 22 can be a flat plate structure with its upper surface parallel to the first direction a. The rolling element 21 is supported on the upper surface of the constraint element 22 and rolls along the upper surface to drive the second end (lower end) of the swing element 10 to move linearly along the first direction a.
[0057] In other alternative embodiments, the constraint component 20 may include a slider and a guide rail structure, wherein the slider is rotatably engaged with the second end of the swing member 10, and the slider moves linearly along the first direction a through the engagement of the slider and the guide rail, thereby driving the second end of the swing member 10 to move linearly.
[0058] The wafer transmission module adjustment device further includes a distance detection component 50, which is used to detect the linear motion distance of the linear motion component 40.
[0059] Combination Figure 1 As shown, the distance detection component 50 is a reflective distance sensor. The reflective distance sensor determines the existence and position information of the object being measured by the difference in intensity and time of reflected light.
[0060] The distance detection component 50 includes a signal terminal 51 and a reflective layer 52. The signal terminal 51 is mounted on the side of the constraint member 22, and the reflective layer 52 is mounted on the linear motion component 40, with the signal terminal 51 and the reflective layer 52 facing each other. The signal terminal 51 integrates both signal transmitting and signal receiving parts. The signal transmitting part of the signal terminal 51 typically uses infrared or laser light as a light source, shining the beam onto the reflective layer 52 and reflecting it back. The photodiode in the signal receiving part of the signal terminal 51 converts the light into an electrical signal for output, thus realizing distance detection.
[0061] The reflective sensor can be an existing FSN type sensor, and the choice of reflective sensor model can be based on actual usage requirements. The principle, specific structure, and usage of the reflective sensor are common knowledge and will not be elaborated here.
[0062] In other alternative embodiments, the distance detection component 50 may also employ a through-beam distance sensor. A through-beam distance sensor is a device that calculates the distance to an object by emitting light pulses, ultrasonic waves, or other substances and receiving signals. The through-beam distance sensor includes a signal generating end and a signal receiving end. The signal generating end is mounted on the side of the constraint member 22, and the signal receiving end is mounted on the linear motion component 40. The signal generating end and the signal receiving end are positioned opposite each other. The signal receiving end receives the detection signal emitted by the signal generating end and determines the distance by calculating the propagation between them.
[0063] The existing G12 through-beam laser sensor can be purchased as the through-beam sensor. The specific model of the through-beam sensor can be purchased based on actual usage requirements. The principle, specific structure, and usage of the through-beam sensor are all existing technologies and will not be elaborated here.
[0064] In other alternative embodiments, the distance detection component 50 may employ a microwave radar distance sensor, a capacitive distance sensor, a magnetoelectric distance sensor, etc.
[0065] The distance detection component 50 can detect the movement distance of the linear motion component 40 along the second direction b in real time, so as to accurately adjust the position of the wafer transfer module.
[0066] Furthermore, in combination Figures 1 to 4 As shown, in this embodiment, the locking component 30 includes a locking member 31, which is movably disposed on the swing member 10;
[0067] The locking member 31 has a locked state and an unlocked state when it moves relative to the swing member 10;
[0068] Combination Figure 1 As shown, the locking member 31 is in the unlocked state. When the locking member 31 is in the unlocked state, the locking member 31 is separated from the rolling member 21, and the rolling member 21 rotates relative to the swing member 10, that is, the rolling member 21 is not locked at this time.
[0069] Combination Figure 2As shown, the locking member 31 is in the locked state. When the locking member 31 is in the locked state, the locking member 31 contacts the rolling member 21 to prevent the rolling member 21 from rotating relative to the swing member 10. That is, the rolling member 21 is locked and cannot rotate. At this time, the second end (lower end) of the swing member 10 is locked in the horizontal position along the first direction a, and the position of the linear motion component 40 is locked.
[0070] Combination Figure 3 and Figure 4 As shown, in this embodiment, the locking member 31 has a locking tooth, which is similar to a ratchet structure. When the locking member 31 moves, the locking tooth is inserted between adjacent teeth of the rolling member 21, and the rolling member 21 is locked and cannot rotate. When the locking member 31 moves, and its locking tooth extends out between adjacent teeth of the rolling member 21, the rolling member 21 is unlocked and can rotate freely.
[0071] Combination Figure 3 and Figure 4 As shown, the locking component 30 also includes a driving component 32, which is connected to the locking component 31 to drive the locking component 31 to switch between the locked state and the locked state.
[0072] In this embodiment, the driving element 32 is an electromagnet, which controls the magnetism of the driving element 32 by switching the power on and off. The corresponding locking element 31 is made of magnetic material and moves under the influence of the magnetic force of the driving element 32.
[0073] The locking assembly 30 also includes a mounting base 33, which is fixedly mounted on the swing member 10. The locking member 31 is linearly movable and mounted on the mounting base 33. For example, the mounting base 33 has a sliding groove, and the locking member 31 is slidably mounted in the sliding groove. The sliding groove can be a T-shaped groove with a larger inner diameter and a smaller outer diameter, or a dovetail groove. Correspondingly, the locking member 31 is equipped with a slider that matches the shape of the sliding groove, and the slider is slidably mounted in the sliding groove. In other alternative embodiments, a sliding shaft can also be fixedly mounted on the mounting base 33, and the locking member 31 is slidably mounted on the sliding shaft with a single degree of freedom along the axial direction of the sliding shaft.
[0074] When the locking member 31 moves relative to the mounting base 33, it switches between a locked state and the locked state. For example... Figure 3 As shown, when the driving component 32 is not energized, its magnetic force disappears, and the locking component 31 slides down naturally by its own weight. When the locking teeth of the locking component 31 are inserted between the adjacent teeth of the rolling component 21, the rolling component 21 is locked and cannot rotate (as shown). Figure 2 (The state shown).
[0075] like Figure 4As shown, when the driving component 32 is energized, a magnetic force is generated. Since the locking component 31 is made of a magnetic material, it is attracted to the driving component 32 and slides upwards, causing the locking teeth of the locking component 31 to extend between adjacent teeth of the rolling component 21. The rolling component 21 is then unlocked and can rotate freely (as shown). Figure 1 (The state shown).
[0076] The aforementioned locking member 31 switches to the locked state by its own weight. The locking member 31 can be specially equipped with counterweights to meet its movement requirements in the locked state. In other alternative embodiments, the locking member 31 can be configured as a magnetic material. In this case, the locking member 31 can switch its magnetic poles by changing the direction of the current, and the locking member 31 is driven to move by the magnetic attraction and repulsion forces on the locking member 31.
[0077] In other alternative embodiments, the locking member 31 may be configured with an elastic element, such as a spring, which applies an elastic force to the locking member 31 to move it into the locked state. When the driving member 32 is not energized, its magnetic force disappears, and the spring drives the locking member 31 to move into the locked state. When the driving member 32 is energized, it generates a magnetic force, and the driving member 32 generates an attractive force on the locking member 31. This attractive force overcomes the force applied by the spring to the locking member 31, so that the locking member 31 moves into the unlocked state.
[0078] In other alternative embodiments, the drive element 32 may be a hydraulic drive mechanism or a linear motor drive structure, etc., to achieve linear motion drive of the locking element 31.
[0079] In other alternative embodiments, the locking member 31 can also be mounted on the mounting base 33 in a rotating manner. By driving the locking member 31 to rotate, its locking teeth can be inserted between adjacent teeth of the rolling member 21 or extended between adjacent teeth, so as to achieve direct switching between the locked state and the unlocked state.
[0080] Furthermore, when the wafer transmission module adjustment device includes a distance detection component 50, the distance detection component 50 is communicatively or electrically connected to the driving component 32. Specifically, the distance detection component 50 can be communicatively or electrically connected to the driving component 32 through a microcontroller (e.g., a single-chip microcomputer).
[0081] Combination Figure 5 As shown, K1 is communicatively or electrically connected to the distance detection component 50, and the distance detection component 50 controls the switching of K1. K1 can be controlled by a transistor, which is electrically connected to the distance detection component 50. The switching on and off of K1 is controlled by changes in current; for example, the base current can control the conduction of the collector current, thereby controlling the switching on and off of K1.
[0082] When the distance detection component 50 detects that the linear motion component 40 has moved a distance equal to the set distance, the distance detection component 50 sends a disconnect signal to K1, and K1 opens to disconnect the circuit; when the distance detection component 50 detects that the linear motion component 40 has moved a distance less than the set distance, the distance detection component 50 sends a conduction signal to K1 or does not send a signal, and K1 closes to make the circuit conduct.
[0083] K2 is an externally manually controlled single-pole double-throw switch. K1 is connected in series with one end of the drive unit 32 and one end of K2. The other end of K2 is electrically connected to the other end of the drive unit 32. The third end of K2 is connected in parallel with K1.
[0084] The initial position of K2 should be such that the K2 conduction line is connected in series with K1. Figure 5 As shown, when the linear motion component 40 has not reached the designated position, K1 is closed, the drive component 32 is energized, and the drive component 32 attracts the locking component 31, thus unlocking it. When the linear motion component 40 reaches the designated position, K1 is opened, the drive component 32 is de-energized, and the locking component 31 moves to the locked state. When disassembling the linear motion component 40, the K2 switch is manually controlled to connect the K2 conductor in parallel with K1. At this time, the drive component 32 is energized to attract the locking component 31, thus unlocking it, and the position of the linear motion component 40 can be adjusted.
[0085] In addition, K1 can also be manually controlled to open and close, so as to control the state switching of the attachment lock 31 in real time.
[0086] In other alternative embodiments, switch K1 and distance detection component 50 can be connected via analog signals. For example, if distance detection component 50 outputs an analog signal, an analog-to-digital converter (ADC) is needed to convert the analog signal into a digital signal and transmit the signal to a microcontroller (such as a microcontroller) for processing. The microcontroller compares the converted digital signal with a preset distance threshold. When the condition is met, it outputs a control signal to switch K1 to control its on / off state.
[0087] In other alternative embodiments, switch K1 and distance detection component 50 can be connected via digital signals. For example, if distance detection component 50 itself outputs a digital signal, it can be directly connected to the digital input pin of a microcontroller (such as a microcontroller). The microcontroller reads the digital signal from the sensor and controls switch K1 according to preset logic. This connection method is relatively simple, reduces signal conversion steps, and improves system stability and response speed.
[0088] In other alternative embodiments, switch K1 can also be a relay, which is an electrical control device that can control the switching of a larger current with a smaller current. The distance detection component 50 is connected to the control terminal of switch K1 via a microcontroller. When the distance detection component 50 detects a distance that meets the conditions, the microcontroller controls the coil of the relay to be energized, causing the relay contacts to close or open, thereby adjusting the state of the switch.
[0089] In other alternative embodiments, switches K1 and K2 may also be power devices or other switches. The principles and connection methods of switches K1 and K2 are existing technologies and will not be described in detail here.
[0090] The locking element 31 described above is configured as a ratchet-like structure. In other alternative embodiments, the locking element 31 may be configured as a brake caliper-like structure or other known structures that can brake the rolling element 21.
[0091] In this embodiment, the wafer transfer module adjustment device further includes an adjustment component 60, which is connected to the oscillating member 10. The adjustment component 60 is used to drive the oscillating member 10 to move, so that the first end of the oscillating member 10 rotates relative to the linear motion component 40, and the second end of the oscillating member 10 moves along the first direction a.
[0092] Combination Figure 1 and Figure 2 As shown, the adjustment assembly 60 includes an adjustment rod 61, a rotating block 62, and a handle 63. The rotating block 62 is rotatably mounted on the swing member 10, and the rotation axis of the rotating block 62, the rotation axis of the upper end (first end) of the swing member 10 at the connection with the linear motion assembly 40, and the rotation axis of the rolling member 21 are parallel. A threaded hole is formed on the rotating block 62, and the axis of the threaded hole is perpendicular to the rotation axis of the rotating block 62. The adjustment rod 61 is threadedly connected to the threaded hole.
[0093] A handle 63 is connected to one end of an adjusting rod 61 for rotating the adjusting rod 61. The adjusting rod 61 and the handle 63 are connected via a universal bearing, and the handle 63 can be fixed to the machine base and rotate with a single degree of freedom. Therefore, when the handle 63 rotates, it drives the adjusting rod 61 to rotate. Since the adjusting rod 61 and the rotating block 62 are threadedly connected, when the adjusting rod 61 rotates, it drives the rotating block 62 to move along the axial direction of the adjusting rod 61, and the rotating block 62 rotates relative to the swing member 10. Since the rotating block 62 has simultaneous component movements along the first direction a and the second direction b, it drives the swing member 10 to swing. At the same time, the adjusting rod 61 also adaptively adjusts its angle relative to the handle 63. The angle adjustment between the adjusting rod 61 and the handle 63 is achieved through the universal bearing between them.
[0094] The second end (lower end) of the swing member 10 moves linearly along the first direction a. Since the linear motion component 40 can only move linearly along the second direction b, the first end (upper end) of the swing member 10 is constrained to move only along the second direction b. Therefore, the first end of the swing member 10 moves along the second direction b and drives the linear motion component 40 to move linearly along the second direction b.
[0095] In other alternative embodiments, the adjustment component 60 can be a handle mounted on the swing member 10, which can be manually gripped to drive the swing member 10. Alternatively, the adjustment component 60 can be a multi-link structure, etc., which will not be described in detail here.
[0096] The aforementioned adjustment device enables precise positioning of the wafer transfer module. Equipped with gears and racks, and a locking component 30, the device utilizes a high-precision distance detection component 50 (e.g., a pulsed laser rangefinder with an accuracy of 0.1 mm) to detect the adjustment position in real time. The height of the linear motion component 40 during the first HWCZ test is stored in the machine computer, serving as the target position for adjustment. During reassembly of the wafer transfer module, when the distance detection component 50 detects that the linear motion component 40 has reached the target position, the locking component 30 locks the position of the linear motion component 40, eliminating the need for the HWCZ test step and improving adjustment efficiency.
[0097] For example, the time for carrier height working calibration (HWCZ) after each preventive maintenance (PM) disassembly and assembly of the wafer transmission module is 30 minutes, and the testing frequency is at least twice a month. However, the calibration of the distance detection component 50 can be performed once every six months, with a single calibration time of less than 20 minutes. Since this structure only contacts the rolling element 21 when the locking element 31 is in the locked state, the wear of the locking element 31 can be almost ignored. The overall time saving can reach 680 minutes / year on an annual basis, which helps to improve production efficiency.
[0098] In summary, the wafer transfer module adjustment device includes: a swing member, a constraint component, a locking component, and a linear motion component; the first end of the swing member is rotatably connected to the linear motion component, which is configured to move linearly; the constraint component is connected to the swing member and is used to constrain the second end of the swing member to move linearly along a first direction when the swing member rotates around the first end; the locking component is connected to the swing member and is used to lock the position of the second end of the swing member along the first direction.
[0099] With this configuration, in the actual adjustment process of the aforementioned wafer transfer module adjustment device, the second end of the oscillating element faces downwards, meaning the lower end of the oscillating element moves linearly along the first direction. The first end of the oscillating element faces upwards, meaning the upper end of the oscillating element is rotatably connected to the linear motion component. Therefore, when the oscillating element is driven to oscillate, the height of its lower end (second end) remains unchanged, while the upper end (first end) of the oscillating element rotates relative to the linear motion component, and its upper end (first end) moves linearly synchronously along the linear motion direction of the linear motion component. At this time, the upper end (first end) of the oscillating element synchronously drives the linear motion component to move linearly, thereby achieving the height adjustment of the wafer transfer module.
[0100] When the horizontal position of the second end (lower end) of the swing component along the first direction is locked, the position of its first end (upper end) and the linear motion component along its linear motion direction is limited. At this time, the vertical position of the linear motion component is locked, that is, the vertical position of the wafer transfer module is locked. The adjustment device can lock the adjustment height in real time to facilitate the calibration of the positioning height and improve the positioning accuracy.
[0101] This embodiment also provides a semiconductor device, which includes the wafer transport module adjustment device described above. The semiconductor device is, for example, a lithography machine or other equipment equipped with a wafer transport module.
[0102] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.
[0103] The above description is only a description of the preferred embodiment of the present utility model and is not intended to limit the scope of the present utility model in any way. Any changes or modifications made by those skilled in the art based on the above disclosure shall fall within the protection scope of the claims.
Claims
1. A wafer transfer module adjustment device, characterized in that, include: Swinging components, constraint components, locking components, and linear motion components; The first end of the swing member is used for rotational connection with the linear motion component, which is configured for linear motion. The constraint component is connected to the swing member, and the constraint component is used to constrain the second end of the swing member to move linearly in a first direction when the swing member rotates around the first end. The locking component is connected to the swing member to lock the position of the second end of the swing member along the first direction.
2. The wafer transfer module adjustment device as described in claim 1, characterized in that, The wafer transfer module adjustment device further includes an adjustment component connected to the oscillating member. The adjustment component is used to drive the oscillating member to move so that the first end of the oscillating member rotates relative to the linear motion component.
3. The wafer transfer module adjustment device as described in claim 1, characterized in that, The wafer transmission module adjustment device further includes a distance detection component, which is used to detect the linear motion distance of the linear motion component.
4. The wafer transport module adjustment device as described in any one of claims 1 to 3, characterized in that, The constraint component includes a rolling element and a constraint element; The rolling element is rotatably disposed at the second end of the swinging element; the rolling element is also rotatably disposed at the constraint element, and when the rolling element rolls along the constraint element, it drives the second end of the swinging element to move linearly along the first direction.
5. The wafer transfer module adjustment device as described in claim 4, characterized in that, The rolling element is a gear, the constraining element is a rack, and the rolling element meshes with the constraining element.
6. The wafer transfer module adjustment device as described in claim 4, characterized in that, The locking component includes a locking member, which is movably disposed on the swing member; The locking member has a locked state and an unlocked state when it moves relative to the swinging member; When the locking member is in the locked state, the locking member contacts the rolling member and prevents the rolling member from rotating relative to the swing member; When the locking member is in the unlocked state, the locking member separates from the rolling member, so that the rolling member rotates relative to the swing member.
7. The wafer transfer module adjustment device as described in claim 6, characterized in that, The locking component further includes a drive unit connected to the locking component, which drives the locking component to switch between the locked state and the locked state.
8. The wafer transfer module adjustment device as described in claim 7, characterized in that, When the wafer transmission module adjustment device includes a distance detection component, the distance detection component is communicatively or electrically connected to the driving component.
9. The wafer transfer module adjustment device as described in claim 7, characterized in that, The driving component is an electromagnet.
10. A semiconductor device, characterized in that, The semiconductor device includes the wafer transfer module adjustment device according to any one of claims 1 to 9.