Refrigerant heat dissipation device and heat pump unit

Abstract

The utility model relates to a refrigerant heat dissipation device and a heat pump unit, and belongs to the technical field of heat pumps. The heat insulation piece is arranged in the heat dissipation block, and the heat insulation piece divides the heat dissipation block into a first part and a second part; the at least one first runner is arranged in the first part; the at least one second flow channel is arranged in the second part, and the first flow channel is not communicated with the second flow channel; the connecting piece is used for communicating a refrigerant pipe with the first flow channel, and / or the connecting piece is used for communicating the refrigerant pipe with the second flow channel; the heat dissipation plate is fixedly connected with the heat dissipation block; wherein a flow channel through which a refrigerant flows during the refrigeration cycle is different from a flow path through which the refrigerant flows during the heating cycle. Therefore, in the refrigerating mode and the heating mode, refrigerants pass through different flow channels, and the problems of temperature rise and condensation are solved at the same time.

Description

Technical Field

[0001] This application relates to the field of heat pump technology, and in particular to refrigerant heat dissipation devices and heat pump units. Background Technology

[0002] In air conditioner outdoor units, air cooling is limited by heat dissipation capacity and air duct design, and usually relies on the refrigerant circulation of the air conditioning system itself for refrigerant heat dissipation.

[0003] In the prior art, when the ambient temperature is high and the water temperature is low, the refrigerant temperature in the refrigerant radiator is often lower than the air dew point temperature of the electronically controlled drive environment. This causes the temperature of the heat dissipation aluminum plate in the refrigerant radiator to be lower than the dew point temperature, resulting in condensation failure of the electronically controlled power devices on the surface of the heat dissipation aluminum plate.

[0004] Because condensation significantly impacts the normal operation of electronically controlled power devices, current improvements typically focus on increasing the temperature of the heat sink aluminum plate. However, this increases the thermal resistance of the power devices. During stable high-frequency cooling operation, the high current draw leads to excessive temperature rise in the power devices, further affecting their lifespan and operational safety. Therefore, in existing technologies, refrigerant radiators cannot adequately meet the requirements of heat pump units. Utility Model Content

[0005] This utility model solves, to at least a certain extent, one of the technical problems in the related art.

[0006] Therefore, this application aims to provide a refrigerant heat dissipation device, which solves the problems of temperature rise and condensation by setting a first flow channel and a second flow channel in the heat dissipation block and setting a heat insulation component between the first flow channel and the second flow channel, so that the refrigerant flows through different flow channels in the cooling mode and the heating mode.

[0007] To achieve the above objectives, this utility model provides a refrigerant heat dissipation device for cooling the electronic control power devices of a heat pump unit, comprising:

[0008] Heat sink;

[0009] A heat insulation component is disposed within the heat dissipation block, the heat insulation component dividing the heat dissipation block into a first part and a second part;

[0010] At least one first flow channel is disposed within the first portion;

[0011] At least one second flow channel is provided within the second portion, and the first flow channel and the second flow channel are not connected;

[0012] A connector for connecting a refrigerant pipe to the first flow channel, and / or, a connector for connecting a refrigerant pipe to the second flow channel;

[0013] A heat sink, which is fixedly connected to the heat sink block;

[0014] The refrigerant flows through a different channel during the refrigeration cycle than during the heating cycle.

[0015] In the technical solution, by setting a first flow channel and a second flow channel in the refrigerant heat dissipation device, the refrigerant passes through the first flow channel and the second flow channel respectively in different working modes. By setting a heat insulation component, when the refrigerant passes through the first flow channel in heating mode, the temperature of the refrigerant is unlikely to affect the temperature of the heat sink, thereby reducing the impact on the temperature of the heat sink. This allows the temperature of the heat sink to be higher than the air dew point temperature under high ambient temperature conditions, thus avoiding condensation and reducing the probability of temperature rise problems, thereby protecting the electronically controlled power devices.

[0016] In some embodiments of this application, the second flow channel includes multiple interconnected connecting channels.

[0017] In the technical solution, by extending the second flow channel, the flow path of the refrigerant in the heat sink is increased in the cooling mode, thereby extending the heat exchange time and increasing the effective heat dissipation area, improving the heat dissipation effect of the heat sink, and thus solving the temperature rise problem.

[0018] In some embodiments of this application, the connection channel is entirely located inside the second part and connects to multiple connections.

[0019] In the technical solution, the connection channel is entirely located within the second part, which simplifies the external structure of the heat sink and reduces production costs.

[0020] In some embodiments of this application, the connection channel includes:

[0021] A first connecting segment, the first connecting segment passing through the opposite side walls of the heat sink;

[0022] The second connecting section extends through the opposite side walls of the heat sink;

[0023] The third connecting section extends through the opposite side walls of the heat sink;

[0024] The second flow channel further includes a connecting pipe, the first connecting pipe being used to connect the first connecting segment, the second connecting segment and the third connecting segment to form a passage, the first connecting pipe being located outside the second part.

[0025] In the technical solution, the first connecting section, the second connecting section and the third connecting section are connected by the first connecting pipe, which further increases the length of the second flow channel, thereby further extending the heat exchange time and improving the heat exchange effect.

[0026] In some embodiments of this application, there are two connectors.

[0027] The connector is a one-way valve, and one of the one-way valves is connected to the output end of the first flow channel and the input end of the second flow channel;

[0028] The other one-way valve is connected to the output end of the second flow channel and the input end of the first flow channel.

[0029] In the technical solution, a one-way valve is set up to allow the refrigerant to flow through the first or second flow channel respectively in cooling and heating modes, thereby solving the temperature rise problem.

[0030] In some embodiments of this application, the one-way valve includes:

[0031] The first branch pipe is connected to the refrigerant pipe inlet and the first flow channel inlet.

[0032] The second branch pipe is connected to the output end of the first flow channel and the output end of the refrigerant pipe.

[0033] The valve core is located at the connection between the first branch pipe and the refrigerant pipe inlet or the connection between the second branch pipe and the refrigerant pipe outlet. The valve core is used to switch the first branch pipe and the second branch pipe to control the refrigerant flow path.

[0034] In the technical solution, by setting up a first branch pipe and a second branch pipe, and controlling the connection between the first branch pipe and the refrigerant pipe input end and the second branch pipe and the refrigerant pipe output end through the valve core, the refrigerant can flow through the first flow channel or the second flow channel respectively in cooling mode and heating mode, thereby solving the temperature rise problem.

[0035] In some embodiments of this application, there are two connectors, each located at one end of the heat sink.

[0036] The connector is a diversion cover, the open end of which is connected to the heat sink, and a sealed cavity is formed between the diversion cover and the heat sink; the diversion cover has a connection port that is connected to the refrigerant pipe.

[0037] In the technical solution, by setting up a diversion cover, the refrigerant flows through the first flow channel or the second flow channel respectively in cooling mode and heating mode, so as to solve the temperature rise problem.

[0038] In some embodiments of this application, the connection ports on the two diversion covers correspond to the first flow channel and the second flow channel, respectively.

[0039] In the technical solution, by setting two connection ports corresponding to the first flow channel and the second flow channel, the probability of the refrigerant entering the first flow channel and the second flow channel is increased, thereby increasing the certainty of the refrigerant flow path. This allows the refrigerant to flow through the first flow channel or the second flow channel respectively in cooling mode and heating mode, thus solving the temperature rise problem.

[0040] In addition, this application also provides a heat pump unit, which includes:

[0041] First heat exchanger;

[0042] The second heat exchanger is connected to the first heat exchanger via a refrigerant pipe;

[0043] The refrigerant heat dissipation device as described above.

[0044] In the technical solution, by setting a first flow channel and a second flow channel in the refrigerant heat dissipation device, when the refrigerant in the refrigerant heat dissipation device is engaged in heating and cooling, heating and cooling pass through the first flow channel and the second flow channel respectively. By setting a heat insulation cavity, the heat transfer efficiency between the refrigerant and the heat sink is low when the refrigerant passes through the first flow channel in heating mode, thereby reducing the impact on the surface temperature of the heat sink. At the same time, the temperature rise of the heat sink under condensation conditions is less affected by the refrigerant temperature. Thus, while reducing the temperature rise of the electronic power device, the probability of condensation is also reduced, thereby achieving dual protection for the electronic power device.

[0045] In some embodiments of this application, the heat insulation element is a heat insulation cavity, which includes:

[0046] First heat insulation groove;

[0047] Second heat insulation groove;

[0048] Third heat insulation groove;

[0049] The first heat insulation groove, the second heat insulation groove, and the third heat insulation groove together enclose a heat insulation zone, and the first flow channel is located within the heat insulation zone.

[0050] In the technical solution, by setting up a heat insulation zone, the first flow channel is located in the heat insulation zone, making it difficult for the temperature in the first flow channel to be transferred to the heat sink. Therefore, when the temperature of the heat sink rises above the target temperature, the temperature of the heat sink exceeds the dew point temperature of the ambient air, thereby avoiding condensation on the surface of the heat sink and thus protecting the electronically controlled power devices.

[0051] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0052] Figure 1 This is a front view structural diagram according to an embodiment of this application;

[0053] Figure 2 This is a schematic diagram of the overall structure according to the embodiments of this application;

[0054] Figure 3 This is a schematic diagram of the overall structure after the hidden connector is implemented according to the embodiments of this application;

[0055] Figure 4 This is a front view structural diagram according to an embodiment of this application;

[0056] Figure 5 This is a schematic diagram of the overall structure according to the embodiments of this application;

[0057] Figure 6 This is a schematic diagram of the overall structure after the hidden connector is implemented according to the embodiments of this application;

[0058] Figure 7 This is a cross-sectional structural diagram according to an embodiment of this application;

[0059] Figure 8 This is a front view structural diagram according to an embodiment of this application;

[0060] Figure 9 This is a schematic diagram of the overall structure according to the embodiments of this application;

[0061] Figure 10 This is a cross-sectional structural diagram according to an embodiment of this application;

[0062] Figure 11 This is a schematic diagram of the location of the heat insulation cavity structure according to an embodiment of this application.

[0063] In the above figures: 100, heat sink; 200, refrigerant pipe; 300, heat sink plate; 400, heat insulation component; 401, first heat insulation pad; 402, second heat insulation pad; 403, third heat insulation pad; 404, fourth heat insulation pad; 405, fifth heat insulation pad; 406, sixth heat insulation pad; 407, seventh heat insulation pad; 408, eighth heat insulation pad; 500, first flow channel; 600, second flow channel; 601, first connecting section; 602, second connecting section; 603, third connecting section; 604, first connecting pipe; 700, connector; 710, distributor cap; 720, one-way valve; 721, first distributor pipe; 722, second distributor pipe; 723, second connecting pipe; 800, heat insulation cavity; 801, first heat insulation groove; 802, second heat insulation groove; 803, third heat insulation groove. Detailed Implementation

[0064] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0065] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0066] In this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0067] In this utility model, the terms "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this utility model. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Furthermore, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0068] The present invention will now be described in detail through exemplary embodiments. However, it should be understood that, without further description, elements, structures, and features in one embodiment may be advantageously incorporated into other embodiments.

[0069] In this application, the heat pump unit includes a compressor, a four-way valve, a first heat exchanger, a throttling valve, a refrigerant heat dissipation device, a hydraulic module, a second heat exchanger, and a gas-liquid separator. These components are connected via refrigerant pipes to achieve refrigerant circulation, enabling the heat pump unit to perform both cooling and heating functions. The refrigerant heat dissipation device is installed on the refrigerant pipe between the first and second heat exchangers. This device assists in heat dissipation or subcools the refrigerant, thereby optimizing system efficiency and stability. Due to the working principle of the refrigerant heat dissipation device, condensation and temperature rise are prone to occur, which can easily lead to failure of the electronic control power devices. Therefore, the refrigerant heat dissipation device in this application incorporates a dual-channel design and a thermal insulation structure to effectively mitigate condensation and temperature rise, protecting the electronic control power devices for normal operation.

[0070] In the following, embodiments of this application will be described in detail with reference to the accompanying drawings.

[0071] In one illustrative embodiment of the heat pump unit of this utility model, the heat pump unit includes a compressor for driving refrigerant circulation.

[0072] In some embodiments, the heat pump unit includes a four-way valve for switching the refrigerant flow direction to achieve the switching between cooling and heating modes.

[0073] In some embodiments, the heat pump unit includes a first heat exchanger. When refrigerant enters the first heat exchanger, it evaporates and absorbs heat or condenses and releases heat, thereby changing the state of the refrigerant while simultaneously performing heating or cooling operations. When the refrigerant in the first heat exchanger evaporates and absorbs heat, the first heat exchanger functions as an evaporator; when the refrigerant in the first heat exchanger condenses and releases heat, the first heat exchanger functions as a condenser.

[0074] In some embodiments, the heat pump unit includes a second heat exchanger. When refrigerant enters the second heat exchanger, the refrigerant evaporates and absorbs heat or condenses and releases heat. The second heat exchanger operates on the same principle as the first heat exchanger, and the effect of the refrigerant in the second heat exchanger is opposite to that in the first heat exchanger. When the first heat exchanger acts as an evaporator, the second heat exchanger acts as a condenser; when the first heat exchanger acts as a condenser, the second heat exchanger acts as an evaporator.

[0075] In some embodiments, the heat pump unit includes a refrigerant pipe 200 for connecting a first heat exchanger and a second heat exchanger.

[0076] In some embodiments, the heat pump unit includes a throttling valve for controlling the flow rate and pressure of the refrigerant to change the physical state of the refrigerant, so as to cooperate with the refrigerant in the subsequent second heat exchanger to absorb or release heat, thereby realizing the circulation of the refrigerant in the heat pump unit.

[0077] In some embodiments, the heat pump unit includes a hydraulic module, which is a core subsystem connecting the heat pump unit to terminal devices (such as fan coil units, underfloor heating pipes, etc.). The hydraulic module is primarily responsible for regulating water circulation, stabilizing pressure, and optimizing heat transfer. When the heat pump unit is producing hot water, the hydraulic module acts as a condenser for heat transfer during refrigerant circulation.

[0078] In some embodiments, the heat pump unit includes a gas-liquid separator to prevent liquid slugging of the compressor when liquid refrigerant enters the compressor.

[0079] In some embodiments, the heat pump unit includes a refrigerant heat dissipation device, which is disposed on the refrigerant pipe 200. The refrigerant heat dissipation device is used to assist in heat dissipation or subcool the refrigerant to increase system stability.

[0080] In some embodiments, refer to Figures 1-3 The refrigerant heat dissipation device includes a heat sink 100 and a refrigerant pipe 200 passing through the heat sink 100.

[0081] In some embodiments, the refrigerant heat dissipation device includes a heat sink 300, which is disposed on one side of the heat sink 100. The heat sink 300 is used to accelerate heat release and improve heat exchange efficiency.

[0082] In some embodiments, the refrigerant cooling device is used to dissipate heat from the electronically controlled power devices.

[0083] In the prior art, when a heat pump unit produces hot water, the pressure on the refrigerant side of the refrigerant heat dissipation device is related to the water temperature and is independent of the outdoor ambient temperature. Therefore, when the equipment is in a high ambient temperature and low water temperature, the refrigerant temperature in the refrigerant heat dissipation device is very likely to be lower than the air dew point temperature in the electrically controlled drive environment. This causes the temperature of the heat dissipation plate 300 in the refrigerant heat dissipation device to be lower than the air dew point temperature, causing condensation failure of the electrical power devices on the surface of the heat dissipation plate 300, resulting in electrical faults and affecting the normal operation of the heat pump unit.

[0084] Based on this, a refrigerant heat dissipation device is provided in this application to solve the risk of condensation on the heat sink 300 when the ambient temperature is high and the water temperature is low. At the same time, in the process of solving the condensation problem, the system failure and safety hazards caused by excessive temperature rise of the electronic power device are avoided.

[0085] In some embodiments, refer to Figures 1-3The refrigerant heat dissipation device includes a heat insulation component 400, which is disposed inside the heat dissipation block 100. The heat dissipation block 100 is located on both sides of the heat insulation component 400, which are respectively a first part and a second part. The heat insulation component 400 is used to increase the heat transfer between the first part and the second part, so that when the heat in the first part or the second part changes, the surface temperature of the heat dissipation plate 300 is increased, thereby improving the stability of the refrigerant heat dissipation device.

[0086] In some embodiments, the refrigerant heat dissipation device includes a first flow channel 500, which is disposed within a first portion.

[0087] In some embodiments, the refrigerant heat dissipation device includes a second flow channel 600 disposed within a second portion, and a heat dissipation plate 300 connected to one side of the second portion.

[0088] In some embodiments, the refrigerant heat dissipation device includes a connector 700, which is used to connect the refrigerant pipe 200 to the first flow channel 500 and the refrigerant pipe 200 to the second flow channel 600, or the refrigerant pipe 200 to the first flow channel 500 or the refrigerant pipe 200 to the second flow channel 600.

[0089] Through the above technical solution, by setting a first flow channel 500 and a second flow channel 600 in the refrigerant heat dissipation device, when the refrigerant in the refrigerant heat dissipation device is performing cooling and heating operations, cooling and heating pass through the first flow channel 500 and the second flow channel 600 respectively. By setting the heat insulation component 400, in the heating mode, when the low-temperature refrigerant passes through the first flow channel 500, the heat transfer efficiency between the refrigerant and the heat sink 100 is low, thereby reducing the impact on the surface temperature of the heat sink 300. At the same time, it achieves the temperature increase of the heat sink 300 under condensation conditions, thereby reducing the occurrence of temperature rise in the electronic power device and reducing the probability of condensation, so as to achieve dual protection for the electronic power device.

[0090] In some embodiments, refer to Figures 1-3 The first flow channel 500 is a channel that runs through the opposite sides of the heat sink 100, and the second flow channel 600 is a channel that runs through the opposite sides of the heat sink 100. The first flow channel 500 and the second flow channel 600 have the same length direction. The inlet end and outlet end of the refrigerant pipe 200 are respectively connected to the connector 700 to realize the connection between the refrigerant pipe 200 and the first flow channel 500 and the second flow channel 600. This allows the refrigerant to flow through different channels in cooling mode or heating mode, thereby solving the temperature rise problem of the electronically controlled power device.

[0091] In some embodiments, the second flow channel 600 includes multiple interconnected connecting channels. By providing multiple connecting channels in the second flow channel 600, the flow path of the refrigerant in the second flow channel 600 is lengthened. In cooling mode, increasing the flow path of the refrigerant in the heat sink 100 extends the heat exchange time and increases the heat dissipation area, thereby improving the cooling effect of the refrigerant heat dissipation device and solving the temperature rise problem.

[0092] In some embodiments, refer to Figures 1-3 Two connectors 700 are provided, and the two connectors 700 are located at both ends of the heat sink 100. The connector 700 is a diversion cover 710. The open end of the diversion cover 710 is connected to the heat sink 100, and a sealed cavity is formed between the diversion cover 710 and the heat sink 100. The diversion cover 710 has a connection port and is connected to the refrigerant pipe 200, so that the refrigerant can enter the sealed cavity through the refrigerant pipe 200, and then enter the first flow channel 500 or the second flow channel 600, realizing the diversion of refrigerant in cooling mode and heating mode.

[0093] In some embodiments, the connection ports on the two flow dividers 710 correspond to the first flow channel 500 and the second flow channel 600, respectively. The flow resistance of the refrigerant flowing through the refrigerant heat dissipation device is known to be as follows:

[0094] In cooling mode, if it is desired that all refrigerant passes through the first flow channel 500, or all refrigerant passes through the second flow channel 600, so that in heating mode the refrigerant can pass through the other flow channel, this would solve the temperature rise problem by allowing the refrigerant to pass through different channels in different modes. Under this premise, Case 1: Assuming all refrigerant passes through the first flow channel 500, the total resistance R = R inlet distribution of the first flow channel 500 + R friction along the first flow channel 500 + R local resistance at the outlet; Case 2: Assuming all refrigerant passes through the second flow channel 600, the total resistance R = R inlet distribution of the second flow channel 600 + R friction along the second flow channel 600 + R local resistance at the outlet.

[0095] In heating mode, if it is desired that all refrigerant passes through the first flow channel 500, or all refrigerant passes through the second flow channel 600, so that in cooling mode the refrigerant can pass through the other flow channel, this would allow the refrigerant to pass through different channels in different modes, thereby solving the temperature rise problem. Under this premise, Case 1: Assuming all refrigerant passes through the first flow channel 500, the total resistance R = R inlet distribution of the first flow channel 500 + R friction along the first flow channel 500 + R local resistance at the outlet; Case 2: Assuming all refrigerant passes through the second flow channel 600, the total resistance R = R inlet distribution of the second flow channel 600 + R friction along the second flow channel 600 + R local resistance at the outlet.

[0096] Therefore, in order to achieve the goal of the refrigerant mainly flowing into the first flow channel 500 in the cooling mode, the local resistance of the first flow channel 500+R along the friction of the first flow channel 500+R at the outlet is greater than the local resistance of the second flow channel 600+R along the friction of the second flow channel 600+R at the outlet.

[0097] To achieve the following in heating mode, the refrigerant mainly flows into the second flow channel 600, and the frictional resistance along the second flow channel 600+R at the R inlet is greater than the frictional resistance along the first flow channel 500+R at the R inlet and the local resistance at the first flow channel 500+R at the R outlet.

[0098] From the above inference, it can be concluded that the greater the inlet distribution resistance, the more concentrated the refrigerant circulation flow in the designated flow channel in cooling or heating mode. Therefore, the refrigerant flow through the channel is directly related to the inlet distribution resistance.

[0099] In some embodiments, in order to make the refrigerant flow channels clear, the connection ports on the two diversion covers 710 correspond to the first flow channel 500 and the second flow channel 600, respectively. That is, the input end of the refrigerant pipe 200 corresponds to the port of the first flow channel 500, and the output end of the refrigerant pipe 200 corresponds to the port of the second flow channel 600. A certain gap is left between the input end of the refrigerant pipe 200 and the port of the first flow channel 500, and a certain gap is left between the output end of the refrigerant pipe 200 and the port of the second flow channel 600. The recommended gap size is 1 to 5 mm, taking into account the diversion and processing accuracy.

[0100] Through the above technical solution, when the refrigerant enters the sealed cavity through the inlet end of the refrigerant pipe 200, since the inlet end of the refrigerant pipe 200 corresponds to the second flow channel 600, in cooling mode, the resistance of the refrigerant entering the second flow channel 600 from the inlet end of the refrigerant pipe 200 is smaller, allowing the refrigerant to enter the first flow channel 500 in a more concentrated manner; in heating mode, the resistance of the refrigerant flowing into the first flow channel 500 from the outlet end of the refrigerant pipe 200 is smaller, allowing the refrigerant to enter the first flow channel 500 in a more concentrated manner, thereby achieving a more concentrated refrigerant circulation flow in either cooling or heating mode.

[0101] In some embodiments, refer to Figure 3When the equipment is operating in a high ambient temperature hot water production condition, and the inlet water temperature is maintained at 10℃, the temperature at the input end of the refrigerant pipe 200 may drop below 15℃. Due to the high thermal conductivity of metals, the temperature of the heat sink 300 is generally below 30℃. At this point, because the temperature of the heat sink 300 is below the air dew point temperature, condensation will occur on the surface of the heat sink 300, damaging the electrical control power devices. Therefore, in order to further raise the temperature of the heat sink 300, the heat insulation component 400 includes a first heat insulation pad 401, the plane of which is parallel to the ground plane. The heat sink 300 is parallel, and the first heat insulation pad 401 is located on the side of the first flow channel 500 near the heat sink 300. The target thermal resistance R of the first heat insulation pad 401 is greater than the target value. The first heat insulation pad 401 is used to adjust the thermal resistance and reduce the influence of the low temperature refrigerant flowing into the input end of the refrigerant pipe 200 on the temperature of the heat sink 300, so that the heat in the heat sink block 100 will not be dissipated too quickly, so that the temperature of the heat sink 300 is above the air dew point temperature, thereby reducing the damage to the electronic power device caused by condensation on the surface of the heat sink 300 and ensuring that the electronic power device can work normally.

[0102] In some embodiments, the heat insulation member 400 includes a second heat insulation pad 402, the plane of which the second heat insulation pad 402 is located is perpendicular to the plane of the first heat insulation pad 401. The second heat insulation pad 402 is used to further adjust the thermal resistance and reduce the heat transfer effect of the first flow channel 500 away from the outer wall of the heat sink 100, thereby reducing the impact of the low-temperature refrigerant flowing into the inlet of the refrigerant pipe 200 on the temperature of the heat sink 300.

[0103] In some embodiments, the heat insulation member 400 includes a third heat insulation pad 403, the plane of which the third heat insulation pad 403 is located is perpendicular to the plane of which the second heat insulation pad 402 is located, the third heat insulation pad 403 is located on the side of the first flow channel 500 away from the heat sink 300, and the third heat insulation pad 403 is used to further adjust the thermal resistance and reduce the impact of the temperature of the first flow channel 500 on the heat sink 300.

[0104] Meanwhile, the first heat insulation pad 401, the second heat insulation pad 402, and the third heat insulation pad 403 together form a heat insulation zone. The first flow channel 500 is located within the heat insulation zone, and the inlet end of the refrigerant pipe 200 corresponds to the first flow channel 500. That is, when the heat pump unit in this application produces hot water, the low-temperature refrigerant at the inlet end of the refrigerant pipe 200 enters the first flow channel 500 through the diversion cover 710, and flows out from the outlet end of the refrigerant pipe 200 located at the other end of the heat sink 100 after passing through the first flow channel 500. At this time, due to the setting of the heat insulation zone, the temperature of the low-temperature refrigerant in the first flow channel 500 has little impact on other parts of the heat sink 100, so that the heat will not be lost too quickly. The temperature of the heat sink 300 is affected by the high ambient temperature, and its surface temperature is greater than the air dew point temperature, thereby avoiding condensation.

[0105] In some embodiments, refer to Figures 4-7 The connecting channels are located entirely within the second part and are interconnected with multiple channels, which lengthens the flow path of the refrigerant in the second flow channel 600, thereby solving the problem of temperature rise of the electronically controlled power devices.

[0106] In some embodiments, the connection channel includes a first connection segment 601, which extends through the opposite side walls of the heat sink 100.

[0107] In some embodiments, the connection channel includes a second connection segment 602, which extends through the opposite side walls of the heat sink 100.

[0108] In some embodiments, the connection channel includes a third connection segment 603, which passes through the opposite side walls of the heat sink 100.

[0109] In some embodiments, the second flow channel 600 includes a first connecting pipe 604, which is used to connect the first connecting segment 601, the second connecting segment 602 and the third connecting segment 603 to form a passage. The first connecting pipe 604 is located in a sealed cavity.

[0110] Through the above technical solution, when the inlet of the refrigerant pipe 200 corresponds to the first flow channel 500, the first connecting pipe 604 located away from the inlet of the refrigerant pipe 200 connects the first connecting section 601 and the second connecting section 602; the first connecting pipe 604 located near the inlet of the refrigerant pipe 200 connects the second connecting section 602 and the third connecting section 603, thereby forming a passage in the second flow channel 600, increasing the flow length of the refrigerant in the second flow channel 600, so that heat can be fully accumulated or dissipated in the heat sink 100, thereby improving the cooling effect of the refrigerant heat dissipation device and the heat dissipation effect of the heat sink 300.

[0111] In some embodiments, refer to Figures 4-7 The heat insulation component 400 includes a fourth heat insulation pad 404, which is connected to the first heat insulation pad 401. The plane of the fourth heat insulation pad 404 is perpendicular to the plane of the first heat insulation pad 401. At this time, the heat insulation component 400 is arranged around the first flow channel 500 to further reduce the influence of the water temperature in the first flow channel 500 on the temperature of the heat dissipation plate 300.

[0112] In some embodiments, the heat insulation component 400 includes a fifth heat insulation pad 405, which is connected to a fourth heat insulation pad 404. The plane of the fifth heat insulation pad 405 is perpendicular to the plane of the fourth heat insulation pad 404, and the plane of the fifth heat insulation pad 405 is parallel to the heat sink 300. One end of the fifth heat insulation pad 405 is connected to the side wall of the heat sink 100. The fifth heat insulation pad 405 is used to block the heat in the first flow channel 500 from being transferred to the second connecting section 602 and the third connecting section 603, thereby reducing the impact on the temperature of the heat sink 300.

[0113] In some embodiments, refer to Figures 8-10 Two connectors 700 are provided, each being a one-way valve 720. One one-way valve 720 is connected to the output end of the first flow channel 500 and the input end of the second flow channel 600, while the other one-way valve 720 is connected to both the output end of the second flow channel 600 and the input end of the first flow channel 500. In use, water from the input end of the refrigerant pipe 200 flows into the first flow channel 500 from the input end, passes through the one-way valve 720, and enters the output end of the refrigerant pipe 200 from the output end of the second flow channel 600; or water from the input end of the refrigerant pipe 200 flows into the second flow channel 600 from the input end, passes through the one-way valve 720, and enters the output end of the refrigerant pipe 200 from the output end of the first flow channel 500 and flows out. This ensures that the water in the refrigerant pipe 200 flows through different channels in cooling and heating modes, thereby reducing the probability of condensation and protecting the electronic power control devices.

[0114] In some embodiments, the one-way valve 720 includes a first diversion pipe 721, which is connected to the inlet of the refrigerant pipe 200 and the outlet of the first flow channel 500. The first diversion pipe 721 is used to increase the route of the refrigerant through the heat sink 100 so as to enable the refrigerant to flow through different channels in the cooling mode and the heating mode respectively.

[0115] In some embodiments, the one-way valve 720 includes a second diversion pipe 722, which is connected to the output end of the first flow channel 500 and the output end of the refrigerant pipe 200. The second diversion pipe 722 is used to further increase the route of the refrigerant through the heat sink 100, so as to realize that the refrigerant flows through different channels in the cooling mode and the heating mode respectively.

[0116] In some embodiments, the one-way valve 720 includes a valve core located at the connection between the first branch pipe 721 and the inlet end of the refrigerant pipe 200 or the connection between the second branch pipe 722 and the outlet end of the refrigerant pipe 200. The valve core is used to switch the first branch pipe 721 and the second branch pipe 722 to control the refrigerant flow path.

[0117] In some embodiments, two first flow channels 500 are arranged opposite each other in the heat sink 100, and two second flow channels 600 are arranged opposite each other in the heat sink 100, with the two first flow channels 500 and the two second flow channels 600 passing through the opposite ends of the heat sink 100.

[0118] In some embodiments, refer to Figure 10 The heat insulation component 400 includes a sixth heat insulation pad 406. The plane of the sixth heat insulation pad 406 is perpendicular to the heat sink 300. The side of the sixth heat insulation component 406 away from the heat sink 300 is on the same plane as the side of the heat sink 100 away from the heat sink 300. The sixth heat insulation component 406 is used to reduce the heat transfer efficiency in the first flow channel 500.

[0119] In some embodiments, the heat insulation element 400 includes a seventh heat insulation pad 407, the plane of which the seventh heat insulation pad 407 is located is parallel to the heat sink 300, the seventh heat insulation pad 407 is connected to the sixth heat insulation pad 406, and the seventh heat insulation pad 407 is used to further reduce the heat transfer efficiency in the first flow channel 500.

[0120] In some embodiments, the heat insulation component 400 includes an eighth heat insulation pad 408, the plane of which the eighth heat insulation pad 408 is located is parallel to the heat sink 300, the eighth heat insulation pad 408 is connected to the seventh heat insulation pad 407, the eighth heat insulation pad 408 is located on the side of the first flow channel 500 and the second flow channel 600 near the outer wall of the heat sink 100, and the eighth heat insulation pad 408 is used to further reduce the heat transfer efficiency in the first flow channel 500.

[0121] Two of each of the sixth heat insulation pad 406, the seventh heat insulation pad 407 and the eighth heat insulation pad 408 are provided, which respectively surround the two first flow channels 500 to reduce the influence of the refrigerant temperature in the first flow channel 500 on the temperature of the heat sink 300.

[0122] In some embodiments, the one-way valve 720 includes a second connecting pipe 723 located outside the heat sink 100. Two second connecting pipes 723 are provided, which respectively connect two first flow channels 500 and two second flow channels 600.

[0123] Through the above technical solution, in cooling mode, the refrigerant enters the second flow channel 600 through the inlet of the refrigerant pipe 200, and then enters another second flow channel 600 through the second connecting pipe 723, finally flowing out through the outlet of the refrigerant pipe 200. In heating mode, after the refrigerant enters the inlet of the refrigerant pipe 200, it enters the first branch pipe 721 under the control of the valve core, then enters the first flow channel 500 through the first branch pipe 721, and then enters another first flow channel 500 through the second connecting pipe 723. Finally, it flows out through the outlet of the refrigerant pipe 200 through the second branch pipe 722. This allows the refrigerant to flow through different channels in cooling and heating modes, reducing the impact of the refrigerant temperature in the first flow channel 500 on the temperature of the heat sink 300, thereby avoiding the possibility of condensation and protecting the electronic power control devices.

[0124] In addition, this application also provides a heat pump unit, which includes a compressor for driving a refrigeration cycle.

[0125] In some embodiments, the heat pump unit includes a four-way valve for switching the refrigerant flow direction to achieve the switching between cooling and heating modes.

[0126] In some embodiments, the heat pump unit includes a first heat exchanger. When refrigerant enters the first heat exchanger, it evaporates and absorbs heat or condenses and releases heat, thereby changing the state of the refrigerant while simultaneously performing heating or cooling operations. When the refrigerant in the first heat exchanger evaporates and absorbs heat, the first heat exchanger functions as an evaporator; when the refrigerant in the first heat exchanger condenses and releases heat, the first heat exchanger functions as a condenser.

[0127] In some embodiments, the heat pump unit includes a second heat exchanger. When refrigerant enters the second heat exchanger, the refrigerant evaporates and absorbs heat or condenses and releases heat. The second heat exchanger operates on the same principle as the first heat exchanger, and the effect of the refrigerant in the second heat exchanger is opposite to that in the first heat exchanger. When the first heat exchanger acts as an evaporator, the second heat exchanger acts as a condenser; when the first heat exchanger acts as a condenser, the second heat exchanger acts as an evaporator.

[0128] In some embodiments, the heat pump unit includes a refrigerant pipe 200 for connecting a first heat exchanger and a second heat exchanger.

[0129] In some embodiments, the heat pump unit includes a throttling valve for controlling the flow rate and pressure of the refrigerant to change the physical state of the refrigerant, so as to cooperate with the refrigerant in the subsequent second heat exchanger to absorb or release heat, thereby realizing the circulation of the refrigerant in the heat pump unit.

[0130] In some embodiments, the heat pump unit includes a hydraulic module, which is a core subsystem connecting the heat pump unit to terminal devices (such as fan coil units, underfloor heating pipes, etc.). The hydraulic module is primarily responsible for regulating water circulation, stabilizing pressure, and optimizing heat transfer. When the heat pump unit is producing hot water, the hydraulic module acts as a condenser for heat transfer during refrigerant circulation.

[0131] In some embodiments, the heat pump unit includes a gas-liquid separator to prevent liquid slugging of the compressor when liquid refrigerant enters the compressor.

[0132] In some embodiments, the heat pump unit includes a refrigerant heat dissipation device, which is disposed on the refrigerant pipe 200. The refrigerant heat dissipation device is used to assist in heat dissipation or subcool the refrigerant to increase system stability.

[0133] In some embodiments, the refrigerant heat dissipation device includes a heat sink 100, through which a refrigerant pipe 200 passes.

[0134] In some embodiments, the refrigerant heat dissipation device includes a heat sink 300, which is disposed on one side of the heat sink 100. The heat sink 300 is used to accelerate heat release and improve heat exchange efficiency.

[0135] In some embodiments, the refrigerant cooling device is used to supply power to the electronically controlled power devices.

[0136] In some embodiments, refer to Figure 11 The refrigerant heat dissipation device includes a heat insulation cavity 800, which is disposed inside the heat dissipation block 100. The heat dissipation block 100 is located on both sides of the heat insulation cavity 800, which are respectively a first part and a second part. The heat insulation cavity 800 is used to increase the heat transfer between the first part and the second part, so that when the heat in the first part or the second part changes, the surface temperature of the heat dissipation plate 300 is increased, thereby improving the stability of the refrigerant heat dissipation device.

[0137] In some embodiments, the refrigerant heat dissipation device includes a first flow channel 500, which is disposed within a first portion.

[0138] In some embodiments, the refrigerant heat dissipation device includes a second flow channel 600 disposed within a second portion, and a heat dissipation plate 300 connected to one side of the second portion.

[0139] In some embodiments, the refrigerant heat dissipation device includes a connector 700, which is used to connect the refrigerant pipe 200 to the first flow channel 500 and the refrigerant pipe 200 to the second flow channel 600, or the refrigerant pipe 200 to the first flow channel 500 or the refrigerant pipe 200 to the second flow channel 600.

[0140] Through the above technical solution, by setting a first flow channel 500 and a second flow channel 600 in the refrigerant heat dissipation device, when the refrigerant in the refrigerant heat dissipation device is performing heating and cooling operations, heating and cooling pass through the first flow channel 500 and the second flow channel 600 respectively. By setting a heat insulation cavity 800, when the refrigerant passes through the first flow channel 500 in heating mode, the heat transfer efficiency between the refrigerant and the heat sink 100 is low, thereby reducing the impact on the surface temperature of the heat sink 300. At the same time, the temperature rise of the heat sink 300 under condensation conditions is less affected by the refrigerant temperature. Thus, while reducing the occurrence of temperature rise in the electronic power device, the probability of condensation is also reduced, thereby achieving dual protection for the electronic power device.

[0141] In some embodiments, the heat insulation cavity 800 includes a first heat insulation groove 801. The plane of the first heat insulation groove 801 is parallel to the heat sink 300. The first heat insulation groove 801 is located on the side of the first flow channel 500 near the heat sink 300. Since the first heat insulation groove 801 does not transfer heat, heat is difficult to conduct through this area, thereby reducing heat dissipation efficiency. This reduces the influence of the refrigerant temperature in the first flow channel 500 on the temperature of the heat sink 100, making the temperature of the heat sink 300 higher than the air dew point temperature, thereby reducing the possibility of condensation.

[0142] In some embodiments, the heat insulation cavity 800 includes a second heat insulation groove 802. The plane of the second heat insulation groove 802 is perpendicular to the heat sink 300. The second heat insulation groove 802 is connected to the first heat insulation groove 801. The second heat insulation groove 802 further increases the difficulty of heat transfer, thereby reducing the influence of the refrigerant temperature in the first flow channel 500 on the temperature of the heat sink 100.

[0143] In some embodiments, the heat insulation cavity 800 includes a third heat insulation groove 803. The plane of the third heat insulation groove 803 is parallel to the plane of the heat sink 300. The third heat insulation groove 803 is located on the side of the first flow channel 500 away from the heat sink 300. The third heat insulation groove 803 communicates with the second heat insulation groove 802. The third heat insulation groove 803 further increases the difficulty of heat transfer, thereby reducing the impact of the refrigerant temperature in the first flow channel 500 on the temperature of the heat sink 300. Simultaneously, the first heat insulation groove 801, the second heat insulation groove 802, and the third heat insulation groove 803 together form a heat insulation zone, within which the first flow channel 500 is located. By setting the heat insulation zone, the temperature within the first flow channel 500 is difficult to transfer to the heat sink 300. Therefore, when the temperature of the heat sink 300 rises above the target temperature, the temperature of the heat sink 300 exceeds the dew point temperature of the ambient air, thus preventing condensation on the surface of the heat sink 300 and protecting the electronically controlled power devices.

[0144] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A refrigerant heat dissipation device for cooling the electronic control power devices of a heat pump unit, characterized in that, It includes: Heat sink; A heat insulation component is disposed within the heat dissipation block, the heat insulation component dividing the heat dissipation block into a first part and a second part; At least one first flow channel is disposed within the first portion; At least one second flow channel is provided within the second portion, and the first flow channel and the second flow channel are not connected; A connector for connecting a refrigerant pipe to the first flow channel, and / or, a connector for connecting a refrigerant pipe to the second flow channel; A heat sink, which is fixedly connected to the heat sink block; The refrigerant flows through a different channel during the refrigeration cycle than during the heating cycle.

2. The refrigerant heat dissipation device according to claim 1, characterized in that, The second flow channel includes multiple interconnected connecting channels.

3. The refrigerant heat dissipation device according to claim 2, characterized in that, The connection channel is located entirely within the second part and connects to multiple channels.

4. The refrigerant heat dissipation device according to claim 2, characterized in that, The connection channel includes: A first connecting segment, the first connecting segment passing through the opposite side walls of the heat sink; The second connecting section extends through the opposite side walls of the heat sink; The third connecting section extends through the opposite side walls of the heat sink; The second flow channel further includes a first connecting pipe, which is used to connect the first connecting segment, the second connecting segment and the third connecting segment to form a passage, and the first connecting pipe is located outside the second part.

5. The refrigerant heat dissipation device according to claim 2, characterized in that, There are at least two connecting parts, and each connecting part is a one-way valve. One of the one-way valves is connected to the output end of the first flow channel and the input end of the second flow channel. The other one-way valve is connected to the output end of the second flow channel and the input end of the first flow channel.

6. The refrigerant heat dissipation device according to claim 5, characterized in that, The one-way valve includes: The first branch pipe is connected to the refrigerant pipe inlet and the first flow channel inlet. The second branch pipe is connected to the output end of the first flow channel and the output end of the refrigerant pipe; The valve core is located at the connection between the first branch pipe and the refrigerant pipe inlet or the connection between the second branch pipe and the refrigerant pipe outlet. The valve core is used to switch the first branch pipe and the second branch pipe to control the refrigerant flow path.

7. The refrigerant heat dissipation device according to any one of claims 1 to 4, characterized in that, The connectors are at least two and are located at both ends of the heat sink; The connector is a diversion cover, the open end of which is connected to the heat sink, and a sealed cavity is formed between the diversion cover and the heat sink; the diversion cover has a connection port that is connected to the refrigerant pipe.

8. The refrigerant heat dissipation device according to claim 7, characterized in that, The connection ports on the two diversion covers correspond to the first flow channel and the second flow channel, respectively.

9. A heat pump unit, characterized in that, It includes: First heat exchanger; The second heat exchanger is connected to the first heat exchanger via a refrigerant pipe; The refrigerant heat dissipation device as described in any one of claims 1-8; The surface of the heat sink away from the heat sink block is in contact with the electronically controlled power device.

10. The heat pump unit according to claim 9, characterized in that, The heat insulation component includes: First heat insulation groove; Second heat insulation groove; Third heat insulation groove; The first heat insulation groove, the second heat insulation groove, and the third heat insulation groove together enclose a heat insulation zone, and the first flow channel is located within the heat insulation zone.

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