Case and measuring equipment

Abstract

The utility model discloses a case and measuring equipment, and relates to the technical field of detection equipment, and the case comprises a case body, a bus backboard and a processor module. An accommodating space is limited by the box body; the bus backboard is arranged in the accommodating space of the box body; the processor module comprises a bridge piece carrier plate and a core plate, the bridge piece carrier plate is integrated on the bus backboard, and the core plate is detachably arranged on the bridge piece carrier plate. According to the case provided by the invention, the core board can be detachably arranged on the bridge chip carrier board, so that the function expansion of the case can be conveniently realized, and the bridge chip carrier board is integrated on the bus backboard, so that compared with the traditional mode that a 3U PXIe board card is inserted into a slot of the bus backboard, a notch of the bus backboard can be saved, and meanwhile, the space in the case body is saved; the volume of the case can be reduced, so that the expandability of the performance of the case can be realized while the volume of the case is reduced.

Description

Technical Field

[0001] This application relates to the field of military equipment technology, and more specifically, to a chassis and measuring device. Background Technology

[0002] Distributed technology, characterized by resource sharing, decentralized operation, centralized management, collaborative work, and real-time interaction, will become the main development direction for new equipment support-level standard testing systems. Distributed microwave signal source equipment will also become a key technological development direction for microwave signal source equipment. The microwave signal source chassis (hereinafter referred to as the signal source chassis), as a major component of distributed microwave signal source equipment, provides structural support, power conversion, bus interconnection, display control, signal monitoring, parallel test control, and health management functions for the signal source equipment. It works in conjunction with service boards to realize the construction of microwave signal source service functions.

[0003] Signal source chassis typically use 3U PXIE chassis, and traditional 3U PXIE chassis usually use external 3U PXIe boards, which are plugged into slots on the bus backplane. The specifications are generally fixed, and performance expansion is not possible. This also results in traditional signal source chassis being large and heavy.

[0004] In addition, signal source chassis typically use a traditional external keyboard and a 6.5-inch industrial screen. By plugging the keyboard into the port of the signal source chassis, the control of the signal source chassis is achieved, resulting in a poor human-machine experience. At the same time, when pairing and testing, an aviation plug adapter cable connector must be provided separately, which makes the aviation plug adapter cable connector easy to be lost.

[0005] Therefore, how to reduce the size of the chassis while achieving scalability of chassis performance has become a technical problem that urgently needs to be solved by those skilled in the art. Utility Model Content

[0006] In view of this, the purpose of this application is to provide a chassis that can reduce chassis size while achieving scalability of chassis performance.

[0007] Another object of this application is to provide a measuring device having the above-described chassis.

[0008] To achieve the above objectives, this application provides the following technical solution:

[0009] A chassis, comprising:

[0010] The enclosure, which defines the storage space;

[0011] The bus backplane is located within the housing space of the enclosure;

[0012] The processor module includes a bridge chip carrier board and a core board, wherein the bridge chip carrier board is integrated on the bus backplane and the core board is detachably mounted on the bridge chip carrier board.

[0013] Optionally, the aforementioned chassis also includes a liquid crystal display component with touch functionality. The liquid crystal display component is located at one end of the chassis and is connected to the first power supply interface and the signal interface of the bus backplane, respectively. The first power supply interface, the signal interface, and the processor module are located on the same side of the bus backplane.

[0014] Optionally, the aforementioned chassis also includes an 8HP power supply module, which is plugged into the side of the bus backplane opposite to the processor module.

[0015] Optionally, in the aforementioned chassis, an electrical interface is provided at the end of the chassis opposite to the liquid crystal display component, and the electrical interface is connected to the power module.

[0016] Optionally, in the aforementioned chassis, the chassis has a front cover plate, the liquid crystal display assembly is fixed on the front cover plate, and the front cover plate is provided with a modulation output port and an interface adapter plate. The modulation output port is plugged into the connection port on the bus backplane, and the interface adapter plate is connected to the first power supply interface.

[0017] Optionally, the aforementioned chassis also includes a standard board with a size of 4HP, which is plugged into the side of the bus backplane opposite to the processor module.

[0018] Optionally, in the aforementioned chassis, a functional interface is also provided at the end of the chassis opposite to the liquid crystal display component, and the functional interface is connected to the standard board.

[0019] Optionally, in the aforementioned chassis, multiple cooling fans are respectively provided on both sides of the bus backplane, and each of the cooling fans is connected to the second power supply interface on the bus backplane.

[0020] Optionally, in the aforementioned chassis, the core board is a COME core board; and / or,

[0021] Both ends of the housing are respectively provided with grips to facilitate moving the housing; and / or,

[0022] The bottom of the enclosure is provided with support legs for supporting the enclosure.

[0023] A measuring device comprising a chassis as described in any of the preceding claims.

[0024] The chassis provided in this application integrates the bridge chip carrier board onto the bus backplane located within the chassis's housing space, while the core board is detachably mounted on the bridge chip carrier board. When the chassis requires functional expansion, only the core board needs to be removed and replaced with a motherboard for other functions, thereby improving the convenience of chassis functional expansion. As can be seen from the above example, the chassis provided in this application can facilitate chassis functional expansion by detachably mounting the core board onto the bridge chip carrier board. Furthermore, the integration of the bridge chip carrier board onto the bus backplane saves on bus backplane slots compared to the traditional method of using 3U PXIe cards plugged into bus backplane slots, thus saving space within the chassis and reducing the chassis size. This allows for both a smaller chassis size and scalability of chassis performance.

[0025] The technical features mentioned above, those to be mentioned below, and those shown individually in the accompanying drawings can be combined arbitrarily, provided that the combined technical features are not contradictory. All feasible combinations of features are the technical content explicitly described herein. Any one of the multiple sub-features contained in the same statement can be applied independently, without necessarily being applied together with other sub-features. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of this application. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0027] Figure 1 This is a schematic diagram of the internal structure of the chassis provided in an embodiment of this application;

[0028] Figure 2 A front view of the chassis provided in an embodiment of this application;

[0029] Figure 3 A side view of the chassis provided in an embodiment of this application;

[0030] Figure 4 This is a top view of the chassis provided in an embodiment of this application.

[0031] Among them, 100 is the enclosure, 10 is the bus backplate, 20 is the processor module, 30 is the power module, 40 is the LCD display component, 50 is the front cover, 60 is the standard board, 70 is the cooling fan, 80 is the grip, and 90 is the support foot.

[0032] 11 is the first power supply interface, 12 is the signal interface, 13 is the connection port, and 14 is the second power supply interface;

[0033] 21 is the bridge plate carrier, and 22 is the core plate;

[0034] 31 is the electrical interface;

[0035] 51 is the modulation output port, and 52 is the interface adapter board;

[0036] 61 is the functional interface, 611 is the LAN interface, and 612 is the RS422 interface;

[0037] 71 is a heat dissipation mesh plate;

[0038] 101 is the synchronous input port, 102 is the RF input interface, and 103 is the RF output interface. Detailed Implementation

[0039] The core of this application is to provide a chassis that can reduce chassis size while achieving scalability of chassis performance.

[0040] Another key aspect of this application is to provide a measuring device having the aforementioned chassis.

[0041] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0042] Therefore, this application discloses a chassis including a chassis 100, a bus backplane 10, and a processor module 20. A core board 22 is detachably mounted on a bridge carrier board 21, facilitating functional expansion of the chassis. Furthermore, the bridge carrier board 21 is integrated onto the bus backplane 10. Compared to the traditional method of using 3U PXIe cards plugged into slots on the bus backplane 10, this saves space on the bus backplane 10 and conserves space within the chassis 100, reducing the chassis size. This allows for both reduced chassis size and scalability of chassis performance.

[0043] The following will combine Figures 1 to 4 The chassis disclosed in the embodiments of this application will be explained and described in detail.

[0044] Among them, such as Figures 1 to 4As shown, the enclosure 100 can adopt a cuboid structure, and the enclosure 100 can form an accommodating space, within which the bus backplane 10 can be located. Meanwhile, the processor module 20 includes a bridge chip carrier 21 and a core board 22. The core board 22 is detachably mounted on the bridge chip carrier 21, facilitating replacement of the core board 22 to achieve functional expansion of the chassis. Furthermore, the bridge chip carrier 21 can be integrated onto the bus backplane 10. Compared to the traditional method of using 3U PXIe cards plugged into slots on the bus backplane 10, this saves slot space on the bus backplane 10 and conserves space within the enclosure 100, thus reducing the overall size of the chassis.

[0045] In some embodiments, the core plate 22 and the bridge plate carrier 21 can be connected by connectors, such as plugs and sockets, to ensure reliable electrical connection and easy insertion and removal. Alternatively, threaded holes can be provided at the four corners of the bridge plate carrier 21 and the core plate 22, and through holes can be provided at corresponding positions on the core plate 22, allowing the core plate 22 and the bridge plate carrier 21 to be connected and fixed by fasteners such as bolts. Furthermore, one of the core plate 22 and the bridge plate carrier 21 can be provided with guide posts or positioning holes, and the other can be provided with positioning pins. This means that either the core plate 22 has guide posts or positioning holes, and the bridge plate carrier 21 has positioning pins, or vice versa. This ensures precise alignment between the core plate 22 and the bridge plate carrier 21, prevents misalignment during installation, and enhances the mechanical strength between the core plate 22 and the bridge plate carrier 21.

[0046] In some embodiments, such as Figure 1 As shown, the core board 22 can be a COME core board (COM ExpressModule) to integrate core components such as computing, storage, and display control onto a small module. This allows for expansion of peripheral interfaces via the bridge chip carrier board 21, flexibly meeting different needs. In this embodiment, the COME core board can use a Loongson 3A6000C CPU. Of course, performance expansion of computing and storage capabilities can also be achieved by upgrading the core board 22; that is, the core board 22 can use a higher-performance Phytium module to realize the functions of the COME core board.

[0047] The chassis disclosed in this application integrates the bridge chip carrier board 21 onto the bus backplane 10 located within the housing space of the chassis 100, while the core board 22 is detachably mounted on the bridge chip carrier board 21. When the chassis requires functional expansion, only the core board 22 needs to be removed and replaced with a motherboard with other functions, thereby improving the convenience of chassis functional expansion.

[0048] The chassis disclosed in this application embodiment can be detachably mounted on the bridge chip carrier 21 via the core board 22, thereby facilitating the functional expansion of the chassis. Furthermore, the bridge chip carrier 21 is integrated on the bus backplane 10. Compared with the traditional method of using 3U PXIe cards to be plugged into the slots of the bus backplane 10, this method can save the slots of the bus backplane 10 and save space within the chassis 100, thereby reducing the size of the chassis. In this way, the chassis performance can be expanded while reducing the chassis size.

[0049] In some embodiments, such as Figure 1 , Figure 2 and Figure 4 As shown, the chassis may also include a touch-sensitive LCD display component 40, located at one end of the chassis 100. The LCD display component 40 is connected to the first power supply interface 11 and the signal interface 12 of the bus backplane 10, respectively. The first power supply interface 11, the signal interface 12, and the processor module 20 can be located on the same side of the bus backplane 10, allowing the chassis to be controlled via the touch LCD display component 40. This achieves an integrated display and control design, improving the human-machine interface experience. Optionally, the LCD display component 40 can be a 12.3-inch industrial high-brightness touchscreen, and the touchscreen can have a virtual keyboard, thereby optimizing the human-machine interaction experience by using a large-size touchscreen.

[0050] In some embodiments, such as Figure 1 As shown, the chassis may also include an 8HP power supply module 30, which can be plugged into the side of the bus backplane 10 opposite to the processor module 20 to power the various functional modules connected to the bus backplane 10. By using an 8HP power supply module 30 plugged into the bus backplane 10 to power the various functional modules connected to the bus backplane 10, the number of cables can be reduced, the internal space occupied by the chassis 100 can be reduced, and the overall size of the chassis can be further reduced. It should be noted that HP refers to the size of the power supply module 30, and 8HP power supply module 30 means that the width of the power supply module 30 is approximately 40.64mm.

[0051] In some embodiments, such as Figure 1 As shown, an electrical interface 31 is provided at the end of the enclosure 100 opposite to the liquid crystal display assembly 40, and the electrical interface 31 is connected to the power supply module 30 to supply power to the enclosure. It should be noted that the electrical interface 31 may include a switch, a fuse, and an AC220V interface.

[0052] In some embodiments, such as Figure 1 , Figure 2 and Figure 4As shown, the enclosure 100 may have a front cover 50, and the liquid crystal display assembly 40 may be fixed on the front cover 50. At the same time, the front cover 50 may be provided with a modulation output port 51 and an interface adapter board 52, wherein the modulation output port 51 can be plugged into the connection port 13 on the bus back panel 10, and the interface adapter board 52 can be connected to the first power supply interface 11.

[0053] In some embodiments, such as Figure 1 As shown, the chassis may also include a standard board 60 with a size of 4HP, and the standard board 60 can be plugged into the side of the bus backplane 10 away from the processor module 20 to realize the functional expansion of the chassis, improve the chassis performance, and increase the number of interfaces, so that the chassis can meet diverse needs.

[0054] In some embodiments, such as Figure 1 As shown, a function interface 61 is also provided at the end of the enclosure 100 opposite to the liquid crystal display component 40, and the function interface 61 is connected to the standard board 60 to realize function expansion. It should be noted that the function interface 61 may include a LAN interface 611 and an RS422 interface 612, etc. It should also be noted that, in order to meet the actual use requirements of the enclosure, a synchronization input port 101, an RF input interface 102, and an RF output interface 103 are also provided at the end of the enclosure 100 opposite to the liquid crystal display component 40.

[0055] In some embodiments, such as Figure 1 As shown, multiple cooling fans 70 can be respectively provided on both sides of the bus backplane 10, that is, at least two cooling fans 70 can be provided on each side of the bus backplane 10 to provide effective heat dissipation for the chassis during operation. At the same time, each cooling fan 70 is connected to the second power supply interface 14 on the bus backplane 10 so that power can be supplied to the cooling fan 70 through the bus backplane 10. In addition, as Figure 4 As shown, a heat dissipation mesh plate 71 is provided on the top of the enclosure 100 so that the interior of the enclosure 100 can be connected to the exterior of the enclosure 100 through the heat dissipation mesh plate 71, thereby achieving efficient heat dissipation of the enclosure.

[0056] In some embodiments, symmetrical grips 80 are provided at both ends of the housing 100 to facilitate moving the housing, thereby allowing operators to move the housing under different operating conditions using the grips 80. Meanwhile, four support legs 90 are provided at the bottom of the housing 100 to support the housing and ensure its stability during operation.

[0057] like Figures 1 to 4As shown in the embodiments of this application, the chassis disclosed, through an integrated display and control design, enables the separate functions of display, control, calculation, and signal monitoring to be designed into independent complete units, and achieves a high degree of integration of display, control, and other circuits. Simultaneously, the electrical interface 31 directly interfaces with the power module 30 inside the chassis 100, reducing the overall depth h of the chassis to no more than 600mm, thereby enabling a miniaturized design of the chassis 100.

[0058] This application also discloses a measuring device, including a chassis, which is the same chassis disclosed in the above embodiments. Therefore, the chassis has all the technical effects of the above-mentioned chassis, and will not be repeated here.

[0059] The terms "first" and "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish different objects, not to describe a specific order. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or apparatus that includes a series of steps or units may include steps or units not listed, but rather not listed.

[0060] The above description of the disclosed embodiments enables those skilled in the art to make or use this application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A chassis, characterized in that, include: A housing (100) that defines an accommodating space; The bus backplate (10) is disposed within the housing (100); The processor module (20) includes a bridge chip carrier board (21) and a core board (22). The bridge chip carrier board (21) is integrated on the bus backplane (10), and the core board (22) is detachably disposed on the bridge chip carrier board (21).

2. The chassis according to claim 1, characterized in that, It also includes a touch-enabled liquid crystal display component (40), which is located at one end of the housing (100) and is connected to the first power supply interface (11) and the signal interface (12) of the bus backplane (10), respectively. The first power supply interface (11), the signal interface (12) and the processor module (20) are located on the same side of the bus backplane (10).

3. The chassis according to claim 2, characterized in that, It also includes a power module (30) with a specification size of 8HP, which is plugged into the side of the bus backplane (10) away from the processor module (20).

4. The chassis according to claim 3, characterized in that, An electrical interface (31) is provided at the end of the housing (100) opposite to the liquid crystal display component (40), and the electrical interface (31) is connected to the power module (30).

5. The chassis according to claim 2, characterized in that, The enclosure (100) has a front cover plate (50), the liquid crystal display assembly (40) is fixed on the front cover plate (50), and the front cover plate (50) is provided with a modulation output port (51) and an interface adapter plate (52). The modulation output port (51) is plugged into the connection port (13) on the bus back plate (10), and the interface adapter plate (52) is connected to the first power supply interface (11).

6. The chassis according to claim 2, characterized in that, It also includes a standard board (60) with a specification size of 4HP, which is plugged into the side of the bus backplane (10) away from the processor module (20).

7. The chassis according to claim 6, characterized in that, The housing (100) is also provided with a functional interface (61) at the end opposite to the liquid crystal display component (40), and the functional interface (61) is connected to the standard board (60).

8. The chassis according to claim 1, characterized in that, Multiple cooling fans (70) are provided on both sides of the bus backplate (10), and each cooling fan (70) is connected to the second power supply interface (14) on the bus backplate (10).

9. The chassis according to any one of claims 1 to 8, characterized in that, The core board (22) is a COME core board; and / or, Both ends of the housing (100) are respectively provided with grips (80) to facilitate moving the housing; and / or, The bottom of the enclosure (100) is provided with support legs (90) for supporting the enclosure.

10. A measuring device, characterized in that, Includes the chassis as described in any one of claims 1 to 9.

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