Laser welding device and display device repairing system

Abstract

The utility model relates to a laser welding device and a display device repairing system, and the laser welding device comprises a laser device which is used for emitting laser which is directly irradiated on the surface of a chip; the pressing assembly comprises a light-transmitting plate, and laser light emitted by the laser device is suitable for penetrating through the light-transmitting plate; and the pressing driving assembly is in driving connection with the pressing assembly so as to drive the pressing assembly to move along the emission direction of the laser and enable the light-transmitting plate to be tightly pressed on the surface of the chip. The chip is pressed on the bonding pad through the light-transmitting plate, the laser directly irradiates the surface of the chip through the laser device, the laser penetrates through the light-transmitting plate to heat the chip, the heating effect and heating uniformity of the chip are optimized, and the welding quality of the chip is improved.

Description

Technical Field

[0001] This application relates to the field of chip welding technology, and in particular to a laser welding device and a display device repair system. Background Technology

[0002] MicroLED (micro-light-emitting diode) display devices are widely used due to their advantages such as small size, low power consumption, high brightness, high color saturation, fast response, and long lifespan. To improve the yield of MicroLED display devices, the current manufacturing process involves precise addressing detection and repair of the LED chips after transfer, eliminating any non-displayable chips and thus improving the overall yield.

[0003] Chips to be transferred are typically arranged in batches on a spare substrate. When a defective point on the substrate to be repaired needs to be fixed, the chip is picked up from the spare substrate and then transferred to the defective point on the substrate to be repaired. Generally, the chip is picked up using methods such as adhesive bonding, adsorption, or magnetism. After picking up the chip, it is placed at the defective point and fixed in place.

[0004] In related technologies, laser irradiation is used to heat the chip, thereby soldering and fixing the chip onto pads at defect locations. Generally, while laser irradiation is used to fix the chip, it is also necessary to press the chip firmly onto the pads to ensure the quality of the chip soldering and avoid cold solder joints.

[0005] Because of the small size of the chip, the area of ​​the chip surface that is obscured after being pressed against the chip surface is too large, which adversely affects the heating effect of the chip. In addition, because the space above the chip is occupied by the pressing component, the laser can only be tilted to irradiate the chip surface, resulting in uneven energy of the laser spot on the chip surface. This leads to uneven heating of the chip surface and makes it prone to soldering defects such as cold solder joints. Utility Model Content

[0006] This application provides a laser welding device and a display device repair system to solve the technical problems in related technologies, such as poor chip heating effect, uneven heating of chip surface, and easy occurrence of defects such as cold solder joints.

[0007] In a first aspect, a laser welding apparatus is provided, comprising:

[0008] A laser for emitting laser light that is directly incident on the surface of a chip;

[0009] A pressing assembly, the pressing assembly including a light-transmitting plate, wherein the laser emitted by the laser is adapted to pass through the light-transmitting plate;

[0010] A pressing drive assembly is connected to the pressing assembly to drive the pressing assembly to move along the emission direction of the laser and press the light-transmitting plate against the chip surface.

[0011] In some embodiments, the pressing drive includes:

[0012] A first driving member is connected to the pressing assembly to drive the pressing assembly to move along the emission direction of the laser;

[0013] The second driving member is driven to be connected to the pressing assembly to move the pressing assembly away from the optical path of the laser emitted by the laser, or to place the light-transmitting plate of the pressing assembly in the optical path of the laser emitted by the laser.

[0014] In some embodiments, the driving form of the second driving member includes linear driving or curvilinear driving.

[0015] In some embodiments, the pressing assembly further includes a connecting plate with a mounting groove, the light-transmitting plate being embedded in the mounting groove to be connected to the connecting plate, and the pressing drive assembly being connected to the connecting plate.

[0016] In some embodiments, the bottom of the light-transmitting plate protrudes beyond the bottom surface of the connecting plate.

[0017] In some embodiments, the laser welding apparatus further includes a pressure sensor for measuring the pressure exerted by the pressing assembly on the chip.

[0018] In some embodiments, the laser is arranged vertically to act on the horizontally placed chip.

[0019] The beneficial effects of the technical solution provided in this application include:

[0020] This application provides a laser welding apparatus. When welding and fixing a chip, a pressing drive assembly drives a pressing assembly to press the chip firmly onto the pads at the defect points of the substrate to be repaired. The light-transmitting plate of the pressing assembly presses the chip firmly. On one hand, this prevents the chip from shifting during welding, ensuring welding accuracy and ensuring the chip adheres tightly to the pads, reducing the likelihood of incomplete soldering and improving welding quality. On the other hand, the laser emitted by the laser passes through the light-transmitting plate and directly reaches the chip surface. The laser is not blocked during transmission and is entirely directed at the chip, ensuring sufficient energy reaching the chip surface, optimizing the heating effect, and guaranteeing welding quality. Furthermore, because the laser is directly incident, the energy of the laser spot formed on the chip surface is more uniform, improving the heating uniformity of the chip and thus enhancing the quality of chip welding.

[0021] Secondly, a display device repair system is provided, including the laser welding apparatus described above.

[0022] In some embodiments, the display device repair system further includes a repair component, the repair component comprising:

[0023] A repair platform, used to support the substrate to be repaired;

[0024] A repair drive assembly is connected to the repair stage to drive multiple defect points on the substrate to be repaired to move sequentially to the irradiation point of the laser.

[0025] In some embodiments, the display device repair system further includes a transfer component, the transfer component comprising:

[0026] Transfer rack;

[0027] A pickup head, the pickup head being adapted to pick up the chip;

[0028] A transfer drive assembly is mounted on the transfer frame and is connected to the pickup head drive assembly to drive the pickup head to move in the front-back, left-right, and up-down directions.

[0029] Another embodiment of this application provides a display device repair system. Since the display device repair system includes the laser welding device described above, the beneficial effects of the display device repair system are the same as those of the laser welding device described above, and will not be repeated here. Attached Figure Description

[0030] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0031] Figure 1 A schematic diagram of the laser welding apparatus provided in the embodiments of this application;

[0032] Figure 2 A front view of the laser welding apparatus provided in the embodiments of this application;

[0033] Figure 3 A schematic diagram of a light-transmitting plate pressing a chip according to an embodiment of this application;

[0034] Figure 4 This is a schematic diagram of a display device repair system provided in another embodiment of this application.

[0035] In the figure: 1. Laser; 2. Pressing assembly; 21. Light-transmitting plate; 22. Connecting plate; 3. Pressing drive assembly; 31. First drive component; 32. Second drive component; 4. Repair assembly; 41. Repair stage; 42. Repair drive assembly; 5. Transfer assembly; 51. Transfer frame; 52. Pick-up head; 53. Transfer drive assembly; 6. Substrate to be repaired; a. Chip. Detailed Implementation

[0036] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0037] This application provides a laser welding apparatus and a display device repair system. It utilizes a light-transmitting plate to press a chip onto a solder pad, and a laser beam is directly shone onto the chip surface. The laser passes through the light-transmitting plate to heat the chip, optimizing the heating effect and uniformity, and improving the welding quality. This application solves the technical problems in related technologies such as poor chip heating effect, uneven heating of the chip surface, and the tendency for defects such as cold solder joints.

[0038] Reference Figures 1-3 A laser welding apparatus includes a laser 1, a pressing assembly 2, and a pressing drive assembly 3. The pressing drive assembly 3 drives the pressing assembly 2 to press the chip a onto the pad at the defect point of the substrate 6 to be repaired. The laser 1 irradiates the surface of the chip a, and the laser passes through the pressing assembly 2 and shines directly on the surface of the chip a to heat the chip a and weld the chip a to the pad.

[0039] This configuration ensures that chip a is firmly attached to the pads and prevents chip a from shifting, thus improving the fixation accuracy and welding quality of chip a. Furthermore, because the laser passes through the pressing component 2 and falls onto the surface of chip a, the laser energy is transferred to the surface of chip a to the maximum extent, optimizing the heating effect on chip a. The direct laser beam onto the surface of chip a also results in more uniform heating, further improving the welding quality.

[0040] Reference Figures 1-3 The pressing assembly 2 includes a light-transmitting plate 21, and the laser emitted by the laser 1 is adapted to pass through the light-transmitting plate 21 and fall onto the surface of the chip a. In this embodiment, the light-transmitting plate 21 includes a glass plate.

[0041] This configuration, through the light-transmitting plate 21, supports direct laser illumination onto the surface of chip a, thereby improving the uniformity of heating chip a.

[0042] Preferably, the light-transmitting plate 21 is parallel to the plane of the substrate 6 to be repaired, ensuring that the laser passes through the light-transmitting plate 21 perpendicularly, reducing energy damage, and the optical path is difficult to change, ensuring that the laser shines directly onto the surface of chip a.

[0043] Reference Figures 1-3 The pressing drive assembly 3 is connected to the pressing assembly 2. The pressing drive assembly 3 drives the pressing assembly 2 to move along the emission direction of the laser 1, that is, along the optical path of the emitted laser. Under the drive of the pressing drive assembly 3, the light-transmitting plate 21 of the pressing assembly 2 is pressed against the surface of the chip a, and then the laser emitted by the laser 1 passes through the light-transmitting plate 21 to irradiate the surface of the chip a.

[0044] This configuration allows the light-transmitting plate 21 to press firmly against chip a, ensuring that chip a is in close contact with the pads and preventing chip a from shifting, thus improving the fixing accuracy and welding quality of chip a. Furthermore, the light-transmitting plate 21 supports direct laser illumination onto the surface of chip a without obstructing it, optimizing the heating effect of the laser on chip a and making the heating of the chip a surface more uniform, thereby improving the welding quality.

[0045] Reference Figures 1-3 Specifically, the pressing drive assembly 3 includes a first driving member 31, which is drivenly connected to the pressing assembly 2 to drive the pressing assembly 2 to move in the emission direction of the laser 1. This achieves the pressing of the light-transmitting plate 21 onto the surface of the chip a. In this embodiment, the first driving member 31 includes a linear motor or a lead screw mechanism.

[0046] With this setup, during the process of moving chip a to the defect location, the pressing component 2 rises to make room for chip a. After chip a is placed at the defect location, the pressing component 2 descends to press chip a firmly, thus satisfying the subsequent chip a welding process.

[0047] Reference Figures 1-3 The pressing drive assembly 3 further includes a second drive member 32, which is drivenly connected to the pressing assembly 2. In this embodiment, the first drive member 31 is driven to connect with the pressing assembly 2 by driving the second drive member 32. In other embodiments, the second drive member 32 is driven to connect with the pressing assembly 2 by driving the first drive member 31. The second drive member 32 drives the pressing assembly 2 to move away from the optical path of the laser emitted by the laser 1, or places the light-transmitting plate 21 of the pressing assembly 2 in the optical path of the laser emitted by the laser 1.

[0048] Specifically, the second driving member 32 drives the pressing assembly 2 to move on the vertical plane of the laser 1 emission direction, so that the pressing assembly 2 is in the optical path of the laser emitted by the laser 1, or the pressing assembly 2 moves away from the optical path emitted by the laser 1.

[0049] This configuration moves the pressing assembly 2 away from the laser beam path emitted by the laser 1, allowing the pressing assembly 2 to move away from the laser 1's emission position. This creates space for the mechanism that picks up and transfers chip a to move between the laser 1 and the substrate 6 to be repaired, thus providing space for chip a to be placed at the defect location.

[0050] Reference Figures 1-3 Specifically, the driving form of the second driving member 32 includes linear driving or curvilinear driving. When the second driving member 32 is linearly driven, it includes a linear motor or a lead screw mechanism; when the second driving member 32 is curvilinearly driven, it includes a turntable. In this embodiment, the second driving member 32 drives the pressing assembly 2 to move in a linear driving form.

[0051] Reference Figures 1-3 The pressing assembly 2 further includes a connecting plate 22, which has a mounting groove. The light-transmitting plate 21 is embedded in the mounting groove and connected to the connecting plate 22. The pressing drive assembly 3 is connected to the connecting plate 22 by bolts.

[0052] This configuration connects the light-transmitting plate 21 to the pressing drive assembly 3 via the connecting plate 22, providing an installation position for the light-transmitting plate 21 and facilitating its miniaturized arrangement. This reduces the processing difficulty and saves on processing costs. Furthermore, since the light-transmitting plate 21 repeatedly presses against the chip a, it is easy to replace the light-transmitting plate 21 after it wears out.

[0053] Reference Figures 1-3 Furthermore, the bottom of the light-transmitting plate 21 protrudes beyond the bottom surface of the connecting plate 22.

[0054] With this configuration, since the spacing between chips a on the substrate 6 to be repaired is small, by protruding the bottom of the light-transmitting plate 21, when pressing the chip a at the defect point, only the light-transmitting plate 21 presses the chip a, and the connecting plate 22 does not contact the chips a around the defect point, thus ensuring that the light-transmitting plate 21 presses the chip a tightly, and the chips a around the defect point do not interfere with the downward pressing of the light-transmitting plate 21.

[0055] Optionally, the laser welding apparatus further includes a pressure sensor for measuring the pressure exerted by the pressing assembly 2 on the chip a.

[0056] In this embodiment, a pressure sensor is arranged between the connecting plate 22 and the driving end of the pressing drive assembly 3 to measure the force exerted by the pressing assembly 2 on the chip a. The pressure sensor includes a pressure sensor.

[0057] This configuration allows for the measurement and monitoring of the pressing force exerted on chip a by the pressing component 2 via a pressure sensor. This prevents excessive pressure on chip a, which could damage it, and also avoids insufficient pressure, which could result in chip a not adhering properly to the solder pads. This ensures the quality of the soldering process.

[0058] Reference Figures 1-3 In this embodiment, the substrate 6 to be repaired is placed horizontally, and the chip a is horizontal. The pressing assembly 2 moves vertically to press the chip a, and the laser 1 is arranged vertically, with the laser passing through the light-transmitting plate 21 vertically and directly onto the surface of the chip a. In other embodiments, the laser 1 is arranged horizontally or inclined to the horizontal direction, which is not limited here. Correspondingly, the plane where the substrate 6 to be repaired and the chip a are located is perpendicular to the laser 1's emission direction.

[0059] This application provides a laser welding apparatus. When welding and fixing chip a, the pressing drive assembly 3 drives the pressing assembly 2 to press chip a firmly onto the pad at the defect point of the substrate 6 to be repaired. The light-transmitting plate 21 of the pressing assembly 2 presses chip a firmly. On the one hand, chip a is less likely to shift during welding, ensuring welding accuracy and ensuring chip a close fit to the pad, reducing the likelihood of incomplete soldering and improving welding quality. On the other hand, the laser emitted by laser 1 passes through the light-transmitting plate 21 and directly hits the surface of chip a. The laser is not blocked during transmission and is entirely directed at chip a, ensuring sufficient energy reaching the surface of chip a, optimizing the heating effect, and guaranteeing welding quality. Furthermore, because the laser is directly incident, the energy of the laser spot formed on the surface of chip a is more uniform, improving the heating uniformity of chip a and thus improving the welding quality of chip a.

[0060] Reference Figure 4 Another embodiment of this application provides a display device repair system, including the laser welding apparatus as described above, and further including a repair component 4 and a transfer component 5.

[0061] Reference Figure 4 The repair component 4 includes a repair platform 41 and a repair drive component 42. The repair platform 41 supports the substrate 6 to be repaired. In this embodiment, by creating adsorption holes on the surface of the repair platform 41, the substrate 6 is adsorbed and fixed onto the repair platform 41 using negative pressure. The laser welding device is arranged at intervals from the supporting surface of the repair platform 41. In this embodiment, the surface of the repair platform 41 used to support the substrate 6 is perpendicular to the emission direction of the laser 1.

[0062] The repair drive assembly 42 is driven to the repair stage 41 to move the repair stage 41 in a plane perpendicular to the emission direction of the laser 1. In this embodiment, the repair stage 41 is arranged horizontally, the laser welding device is located above the repair stage 41, and the repair drive assembly 42 drives the repair stage 41 to move in the horizontal plane.

[0063] The repair drive assembly 42 drives the repair stage 41 to move, so that multiple defect points on the substrate 6 to be repaired on the repair stage 41 are sequentially sent to the irradiation point of the laser 1 of the laser welding device.

[0064] With this setup, the defect point is positioned at the irradiation point of the laser 1 by the movement of the repair stage 41. The laser 1 remains unchanged, and the light spot generated by the laser emitted by the laser 1 on the substrate 6 to be repaired remains unchanged. Therefore, as different defect points move to the irradiation point of the laser 1, the light spot generated by the laser 1 at the defect point is consistent, thus ensuring that the energy for heating chip a is consistent each time, and improving the welding consistency of chip a.

[0065] The repair stage 41 moves the substrate 6 to be repaired to the irradiation point of the laser 1 in advance. After the chip a is placed at the defect point, the welding and fixing operation can be performed. The alignment process between the defect point and the laser 1 is completed in advance, saving processing time.

[0066] In this embodiment, the repair drive assembly 42 comprises two linear modules assembled together. The driving directions of the two linear modules are arranged vertically to drive the repair stage 41 to move in the horizontal plane. The linear modules include linear motors or lead screw mechanisms.

[0067] Reference Figure 4 The transfer component 5 is used to pick up and transfer chip a to the defect location on the substrate 6 to be repaired. The transfer component 5 includes a transfer frame 51, a pick-up head 52, and a transfer drive component 53.

[0068] Specifically, the transfer drive assembly 53 is mounted on the transfer frame 51 and is driven by the pick-up head 52 to move the pick-up head 52 in the front-back, left-right, and up-down directions. The pick-up head 52 is used to pick up chip a and, driven by the transfer drive assembly 53, delivers chip a to the defect location on the substrate 6 to be repaired.

[0069] In this embodiment, the pickup head 52 includes an adsorption needle tube, which is connected to an external positive and negative pressure device. By applying negative pressure to the adsorption needle tube, the chip a is adsorbed and picked up. By applying positive pressure to the adsorption needle tube, the connection between the adsorption needle tube and the chip a is released.

[0070] In this embodiment, the transfer drive assembly 53 includes multiple linear modules, which are assembled to drive the pickup head 52 to move in the front-back, left-right, and up-down directions. Each linear module includes a linear motor or a lead screw mechanism.

[0071] This setup, by moving the pickup component, picks up chip a and delivers it to the defect location on the substrate 6 to be repaired, thereby enabling the soldering and loading operation of chip a and improving the automation level of display device repair.

[0072] In the description of this application, it should be noted that the terms "upper," "lower," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Unless otherwise expressly specified and limited, the terms "installed," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication between two elements. For those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.

[0073] It should be noted that in this application, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0074] The above description is merely a specific embodiment of this application, enabling those skilled in the art to understand or implement this application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features claimed herein.

Claims

1. A laser welding apparatus, characterized in that, It includes: A laser for emitting laser light that is directly incident on the surface of a chip; A pressing assembly, the pressing assembly including a light-transmitting plate, wherein the laser emitted by the laser is adapted to pass through the light-transmitting plate; A pressing drive assembly is connected to the pressing assembly to drive the pressing assembly to move along the emission direction of the laser and press the light-transmitting plate against the chip surface.

2. The laser welding apparatus according to claim 1, characterized in that, The pressing drive component includes: A first driving member is connected to the pressing assembly to drive the pressing assembly to move along the emission direction of the laser; The second driving member is driven to be connected to the pressing assembly to move the pressing assembly away from the optical path of the laser emitted by the laser, or to place the light-transmitting plate of the pressing assembly in the optical path of the laser emitted by the laser.

3. The laser welding apparatus according to claim 2, characterized in that, The driving form of the second driving element includes linear driving or curvilinear driving.

4. The laser welding apparatus according to claim 1, characterized in that, The pressing assembly further includes a connecting plate with a mounting groove. The light-transmitting plate is embedded in the mounting groove to connect to the connecting plate, and the pressing drive assembly is connected to the connecting plate.

5. The laser welding apparatus according to claim 4, characterized in that, The bottom of the light-transmitting plate protrudes beyond the bottom surface of the connecting plate.

6. The laser welding apparatus according to claim 1, characterized in that, It also includes a pressure sensor for measuring the pressure exerted on the chip by the pressing assembly.

7. The laser welding apparatus according to any one of claims 1-6, characterized in that, The laser is arranged vertically to act on the horizontally placed chip.

8. A display device repair system, characterized in that, Includes the laser welding apparatus as described in any one of claims 1 to 7.

9. The display device repair system according to claim 8, characterized in that, It also includes a repair component, which includes: A repair platform, used to support the substrate to be repaired; A repair drive assembly is connected to the repair stage to drive multiple defect points on the substrate to be repaired to move sequentially to the irradiation point of the laser.

10. The display device repair system according to claim 8, characterized in that, It also includes a transfer component, the transfer component comprising: Transfer rack; A pickup head, the pickup head being adapted to pick up the chip; A transfer drive assembly is mounted on the transfer frame and is connected to the pickup head drive assembly to drive the pickup head to move in the front-back, left-right, and up-down directions.

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