Device for improving crushing damage of resin grinding copper surface

Abstract

The utility model relates to the technical field of PCB (printed circuit board) production, and discloses a device for improving pressing damage of a resin grinding copper surface, the device is used for resin grinding equipment, the resin grinding equipment comprises a grinding wheel, a back pressure wheel and a conveying platform for conveying a circuit board, the grinding wheel is arranged above or below the back pressure wheel, and the conveying platform is used for conveying the circuit board. The conveying platform is arranged between the grinding wheel and the back pressure wheel, and a conveying position used for bearing the circuit board is arranged on the conveying platform. The device comprises a sprinkler head and a water feeder, the sprinkler head is located between the grinding wheel and the back pressure wheel and arranged on one side of the conveying platform in the width direction, water flows out of the sprinkler head towards the conveying position of the conveying platform, and the water inlet end of the sprinkler head is communicated with the water supply end of the water feeder. Compared with the prior art, foreign matters such as copper cuttings left on the plate surface are washed away in a water flow directional washing mode, and therefore the problem that the copper cuttings cleaning effect is poor in the prior art is solved.

Description

Technical Field

[0001] This utility model belongs to the field of PCB board manufacturing technology, and in particular relates to a device for improving the pressure damage on the copper surface of resin grinding. Background Technology

[0002] In the printed circuit board (PCB) manufacturing industry, resin polishing is a crucial step in the production process, playing a decisive role in the flatness and surface quality of the PCB. The resin polishing process generally involves: a conveyor platform continuously transporting the PCB; as the PCB reaches the polishing wheel, it is polished; during this process, a back pressure roller positioned behind the polishing wheel provides stable pressure to the PCB, ensuring uniform contact between the polishing wheel and the PCB to improve polishing effect and quality. During the polishing process, the polishing wheel generates a large amount of copper shavings. If these tiny copper shavings are not washed away promptly and effectively, they will accumulate on the board surface. When these shaving-laden PCBs pass over the back pressure roller, the high pressure transmitted by the roller presses the copper shavings tightly onto the PCB surface, easily leaving indentations or scratches, thus affecting the overall quality and reliability of the PCB.

[0003] In existing technology, a water spray head is vertically installed between the grinding wheel and the back pressure wheel to wash away copper shavings. During the water spraying process, the copper shavings are washed away from the center of the water spray head and spread outwards. This method of washing away copper shavings is not very effective, and some copper shavings will still be squeezed onto the circuit board by the back pressure wheel, causing indentations or damage to the surface of the circuit board. Utility Model Content

[0004] This invention provides a device for improving the pressure damage on the copper surface during resin polishing, thereby solving the problem of poor copper shaving cleaning effect in the prior art.

[0005] To achieve the above objectives, this utility model provides the following technical solution:

[0006] An apparatus for improving pressure damage on copper surfaces during resin polishing is characterized in that it is used in a resin polishing device, the resin polishing device comprising a polishing wheel, a back pressure wheel, and a conveying platform for conveying circuit boards, the polishing wheel being disposed above or below the back pressure wheel, the conveying platform being disposed between the polishing wheel and the back pressure wheel, and the conveying platform having a conveying position for carrying the circuit boards; the apparatus for improving pressure damage on copper surfaces during resin polishing includes a water spray head and a water supply device, the water spray head being located between the polishing wheel and the back pressure wheel, the water spray head being disposed on one side of the conveying platform in the width direction and the water outlet being directed towards the conveying position of the conveying platform, and the water inlet end of the water spray head being connected to the water supply end of the water supply device.

[0007] Through the above technical solution, during the water supply process from the water supply device to the spray head, the water column falling from a height onto the circuit board supported by the conveying plane will splash and bounce. However, the present invention sets the spray head on one side of the width direction of the conveying platform and the water outlet is directed towards the conveying plane of the conveying platform, so that there is a certain lateral angle between the direction of the water column spray and the circuit board. Based on this lateral angle, the direction of the water column impact, splashing and bouncing will be towards the other side of the conveying platform, rather than spreading in all directions. This can directionally remove foreign objects such as copper shavings remaining on the board surface, thereby solving the problem of poor copper shavings cleaning effect in the prior art.

[0008] Preferably, the spray head rotates 5°-50° toward the grinding wheel with reference to the length direction of the back pressure wheel.

[0009] By adjusting the angle between the water spray head and the grinding wheel, the water flow direction is opposite to that of the back pressure wheel. Metal debris flows out of the conveying platform along the water flow in a direction away from the back pressure wheel, thereby preventing metal debris from flowing to the back pressure wheel and thus improving the cleaning effect.

[0010] Preferably, it also includes a telescopic water supply pipe, through which the spray head is connected to the water supply end of the water supply device.

[0011] With the above technical solution, during the position adjustment of the spray head, it is inevitable that the water supply pipeline will be pulled and damaged. Using a telescopic water supply pipe as the water supply pipeline for the spray head can effectively overcome the above problems.

[0012] Preferably, the telescopic water supply pipe is a metal corrugated pipe.

[0013] Preferably, multiple water spray heads are provided, with the multiple water spray heads spaced apart from each other.

[0014] By using the above technical solution, multiple water spray heads are set up to increase the scouring surface of the side water spray column, thereby improving the cleaning effect.

[0015] Preferably, the water jets from multiple nozzles are directed in the same direction.

[0016] Preferably, the water supply end of the water supply device is equipped with a throttle valve, and the spray head is connected to the water supply end of the water supply device through the throttle valve.

[0017] The above technical solution allows for the use of a throttle valve to regulate the water flow rate of the water supply for circuit boards with different cleaning standards. This helps to adjust the water jet speed, thereby meeting different cleaning needs and reducing resource waste.

[0018] Preferably, it also includes a nozzle positioning component, through which the water nozzle is fixed to the side of the conveyor platform.

[0019] Preferably, the nozzle positioning component includes a rotating connector, a positioning connector, and an inverted U-shaped component; one end of the rotating connector is fixedly connected to the first end of the U-shaped component, and the other end is rotatably connected to the side of the conveying platform; one end of the positioning connector is fixedly connected to the second end of the U-shaped component, and the other end is slidably connected to a pre-cut groove on the conveying platform; the inner wall of the U-shaped component is fastened to the water nozzle.

[0020] With the above technical solution, during the positioning of the spray head, the spray head and the U-shaped part can be pre-fixed first, then the U-shaped part can be twisted to drive the spray head to rotate to the required angle, and finally the U-shaped part and the spray head can be fastened to complete the angle adjustment. The above angle adjustment process is easy to operate and the rotation adjustment accuracy is higher.

[0021] Preferably, the nozzle positioning component is a cable tie.

[0022] The beneficial effects of this utility model are:

[0023] 1. Compared with the prior art, the present invention places the water spray head on the side of the conveying platform and the water outlet is directed toward the conveying plane of the conveying platform. During the water supply process from the water supply device to the water spray head, the water spray head sprays a lateral water column to directionally rinse the surface of the circuit board. The directional water flow is used to rinse away the copper shavings and other foreign objects remaining on the board surface, thereby solving the problem of poor copper shavings cleaning effect in the prior art.

[0024] 2. Compared with the prior art, the device of this utility model can avoid water splashing onto the back pressure wheel by adjusting the angle between the spray head and the back pressure wheel, which is conducive to improving the side spray effect of water flow and thus improving the cleaning effect.

[0025] 3. Compared with the prior art, the present invention improves the cleaning effect by setting multiple water spray heads to increase the scouring surface of the side water spray column. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of the device for improving the pressure marks on the copper surface during resin polishing in Embodiment 1 of this utility model;

[0027] Figure 2 This is a schematic diagram of the device for improving the pressure marks on the copper surface during resin polishing in Embodiment 2 of this utility model;

[0028] Figure 3 This is a schematic diagram of the nozzle positioning component in Embodiment 3 of this utility model;

[0029] Figure 4 This is a schematic diagram showing the connection between the nozzle positioning component and the water spray head in Embodiment 3 of this utility model.

[0030] Explanation of reference numerals in the attached figures:

[0031] 100. Conveying platform; 101. Grinding wheel; 102. Back pressure wheel; 103. Roller; 104. Support rod; 105. Slide groove; 1. Spray head; 2. Water supply device; 3. Telescopic water supply pipe; 4. Throttling valve; 5. Spray head positioning component; 51. Rotating connector; 52. Positioning connector; 53. U-shaped component. Detailed Implementation

[0032] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the protection scope of the present utility model.

[0033] In the description of this utility model, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0034] This embodiment discloses a device for improving the pressure damage on the copper surface during resin polishing, which solves the problem of poor copper shaving cleaning effect in the prior art.

[0035] Example 1

[0036] like Figure 1 As shown, this embodiment discloses a device for improving the damage to copper surfaces during resin polishing. The device is applied to a resin polishing apparatus, which includes a polishing wheel 101, a back pressure wheel 102, and a conveying platform 100 for conveying circuit boards. The polishing wheel 101 is positioned above or below the back pressure wheel 102, and the conveying platform 100 is positioned between the polishing wheel 101 and the back pressure wheel 102. The conveying platform 100 has a conveying position for carrying the circuit board. During operation, the circuit board is placed in the conveying position, and the conveying platform 100 feeds the circuit board between the polishing wheel 101 and the back pressure wheel 102. The polishing wheel 101 polishes the circuit board, while the back pressure wheel 102 presses the circuit board from the back during polishing, ensuring a smooth polishing effect between the surface of the circuit board and the polishing wheel 101.

[0037] The device in this embodiment mainly consists of a water spray head 1 and a water supply unit 2. The water supply end of the water supply unit 2 is connected to the water inlet end of the water spray head 1 to supply water to the water spray head 1. The water spray head 1 is located between the grinding wheel 101 and the back pressure wheel 102, and is set on one side of the conveying platform 100 in the width direction. Its water outlet faces the conveying position of the conveying platform 100, so that when the water supply unit 2 supplies water to the water spray head 1, it sprays a lateral water column to directionally rinse the surface of the circuit board, and uses the directional rinsing of water flow to wash away copper shavings and other foreign objects remaining on the board surface, thereby solving the problem of poor copper shavings cleaning effect in the prior art. Compared with the prior art, the above structural modification can reduce copper surface damage on the circuit board by more than 70%, which greatly improves the yield of circuit board production.

[0038] Preferably, the water supply device 2 is a water pump, and the water supply end of the water supply device 2 is equipped with a throttle valve 4 for adjusting the output flow rate, and the spray head 1 is connected to the water supply end of the water supply device 2 through the throttle valve 4.

[0039] Through the above structural improvements, when the production line stops production, the water supply can be stopped by shutting off the throttle valve 4, reducing water waste. For some production sections with higher grinding precision, the metal particles generated after grinding are smaller in diameter. These metal particles are more likely to adhere to the circuit board due to electrostatic effects and are not easy to fall off the board surface. By increasing the setting of the throttle valve 4, the flow rate of the water supply device 2 is increased, which helps to improve the water pressure and make the flushing effect better.

[0040] To further improve the cleaning effect, in this embodiment, the water spray head 1 rotates 5°-50° with reference to the length direction of the back pressure wheel 102 towards the grinding wheel 101. This method can make the water flow direction opposite to the back pressure wheel 102, and the metal debris flows out or splashes along the water flow direction, thereby avoiding the possibility of metal debris flowing to the back pressure wheel 102, and thus improving the cleaning effect.

[0041] In other embodiments, the aforementioned angle rotation range can be selected from 10° to 45° to further improve the cleaning effect.

[0042] Furthermore, the device of this utility model includes a telescopic water supply pipe 3, and the water nozzle 1 is connected to the water supply device 2 via the telescopic water supply pipe 3.

[0043] Through the above structural improvements, when adjusting the actual position of the spray head 1, a telescopic water supply pipe 3 is used as the water supply pipe for the spray head 1. The telescopic water supply pipe 3 will extend or shorten according to the actual position of the spray head 1, thereby avoiding the possibility of damage to the water supply pipe due to being pulled.

[0044] Furthermore, the telescopic water supply pipe 3 can be made of metal corrugated pipe.

[0045] It should be explained that metal corrugated pipes, as flexible, expandable, and pressure-resistant pipe fittings, are commonly installed in liquid transportation systems. They are excellent water pipes with many advantages, including good flexibility, light weight, corrosion resistance, fatigue resistance, and resistance to high and low temperatures. Using metal corrugated pipes as expandable water pipes is particularly suitable for industrial production environments and results in lower maintenance costs.

[0046] It should be further explained that the aforementioned conveying platform 100 is composed of multiple rollers 103 and multiple support rods 104. The top of the rollers 103 is slightly higher than the top of the support rods 104. The surfaces of the multiple rollers 103 together form a conveying position for carrying the circuit board, while the support rods 104 serve as structural reinforcement components of the conveying platform 100. The water nozzle 1 and the telescopic water pipe 3 are secured to the support rods 104 using cable ties as nozzle positioning components 5.

[0047] The working principle of this utility model embodiment is as follows:

[0048] When the throttle valve 4 is opened, the water supply device 2 supplies water to the spray head 1. The spray head 1 sprays a lateral water column to directionally rinse the surface of the circuit board. By using the directional rebound of the water flow, the copper shavings and other foreign objects remaining on the board surface are washed away, thereby solving the problem of poor copper shavings cleaning effect in the existing technology.

[0049] Example 2

[0050] like Figure 2 As shown, unlike Embodiment 1, the device for improving the pressure damage on the copper surface of resin grinding in this embodiment is provided with multiple water spray heads 1, which are spaced apart from each other.

[0051] Through the above structural improvements, multiple water nozzles 1 spray water simultaneously to form a "water curtain," increasing the rinsing area and thus thoroughly and completely rinsing the circuit board without any blind spots, thereby removing all metal debris attached to the circuit board and further improving the cleaning effect.

[0052] Furthermore, the multiple water nozzles 1 spray water in the same direction, which increases the rinsing area and makes the rinsing direction of multiple water jets consistent, thereby enhancing the guiding ability of the water flow and further improving the cleaning effect.

[0053] In this embodiment, each spray head 1 can be supplied with water by a separate water supply device 2 to meet the needs of actual industrial conditions.

[0054] Example 3

[0055] like Figure 3 and Figure 4 As shown, unlike Embodiment 1, the nozzle positioning component 5 in this embodiment no longer uses cable ties, but adopts a structure similar to a U-shaped clamp.

[0056] The nozzle positioning component 5 includes a rotating connector 51, a positioning connector 52, and an inverted U-shaped component 53.

[0057] Specifically, the rotating connector 51 is a bolt whose thread penetrates the support rod 104 and is rotatable relative to the support rod 104. A nut is fitted and fastened to the end of the rotating connector 51 penetrating the support rod 104. The positioning connector 52 is a metal component. One end of the rotating connector 51 is fixedly connected to the first end of the U-shaped component 53, while the other end is rotatably connected to the side of the conveying platform 100. One end of the positioning connector 52 is fixedly connected to the second end of the U-shaped component 53, and the other end is slidably connected to a pre-cut groove 105 in the conveying platform 100. The inner wall of the U-shaped component 53 tightly clamps the end of the spray head 1 to fix the spray head 1.

[0058] Through the aforementioned structural improvements, a U-shaped clamp-like structure is adopted to position the water nozzle 1, resulting in higher reliability and easier maintenance. Furthermore, the rotation angle of the nozzle positioning component 5 can be adjusted according to the required water spray angle of the water nozzle 1, allowing operators to adjust the water jet direction based on actual needs.

[0059] The above are all preferred embodiments of this utility model, and are not intended to limit the scope of protection of this utility model. Therefore, all equivalent changes made to the structure, shape and principle of this utility model should be covered within the scope of protection of this utility model.

Claims

1. An apparatus for improving resin grinding copper surface indentation, characterized in that, The resin grinding device comprises a grinding wheel (101), a back pressure wheel (102) and a conveying platform (100) for conveying a circuit board, the grinding wheel (101) is arranged above or below the back pressure wheel (102), the conveying platform (100) is arranged between the grinding wheel (101) and the back pressure wheel (102), and conveying positions for carrying the circuit board are arranged on the conveying platform (100); the device for improving the resin grinding copper surface bruise comprises a water spraying head (1) and a water supply device (2), the water spraying head (1) is arranged between the grinding wheel (101) and the back pressure wheel (102), the water spraying head (1) is arranged on one side of the conveying platform (100) in the width direction and the water outlet of the water spraying head (1) faces the conveying position of the conveying platform (100), and the water inlet of the water spraying head (1) is communicated with the water supply end of the water supply device (2).

2. The apparatus for improving the resin grinding copper surface indentation according to claim 1, wherein, The water spraying head (1) is rotated by 5°-50° in the direction close to the grinding wheel (101) with the length direction of the back pressure wheel (102) as the reference.

3. The apparatus for improving the resin grinding copper surface indentation according to claim 1, wherein, The water spraying head (1) is communicated with the water supply end of the water supply device (2) through a telescopic water supply pipe (3).

4. The apparatus for improving the resin grinding copper surface indentation according to claim 3, wherein, The telescopic water supply pipe (3) is a metal bellows.

5. The apparatus for improving the resin grinding copper surface indentation according to claim 1, wherein, A plurality of water spraying heads (1) are arranged.

6. The apparatus for improving the resin grinding copper surface indentation according to claim 5, wherein, The water outlets of the plurality of water spraying heads (1) face the same direction.

7. The apparatus for improving the resin grinding copper surface indentation according to claim 1, wherein, The water supply end of the water supply device (2) is provided with a throttle valve (4), and the water spraying head (1) is communicated with the water supply end of the water supply device (2) through the throttle valve (4).

8. The apparatus for improving the resin grinding copper surface indentation according to claim 1, wherein, The water spraying head (1) is fixed to the side of the conveying platform (100) through a nozzle positioning member (5).

9. The apparatus for improving the resin grinding copper surface indentation according to claim 8, wherein, The nozzle positioning member (5) comprises a rotating connecting member (51), a positioning connecting member (52) and an inverted U-shaped member (53); one end of the rotating connecting member (51) is fixedly connected to the first end of the U-shaped member (53), and the other end is rotatably connected to the side of the conveying platform (100); one end of the positioning connecting member (52) is fixedly connected to the second end of the U-shaped member (53), and the other end is slidably connected to a sliding groove (105) of the conveying platform (100); and the inner wall of the U-shaped member (53) is fixedly connected with the water spraying head (1).

10. The apparatus for improving the resin grinding copper surface indentation according to claim 8, wherein, The nozzle positioning member (5) is a cable tie.

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