Thermal diffusion device and electronic equipment

Abstract

Provided are a thermal diffusion device and an electronic apparatus that exhibit a large capillary force. A vapor chamber (1), which is an embodiment of a heat diffusion device, is provided with: a housing (10) having a first inner surface (11a) and a second inner surface (12a) facing each other in the thickness direction (Z), and having an internal space; a working medium (20) sealed in the internal space of the housing; and a core (30) disposed in the internal space of the housing. The core has a first through-hole (61), and a protrusion (65) is provided on the periphery of the first through-hole, the protrusion (65) being close to the first inner surface of the case in the thickness direction. A gap (70) is provided between the tip end surface (65a) of the protrusion and the first inner surface of the housing. The maximum interval in the thickness direction of the gap is smaller than the inner diameter of the first through hole.

Description

Technical Field

[0001] This utility model relates to a heat diffusion device and electronic equipment. Background Technology

[0002] In recent years, the increasing integration and performance of components have led to increased heat generation. Furthermore, the miniaturization of products has increased heat density, making heat dissipation strategies crucial. This is particularly evident in mobile devices such as smartphones and tablets. While graphite sheets are commonly used as heat dissipation components, their insufficient heat transfer necessitates research into various other heat dissipation components. Among these, research is underway into vapor chambers, which function as planar heat pipes, as heat dissipation devices capable of highly efficient heat diffusion.

[0003] The vapor chamber has the following structure: a working medium (also called working fluid) is sealed inside the shell, and a core that transports the working medium using capillary force. The working medium absorbs heat from the heating elements (such as electronic components) in the evaporation section and evaporates within the vapor chamber. Afterward, the working medium moves within the vapor chamber, is cooled, and returns to a liquid phase. The liquid-phase working medium then moves again towards the evaporation section on the heating element side using the capillary force of the core, cooling the heating element. By repeating this process, the vapor chamber can operate autonomously without external power, utilizing the latent heat of vaporization and condensation of the working medium to achieve high-speed, two-dimensional heat diffusion.

[0004] Patent Document 1 discloses a heat spreader comprising: a shell including opposing upper and lower shell sheets joined at their outer edges, having an internal space; a working fluid sealed within the internal space; microchannels disposed in the internal space of the lower shell sheet, forming flow paths for the working fluid; and a sheet-like core disposed in the internal space of the shell, in contact with the microchannels, wherein the contact area between the core and the microchannels is 5% to 40% of the area of ​​the internal space when viewed from above.

[0005] Existing technical documents

[0006] Patent documents

[0007] Patent Document 1: International Publication No. 2021 / 229961 Utility Model Content

[0008] Problems to be solved by utility models

[0009] In patent document 1 Figure 1In one embodiment of the heat spreader, a structure is shown in which the core is sandwiched between a protruding portion of a microchannel formed in the lower housing sheet and a support formed in the upper housing sheet. Furthermore, Patent Document 1 describes a core having multiple fine pores, which are formed, for example, by etching.

[0010] The capillary force of the core is determined by the diameter of the hole in the core. However, due to limitations in processing methods such as etching, there are limits to minimizing the hole diameter.

[0011] Furthermore, the aforementioned problems are not limited to vapor chambers, but are common to all heat diffusion devices that can utilize the same structure as vapor chambers to diffuse heat.

[0012] This invention was made to solve the aforementioned problems, and its purpose is to provide a heat diffusion device that exhibits a large capillary force. Furthermore, this invention also aims to provide an electronic device that includes the aforementioned heat diffusion device.

[0013] Solution for solving the problem

[0014] The heat diffusion device of this invention includes: a housing having a first inner surface and a second inner surface opposite each other in the thickness direction, and having an internal space; a working medium sealed in the internal space of the housing; and a core disposed in the internal space of the housing. The core has a first through hole, and a protrusion is provided around the periphery of the first through hole, approaching the first inner surface of the housing in the thickness direction. A gap is provided between the top surface of the protrusion and the first inner surface of the housing. The maximum spacing of the gap in the thickness direction is smaller than the inner diameter of the first through hole.

[0015] Preferably, the top surface of the protrusion has an uneven structure, thereby providing the gap between the top surface of the protrusion and the first inner surface of the housing.

[0016] Preferably, the first inner surface of the housing has an uneven structure, thereby providing the gap between the top surface of the protrusion and the first inner surface of the housing.

[0017] Preferably, the core further has a second through hole, and no protrusion is provided at the periphery of the second through hole near the first inner surface or the second inner surface of the housing in the thickness direction.

[0018] Preferably, the maximum spacing of the gap in the thickness direction is less than 30 μm.

[0019] Preferably, the inner diameter of the first through hole is less than 40 μm.

[0020] Preferably, the protrusion does not engage with the first inner surface of the housing.

[0021] Preferably, the distance between the outer walls of the protrusion narrows towards the top surface of the protrusion.

[0022] Preferably, the distance between the outer walls of the protrusions is constant towards the top surface of the protrusions.

[0023] The electronic device of this invention includes the heat diffusion device of this invention.

[0024] Effects of the utility model

[0025] According to this invention, a heat diffusion device exhibiting a large capillary force can be provided. Furthermore, according to this invention, an electronic device including the aforementioned heat diffusion device can be provided. Attached Figure Description

[0026] Figure 1 This is a perspective view schematically illustrating an example of a heat diffusion device according to the first embodiment of the present invention.

[0027] Figure 2 This is a cross-sectional view schematically illustrating an example of a heat diffusion device according to the first embodiment of the present invention.

[0028] Figure 3 This is a schematic cross-sectional view showing an example of the housing and core of the heat diffusion device constituting the first embodiment of the present invention.

[0029] Figure 4 It is a schematic representation Figure 3 A top view of an example of a core shown.

[0030] Figure 5 This is a perspective view schematically showing an example of a protrusion provided around the periphery of the first through hole.

[0031] Figure 6 It is a schematic representation in Figure 3 A cross-sectional view of the first variant of the part denoted by α.

[0032] Figure 7 It is a schematic representation in Figure 3 A cross-sectional view of the second variant of the part indicated by α.

[0033] Figure 8 It is a schematic representation in Figure 3 A cross-sectional view of the third variation of the part indicated by α.

[0034] Figure 9 It is a schematic representation in Figure 3 A cross-sectional view of the fourth variation of the part indicated by α.

[0035] Figure 10 A and Figure 10 B is a perspective view schematically illustrating an example of a method for forming a folded protrusion on the top surface of a protrusion.

[0036] Figure 11 It is a schematic representation in Figure 3 A cross-sectional view of the fifth variation of the part indicated by α.

[0037] Figure 12 It is a schematic representation in Figure 3 A cross-sectional view of the sixth variant of the part indicated by α.

[0038] Figure 13 It is a schematic representation in Figure 3 A cross-sectional view of the seventh variation of the part indicated by α.

[0039] Figure 14 This is a cross-sectional view schematically showing an example of the housing and core of the heat diffusion device constituting the second embodiment of the present invention.

[0040] Figure 15 It is a cross-sectional view schematically showing a modified example of the shape of the protrusion near the first inner surface of the housing. Detailed Implementation

[0041] The following describes the heat diffusion device of this utility model.

[0042] However, this invention is not limited to the following embodiments, and can be applied with appropriate modifications without changing the spirit of this invention. Furthermore, structures combining two or more preferred configurations of this invention described below are also part of this invention.

[0043] In the heat diffusion device of this utility model, a liquid flow path for the working medium can be formed between adjacent protrusions by having a first through hole in the core having a protrusion on the periphery that is close to the first inner surface of the shell in the thickness direction.

[0044] Furthermore, in the heat diffusion device of this invention, a gap is provided between the top surface of the protrusion located around the first through hole and the first inner surface of the housing, such that the first through hole is not blocked by the first inner surface of the housing. Capillary force is exerted through this gap. Moreover, by making the maximum gap in the thickness direction (hereinafter also referred to as the height of the gap) smaller than the inner diameter of the first through hole, a greater capillary force is exerted.

[0045] As described in Patent Document 1, the reduction of the diameter of the hole in the core is limited by the processing method, but for a structure in which a gap is provided between the top surface of the protrusion and the first inner surface of the shell, the height of the gap is easy to control, and the same effect as the reduction of the diameter of the hole can be obtained.

[0046] The embodiments shown below are illustrative, and it is self-evident that parts of the structures shown in different embodiments can be replaced or combined. From the second embodiment onwards, descriptions of matters common to the first embodiment are omitted, and only the differences are explained. In particular, the same effects produced by the same structure are not mentioned sequentially in each embodiment.

[0047] In the following description, without specifically distinguishing between different embodiments, they are simply referred to as "the thermal diffusion device of this utility model".

[0048] As one embodiment of the heat diffusion device of this utility model, a heat spreader plate will be used as an example for description below. The heat diffusion device of this utility model can also be applied to heat diffusion devices such as heat pipes.

[0049] The accompanying drawings are schematic diagrams and may differ from the actual product in dimensions or aspect ratios. Identical or equivalent parts are labeled with the same reference numerals. Furthermore, identical elements are labeled with the same reference numerals across all drawings, and redundant descriptions are omitted.

[0050] In this specification, terms indicating the relationship between elements (such as "perpendicular", "parallel", "orthogonal") and terms indicating the shape of elements are not merely expressions with strict meanings, but rather expressions indicating substantially equal ranges, such as expressions that also include differences of several percentage points.

[0051] [First Implementation]

[0052] In the heat diffusion device of the first embodiment of the present invention, the core has a first through hole with a protrusion on the periphery that is close to the first inner surface of the shell in the thickness direction, and a second through hole with a protrusion on the periphery that is not close to the first inner surface or the second inner surface of the shell in the thickness direction.

[0053] Figure 1 This is a perspective view schematically illustrating an example of a heat diffusion device according to the first embodiment of the present invention. Figure 2 This is a cross-sectional view schematically illustrating an example of a heat diffusion device according to the first embodiment of the present invention. Furthermore, Figure 2 yes Figure 1 An example of a cross-sectional view of the heat diffusion device shown along line II-II.

[0054] Figure 1 and Figure 2 The vapor chamber (heat diffusion device) 1 shown includes a hollow shell 10 sealed in an airtight state. The shell 10 has a first inner surface 11a and a second inner surface 12a opposite each other in the thickness direction Z. An internal space is provided in the shell 10. The vapor chamber 1 also includes: a working medium 20, which is sealed in the internal space of the shell 10; and a core 30, which is disposed in the internal space of the shell 10. Alternatively, the vapor chamber 1 may also include a support column 40 disposed in the internal space of the shell 10.

[0055] An evaporation section is provided in the housing 10 for evaporating the sealed working medium 20. For example... Figure 1 As shown, a heat source HS, serving as a heating element, is disposed on the outer surface of the housing 10. Examples of heat sources HS include electronic components of electronic devices, such as central processing units (CPUs). The portion of the interior space of the housing 10 located near the heat source HS and heated by it corresponds to an evaporation section.

[0056] Preferably, the heat spreader 1 is generally planar. That is, preferably, the housing 10 is generally planar. Here, "planar" means a shape that includes plate-like and sheet-like shapes, where the dimensions in the width direction X (hereinafter referred to as width) and length direction Y (hereinafter referred to as length) are relatively large relative to the dimensions in the thickness direction Z (hereinafter referred to as thickness or height), for example, the width and length are more than 10 times the thickness, preferably more than 100 times.

[0057] The size of the heat spreader 1, i.e., the size of the housing 10, is not particularly limited. The width and length of the heat spreader 1 can be appropriately set according to the application. For example, the width and length of the heat spreader 1 can be 5 mm or more and 500 mm or less, 20 mm or more and 300 mm or less, or 50 mm or more and 200 mm or less, respectively. The width and length of the heat spreader 1 can be the same or different.

[0058] Preferably, the housing 10 is composed of opposing first pieces 11 and second pieces 12 joined at their outer edges.

[0059] When the housing 10 is composed of a first piece 11 and a second piece 12, the materials constituting the first piece 11 and the second piece 12 are not particularly limited, as long as they possess properties suitable for use as heat diffusion devices such as heat spreaders, such as thermal conductivity, strength, flexibility, and so on. The materials constituting the first piece 11 and the second piece 12 are preferably metals, such as copper, nickel, aluminum, magnesium, titanium, iron, or alloys with these as their main components, with copper being particularly preferred. The materials constituting the first piece 11 and the second piece 12 may be the same or different, but they are preferably the same.

[0060] When the housing 10 is composed of a first piece 11 and a second piece 12, the first piece 11 and the second piece 12 are joined together at their outer edges. The method of joining is not particularly limited, for example, laser welding, resistance welding, diffusion bonding, brazing, TIG welding (tungsten-inactive gas welding), ultrasonic bonding or resin sealing can be used, and laser welding, resistance welding or brazing is preferred.

[0061] The thickness of the first sheet 11 and the second sheet 12 is not particularly limited, but is preferably 10 μm or more and 200 μm or less, more preferably 30 μm or more and 100 μm or less, and even more preferably 40 μm or more and 60 μm or less. The thickness of the first sheet 11 and the second sheet 12 can be the same or different. In addition, the thickness of each sheet of the first sheet 11 and the second sheet 12 can be the same throughout or be thinner in some areas.

[0062] The shapes of the first piece 11 and the second piece 12 are not particularly limited. For example, the first piece 11 and the second piece 12 may also be shapes in which the outer edge is thicker than the parts outside the outer edge.

[0063] The overall thickness of the heat spreader 1 is not particularly limited, but it is preferably 50 μm or more and 500 μm or less.

[0064] The planar shape of the shell 10 as viewed from the thickness direction Z is not particularly limited. For example, it can be a polygon such as a triangle or rectangle, a circle, an ellipse, or a combination of these shapes. Furthermore, the planar shape of the shell 10 can also be L-shaped, C-shaped, stepped, etc. Additionally, the shell 10 may have a through opening. The planar shape of the shell 10 can also correspond to the purpose of the heat diffusion device such as the heat spreader, the shape of the assembly part of the heat diffusion device, or other components present nearby.

[0065] The working medium 20 is not particularly limited as long as it can produce a gas-liquid phase change in the environment inside the housing 10. For example, water, alcohols, Freon substitutes, etc., can be used. For example, the working medium 20 is an aqueous compound, preferably water.

[0066] The core 30 has a capillary structure that enables the working medium 20 to move using capillary force. The core 30 is preferably planar.

[0067] The material constituting the core 30 is not particularly limited, but it is preferably a metal, such as copper, nickel, aluminum, magnesium, titanium, iron, or alloys with these as the main components, with copper being particularly preferred. The material constituting the core 30 may be the same as or different from the material constituting the shell 10.

[0068] The size and shape of the core 30 are not particularly limited, but it is preferable, for example, that the core 30 is continuously arranged in the internal space of the housing 10. Alternatively, the core 30 may be arranged throughout the internal space of the housing 10 when viewed from the thickness direction Z, or it may be arranged locally in the internal space of the housing 10 when viewed from the thickness direction Z.

[0069] The thickness of core 30 is not particularly limited, but it is, for example, greater than 5μm and less than 50μm.

[0070] It could also be, such as Figure 2 As shown, a support column 40 is disposed in the internal space of the housing 10, which contacts the second inner surface 12a. By disposing of the support column 40 in the internal space of the housing 10, the housing 10 and the core 30 can be supported.

[0071] The material constituting the support column 40 is not particularly limited, but examples include resin, metal, ceramic or mixtures thereof, laminates, etc. Additionally, as... Figure 2 As shown, the support column 40 can also be integral with the housing 10, for example, it can be formed by etching the second inner surface 12a of the housing 10.

[0072] The shape of the support column 40 is not particularly limited as long as it can support the shell 10 and the core 30. However, the shape of the cross section of the support column 40 perpendicular to the height direction can be, for example, a polygon such as a rectangle, a circle, an ellipse, etc.

[0073] like Figure 2 As shown, the support column 40 can also have a tapered shape whose width narrows from the second inner surface 12a of the housing 10 toward the core 30. This allows the flow path between the supports 40 to be widened on the core 30 side.

[0074] The height of the support column 40 can be the same or different within a vapor chamber. For example, the height of the support column 40 can be greater than 50 μm and less than 1000 μm.

[0075] The arrangement of the supports 40 is not particularly limited, but it is preferable that they are evenly arranged in a predetermined area, and more preferably evenly arranged over the entire area, for example, in a manner where the center-to-center distance (spacing) between adjacent supports 40 is constant. By evenly arranging the supports 40, uniform strength can be ensured over the entire area of ​​the heat diffusion device such as the heat spreader. The center-to-center distance of the supports 40 is, for example, 100 μm or more and 5000 μm or less.

[0076] exist Figure 2In the cross-section shown, the width of the support 40 is not particularly limited as long as it provides sufficient strength to suppress deformation of the housing 10. However, the equivalent circle diameter of the section perpendicular to the height direction at the end of the support 40 near the core 30 is, for example, 100 μm or more and 2000 μm or less, preferably 300 μm or more and 1000 μm or less. By increasing the equivalent circle diameter of the support 40, deformation of the housing 10 can be further suppressed. On the other hand, by decreasing the equivalent circle diameter of the support 40, more space can be ensured for the movement of vapor of the working medium 20.

[0077] In the heat spreader 1, the core 30 has a through hole 60 extending in the thickness direction Z.

[0078] Within the through-hole 60, the working medium 20 can move using capillary action. The shape of the through-hole 60 is not particularly limited, but the cross-section at the surface perpendicular to the thickness direction Z is preferably circular or elliptical.

[0079] The arrangement of the through holes 60 is not particularly limited, but it is preferred that they be arranged equally in a predetermined area, and more preferably that they are arranged equally in the overall area, for example, in such a way that the center-to-center distance (spacing) between adjacent through holes 60 is constant.

[0080] The through hole 60 can be formed, for example, by punching the metal foil constituting the core 30 based on a pressing process.

[0081] Figure 3 This is a schematic cross-sectional view showing an example of the housing and core of the heat diffusion device constituting the first embodiment of the present invention. Figure 4 It is a schematic representation Figure 3 A top view of an example of a core is shown. Furthermore, in Figure 3 The middle shows Figure 4 The cross-section of the core along line AA is shown.

[0082] exist Figure 3 and Figure 4 In the example shown, the core 30 has a first through hole 61 and a second through hole 62 as through holes 60.

[0083] like Figure 3 As shown, a protrusion 65 is provided around the periphery of the first through hole 61, which is close to the first inner surface 11a of the housing 10 in the thickness direction Z.

[0084] On the other hand, the periphery of the second through hole 62 is not provided near the first inner surface 11a or the second inner surface 12a of the housing 10 in the thickness direction Z (see reference). Figure 2 ) of the convex portion 65.

[0085] A liquid working medium 20 is maintained between the protrusions 65 located around the periphery of the first through hole 61. This improves the heat transfer capacity of heat diffusion devices such as heat spreaders.

[0086] Furthermore, a gap 70 is provided between the top surface 65a of the protrusion 65 and the first inner surface 11a of the housing 10. The maximum spacing (height of the gap 70) in the thickness direction Z of the gap 70 is smaller than the inner diameter of the first through hole 61. Due to this gap 70, a larger capillary force is exhibited.

[0087] The maximum spacing in the thickness direction Z of the gap 70 can be, for example, 30 μm or less. On the other hand, the maximum spacing in the thickness direction Z of the gap 70 can be, for example, 1 μm or more.

[0088] The inner diameter of the first through hole 61 may, for example, be 40 μm or less. On the other hand, the inner diameter of the first through hole 61 may, for example, be 5 μm or more.

[0089] Furthermore, the inner diameter of the first through hole 61 refers to the equivalent circle diameter of the first through hole 61 located on the top surface 65a of the protrusion 65. Preferably, the inner diameter of the first through hole 61 is smaller than the equivalent circle diameter of the section perpendicular to the height direction at the end of the support column 40 on the side near the core 30.

[0090] The center-to-center distance of the first through hole 61 is, for example, 60 μm or more and 800 μm or less. Preferably, the center-to-center distance of the first through hole 61 is smaller than the center-to-center distance of the support column 40.

[0091] The inner diameter of the second through hole 62 is, for example, 100 μm or less. The inner diameter of the second through hole 62 can be the same as, larger than, or smaller than the inner diameter of the first through hole 61. Furthermore, when the inner diameter of the second through hole 62 differs in the thickness direction Z, the inner diameter of the smallest portion is defined as the inner diameter of the second through hole 62.

[0092] The center-to-center distance of the second through hole 62 is, for example, more than 3 μm and less than 150 μm. The center-to-center distance of the second through hole 62 can be the same as, greater than or less than the center-to-center distance of the first through hole 61.

[0093] The arrangement of the protrusions 65 is not particularly limited, but it is preferable that they are evenly arranged in a predetermined area, and more preferably that they are evenly arranged in the overall area, for example, in a manner in which the center-to-center distance (spacing) between adjacent protrusions 65 is constant.

[0094] The height of the protrusion 65 is, for example, 10 μm or more and 100 μm or less. Preferably, the height of the protrusion 65 is smaller than the height of the support column 40.

[0095] The dimensions of the protrusion 65 are not particularly limited. For example, the height of the protrusion 65 can be larger than the inner diameter of the first through hole 61, smaller than the inner diameter of the first through hole 61, or the same as the inner diameter of the first through hole 61.

[0096] The protrusion 65 can be formed, for example, by punching the metal foil constituting the core 30 using a pressing process. In this case, the protrusion 65 can be formed simultaneously with the through holes 60 such as the first through hole 61, or it can be formed separately from the through holes 60 such as the first through hole 61. In the pressing process, the shape of the protrusion 65 can be adjusted by appropriately adjusting the punching depth, etc. Furthermore, the punching depth refers, for example, to the extent to which the punch is pressed in the punching direction when punching with a punch.

[0097] Preferably, the thickness of the metal foil is constant before processing such as pressing. However, it is also possible that the metal foil becomes thinner in the portion that has undergone pressing. Therefore, it is preferable that... Figure 3 As shown in the example, the thickness of the protrusion 65 is the same as the thickness of the portion of the core 30 excluding the protrusion 65, or the thickness of the protrusion 65 is less than the thickness of the portion of the core 30 excluding the protrusion 65.

[0098] Figure 5 This is a perspective view schematically showing an example of a protrusion provided around the periphery of the first through hole.

[0099] exist Figure 5 In the example shown, the top surface 65a of the protrusion 65 has a flat structure.

[0100] Although the protrusion 65 may be provided only locally around the periphery of the first through hole 61, it is preferable to provide as follows: Figure 5 As shown, a protrusion 65 is provided on the periphery of the first through hole 61.

[0101] Preferably, the protrusion 65 does not engage with the first inner surface 11a of the housing 10. Furthermore, as long as a gap 70 is provided between the top surface 65a of the protrusion 65 and the first inner surface 11a of the housing 10, a portion of the top surface 65a of the protrusion 65 can also contact the first inner surface 11a of the housing 10.

[0102] When multiple protrusions 65 are provided in the core 30, the shape of the gap 70 can be the same shape, a combination of two or more shapes, or all different random shapes. Alternatively, it may include protrusions 65 that do not have a gap 70 between the top surface 65a of the protrusion 65 and the first inner surface 11a of the housing 10.

[0103] Alternatively, the top surface 65a of the protrusion 65 may have a concave-convex structure. In this case, the top surface 65a of the protrusion 65 may have a concave-convex structure, thereby providing a gap 70 between the top surface 65a of the protrusion 65 and the first inner surface 11a of the housing 10.

[0104] Figure 6 It is a schematic representation in Figure 3 A cross-sectional view of the first modified example of the portion indicated by α. Figure 3 In this context, α denotes the portion relating to the top surface 65a of the protrusion 65 and the first inner surface 11a of the housing 10. (As will be described later...) Figure 14 The same applies to China.

[0105] exist Figure 6 In the example shown, the top surface 65a of the protrusion 65 has a cross-sectional shape with a curved undulation.

[0106] Figure 7 It is a schematic representation in Figure 3 A cross-sectional view of the second variant of the part indicated by α.

[0107] exist Figure 7 In the example shown, the top surface 65a of the protrusion 65 has a cross-sectional shape with triangular wavy undulations.

[0108] Figure 8 It is a schematic representation in Figure 3 A cross-sectional view of the third variation of the part indicated by α.

[0109] exist Figure 8 In the example shown, the top surface 65a of the protrusion 65 has a cross-sectional shape with rectangular wavy undulations.

[0110] Figure 9 It is a schematic representation in Figure 3 A cross-sectional view of the fourth variation of the part indicated by α.

[0111] exist Figure 9 In the example shown, a folded-back protrusion 65b is provided on the top surface 65a of the protrusion 65, which protrudes radially inward toward the first through hole 61.

[0112] Figure 10 A and Figure 10 B is a perspective view schematically illustrating an example of a method for forming a folded protrusion on the top surface of a protrusion.

[0113] For example, when the protrusion 65 is formed by punching, such as by performing a process based on pressing, etc. Figure 10As shown in Figure A, a plate-shaped protrusion 65c is formed on the top surface 65a of the protrusion 65 as a flash during processing. Subsequently, the protrusion 65 is flattened by processes such as rolling, as... Figure 10 As shown in B, the plate-like protrusion 65c bends to form a folded-back protrusion 65b.

[0114] Alternatively, the first inner surface 11a of the housing 10 may have an uneven structure, thus providing a gap 70 between the top surface 65a of the protrusion 65 and the first inner surface 11a of the housing 10. In this case, the top surface 65a of the protrusion 65 may have either a flat structure or an uneven structure.

[0115] Figure 11 It is a schematic representation in Figure 3 A cross-sectional view of the fifth variation of the part indicated by α.

[0116] exist Figure 11 In the example shown, the first inner surface 11a of the housing 10 has a cross-sectional shape with a curved undulation.

[0117] Figure 12 It is a schematic representation in Figure 3 A cross-sectional view of the sixth variant of the part indicated by α.

[0118] exist Figure 12 In the example shown, the first inner surface 11a of the housing 10 has a cross-sectional shape with triangular wavy undulations.

[0119] Figure 13 It is a schematic representation in Figure 3 A cross-sectional view of the seventh variation of the part indicated by α.

[0120] exist Figure 13 In the example shown, the first inner surface 11a of the housing 10 has a cross-sectional shape with rectangular wavy undulations.

[0121] also, Figures 6-9 Any construction of the top surface 65a of the convex portion 65 shown and Figures 11-13 Any of the constructions of the first inner surface 11a of the shell 10 shown can also be combined with each other.

[0122] [Second Implementation]

[0123] In the heat diffusion device of the second embodiment of the present invention, the core has only a first through hole with a protrusion on the periphery that is close to the first inner surface of the shell in the thickness direction.

[0124] Figure 14 This is a cross-sectional view schematically showing an example of the housing and core of the heat diffusion device constituting the second embodiment of the present invention.

[0125] exist Figure 14 In the example shown, core 30 only has a first through hole 61 as a through hole 60. On the other hand, core 30 does not have a second through hole 62 (see reference). Figure 3 ) as a through hole 60.

[0126] like Figure 14 As shown, a protrusion 65 is provided around the periphery of the first through hole 61, which is close to the first inner surface 11a of the housing 10 in the thickness direction Z.

[0127] Furthermore, a gap 70 is provided between the top surface 65a of the protrusion 65 and the first inner surface 11a of the housing 10. The maximum interval (height of the gap 70) in the thickness direction Z of the gap 70 is smaller than the inner diameter of the first through hole 61.

[0128] In addition, Figure 14 The structure of the part represented by α is the same as that described in the first embodiment.

[0129] [Other Implementation Methods]

[0130] The heat diffusion device of this utility model is not limited to the above-described embodiments. Various applications and modifications can be applied to the structure and manufacturing conditions of the heat diffusion device within the scope of this utility model.

[0131] For example, the shape of the protrusion 65 that is close to the first inner surface 11a of the housing 10 in the thickness direction Z is not particularly limited.

[0132] Figure 15 It is a cross-sectional view schematically showing a modified example of the shape of the protrusion near the first inner surface of the housing.

[0133] It could also be, such as Figure 15 As shown, the distance between the outer walls of the protrusion 65 toward the top surface 65a of the protrusion 65 is constant.

[0134] Or, it could be, such as Figure 3 As shown, the distance between the outer walls of the protrusion 65 narrows towards the top surface 65a of the protrusion 65. In this case, the protrusion 65 can be oriented towards the first inner surface 11a (in... Figure 3 The shape of the protrusion (the lower side) can also be oriented towards the second inner surface 12a (in the middle). Figure 3 The middle part is the shape of the upper part (the convex shape).

[0135] Alternatively, the distance between the outer walls of the protrusion 65 may widen towards the top surface 65a of the protrusion 65. In this case, the protrusion 65 may be shaped to protrude towards the first inner surface 11a or towards the second inner surface 12a.

[0136] In the case where the core 30 has multiple first through holes 61, a gap 70 with a height (maximum interval in the thickness direction Z) larger than the inner diameter of the first through hole 61 may be provided between the top surface 65a of the protrusion 65 and the first inner surface 11a of the housing 10.

[0137] When the core 30 has multiple through holes 60, in addition to the first through hole 61, the second through hole 62 may or may not be present.

[0138] In the heat diffusion device of this invention, the shell can have one evaporation section or multiple evaporation sections. That is, one heat source or multiple heat sources can be arranged on the outer wall surface of the shell.

[0139] In the heat diffusion device of this utility model, when the shell is composed of a first piece and a second piece, the first piece and the second piece can overlap either with their ends aligned or with their ends staggered.

[0140] In the heat diffusion device of this invention, when the shell is composed of a first piece and a second piece, the materials constituting the first piece and the second piece may be different. For example, by using a material with higher strength for the first piece, the stress acting on the shell can be dispersed. Furthermore, by using different materials for the two pieces, one piece can achieve one function, and the other piece can achieve other functions. The functions described are not particularly limited, but examples include heat conduction and electromagnetic wave shielding.

[0141] The heat diffusion device of this invention can be incorporated into electronic devices for the purpose of heat dissipation. Therefore, electronic devices including the heat diffusion device of this invention are also considered part of this invention. Examples of electronic devices that can be incorporated into this invention include smartphones, tablet computers, laptops, gaming devices, and wearable devices. As described above, the heat diffusion device of this invention can operate autonomously without external power, utilizing the latent heat of vaporization and latent heat of condensation of the working medium to diffuse heat in a two-dimensional manner at high speed. Therefore, electronic devices incorporating the heat diffusion device of this invention can effectively achieve heat dissipation within the limited space inside the electronic device.

[0142] The following information is disclosed in this specification.

[0143] <1>

[0144] A heat diffusion device, wherein,

[0145] The heat diffusion device includes:

[0146] A housing having a first inner surface and a second inner surface opposite each other in the thickness direction, and having an internal space;

[0147] The working medium, which is sealed within the aforementioned internal space of the housing; and

[0148] The core, which is disposed in the aforementioned internal space of the aforementioned housing,

[0149] The core has a first through hole, and a protrusion is provided around the periphery of the first through hole, which is close to the first inner surface of the housing in the thickness direction.

[0150] A gap is provided between the top surface of the protrusion and the first inner surface of the housing.

[0151] The maximum spacing in the thickness direction of the aforementioned gap is smaller than the inner diameter of the aforementioned first through hole.

[0152] <2>

[0153] According to the heat diffusion device described in <1>, wherein...

[0154] The top surface of the protrusion has a concave-convex structure, thereby providing the gap between the top surface of the protrusion and the first inner surface of the housing.

[0155] <3>

[0156] According to the heat diffusion device described in <1> or <2>, wherein,

[0157] The first inner surface of the housing has an uneven structure, thereby providing the gap between the top surface of the protrusion and the first inner surface of the housing.

[0158] <4>

[0159] The heat diffusion device according to any one of <1> to <3>, wherein...

[0160] The core also has a second through hole, and no protrusion is provided around the periphery of the second through hole that is close to the first inner surface or the second inner surface of the housing in the thickness direction.

[0161] <5>

[0162] The heat diffusion device according to any one of <1> to <4>, wherein,

[0163] The maximum spacing in the thickness direction of the aforementioned gap is less than 30 μm.

[0164] <6>

[0165] The heat diffusion device according to any one of <1> to <5>, wherein,

[0166] The inner diameter of the first through hole is less than 40 μm.

[0167] <7>

[0168] The heat diffusion device according to any one of <1> to <6>, wherein,

[0169] The aforementioned protrusion does not engage with the aforementioned first inner surface of the aforementioned housing.

[0170] <8>

[0171] The heat diffusion device according to any one of <1> to <7>, wherein,

[0172] The distance between the outer walls of the aforementioned protrusions narrows toward the top surface of the aforementioned protrusions.

[0173] <9>

[0174] The heat diffusion device according to any one of <1> to <7>, wherein,

[0175] The distance between the outer walls of the aforementioned protrusions is constant towards the top surface of the aforementioned protrusions.

[0176] <10>

[0177] An electronic device, wherein,

[0178] The electronic device includes any one of <1> to <9>.

[0179] Industrial availability

[0180] This heat dissipation device can be widely used in portable information terminals and other fields. For example, it can be used to reduce the temperature of heat sources such as CPUs and extend the life of electronic devices, and can be used in smartphones, tablet computers, laptops, etc.

[0181] Explanation of reference numerals in the attached figures

[0182] 1. Heat spreader (heat diffusion device); 10. Shell; 11. First piece; 11a. First inner surface; 12. Second piece; 12a. Second inner surface; 20. Working medium; 30. Core; 40. Support; 60. Through hole; 61. First through hole; 62. Second through hole; 65. Protrusion; 65a. Top surface; 65b. Fold-back protrusion; 65c. Plate-shaped protrusion; 70. Gap; HS. Heat source; X. Width direction; Y. Length direction; Z. Thickness direction.

Claims

1. A heat diffusion device, characterized in that, The heat diffusion device includes: A housing having a first inner surface and a second inner surface opposite each other in the thickness direction, and having an internal space; A working medium, which is sealed within the internal space of the housing; and The core, which is disposed within the internal space of the housing. The core has a first through hole, and a protrusion is provided around the periphery of the first through hole, which is close to the first inner surface of the housing in the thickness direction. A gap is provided between the top surface of the protrusion and the first inner surface of the housing. The maximum spacing of the gap in the thickness direction is smaller than the inner diameter of the first through hole.

2. The heat diffusion device according to claim 1, characterized in that, The top surface of the protrusion has an uneven structure, thereby providing the gap between the top surface of the protrusion and the first inner surface of the housing.

3. The heat diffusion device according to claim 1 or 2, characterized in that, The first inner surface of the housing has an uneven structure, thereby providing the gap between the top surface of the protrusion and the first inner surface of the housing.

4. The heat diffusion device according to claim 1 or 2, characterized in that, The core also has a second through hole, the periphery of which is not provided with a protrusion close to the first inner surface or the second inner surface of the housing in the thickness direction.

5. The heat diffusion device according to claim 1 or 2, characterized in that, The maximum spacing of the gap in the thickness direction is less than 30 μm.

6. The heat diffusion device according to claim 1 or 2, characterized in that, The inner diameter of the first through hole is less than 40 μm.

7. The heat diffusion device according to claim 1 or 2, characterized in that, The protrusion does not engage with the first inner surface of the housing.

8. The heat diffusion device according to claim 1 or 2, characterized in that, The distance between the outer walls of the protrusion narrows towards the top surface of the protrusion.

9. The heat diffusion device according to claim 1 or 2, characterized in that, The distance between the outer walls of the protrusions is constant toward the top surface of the protrusions.

10. An electronic device, characterized in that, The electronic device includes the heat diffusion device according to any one of claims 1 to 9.

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