XMP mode memory with optimized structure
By using ultra-thin heat pipes and fin array design, the problem of insufficient memory heat dissipation in XMP mode is solved, achieving efficient heat dissipation and compact structure, thus improving the stability and applicability of the memory.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- HUIJU ELECTRONICS (DONGGUAN) IND CO LTD
- Filing Date
- 2025-05-10
- Publication Date
- 2026-05-12
AI Technical Summary
Existing technologies have limited heat dissipation performance in XMP mode, which affects memory stability and lifespan. Furthermore, traditional heat dissipation solutions take up space or generate noise.
It adopts an ultra-thin heat pipe and fin array design. The ultra-thin heat pipe is attached to the top surface of the memory chip, and the heat is exchanged with the air inside the chassis through the fin array. The auxiliary clip is used for fixation to avoid interference with other hardware.
It achieves efficient heat dissipation, ensuring stable memory operation and preventing data errors or system crashes. At the same time, its compact structure does not occupy extra space and reduces costs.
Smart Images
Figure CN224232144U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the technical field of desktop computer memory overclocking, and in particular to an optimized XMP mode memory structure. Background Technology
[0002] In recent years, with the rapid development of computer technology, the computing power of the central processing unit (CPU) has been continuously enhanced, and its operating frequency has also increased rapidly. In order to fully utilize the CPU's performance, the performance requirements for memory have also been increasing, including higher operating frequencies and greater data throughput. Against this backdrop, Intel introduced Extreme Memory Profile (XMP) technology. This technology allows memory modules to store preset performance profiles, enabling the motherboard to automatically recognize and load these configurations, thereby achieving automatic memory overclocking and improving overall system performance.
[0003] However, while XMP technology improves memory performance, it also brings new challenges. When memory operates in XMP mode, its operating frequency and voltage increase significantly, leading to a sharp increase in power consumption and heat generation. Excessive operating temperature can affect memory stability and lifespan, and may even cause data errors or system crashes. Therefore, how to effectively dissipate heat and ensure stable operation of memory in XMP mode has become an urgent problem to be solved.
[0004] Currently, common memory cooling solutions on the market mainly include heatsinks and cooling fans. Heatsinks passively dissipate heat by increasing the surface area; they are simple in structure and low in cost, but their cooling effect is limited and difficult to meet the high heat generation requirements of XMP mode. Cooling fans improve cooling efficiency through forced convection, but they are bulky, occupying additional space and increasing noise. Furthermore, the distance between memory slots is usually small, and large cooling fans may interfere with other hardware devices (such as CPU coolers), limiting their application. Therefore, a memory cooling solution that can effectively dissipate heat without occupying too much space is needed. Utility Model Content
[0005] To overcome the shortcomings mentioned above, this utility model aims to provide a technical solution that can solve the above problems.
[0006] This utility model provides an optimized XMP mode memory, including a memory substrate. The bottom end of the memory substrate is provided with pins, and chip particles are mounted on the side of the memory substrate. The bottom surface of the chip particles is fixed to the memory substrate, and an ultra-thin heat pipe is mounted on the top surface of the chip particles. One end of the ultra-thin heat pipe is attached to the top surface of the chip particles, and the other end extends out of the top of the memory substrate and passes through the fin array provided at the top of the memory substrate.
[0007] Furthermore, an auxiliary clip is installed on the side of the memory substrate, which clamps the ultra-thin heat pipe on the side away from the chip particles to assist in fixing the ultra-thin heat pipe.
[0008] Furthermore: the fin array is fixed to the auxiliary clip, so that the auxiliary clip provides auxiliary fixation for the fin array.
[0009] Furthermore, the two sides of the memory substrate are designated as a first side and a second side. The first side is equipped with chip particles, an ultra-thin heat pipe, and an auxiliary clip, which is fixed to the memory substrate.
[0010] Furthermore: an auxiliary clip is installed on the second side, and the auxiliary clips on both sides are fixed to each other and clamped to the memory substrate.
[0011] Furthermore: a chip and an ultra-thin heat pipe are installed on the second side. The chip is fixed to the second side of the memory substrate, and the ultra-thin heat pipe is attached to the top surface of the chip on the second side. An auxiliary clip holds the ultra-thin heat pipe for auxiliary fixation.
[0012] Furthermore: the width of the fin array along the thickness direction of the memory substrate is less than or equal to the sum of the thicknesses of the auxiliary clips on both sides.
[0013] Furthermore, the ultra-thin heat pipe is designed in a U-shaped bend, with one branch attached to the chip particle and the other branch passing through the fin array.
[0014] Furthermore: A first row of chips and a second row of chips are mounted on one side of the memory substrate, and an ultra-thin heat pipe is provided with a first heat pipe and a second heat pipe. The first heat pipe is attached to the first row of chips, and the second heat pipe is attached to the second row of chips.
[0015] Compared with the prior art, the beneficial effects of this utility model are:
[0016] 1. High-efficiency heat dissipation ensures stable operation: By attaching ultra-thin heat pipes to the top surface of the memory chip, the heat generated by the chip is quickly conducted to the fin array. The fin array effectively dissipates heat through heat exchange with the airflow inside the chassis, significantly reducing the operating temperature of the memory chip. This improves the stability and reliability of the memory in XMP mode, preventing data errors or system crashes caused by overheating.
[0017] 2. Compact structure and strong applicability: Utilizing ultra-thin heat pipes and a compact fin array design, the overall thickness of the memory module is effectively controlled, avoiding interference with adjacent memory slots or other hardware devices. This cooling solution can be easily installed and used even inside a space-constrained chassis.
[0018] 3. Flexible heat dissipation and high adaptability: The fin array can utilize the existing airflow inside the chassis for heat dissipation, eliminating the need for additional power supplies or control circuitry, thus reducing cost and complexity. Furthermore, the heat dissipation effect can be optimized by adjusting the size and shape of the fin array to accommodate different models and specifications of memory modules.
[0019] In summary, through the above improvements, this invention proposes an innovative memory heat dissipation solution that significantly improves the heat dissipation efficiency of memory in XMP mode, optimizes the structural design, reduces production costs, and enhances the market competitiveness of the product.
[0020] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description
[0021] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0022] Figure 1 This is a schematic diagram of the structure of the ultrathin heat pipe and fin array of this utility model;
[0023] Figure 2 This is a schematic diagram of the structure of the ultra-thin heat pipe and auxiliary clips of this utility model;
[0024] Figure 3 This is a schematic diagram of the memory substrate and ultra-thin heat pipe of this utility model;
[0025] Figure 4 This is a schematic diagram of the structure of the ultrathin heat pipe and groove of this utility model;
[0026] Figure 5 This is a schematic diagram of the structure of the chip and auxiliary clip of this utility model;
[0027] Figure 6 This is a schematic diagram of the structure of this utility model, in which ultra-thin heat pipes are installed on both sides.
[0028] Figure 7 This is a schematic diagram of the structure of the first heat pipe and the second heat pipe of this utility model.
[0029] The reference numerals and names in the figure are as follows:
[0030] 10 Memory substrate; 11 Bottom end; 12 Top end; 13 First side; 14 Second side; 20 Chip chip; 21 First row of chips; 22 Second row of chips; 30 Ultra-thin heat pipe; 31 First heat pipe; 32 Second heat pipe; 40 Fin array; 50 Auxiliary clip; 51 Groove. Detailed Implementation
[0031] The technical solutions in the embodiments of this utility model will be clearly and completely described below. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.
[0032] Please see Figures 1 to 7 In this embodiment of the present invention, an optimized XMP mode memory includes a memory substrate 10. The bottom end 11 of the memory substrate 10 is provided with pins. Chip particles 20 are mounted on the side of the memory substrate 10. The bottom surface of the chip particles 20 is fixed to the memory substrate 10. An ultra-thin heat pipe 30 is mounted on the top surface of the chip particles 20. One end of the ultra-thin heat pipe 30 is attached to the top surface of the chip particles 20, and the other end extends out of the top end 12 of the memory substrate 10 and passes through the fin array 40 provided at the top end 12 of the memory substrate 10.
[0033] Specifically, with the continuous improvement of computer performance, especially the gradual increase in CPU frequency, higher demands are placed on memory operating frequency. Therefore, Intel introduced Extreme Memory technology and formulated Intel Extreme Memory Profiles (Intel XMP Specification). Intel certifies the relevant memory, enabling the chipset to read the SPD (Special Process Device) in the memory module during operation and perform targeted optimization and automatic overclocking according to the XMP specification. When enabled, the frequency is higher and memory read / write speeds are faster. However, when memory operates in XMP mode, its operating frequency and voltage are also higher, resulting in greater heat generation. Therefore, a more superior heat dissipation structure is needed to ensure stable memory operation.
[0034] Because memory modules are relatively thin and the spacing between memory slots is narrow, large heat dissipation structures or fans are unsuitable for cooling, and traditional heat spreaders have limited cooling effectiveness. Through dedicated research and innovative thinking, the inventors, combining existing technology, creatively proposed using an ultra-thin heat pipe 30 directly attached to the top surface of the chip 20. This heat pipe 30 is bent and extended along its flat direction, extending beyond the top 12 of the memory substrate 10. A fin array 40 is then positioned at the top 12 to cool the heat pipe. The airflow generated by fans in other components within the chassis (such as CPU cooling fans or chassis fans) carries away the heat from the fins themselves as it passes through the fin array 40, achieving a cooling effect. This approach not only directly cools the memory chip 20, which generates significant heat in XMP mode, improving its cooling efficiency, but also controls the overall thickness of the finished memory module, avoiding installation interference between adjacent memory slots.
[0035] Secondly, a high-temperature resistant and thermally conductive adhesive (such as thermally conductive silicone) can be used to directly bond and fix the ultra-thin heat pipe 30 to the top surface of the chip particle 20, allowing the ultra-thin heat pipe 30 to directly conduct heat to the chip particle 20, thus improving its heat dissipation effect. Thermally conductive silicone is also known as thermally conductive RTV adhesive, a potting compound that can cure at room temperature. The biggest difference between thermally conductive silicone grease and thermally conductive silicone is that thermally conductive silicone can cure and has certain adhesive properties.
[0036] like Figures 2 to 5 As shown, preferably, an auxiliary clip 50 is installed on the side of the memory substrate 10. The auxiliary clip 50 is clamped on the side of the ultra-thin heat pipe 30 away from the chip particle 20 to assist in fixing the ultra-thin heat pipe 30.
[0037] Specifically, to protect the ultra-thin heat pipe 30 and facilitate handling and installation, preferably, an auxiliary clip 50 can be provided on the side of the memory substrate 10, and the auxiliary clip 50 is sleeved on the outside of the ultra-thin heat pipe 30, so that the auxiliary clip 50 can provide a clamping and auxiliary fixing function for the ultra-thin heat pipe 30. In the specific assembly and production process, the auxiliary clip 50 can be produced first, and a corresponding groove 51 can be opened on it. Then, the ultra-thin heat pipe 30 is fixed in the groove 51. An interference fit connection can be used to fix the ultra-thin heat pipe 30 in the groove 51, or an adhesive method can be used to bond the ultra-thin heat pipe 30 in the groove 51.
[0038] Secondly, since the auxiliary clip 50 is used, it can be fixed by bolting it to the positioning holes on the memory substrate 10. Based on this, the ultra-thin heat pipe 30 and the chip 20 do not need to be bonded together. Instead, thermal grease is used to attach the ultra-thin heat pipe 30 to the top surface of the chip 20 to achieve heat transfer.
[0039] like Figures 3 to 6 As shown, preferably, the fin array 40 is fixed to the auxiliary clip 50, so that the auxiliary clip 50 provides auxiliary fixation for the fin array 40.
[0040] Specifically, in order to strengthen the fixation of the fin array 40, it is preferable to fix the fin array 40 to the part of the auxiliary clip 50 near the top 12 of the memory substrate 10 by welding.
[0041] like Figure 3 and Figure 5 As shown, preferably, the two sides of the memory substrate 10 are designated as a first side 13 and a second side 14. The first side 13 is equipped with a chip 20, an ultra-thin heat pipe 30, and an auxiliary clip 50, which is fixed to the memory substrate 10.
[0042] Specifically, when the chip 20, ultra-thin heat pipe 30 and auxiliary clip 50 are only installed on one side of the memory substrate 10, and the other side is not equipped with auxiliary clip 50, the auxiliary clip 50 can be directly fixed on the memory substrate 10. For example, positioning through holes can be opened on the memory substrate 10 and the auxiliary clip 50 respectively, and the two can be directly fixed by bolt connection.
[0043] Secondly, due to the rapid development of chip particles 20, their single-chip capacity is already relatively large. For some finished memory modules with specific capacities, the corresponding capacity requirement can be achieved by attaching the corresponding number of chip particles 20 to only one side. This reduces the cost of double-sided attachment and also reduces the number of ultra-thin heat pipes 30 and auxiliary clips 50, thereby lowering production costs and improving product competitiveness.
[0044] like Figure 5 As shown, preferably, an auxiliary clip 50 is installed on the second side 14, and the auxiliary clips 50 on both sides are fixed to each other and clamped to the memory substrate 10.
[0045] Specifically, when the second side 14 is also equipped with auxiliary clips 50, the two auxiliary clips 50 on both sides can be used to fix each other. For example, corresponding positioning holes are opened on the two clips respectively, and the two clips are directly fixed by bolt connection, thus forming a clamp on the memory substrate 10.
[0046] Secondly, for a finished memory module solution with only one side having the chip 20, a relatively inexpensive auxiliary clip 50 can be installed on the other side, but the relatively expensive ultra-thin heat pipe 30 can be omitted. The advantage of this solution is that the nut will not directly contact the memory substrate 10, thereby avoiding potential damage to the memory substrate 10 itself.
[0047] like Figure 5 and Figure 6As shown, preferably, a chip 20 and an ultra-thin heat pipe 30 are mounted on the second side 14. The chip 20 is fixed to the second side 14 of the memory substrate 10, and the ultra-thin heat pipe 30 is attached to the top surface of the chip 20 on the second side 14. An auxiliary clip 50 is clamped to the ultra-thin heat pipe 30 for auxiliary fixation.
[0048] Specifically, for larger capacity finished memory modules, it is still necessary to install corresponding chip particles 20 on both sides to maximize their overall capacity. Correspondingly, ultra-thin heat pipes 30 can be set on both sides for heat transfer.
[0049] like Figure 5 As shown, preferably, the width of the fin array 40 along the thickness direction of the memory substrate 10 is less than or equal to the sum of the thicknesses of the auxiliary clips 50 on both sides.
[0050] Specifically, to avoid the fin array 40 being too wide and affecting the installation of memory modules in adjacent slots, it is preferable to set the width of the fin array 40 to be no greater than the total thickness of the auxiliary clips 50. That is, when auxiliary clips 50 are installed on both sides of the memory substrate 10, the thickness of the entire finished memory module should be relatively uniform to avoid the width of the fin array 40 exceeding the thickness of the entire memory module.
[0051] like Figure 1 and Figure 4 As shown, preferably, the ultrathin heat pipe 30 is configured in a U-shaped bend, with one branch attached to the chip particle 20 and the other branch passing through the fin array 40.
[0052] Specifically, for ease of installation, it is preferable to set the ultra-thin heat pipe 30 in a U-shaped bend, so that one branch pipe can be directly attached to a row of chip particles 20, while the other branch pipe can extend out of the top 12 of the memory substrate 10, and the end of this branch pipe can be easily inserted into the fin array 40 to form an integrated heat dissipation structure.
[0053] A first row of chips 21 and a second row of chips 22 are mounted on one side of the memory substrate 10. The ultra-thin heat pipe 30 is provided with a first heat pipe 31 and a second heat pipe 32. The first heat pipe 31 is attached to the first row of chips 21, and the second heat pipe 32 is attached to the second row of chips 22.
[0054] Specifically, for finished memory modules that require larger capacity, some need to install two rows of chip chips 20 on the same side. Therefore, an independent ultra-thin heat pipe 30 can be set on each row of chips for heat transfer.
[0055] like Figure 7 As shown, preferably, the bending diameter of the first heat pipe 31 is smaller than the bending diameter of the second heat pipe 32.
[0056] Specifically, for ease of installation, the ultra-thin heat pipe 30 attached to the first row of particles 21 near the top 12 of the memory substrate 10 can be designated as the first heat pipe 31, while the ultra-thin heat pipe 30 attached to the second row of particles 22 away from the top 12 of the memory substrate 10 can be designated as the second heat pipe 32. Preferably, the bending diameter of the first heat pipe 31 is smaller than that of the second heat pipe 32, and the second heat pipe 32 is installed on the outside of the first heat pipe 31, so that the installation position of the first heat pipe 31 is exactly located in the area between the two branches formed after the second heat pipe 32 is bent.
[0057] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention.
Claims
1. An optimized XMP mode memory structure, characterized in that, The system includes a memory substrate (10), with pins at the bottom end (11) of the memory substrate (10). Chip particles (20) are mounted on the side of the memory substrate (10), with the bottom surface of the chip particles (20) fixed to the memory substrate (10). An ultra-thin heat pipe (30) is mounted on the top surface of the chip particles (20). One end of the ultra-thin heat pipe (30) is attached to the top surface of the chip particles (20), and the other end extends out of the top end (12) of the memory substrate (10) and passes through the fin array (40) set at the top end (12) of the memory substrate (10).
2. The XMP mode memory with an optimized structure according to claim 1, characterized in that, An auxiliary clip (50) is installed on the side of the memory substrate (10). The auxiliary clip (50) is clamped on the side of the ultra-thin heat pipe (30) away from the chip particle (20) to assist in fixing the ultra-thin heat pipe (30).
3. The XMP mode memory with an optimized structure according to claim 2, characterized in that, The fin array (40) is fixed to the auxiliary clip (50), so that the auxiliary clip (50) provides auxiliary fixation for the fin array (40).
4. The XMP mode memory with an optimized structure according to claim 3, characterized in that, The two sides of the memory substrate (10) are designated as a first side (13) and a second side (14). The first side (13) is equipped with a chip (20), an ultra-thin heat pipe (30) and an auxiliary clip (50), which is fixed to the memory substrate (10).
5. The XMP mode memory with an optimized structure according to claim 4, characterized in that, The second side (14) is equipped with an auxiliary clip (50), and the auxiliary clips (50) on both sides are fixed to each other and clamped to the memory substrate (10).
6. The XMP mode memory with an optimized structure according to claim 5, characterized in that, The second side (14) is equipped with a chip (20) and an ultra-thin heat pipe (30). The chip (20) is fixed to the second side (14) of the memory substrate (10). The ultra-thin heat pipe (30) is attached to the top surface of the chip (20) on the second side (14). An auxiliary clip (50) is clamped to the ultra-thin heat pipe (30) for auxiliary fixation.
7. The XMP mode memory with an optimized structure according to claim 2, characterized in that, The width of the fin array (40) along the thickness direction of the memory substrate (10) is less than or equal to the sum of the thicknesses of the auxiliary clips (50) on both sides.
8. The XMP mode memory with an optimized structure according to claim 1, characterized in that, The ultrathin heat pipe (30) is configured in a U-shaped bend, with one branch attached to the chip particle (20) and the other branch passing through the fin array (40).
9. The XMP mode memory with an optimized structure according to claim 1, characterized in that, A first row of chips (21) and a second row of chips (22) are mounted on one side of the memory substrate (10). The ultra-thin heat pipe (30) is provided with a first heat pipe (31) and a second heat pipe (32). The first heat pipe (31) is attached to the first row of chips (21), and the second heat pipe (32) is attached to the second row of chips (22).