Display device

Abstract

The utility model discloses a display device. The display device comprises a display panel, a driving module and a heat dissipation film, the driving module is connected with the display panel; the heat dissipation film comprises a heat dissipation base material and a graphene layer, the heat dissipation film is attached to the driving module, a microstructure is arranged on the surface, away from the driving module, of the heat dissipation base material, the graphene layer is arranged on the heat dissipation base material, and the graphene layer is attached to the microstructure; specifically, the microstructure comprises a plurality of grooves, the plurality of grooves are arranged at intervals, and a part of the graphene layer is filled in the grooves. The driving chip has the advantage that the problem that the working stability of the driving chip of the display device is reduced can be solved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display, in particular to a display device. BACKGROUND

[0002] With the increasing resolution of the display device, the working temperature of the driving chip of the display device is also increasing, which causes the heat of the driving chip to easily accumulate and not be able to dissipate to the outside in time, resulting in the working stability of the driving chip of the display device being reduced. UTILITY MODEL CONTENT

[0003] Embodiments of the present application provide a display device to improve the problem of reduced working stability of the driving chip of the display device.

[0004] Embodiments of the present application provide a display device, comprising:

[0005] a display panel;

[0006] a driving module connected with the display panel;

[0007] a heat dissipation film comprising a heat dissipation substrate and a graphene layer, the heat dissipation film is attached to the driving module, one surface of the heat dissipation substrate away from the driving module is provided with a microstructure, the graphene layer is arranged on the heat dissipation substrate, and the graphene layer is attached to the microstructure.

[0008] Further, the microstructure comprises a plurality of grooves, and the plurality of grooves are arranged at intervals, wherein a part of the graphene layer fills the grooves.

[0009] Further, the opening of the groove is circular.

[0010] Further, the number of grooves y1 is greater than or equal to S1 / (S2-S3); wherein S1 is the area of the heat dissipation substrate, S2 is the surface area of a single groove, S3 is the area of the opening of a single groove, and the depth of the groove is not less than the radius of the opening of the groove.

[0011] Further, the opening of the groove is square.

[0012] Further, the number of grooves y2 is greater than or equal to S4 / (S5-S6); wherein S4 is the area of the heat dissipation substrate, S5 is the surface area of a single groove, S6 is the area of the opening of a single groove, and the depth of the groove is not less than one fourth of the side length of the square.

[0013] Further, the microstructure comprises a plurality of protrusions, and the plurality of protrusions are arranged at intervals, wherein the graphene layer covers the protrusions.

[0014] Further, the driving module comprises:

[0015] A driving substrate is fixed with the display panel.

[0016] A driving chip is arranged on the side of the driving substrate away from the display panel.

[0017] Further, the heat dissipation film is arranged on the surface of the driving chip away from the driving substrate.

[0018] Further, the heat dissipation film is arranged between the driving substrate and the display panel.

[0019] The beneficial effects of the present application are:

[0020] The present application provides a display device, by arranging a heat dissipation film, and arranging the heat dissipation film comprising a heat dissipation substrate and a graphene layer, the heat dissipation film is attached to the driving module, the heat dissipation substrate is provided with a microstructure on the surface away from the driving module, the graphene layer is arranged on the heat dissipation substrate, and the graphene layer is attached to the microstructure, which can increase the contact area of the graphene layer and the heat dissipation substrate, thereby improving the heat dissipation efficiency of the heat dissipation film, so that the heat generated by the driving chip can be dissipated to the outside in time, avoiding the accumulation of heat of the driving chip, and improving the working stability of the driving chip of the display device. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1 is a schematic diagram of the first structure of the display device of the present application;

[0022] Figure 2 is a schematic diagram of the second structure of the display device of the present application;

[0023] Figure 3 is a schematic diagram of the first heat dissipation film of the display device of the present application;

[0024] Figure 4 is a schematic diagram of the second heat dissipation film of the display device of the present application;

[0025] Figure 5 is a schematic diagram of the third heat dissipation film of the display device of the present application.

[0026] REFERENCE SIGNS:

[0027] 100-display panel; 200-driving module, 210-driving substrate, 220-driving chip; 300-heat dissipation film, 310-heat dissipation substrate, 311-microstructure, 3111-groove, 3112-protrusion, 320-graphene layer. DETAILED DESCRIPTION

[0028] The technical solutions in the embodiments of the present application will be described below with reference to the accompanying drawings in the embodiments of the present application. The technical solutions described below are only used to explain and illustrate the ideas of the present application, and should not be regarded as limiting the protection scope of the present application.

[0029] In addition, the terms "first", "second", and similar words do not represent any order, number or importance, but are only used to distinguish different technical features. The term "multiple" and similar words represent two or more, unless otherwise explicitly limited.

[0030] The first embodiment of the present application provides a display device, referring to Figure 1 , Figure 2 , Figure 3 and Figure 4 , the display device comprises a display panel 100, a driving module 200 and a heat dissipation film 300; the driving module 200 is connected with the display panel 100; the heat dissipation film 300 comprises a heat dissipation substrate 310 and a graphene layer 320, the heat dissipation film 300 is attached with the driving module 200, one surface of the heat dissipation substrate 310 away from the driving module 200 is provided with a microstructure 311, the graphene layer 320 is arranged on the heat dissipation substrate 310, and the graphene layer 320 is attached with the microstructure 311; specifically, the microstructure 311 comprises a plurality of grooves 3111, a plurality of the grooves 3111 are arranged at intervals, wherein a part of the graphene layer 320 fills the grooves 3111.

[0031] With the resolution and refresh rate of the display device being higher and higher, the load of the display device is also higher and higher, so that the working temperature of the driving chip 220 of the display device is also higher and higher. The conventional scheme pastes a heat dissipation film on the driving chip of the display device, but in the case that the area of the heat dissipation film is fixed, the heat dissipation performance of the heat dissipation film is unchanged, so that the heat of the driving chip 220 is still prone to accumulation, which cannot be dissipated to the outside in time, resulting in the working stability of the driving chip 220 of the display device being reduced. Therefore, the technical scheme of the present application sets the heat dissipation film 300, and sets the heat dissipation film 300 to include a heat dissipation base material 310 and a graphene layer 320, the heat dissipation film 300 is attached to the driving module 200, one surface of the heat dissipation base material 310 away from the driving module 200 is provided with a microstructure 311, the graphene layer 320 is arranged on the heat dissipation base material 310, and the graphene layer 320 is attached to the microstructure 311, the microstructure 311 includes a plurality of grooves 3111, a plurality of the grooves 3111 are arranged at intervals, wherein a part of the graphene layer 320 fills the grooves 3111, which can increase the contact area of the graphene layer 320 and the heat dissipation base material 310, thereby improving the heat dissipation efficiency of the heat dissipation film 300, so that the heat generated by the driving chip 220 can be dissipated to the outside in time, avoiding the accumulation of heat of the driving chip 220, and improving the working stability of the driving chip 220 of the display device.

[0032] In the present embodiment, with reference to Figure 3 , the opening of the groove 3111 is circular. Specifically, the number of the grooves 3111 y1≥S1 / (S2-S3); wherein S1 is the area of the heat dissipation base material 310, S2 is the surface area of a single groove 3111, S3 is the area of the opening of a single groove 3111, and the depth of the groove 3111 is not less than the radius of the opening of the groove 3111. By setting the number of the grooves 3111 y1≥S1 / (S2-S3); wherein S1 is the area of the heat dissipation base material 310, S2 is the surface area of a single groove 3111, S3 is the area of the opening of a single groove 3111, and the depth of the groove 3111 is not less than the radius of the opening of the groove 3111, the contact area of the graphene layer 320 and the heat dissipation base material 310 can be further increased, thereby further improving the heat dissipation efficiency of the heat dissipation film 300, and compared with the conventional scheme of increasing the number of heat dissipation films 300 to improve the heat dissipation efficiency of the driving chip 220 of the display device, the number of heat dissipation films 300 does not need to be increased, thereby saving the number of heat dissipation films 300.

[0033] In the present embodiment, the shape of the groove 3111 is hemispherical, and the graphene layer 320 is rectangular; then the number of the grooves 3111 y1≥a*b / (1 / 24πr 2 -πr.2 ); where a is the length of the long side of the graphene layer 320, b is the length of the short side of the graphene layer 320, and r is the radius of the hemispherical groove 3111.

[0034] In this embodiment, the depth of the groove 3111 is not greater than the thickness of the heat dissipation substrate 310.

[0035] In this embodiment, reference Figure 4 The opening of the groove 3111 is square. Specifically, the number of grooves 3111, y2 ≥ S4 / (S5-S6); where S4 is the area of ​​the heat dissipation substrate 310, S5 is the surface area of ​​a single groove 3111, S6 is the area of ​​the opening of a single groove 3111, and the depth of the groove 3111 is not less than one-quarter of the side length of the square. By setting the number of grooves 3111, y2≥S4 / (S5-S6), where S4 is the area of ​​the heat dissipation substrate 310, S5 is the surface area of ​​a single groove 3111, and S6 is the area of ​​the opening of a single groove 3111, and the depth of the groove 3111 is not less than one-quarter of the side length of the square, the contact area between the graphene layer 320 and the heat dissipation substrate 310 is further increased, thereby further improving the heat dissipation efficiency of the heat dissipation film 300. Moreover, compared with the conventional solution that requires increasing the number of heat dissipation films 300 to improve the heat dissipation efficiency of the driver chip 220 of the display device, it is not necessary to increase the number of heat dissipation films 300, thereby saving the number of heat dissipation films 300.

[0036] In this embodiment, the groove 3111 is square in shape, and the graphene layer 320 is rectangular in shape; therefore, the number of grooves 3111 is y2 ≥ c*d / (5A). 2 -A 2 ); where c is the length of the long side of the graphene layer 320, d is the length of the short side of the graphene layer 320, and A is the side length of the cubic groove 3111.

[0037] In this embodiment, the depth of the groove 3111 is not greater than the thickness of the heat dissipation substrate 310.

[0038] In this embodiment, reference Figure 1 , Figure 2 The driving module 200 includes a driving substrate 210 and a driving chip 220; the driving substrate 210 is fixed to the display panel 100; the driving chip 220 is disposed on the side of the driving substrate 210 away from the display panel 100.

[0039] In this embodiment, the heat dissipation film 300 further includes an adhesive layer, which is bonded and fixed to the drive module 200.

[0040] In the embodiment, referring to Figure 1 , the heat dissipation film 300 is arranged on a surface of the driving chip 220 away from the driving substrate 210. By arranging the heat dissipation film 300 on a surface of the driving chip 220 away from the driving substrate 210, the heat dissipation film 300 is in direct contact with the driving chip 220, and the heat conduction does not need to pass through the driving substrate 210, so that the thermal resistance can be reduced, and the heat generated by the driving chip 220 can be quickly conducted to the heat dissipation film 300, avoiding the accumulation of heat of the driving chip 220.

[0041] Specifically, the heat dissipation substrate 310 is fixedly connected to the driving chip 220 through the adhesive layer.

[0042] In the embodiment, referring to Figure 2 , the heat dissipation film 300 is arranged between the driving substrate 210 and the display panel 100.

[0043] Specifically, the heat dissipation substrate 310 is fixedly connected to the driving substrate 210 through the adhesive layer.

[0044] In the embodiment, the material of the heat dissipation substrate 310 includes copper or aluminum.

[0045] The second embodiment of the present application provides a display device, referring to Figure 1 , Figure 2 , Figure 3 and Figure 5 , the heat dissipation device includes a display panel 100, a driving module 200 and a heat dissipation film 300; the driving module 200 is connected to the display panel 100; the heat dissipation film 300 includes a heat dissipation substrate 310 and a graphene layer 320, the heat dissipation film 300 is attached to the driving module 200, a surface of the heat dissipation substrate 310 away from the driving module 200 is provided with a microstructure 311, the graphene layer 320 is arranged on the heat dissipation substrate 310, and the graphene layer 320 is attached to the microstructure 311; specifically, the microstructure 311 includes a plurality of protrusions 3112, and the plurality of protrusions 3112 are arranged at intervals, wherein the graphene layer 320 covers the protrusions 3112.

[0046] With the resolution and refresh rate of the display device being higher and higher, the load of the display device is also higher and higher, so that the working temperature of the driving chip 220 of the display device is also higher and higher, which causes the heat of the driving chip 220 to be prone to accumulation and unable to be dissipated to the outside in time, thereby reducing the working stability of the driving chip 220 of the display device. Therefore, the technical scheme of the present application sets the heat dissipation film 300, and sets the heat dissipation film 300 to include a heat dissipation base material 310 and a graphene layer 320, the heat dissipation film 300 is attached to the driving module 200, one surface of the heat dissipation base material 310 away from the driving module 200 is provided with a microstructure 311, the graphene layer 320 is arranged on the heat dissipation base material 310, and the graphene layer 320 is attached to the microstructure 311, the microstructure 311 includes a plurality of protrusions 3112, a plurality of the protrusions 3112 are arranged at intervals, and the graphene layer 320 covers the protrusions 3112. The contact area of the graphene layer 320 and the heat dissipation base material 310 can be increased, so as to improve the heat dissipation efficiency of the heat dissipation film 300, so that the heat generated by the driving chip 220 can be dissipated to the outside in time, the heat accumulation of the driving chip 220 is avoided, and the working stability of the driving chip 220 of the display device is improved.

[0047] In the embodiment, referring to Figure 1 , Figure 2 , the driving module 200 includes a driving substrate 210 and a driving chip 220; the driving substrate 210 is fixed to the display panel 100; and the driving chip 220 is arranged on one side of the driving substrate 210 away from the display panel 100.

[0048] In the embodiment, the heat dissipation film 300 further includes an adhesive layer, and the adhesive layer is adhesively fixed to the driving module 200.

[0049] In the embodiment, referring to Figure 1 , the heat dissipation film 300 is arranged on one surface of the driving chip 220 away from the driving substrate 210. By arranging the heat dissipation film 300 on one surface of the driving chip 220 away from the driving substrate 210, the heat dissipation film 300 is directly in contact with the driving chip 220, the heat conduction does not need to pass through the driving substrate 210, the thermal resistance can be reduced, the heat generated by the driving chip 220 can be quickly conducted to the heat dissipation film 300, and the accumulation of the heat of the driving chip 220 is avoided.

[0050] Specifically, the heat dissipation base material 310 is adhesively fixed to the driving chip 220 through the adhesive layer.

[0051] In the embodiment, referring to Figure 2 , the heat dissipation film 300 is arranged between the driving substrate 210 and the display panel 100.

[0052] Specifically, the heat dissipation substrate 310 is adhered and fixed to the driving substrate 210 through the adhesive layer.

[0053] In this embodiment, the material of the heat dissipation substrate 310 includes copper or aluminum.

[0054] The specific embodiments of the application have been described above. The above-described embodiments of the application are only preferred embodiments of the application, and those of ordinary skill in the art can make many modifications and improvements without departing from the concept of the application. These modifications and improvements fall within the scope of the claims of the application.

Claims

1. A display device, characterized in that, include: Display panel; A driving module, which is connected to the display panel; A heat dissipation film, comprising a heat dissipation substrate and a graphene layer, wherein the heat dissipation film is bonded to the drive module, a microstructure is provided on a surface of the heat dissipation substrate away from the drive module, and the graphene layer is disposed on the heat dissipation substrate and bonded to the microstructure.

2. The display device according to claim 1, characterized in that, The microstructure includes multiple grooves arranged at intervals, wherein a portion of the graphene layer fills the grooves.

3. The display device according to claim 2, characterized in that, The opening of the groove is circular.

4. The display device according to claim 3, characterized in that, The number of grooves y1≥S1 / (S2-S3); where S1 is the area of ​​the heat dissipation substrate, S2 is the surface area of ​​a single groove, S3 is the area of ​​the opening of a single groove, and the depth of the groove is not less than the radius of the opening of the groove.

5. The display device according to claim 2, characterized in that, The opening of the groove is square.

6. The display device according to claim 5, characterized in that, The number of grooves y2≥S4 / (S5-S6); where S4 is the area of ​​the heat dissipation substrate, S5 is the surface area of ​​a single groove, S6 is the area of ​​the opening of a single groove, and the depth of the groove is not less than one-quarter of the side length of the square.

7. The display device according to claim 1, characterized in that, The microstructure includes multiple protrusions arranged at intervals, wherein the graphene layer covers the protrusions.

8. The display device according to claim 1, characterized in that, The drive module includes: A driving substrate, which is fixed to the display panel; A driver chip is disposed on the side of the driver substrate away from the display panel.

9. The display device according to claim 8, characterized in that, The heat dissipation film is disposed on a surface of the driver chip that is away from the driver substrate.

10. The display device according to claim 8, characterized in that, The heat dissipation film is disposed between the driving substrate and the display panel.

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