Battery management system, communication circuit thereof and energy storage system or electric device
By incorporating ground wires and a split-board design in the communication circuit, the problems of low bus-type communication speed and weak anti-interference in point-to-point communication are solved, achieving efficient anti-interference of communication signals and low-cost maintenance.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- CONTEMPORARY AMPEREX TECHNOLOGY CO LTD
- Filing Date
- 2025-04-07
- Publication Date
- 2026-05-12
AI Technical Summary
In existing technologies, bus-type communication has low communication speed and is limited by nodes and distance, while point-to-point high-speed communication has weak anti-interference ability, is prone to communication quality problems, and has more hardware modules and higher maintenance costs.
In the communication circuit, a ground wire is laid on one side of each signal channel in the same direction as its extension to form the minimum return path. The communication circuit is set up on separate boards, and the signal channels are isolated by ground wires. A unified reference point and electrostatic protection circuit are set up to improve the anti-interference capability.
It improves the anti-interference capability of communication circuits and signals, reduces signal crosstalk, reduces hardware module maintenance costs, and enhances the integrity and efficiency of communication signals.
Smart Images

Figure CN224233690U_ABST
Abstract
Description
Technical Field
[0001] This application belongs to the field of electronic circuit technology, and in particular relates to a battery management system and its communication circuit and energy storage system or power consumption device. Background Technology
[0002] Medium to large-scale control systems typically include a main control board, slave control boards, and data acquisition boards. Typically, one main control board interacts with multiple slave control boards, and one slave control board interacts with multiple data acquisition boards. Bus-based communication methods, due to their low communication speed and limitations on nodes and distance, cannot meet the needs of such control systems. Point-to-point communication methods can utilize high-speed communication, but high-speed signals are weakly resistant to interference and prone to communication quality issues. Utility Model Content
[0003] In view of the above problems, this application provides a battery management system and its communication circuit and energy storage system or power device, which aims to solve the problem of weak anti-interference capability of conventional point-to-point high-speed communication.
[0004] In a first aspect, embodiments of this application provide a communication circuit for a battery management system. The communication circuit includes a control circuit, a communication line, and a transceiver circuit. The communication line is connected between the control circuit and the transceiver circuit. The communication line includes at least one signal channel, and a ground wire is provided on one side of the at least one signal channel in the same direction as the extension of the signal channel.
[0005] In the technical solution of this application embodiment, when the communication circuit is applied to point-to-point high-speed communication, a ground wire is laid on one side of the signal channel in the same direction as the extension of the signal channel, so that the signal channel and the ground wire form the smallest return path, thereby improving the anti-interference capability of the communication circuit and the communication signal.
[0006] In some embodiments, the communication circuit further includes a circuit board, on which one or more of the control circuit, communication lines, and transceiver circuits are disposed.
[0007] In the technical solutions of this application embodiment, some applicable scenarios for communication circuits are provided. Control circuits, communication lines and transceiver circuits can be set on separate boards or on the same board. Communication lines can be laid out using circuit board wiring, or they can be laid out using ribbon cables or wires.
[0008] In some embodiments, the circuit board includes a first circuit board and a second circuit board, a control circuit is disposed on the first circuit board, a transceiver circuit is disposed on the second circuit board, and the first circuit board and the second circuit board are connected by a connector.
[0009] In the technical solution of this application embodiment, the control circuit and the transceiver circuit are set on different circuit boards. When some circuits need to be updated or are damaged, some circuit boards can be directly replaced, reducing maintenance costs.
[0010] In some embodiments, the circuit board further includes a third circuit board, and the connectors include a first connector and a second connector. The first circuit board and the third circuit board are mated through the first connector, the second circuit board and the third circuit board are mated through the second connector, and the first connector and the second connector are electrically connected through the third circuit board.
[0011] In the technical solution of this application embodiment, the third circuit board is equivalent to providing a fixed plug-in or expansion platform for the communication circuit, which is beneficial to the assembly and maintenance of the system.
[0012] In some embodiments, the connector includes signal pins connected to signal channels and ground pins connected to ground. In the connector, ground pins are provided between signal pins connected to adjacent signal channels.
[0013] In the technical solution of this application embodiment, the pins of the connector are also separated by ground pins, so that the signal can have the minimum return path and improve the anti-interference capability of the communication circuit and the communication signal.
[0014] In some embodiments, the signal channels include multiple channels, and ground wires are arranged between adjacent signal channels.
[0015] In the technical solution of this application embodiment, when multiple signal channels are deployed simultaneously, ground wires are arranged between adjacent signal channels, so that each signal channel forms a minimum return path with the adjacent ground wire, reducing signal crosstalk between signal channels and improving the anti-interference capability of communication circuits and communication signals.
[0016] In some embodiments, the communication circuit further includes a power supply circuit and a power line, and the transceiver circuit includes a power port and a first ground port connected to a ground wire.
[0017] The first end of the positive wire of the power supply line is connected to the positive output terminal of the power supply circuit, and the second end of the positive wire is connected to the power port of the transceiver circuit.
[0018] The first end of the negative wire of the power supply line is connected to the negative output terminal of the power supply circuit, and the second end of the negative wire is connected to the first ground port of the transceiver circuit.
[0019] In the technical solution of this application embodiment, the ground wires are connected together with the negative line of the power supply circuit so that the ground wires have a common reference point. That is, a unified reference point is set for the communication signals of each signal channel, which is beneficial to the consistency of communication signals and improves communication efficiency.
[0020] In some embodiments, the transceiver circuit includes at least one transceiver, the transceiver includes a first communication port and a first ground port, the control circuit includes at least one second communication port and at least one second ground port, the two ends of the signal channel are respectively connected to the corresponding second communication port and the corresponding first communication port of the transceiver, and the two ends of the ground wire are respectively connected to the corresponding second ground port and the corresponding first ground port of the transceiver.
[0021] In the technical solution of this application embodiment, the control circuit and each transceiver are provided with a separate ground port for each ground line, which improves the isolation between each ground line, reduces signal crosstalk between each ground line, and improves the anti-interference capability of the communication signal.
[0022] In some embodiments, a signal processing circuit is also included, which is connected to the communication line and the ground line and is located between the control circuit and the transceiver circuit.
[0023] In the technical solution of this application embodiment, the signal processing circuit is used to process the signal transmitted by the communication line, which can enhance the strength of the communication signal, improve the integrity of the signal, and improve communication efficiency and protection capability.
[0024] In some embodiments, the signal processing circuit includes a level conversion circuit and / or a buffer circuit.
[0025] In the technical solution of this application embodiment, the level conversion circuit enables the communication signal levels of the control circuit and the transceiver circuit to be consistent, thereby improving communication efficiency and anti-interference power; the buffer circuit can improve the coordination ability and integrity of each communication signal, thereby improving communication efficiency and anti-interference ability.
[0026] In some embodiments, the signal processing circuit includes at least one electrostatic discharge (ESD) protection circuit, which is connected to the signal channel and a ground wire located on one side of the signal channel.
[0027] In the technical solution of this application embodiment, the electrostatic discharge protection circuit can improve the electrostatic discharge capability of communication signals, improve communication efficiency and anti-interference capability.
[0028] In some embodiments, the electrostatic discharge protection circuit includes a transient suppression diode, with the negative terminal of the transient suppression diode connected to the signal channel and the positive terminal of the transient suppression diode connected to the ground wire.
[0029] In some embodiments, the signal channel includes a first communication line and a second communication line, and the electrostatic discharge protection circuit includes an electrostatic discharge tube, the two negative terminals of which are respectively connected to the first communication line and the second communication line, and the positive terminal of which is connected to the ground wire.
[0030] Secondly, embodiments of this application provide a battery management system, including the communication circuit described above.
[0031] Thirdly, embodiments of this application provide an energy storage system or electrical device, including a battery device and a communication circuit as described above, wherein the communication circuit is electrically connected to the battery device.
[0032] The above description is only an overview of the technical solution of this application. In order to better understand the technical means of this application and to implement it in accordance with the contents of the specification, and to make the above and other objects, features and advantages of this application more obvious and understandable, the following are specific embodiments of this application. Attached Figure Description
[0033] Various other advantages and benefits will become apparent to those skilled in the art upon reading the detailed description of the preferred embodiments below. The accompanying drawings are for illustrative purposes only and are not intended to limit the scope of this application. Furthermore, the same reference numerals denote the same parts throughout the drawings. In the drawings:
[0034] Figure 1 A schematic diagram of the communication circuit of a battery management system provided in some embodiments of this application;
[0035] Figure 2 A schematic diagram of the communication circuit of a battery management system provided in some embodiments of this application;
[0036] Figure 3 A schematic diagram of the communication circuit of the battery management system provided in some embodiments of this application;
[0037] Figure 4 A schematic diagram of the communication circuit of the battery management system provided in some embodiments of this application;
[0038] Figure 5 A schematic diagram of the communication circuit of a battery management system provided in some embodiments of this application;
[0039] Figure 6 A schematic diagram of the communication circuit of a battery management system provided in some embodiments of this application;
[0040] Figure 7 A schematic diagram of the communication circuit of a battery management system provided in some embodiments of this application;
[0041] Figure 8 A schematic diagram of the communication circuit of a battery management system provided in some embodiments of this application;
[0042] Figure 9 A schematic diagram of the communication circuit of a battery management system provided in some embodiments of this application;
[0043] Figure 10A schematic diagram of the communication circuit of a battery management system provided in some embodiments of this application;
[0044] Figure 11 A circuit diagram of an electrostatic discharge protection circuit provided in some embodiments of this application;
[0045] Figure 12 This is a circuit diagram of an electrostatic discharge (ESD) protection circuit provided in some embodiments of this application. Detailed Implementation
[0046] The embodiments of the technical solution of this application will now be described in detail with reference to the accompanying drawings. These embodiments are only used to more clearly illustrate the technical solution of this application and are therefore merely examples, and should not be used to limit the scope of protection of this application.
[0047] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the application; the terms “comprising” and “having”, and any variations thereof, in the specification, claims, and foregoing description of the drawings are intended to cover non-exclusive inclusion.
[0048] In the description of the embodiments of this application, technical terms such as "first" and "second" are used only to distinguish different objects and should not be construed as indicating or implying relative importance or implicitly specifying the number, specific order, or primary and secondary relationship of the indicated technical features. In the description of the embodiments of this application, "multiple" means two or more, unless otherwise explicitly defined.
[0049] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.
[0050] In the description of the embodiments in this application, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.
[0051] In the description of the embodiments of this application, the term "multiple" refers to two or more (including two), similarly, "multiple sets" refers to two or more (including two sets), and "multiple pieces" refers to two or more (including two pieces).
[0052] In energy storage systems, the control section typically includes a main control board, slave control boards, and data acquisition boards. The main control board may contain a Valve Base Controller (VBC), slave control boards may contain a Sub-Module Controller (SMC) or Battery Management Controller (BMC), and data acquisition boards may contain a Sub-Module Battery Management Unit (SBMU). A main control board needs to interact with multiple slave control boards, and a slave control board needs to interact with multiple data acquisition boards. However, bus-based communication methods, due to their low communication speed and limitations on nodes and distance, cannot meet these requirements. Point-to-point communication methods can use high-speed communication, such as fiber optic communication or Ethernet communication; however, routing multiple high-speed signals on the circuit board can easily lead to crosstalk; and high-speed signals have weak anti-interference capabilities, easily causing communication quality problems. Another issue is that point-to-point communication requires more hardware functional modules, resulting in larger size and higher maintenance costs.
[0053] To address this issue, one embodiment of this application provides a communication circuit that solves the aforementioned problems. This communication circuit can have a corresponding ground wire in each communication channel, with adjacent communication channels separated by this ground wire, thus minimizing the return path for each communication channel and improving its anti-interference and crosstalk capabilities. Furthermore, the communication circuit can be deployed on separate boards, thereby reducing the maintenance costs of the hardware modules.
[0054] The communication circuit provided in one embodiment of this application can be configured in a control system with one master and multiple slave devices, such as a battery management system. The control system can be applied to electrical equipment, such as an energy storage system, an electrical appliance, or a power generation system, and the energy storage system can be such as a containerized energy storage system. Furthermore, it can also be used in mobile phones, tablets, laptops, electric toys, power tools, electric vehicles, electric cars, ships, spacecraft, etc.
[0055] For ease of explanation, the following embodiments use a communication circuit from one embodiment of this application applied to a containerized energy storage system as an example. In the accompanying drawings of the following embodiments, the reference numeral i takes the values 1, 2, 3...n.
[0056] Please refer to Figure 1 , Figure 1 This is a schematic diagram of the communication circuit provided in some embodiments of this application. For example... Figure 1As shown, the communication circuit includes a control circuit 210, a communication line 220, and a transceiver circuit 230. The communication line 220 is connected between the control circuit 210 and the transceiver circuit 230. The communication line 220 includes at least one signal channel TXI / RXi. A ground line GNDi is provided on one side of the at least one signal channel TXI / RXi, which is consistent with the extension direction of the signal channel TXI / RXi.
[0057] The control circuit 210 includes, for example, a communication chip or a main chip, such as a Field Programmable Gate Array (FPGA), a Microcontroller Unit (MCU), a Central Processing Unit (CPU), or a System on Chip (SoC). The transceiver circuit 230 includes, for example, a fiber optic transceiver, an Ethernet transceiver, or a Controller Area Network (CAN) transceiver.
[0058] The signal channels TXI / RXi are, for example, signal channels suitable for serial communication, specifically the first communication line TXI and the second communication line RXI. It is understood that the signal channels TXI / RXi can also be other single-wire or three-wire or higher signal channels, and this is not limited here. The ground wire GNDi on one side of the signal channels TXI / RXi is, for example, partially or entirely parallel to the signal channels TXI / RXi.
[0059] In the technical solution of this application embodiment, when the communication circuit is applied to point-to-point high-speed communication, a ground line GNDi is laid on one side of the signal channel TXI / RXi, which is consistent with the extension direction of the signal channel TXI / RXi. This makes the signal channel TXI / RXi and the ground line GNDi form the smallest return path, thereby improving the anti-interference capability of the communication circuit and the communication signal.
[0060] According to some embodiments of this application, refer to Figures 2 to 5 , Figures 2 to 5 This is a schematic diagram of the structure of a communication circuit provided in some embodiments of this application. The communication circuit includes a circuit board 100, and one or more of the following: a control circuit 210, a communication line 220, and a transceiver circuit 230 are disposed on the circuit board 100. The circuit board 100 may be a printed circuit board (PCB) or a flexible printed circuit (FPC).
[0061] In one embodiment, such as Figure 2As shown, the control circuit 210 and the transceiver circuit 230 are both located on the circuit board 100, while the communication line 220 can be a ribbon cable, a wire, or arranged on the circuit board 100, and is respectively connected to the control circuit 210 and the transceiver circuit 230 on the circuit board 100.
[0062] In one embodiment, such as Figure 3 As shown, the control circuit 210 and the communication line 220 are mounted on the circuit board 100. The transceiver circuit 230 is an external device of the circuit board 100, which can be detached or fixedly connected to the circuit board 100 and is electrically connected to the communication line 220.
[0063] In one embodiment, such as Figure 4 As shown, the communication line 220 and the transceiver circuit 230 are disposed on the circuit board 100. The control circuit 210 is an external device of the circuit board 100, which can be detached or fixedly connected to the circuit board 100 and is electrically connected to the communication line 220.
[0064] In one embodiment, such as Figure 5 As shown, the communication line 220 is arranged on the circuit board 100. The control circuit 210 and the transceiver circuit 230 are external devices of the circuit board 100, which can be detached or fixedly connected to the circuit board 100 and are electrically connected to the communication line 220.
[0065] Understandable, Figures 2 to 5 In the circuit, the communication line 220 is laid on the circuit board 100 to connect the control circuit 210 and the transceiver circuit 230. The communication line 220 includes at least one signal channel TXI / RXi, and a ground line GNDi is laid on one side of the at least one signal channel TXI / RXi in the same direction as the extension of the signal channel TXI / RXi.
[0066] Taking a signal channel TXI / RXi suitable for serial communication as an example, it includes two copper traces laid on the circuit board 100. The ground line GNDi on one side of the signal channel TXI / RXi is arranged on the circuit board 100 in partial or complete parallel to the signal channel TXI / RXi; or a signal channel TXI / RXi and its ground line GNDi include three parallel ribbon cables or cables.
[0067] According to some embodiments of this application, refer to Figure 6 This is a schematic diagram of the communication circuit provided in some embodiments of this application. Figure 6 As shown, the communication circuit includes multiple signal channels TXI / RXi, and the ground line GND1 is arranged between adjacent signal channels (i.e., signal channels TXn / RXn and signal channels TXn-1 / RXn-1). For example, signal channels TX1 / RX1 and signal channels TX2 / RX2 are separated by the ground line GND1.
[0068] In order to save space on the circuit board 100, if multiple signal channels TXI / RXi are arranged on the circuit board 100, the multiple signal channels TXI / RXi can be arranged in parallel with each other.
[0069] In the technical solution of this application embodiment, when multiple signal channels TXI / RXi are deployed simultaneously, a ground wire GNDi is arranged between adjacent signal channels, so that each signal channel forms a minimum return path with the adjacent ground wire GNDi, reducing signal crosstalk between signal channels TXI / RXi and improving the anti-interference capability of communication circuits and communication signals.
[0070] According to some embodiments of this application, refer to Figure 6 This is a schematic diagram of the structure of a communication circuit provided in some embodiments of this application.
[0071] The circuit board 100 also includes a power supply circuit 300 and a power line. The transceiver 231 also includes a power port VDDI and a first ground port ci for connecting the ground line GNDi. The first end of the positive line VDD of the power line is connected to the positive output terminal of the power supply circuit 300, and the second end of the positive line VDD is connected to the power port VDDI of each transceiver 231. The first end of the negative line GND of the power line is connected to the negative output terminal of the power supply circuit 300, and the second end of the negative line GND is connected to the first ground port ci of each transceiver 231.
[0072] The power supply circuit 300 can be located inside or outside the circuit board 100, and this is not limited here.
[0073] In the technical solution of this application embodiment, each ground line GNDi is connected to the negative line GND of the power supply circuit 300, so that each ground line GNDi has a common reference point, that is, a unified reference point is set for the communication signals of each signal channel TXI / RXi, which is beneficial to the consistency of communication signals and improves communication efficiency.
[0074] Based on some embodiments of this application, please continue to refer to Figure 6 The transceiver circuit 230 includes at least one transceiver 231, which includes a first communication port ai / bi and a first ground port ci. The control circuit 210 includes at least one second communication port Ai / Bi and at least one second ground port Ci. The two ends of the signal channel TXI / RXI are respectively connected to the corresponding second communication port Ai / Bi and the corresponding first communication port ai / bi of the transceiver 231. The two ends of the ground line GNDi are respectively connected to the corresponding second ground port Ci and the corresponding first ground port ci of the transceiver 231.
[0075] In this embodiment, each transceiver 231 includes a first communication port ai / bi and a first ground port ci. The first communication port ai / bi includes a receive pin ai and a transmit pin bi. The second communication port Ai / Bi includes a transmit pin Ai and a receive pin Bi. A first communication line TXi is connected between the transmit pin Ai and the receive pin ai, and a second communication line RXi is connected between the receive pin Bi and the transmit pin bi.
[0076] In the technical solution of this application embodiment, the control circuit 210 and each transceiver 231 each set a separate ground port ci for each ground line GNDi, thereby improving the isolation between each ground line GNDi, reducing signal crosstalk between each ground line GNDi, and improving the anti-interference capability of the communication signal.
[0077] According to some embodiments of this application, refer to Figure 7 This is a schematic diagram of the structure of a communication circuit provided in some embodiments of this application.
[0078] The circuit board 100 includes a first circuit board 101 and a second circuit board 102. The control circuit 210 is disposed on the first circuit board 101, and the transceiver circuit 230 is disposed on the second circuit board 102. The first circuit board 101 and the second circuit board 102 are connected by a connector 410.
[0079] The first circuit board 101 is, for example, a main control board, and the second circuit board 102 is, for example, a data acquisition board or a signal board. The connector 410 includes a female connector 410A and a plug 410B, with the plug 410B pluggable into the female connector 410A. The communication line 220 is divided into two parts, respectively arranged on the first circuit board 101 and the second circuit board 102. These two parts of the communication line 220 can be ribbon cables, wires, or arranged on the circuit board 100. The female connector 410A is located on the first circuit board 101 and connects to the control circuit 210 via a portion of the communication line 220. The plug 410B is located on the second circuit board 102 and connects to the transceiver circuit 230 via another portion of the communication line 220. The second circuit board 102 connects to the female connector 410A on the first circuit board 101 via the plug 410B, thus enabling the communication circuit to be connected.
[0080] In one embodiment, the power supply circuit 300 is also arranged on the first circuit board 101 to supply power to the control circuit 210. It is understood that the power supply circuit 300 may also be located outside the circuit board 100 or on the second circuit board 102.
[0081] In the technical solution of this application embodiment, the control circuit 210 and the transceiver circuit 230 are separately arranged on different first circuit boards 101 and second circuit boards 102. When some circuits need to be updated or are damaged, some circuit boards can be directly replaced to reduce maintenance costs.
[0082] According to some embodiments of this application, refer to Figure 8 This is a schematic diagram of the communication circuit provided in some embodiments of this application. The circuit board 100 also includes a third circuit board 103, and the connector 410 includes a first connector 411 and a second connector 412. The first circuit board 101 and the third circuit board 103 are connected through the first connector 411, and the second circuit board 102 and the third circuit board 103 are connected through the second connector 412. The first connector 411 and the second connector 412 are electrically connected through the third circuit board 103.
[0083] The first circuit board 101 is, for example, a main control board; the second circuit board 102 is, for example, a data acquisition board; and the third circuit board 103 is, for example, a backplane. The first connector 411 includes a first plug 411A and a first female connector 411B; the second connector 412 includes a second plug 412A and a second female connector 412B. The communication line 220 is divided into three parts: the first part of the communication line 220 is arranged on the first circuit board 101; the second part of the communication line 220 is arranged on the second circuit board 102; and the third part of the communication line 220 is arranged on the third circuit board 103. The three parts of the communication line 220 can be ribbon cables, electrical cables, or can be arranged on the circuit board 100. The first plug 411A is disposed on the first circuit board 101 and is connected to the control circuit 210 through the first part of the communication line 220; the second plug 412A is disposed on the second circuit board 102 and is connected to the transceiver circuit 230 through the second part of the communication line 220; the first female connector 411B and the second female connector 412B are disposed on the third circuit board 103 and are interconnected through the third part of the communication line 220. The first circuit board 101 is connected to the first female connector 411B on the third circuit board 103 via the first plug 411A, and the second circuit board 102 is connected to the second female connector 412B on the third circuit board 103 via the second plug 412A, so that the communication circuit is connected.
[0084] In this embodiment, the positive line VDD and the negative line GND of the power supply line are also connected through the first connector 411 and the second connector 412.
[0085] In the technical solution of this application embodiment, the third circuit board 103 serves as the backplane of the device, which is equivalent to providing a fixed plug-in or expansion platform for the communication circuit, which is beneficial to the assembly and maintenance of the system.
[0086] in, Figure 7 and Figure 8 In the example, the communication line 220 includes multiple signal channels TXI / RXi. It can be understood that the technical solutions provided by these embodiments are also applicable to the case where the communication line 220 includes only one signal channel TXI / RXi.
[0087] According to some embodiments of this application, the second circuit board 102 may be configured with one or more components as required by the transceiver 231.
[0088] Based on some embodiments of this application, please continue to refer to Figure 7 and Figure 8 The connector 410 includes signal pins connected to signal channels TXI / RXi and ground pins connected to ground line GND1. In the connector 410, a ground pin (a ground pin connected to ground line GND1) is provided between the signal pins connected to adjacent signal channels (e.g., signal channels TX1 / RX1 and signal channels TX2 / RX2).
[0089] In the technical solution of this application embodiment, the pins of connector 410 are also separated by ground pins, so that the signal can have the minimum return path and improve the anti-interference capability of communication circuit and communication signal.
[0090] According to some embodiments of this application, refer to Figure 9 This is a schematic diagram of the communication circuit provided in some embodiments of this application. The communication circuit also includes a signal processing circuit 500, which is connected to the communication line 220 and the ground line GNDi, and is located between the control circuit 210 and the transceiver circuit 230.
[0091] In the technical solution of this application embodiment, the signal processing circuit 500 is used to process the signal transmitted by the communication line 220, which can enhance the strength of the communication signal, improve the integrity of the signal, and improve communication efficiency and protection capability.
[0092] In some cases, the voltage levels of the control circuit 210 and the transceiver circuit 230 are inconsistent. Please refer to some embodiments of this application for further details. Figure 9 The signal processing circuit 500 includes a level conversion circuit. A level conversion circuit, such as a level conversion chip, is added between the control circuit 210 and the transceiver circuit 230 to ensure that the communication signal levels of the control circuit 210 and the transceiver circuit 230 are consistent, thereby improving communication efficiency and anti-interference capabilities. It is understood that the design of the level conversion circuit needs to consider communication rate, signal level, and data delay, among other factors.
[0093] In some cases, the control circuit 210 and the transceiver circuit 230 are far apart. Therefore, please refer to some embodiments of this application. Figure 9 The signal processing circuit 500 includes a buffer circuit. The buffer circuit is used to suppress the attenuation of the communication signal and ensure its integrity. The buffer circuit may include, for example, a buffer. Understandably, the selection of the buffer also needs to consider factors such as communication rate, voltage level, and data delay.
[0094] In some embodiments, each signal channel TXI / RXI is provided with a level shifting chip and / or a buffer.
[0095] In some embodiments, multiple signal channels TXI / RXI share a single level shifting chip and / or a buffer.
[0096] According to some embodiments of this application, refer to Figure 10 This is a schematic diagram of the communication circuit provided in some embodiments of this application. The signal processing circuit 500 includes at least one electrostatic discharge (ESD) protection circuit 600, which is connected to the signal channel TXI / RXi and the ground line GNDi located on one side of the signal channel TXI / RXi.
[0097] The electrostatic discharge protection circuit 600 is used to discharge static electricity from the signal channels TXI / RXI, preventing interference with the communication signals and even damage to the hardware circuits due to static electricity.
[0098] In the technical solution of this application embodiment, the electrostatic discharge protection circuit 600 can improve the electrostatic discharge capability of communication signals, improve communication efficiency and anti-interference capability.
[0099] According to some embodiments of this application, the electrostatic discharge protection circuit 600 includes a transient suppression diode, with its two ends connected to the signal path TXI / RXI and the ground line GNDi, respectively. (See also...) Figure 11 The diagram below shows a schematic of an electrostatic discharge (ESD) protection circuit provided in some embodiments of this application. Taking signal channel TX1 / RX1 and ground line GND1 as an example, the ESD protection circuit 600 includes two transient suppression diodes D1 and D2. Transient suppression diode D1 is connected between the first communication line TX1 and the ground line GND1, and transient suppression diode D2 is connected between the second communication line RX1 and the ground line GND1.
[0100] According to some embodiments of this application, refer to Figure 12 This is a circuit diagram of an electrostatic discharge (ESD) protection circuit provided in some embodiments of this application. Taking the signal channel TX1 / RX1 and ground line GND1 as an example, the signal channel TX1 / RX1 includes a first communication line TX1 and a second communication line RX1. The ESD protection circuit 600 includes an ESD tube ESD1. The two negative terminals of the ESD tube ESD1 are respectively connected to the first communication line TX1 and the second communication line RX1, and the positive terminal of the ESD tube ESD1 is connected to the ground line GND1.
[0101] The selection of transient voltage suppressor diodes D1 and D2, and electrostatic discharge diode ESD1 needs to consider that the maximum operating voltage of the communication circuit must be lower than the stand-off voltage of the transient voltage suppressor diodes, the maximum clamping voltage should be lower than the operating voltage of the communication circuit, and the peak pulse current should be able to meet the maximum pulse current that may occur on the 220V communication line. The parasitic capacitance of the transient voltage suppressor diodes D1 and D2, and the electrostatic discharge diode ESD1 should also be minimized to improve the problem of high-speed signals passing through large capacitances and distortion.
[0102] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and not to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. These modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application, and they should all be covered within the scope of the claims and specification of this application. In particular, as long as there is no structural conflict, the various technical features mentioned in the embodiments can be combined in any way. This application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.
Claims
1. A communication circuit for a battery management system, characterized in that, The communication circuit includes a control circuit, a communication line, and a transceiver circuit. The communication line is connected between the control circuit and the transceiver circuit. The communication line includes at least one signal channel, and a ground wire is laid on one side of the at least one signal channel in the same direction as the extension of the signal channel.
2. The communication circuit according to claim 1, characterized in that, The communication circuit also includes a circuit board, on which one or more of the control circuit, the communication line, and the transceiver circuit are disposed.
3. The communication circuit according to claim 2, characterized in that, The circuit board includes a first circuit board and a second circuit board. The control circuit is disposed on the first circuit board, and the transceiver circuit is disposed on the second circuit board. The first circuit board and the second circuit board are connected by a connector.
4. The communication circuit according to claim 3, characterized in that, The circuit board further includes a third circuit board, and the connector includes a first connector and a second connector. The first circuit board and the third circuit board are connected via the first connector, and the second circuit board and the third circuit board are connected via the second connector. The first connector and the second connector are electrically connected via the third circuit board.
5. The communication circuit according to claim 3 or 4, characterized in that, The connector includes signal pins connected to the signal channels and ground pins connected to the ground wire. In the connector, the ground pins are provided between the signal pins connected to adjacent signal channels.
6. The communication circuit according to any one of claims 1 to 4, characterized in that, The signal channels include multiple channels, and the ground wire is arranged between adjacent signal channels.
7. The communication circuit according to any one of claims 1 to 4, characterized in that, The communication circuit also includes a power supply circuit and a power line, and the transceiver circuit includes a power port and a first ground port for connecting the ground wire. The first end of the positive line of the power supply is connected to the positive output terminal of the power supply circuit, and the second end of the positive line is connected to the power port of the transceiver circuit. The first end of the negative wire of the power supply line is connected to the negative output terminal of the power supply circuit, and the second end of the negative wire is connected to the first ground port of the transceiver circuit.
8. The communication circuit according to any one of claims 1 to 4, characterized in that, The transceiver circuit includes at least one transceiver, the transceiver includes a first communication port and a first ground port, the control circuit includes at least one second communication port and at least one second ground port, the two ends of the signal channel are respectively connected to the corresponding second communication port and the corresponding first communication port of the transceiver, and the two ends of the ground wire are respectively connected to the corresponding second ground port and the corresponding first ground port of the transceiver.
9. The communication circuit according to any one of claims 1 to 4, characterized in that, It also includes a signal processing circuit, which is connected to the communication line and the ground line, and is located between the control circuit and the transceiver circuit.
10. The communication circuit according to claim 9, characterized in that, The signal processing circuit includes a level conversion circuit and / or a buffer circuit.
11. The communication circuit according to claim 9, characterized in that, The signal processing circuit includes at least one electrostatic discharge (ESD) protection circuit, which is connected to the signal channel and the ground wire located on one side of the signal channel.
12. The communication circuit according to claim 11, characterized in that, The electrostatic discharge protection circuit includes a transient suppression diode, with its two ends connected to the signal channel and the ground wire, respectively.
13. The communication circuit according to claim 11, characterized in that, The signal channel includes a first communication line and a second communication line. The electrostatic discharge protection circuit includes an electrostatic discharge tube. The two negative terminals of the electrostatic discharge tube are respectively connected to the first communication line and the second communication line, and the positive terminal of the electrostatic discharge tube is connected to the ground wire.
14. A battery management system, characterized in that, The communication circuit of the battery management system as described in any one of claims 1 to 13 is included.
15. An energy storage system or electrical device, characterized in that, It includes a battery device and a communication circuit of a battery management system as described in any one of claims 1 to 13, the communication circuit being electrically connected to the battery device.