High-density interconnection circuit board structure based on stepped micro blind holes
By introducing a stepped micro-blind via design and auxiliary mounting components into the circuit board, the problems of interlayer misalignment and deformation during the processing and use of high-density interconnect circuit boards are solved, achieving higher mounting accuracy, heat dissipation efficiency and shock resistance.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- JIANGXI HONGSEN TECH CO LTD
- Filing Date
- 2025-05-22
- Publication Date
- 2026-05-12
AI Technical Summary
Existing high-density interconnect circuit boards are prone to interlayer misalignment and board deformation during manufacturing and processing, and are easily affected by environmental factors, leading to circuit function damage or failure.
The high-density interconnect circuit board structure, which adopts a stepped micro-blind via design, is fixed and protected by auxiliary mounting components (including mounting bases, connecting rods, limit buckles, heat sinks, cover plates, and buffer feet, etc.) to ensure precise alignment of the stack and enhance resistance to deformation.
It effectively prevents interlayer misalignment, reduces the risk of board deformation, improves the heat dissipation performance and shock resistance of the circuit board, and enhances the reliability and practicality of the circuit board.
Smart Images
Figure CN224234005U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of circuit board technology, and in particular to a high-density interconnect circuit board structure based on stepped micro-blind vias. Background Technology
[0002] A circuit board, also known as a printed circuit board or printed circuit board, is an important electronic component. It serves as the support for electronic components and the carrier for their electrical connections. High-density interconnect circuit boards (HDPCBs) interconnect multiple circuit boards to meet different device requirements, and current HDPCBs are often formed by stacking multiple circuit boards together.
[0003] Multilayer circuit boards often have more intricate internal circuitry. On one hand, during the manufacturing process, the conventional multilayer circuit board stacking process can easily lead to interlayer misalignment. On the other hand, multilayer circuit boards are also prone to bending, shrinking, or stretching deformation when affected by environmental factors (such as temperature and humidity) or external forces. When interlayer misalignment or board deformation occurs, it often leads to damage to circuit functionality or even complete failure. Utility Model Content
[0004] Therefore, it is necessary to provide a high-density interconnect circuit board structure based on stepped micro-blind vias to address the shortcomings of existing technologies.
[0005] A high-density interconnect circuit board structure based on stepped micro-blind vias includes multiple layers of boards stacked sequentially and auxiliary mounting components located at the bottom and sides of the multiple layers. Each of the multiple layers of boards has several through-holes extending vertically, with the through-holes between the upper and lower layers corresponding vertically. The auxiliary mounting components include symmetrically arranged mounting bases and two connecting rods connecting the mounting bases. The mounting bases have an "L"-shaped cross-section and are also equipped with several mounting rods. The left and right ends of the multiple layers of boards are stacked sequentially on the mounting bases, with the through-holes corresponding to the mounting rods. The two connecting rods are axially connected in an "X" shape, with their ends connected to the mounting bases on the left and right sides, respectively.
[0006] Furthermore, the auxiliary mounting component also includes a limiting buckle, and the inner side of the mounting base is provided with an adjusting groove. The end of the connecting rod is engaged in the adjusting groove and can be slidably adjusted, and the limiting buckle is engaged at the shaft joint of the two sets of connecting rods and can limit the position of the connecting rod.
[0007] Furthermore, the high-density interconnect circuit board structure based on stepped micro-blind vias also includes two sets of heat sinks, the ends of which are respectively engaged with the mounting base, and the two sets of heat sinks are respectively attached to the front and rear sides of the multilayer board.
[0008] Furthermore, the outer side of the heat sink is provided with several outwardly extending heat sinks, all of which are designed to be inclined downwards.
[0009] Furthermore, the high-density interconnect circuit board structure based on stepped micro-blind vias also includes a cover plate, which is provided with a through-hole and an elastic limiting member. The upper part of the mounting rod is correspondingly provided with a limiting locking groove. The cover plate covers the uppermost board and the through-hole passes through the mounting rod. The elastic limiting member and the limiting locking groove of the mounting rod engage and limit each other.
[0010] Furthermore, the high-density interconnect circuit board structure based on stepped micro-blind vias also includes several buffer feet, and the outer side of the mounting base is provided with corresponding buffer through holes. The buffer feet include a mounting plate, a buffer rod, and a buffer spring. The buffer rod is integrally mounted on the mounting plate and movably passes through the buffer through hole. The buffer spring is sleeved on the buffer rod, and its two ends abut against the bottom of the buffer through hole and the top of the mounting plate, respectively.
[0011] Furthermore, the inner side of the mounting base is provided with a foolproof protrusion, and the left and right sides of the multi-layer plate are provided with foolproof notches, which are engaged and limited by the foolproof notches and the foolproof protrusions.
[0012] In summary, the beneficial effects of this utility model's high-density interconnect circuit board structure based on stepped micro-blind vias are as follows: By designing a circuit board structure with auxiliary mounting components, the circuit board is easier to install during manufacturing, effectively preventing interlayer misalignment during multi-layer board stacking. Furthermore, the mounting base of the auxiliary mounting components, in conjunction with the connecting rod, can fix and limit the board, greatly reducing the risk of board deformation. The adjustable spacing of the auxiliary mounting components allows it to be used for stacking boards of different lengths. The addition of a heat dissipation structure and a cover plate structure to the circuit board not only improves its heat dissipation performance during use but also optimizes its waterproof and dustproof effects. The design of a buffer mounting structure significantly improves the circuit board's shock absorption capacity, further enhancing its reliability. This utility model is highly practical and has significant potential for widespread application. Attached Figure Description
[0013] Figure 1 This is a schematic diagram of a high-density interconnect circuit board structure based on a stepped micro-blind via according to the present invention.
[0014] Figure 2 for Figure 1 A schematic diagram of the decomposed structure;
[0015] Figure 3 for Figure 2 Schematic diagram of the middle plate structure;
[0016] Figure 4 for Figure 2 Exploded view of the auxiliary installation components;
[0017] Figure 5 for Figure 2 Schematic diagram of the heat sink structure;
[0018] Figure 6 for Figure 2 Exploded view of the middle cover plate;
[0019] Figure 7 for Figure 2 A schematic diagram of the exploded structure of the buffer support. Detailed Implementation
[0020] To make the objectives, technical solutions, and advantages of this utility model clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of the utility model.
[0021] like Figures 1 to 7 As shown, this utility model provides a high-density interconnect circuit board structure 100 based on stepped micro-blind vias, which includes a multilayer board body 10 stacked vertically and auxiliary mounting components 20 disposed at the bottom and sides of the multilayer board body 10.
[0022] Each of the multi-layered plates 10 is provided with several vertically penetrating positioning through holes 11, and the positioning through holes 11 between the upper and lower plates 10 are arranged vertically and vertically. The auxiliary mounting component 20 includes a mounting base 21 arranged symmetrically on the left and right sides and two connecting rods 22 connecting the mounting base 21. The mounting base 21 has an "L" shaped cross-section and is also provided with several mounting rods 211. The left and right ends of the multi-layered plates 10 are stacked on the mounting base 21 in sequence, and the positioning through holes 11 are correspondingly inserted into the mounting rods 211. The two connecting rods 22 are arranged in an "X" shaped axial connection, and the two ends of the two connecting rods 22 are respectively connected to the mounting bases 21 on the left and right sides.
[0023] When stacking and mounting the circuit board, simply stack the multiple layers of board 10 sequentially from top to bottom onto the mounting base 21, and insert the mounting rod 211 into the positioning through hole 11. Due to the positioning and limiting effect of the mounting rod 211 and the positioning through hole 11, the upper and lower layers of board 10 can be precisely aligned vertically without interlayer misalignment. After the circuit board is stacked, the "X"-shaped connecting rod 22 provides limiting support to the mounting bases 21 at both ends and the layers stacked on the mounting bases 21, resisting lateral tensile or pushing forces. This effectively prevents the board 10 from bending, shrinking, or stretching due to internal stress or external forces, ensuring the normal and reliable operation of the circuit board's precision lines.
[0024] The auxiliary mounting component 20 also includes a limiting buckle 23, and the inner side of the mounting base 21 is provided with an adjusting groove 212. The end of the connecting rod 22 is engaged in the adjusting groove 212 and can be slidably adjusted. The limiting buckle 23 is engaged at the shaft joint of the two sets of connecting rods 22 and can limit the connecting rod 22. The adjusting groove 212 on the inner side of the mounting base 21 allows the connecting rod 22 to slide and rotate for adjustment, thereby adjusting the distance between the two mounting bases 21 to match circuit boards of different lengths. The limiting buckle 23 can limit and fix the connecting rod 22 to prevent the installed circuit board from becoming loose and unstable. The inner side of the mounting base 21 is also provided with a foolproof protrusion 213, and the left and right sides of the multi-layer board body 10 are provided with foolproof notches 12. The foolproof notches 12 and the foolproof protrusions 213 engage and limit each other. The foolproof protrusions 213 and the foolproof notches 12 can effectively prevent the problem of the board body 10 being stacked in reverse.
[0025] The high-density interconnect circuit board structure 100 based on stepped micro-blind vias also includes two sets of heat sinks 30. The ends of the two sets of heat sinks 30 are respectively engaged with the mounting base 21, and the two sets of heat sinks 30 are respectively attached to the front and rear sides of the multilayer board 10. Several outwardly extending heat sinks 31 are also provided on the outer side of each heat sink 30, and all of the heat sinks 31 are designed to slope downwards. The heat sinks 30 are attached to the front and rear sides of the circuit board, which can significantly improve the heat dissipation efficiency of the circuit board during operation. The design of the heat sinks 31 further enhances the heat dissipation area of the heat sinks 30, improving the heat dissipation effect. Furthermore, the downwardly sloped design of the heat sinks 31 reduces the problem of dust accumulation on the surface, thus reducing the impact on heat dissipation.
[0026] The high-density interconnect circuit board structure 100 based on stepped micro-blind vias also includes a cover plate 40. The cover plate 40 is provided with a through-hole 41 and an elastic limiting member 42. The upper part of the mounting rod 211 is correspondingly provided with a limiting locking groove 211a. The cover plate 40 covers the uppermost plate 10, and the through-hole 41 passes through the mounting rod 211. The elastic limiting member 42 and the limiting locking groove 211a of the mounting rod 211 engage and limit each other. The cover plate 40 with the elastic limiting member 42 not only facilitates the assembly and disassembly of the circuit board, but also provides effective protection for the circuit board, reducing its erosion and damage from external dust, water stains, etc. It is understood that in other embodiments, the cover plate 40 may also have several holes to correspond to the chips, components, and other structures integrated on the circuit board.
[0027] The high-density interconnect circuit board structure 100 based on stepped micro-blind vias also includes several buffer feet 50, and a buffer through-hole 214 is correspondingly provided on the outer side of the mounting base 21. Each buffer foot 50 includes a mounting plate 51, a buffer rod 52, and a buffer spring 53. The buffer rod 52 is integrally mounted on the mounting plate 51 and movably passes through the buffer through-hole 214. The buffer spring 53 is sleeved on the buffer rod 52, with its two ends abutting against the bottom of the buffer through-hole 214 and the top of the mounting plate 51, respectively. The buffer feet 50 enhance the shock absorption capacity of the circuit board structure and reduce damage from external impacts.
[0028] In summary, the beneficial effects of this utility model's high-density interconnect circuit board structure 100 based on stepped micro-blind vias are as follows: By designing a circuit board structure with auxiliary mounting parts 20, the circuit board is easier to install during the manufacturing process, effectively preventing interlayer misalignment during the stacking of multi-layer boards 10. Furthermore, the mounting base 21 of the auxiliary mounting parts 20, in conjunction with the connecting rod 22, can fix and limit the board 10, greatly reducing the risk of board 10 deformation. The auxiliary mounting parts 20 are designed with adjustable spacing, making them suitable for stacking boards 10 of different lengths. The circuit board is equipped with a heat dissipation structure and a cover plate 40, which not only improves the heat dissipation performance during use but also optimizes its waterproof and dustproof effects. The design of a buffer mounting structure significantly improves the shock absorption capacity of the circuit board, further enhancing its reliability. This utility model is highly practical and has significant potential for widespread application.
[0029] The embodiments described above illustrate only one implementation of the utility model, and while the description is relatively specific and detailed, it should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the inventive concept, and these all fall within the protection scope of the utility model. Therefore, the protection scope of the utility model patent should be determined by the appended claims.
Claims
1. A high-density interconnect circuit board structure based on stepped micro-blind vias, characterized in that: The system comprises multiple layers of boards stacked sequentially and auxiliary mounting components located at the bottom and sides of the boards. Each of the multiple boards has several through-holes extending vertically, with the through-holes between the upper and lower boards corresponding vertically. The auxiliary mounting components include mounting bases arranged symmetrically on the left and right sides and two connecting rods connecting the mounting bases. The mounting bases have an "L"-shaped cross-section and are also provided with several mounting rods. The left and right ends of the multiple boards are stacked sequentially on the mounting bases, with the through-holes corresponding to the mounting rods. The two connecting rods are axially connected in an "X" shape, and their ends are respectively connected to the mounting bases on the left and right sides.
2. The high-density interconnect circuit board structure based on stepped micro-blind vias as described in claim 1, characterized in that: The auxiliary mounting component also includes a limiting buckle, and the inner side of the mounting base is provided with an adjusting groove; the end of the connecting rod is engaged in the adjusting groove and can be slidably adjusted, and the limiting buckle is engaged at the shaft joint of the two sets of connecting rods and can limit the connecting rod.
3. The high-density interconnect circuit board structure based on stepped micro-blind vias as described in claim 1, characterized in that: It also includes two sets of heat dissipation plates, the ends of which are respectively engaged with the mounting base, and the two sets of heat dissipation plates are respectively attached to the front and rear sides of the multilayer board.
4. The high-density interconnect circuit board structure based on stepped micro-blind vias as described in claim 3, characterized in that: The heat sink is also provided with several outwardly extending heat sinks on its outer side, and all of the heat sinks are designed to be inclined downwards.
5. The high-density interconnect circuit board structure based on stepped micro-blind vias as described in claim 1, characterized in that: It also includes a cover plate, which is provided with a through-hole and an elastic limiting member. The upper part of the mounting rod is provided with a limiting lock groove. The cover plate covers the uppermost plate and the through-hole passes through the mounting rod. The elastic limiting member and the limiting lock groove of the mounting rod engage with each other to limit the movement.
6. The high-density interconnect circuit board structure based on stepped micro-blind vias as described in claim 1, characterized in that: It also includes several buffer legs, and the outer side of the mounting base is provided with buffer through holes; the buffer legs include a mounting plate, a buffer rod and a buffer spring, the buffer rod is integrally mounted on the mounting plate and is movably inserted into the buffer through hole, the buffer spring is sleeved on the buffer rod and its two ends abut against the bottom of the buffer through hole and the top of the mounting plate, respectively.
7. The high-density interconnect circuit board structure based on stepped micro-blind vias as described in claim 1, characterized in that: The inner side of the mounting base is also provided with a foolproof protrusion, and the left and right sides of the multi-layer plate are provided with foolproof notches. The foolproof notches and the foolproof protrusions engage and limit each other.