Packaging structure of perovskite device and perovskite solar cell
By embedding conductive tape into a pre-reserved groove in the perovskite device packaging structure, the problem of packaging gaps caused by the thickness of the conductive tape is solved, achieving efficient waterproofing against water vapor penetration in perovskite solar cells and extending device lifespan.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- BEI JING SHUO WEI GUANG DIAN KE JI YOU XIAN GONG SI
- Filing Date
- 2025-05-23
- Publication Date
- 2026-05-12
AI Technical Summary
In the existing perovskite device packaging process, tiny gaps are easily formed between the conductive tape and the butyl tape. Moisture can seep into the device through these gaps, affecting the device's lifespan and performance.
A groove is pre-drilled in the glass substrate, butyl tape, or glass cover to form a space for the conductive tape, allowing the conductive tape to be embedded in the groove, eliminating the bulge caused by the tape thickness, and optimizing the encapsulation structure to block the path of water vapor penetration.
By optimizing the encapsulation structure, the problem of uneven interface caused by the thickness of conductive tape during the encapsulation process was eliminated, forming a continuous, gapless sealing layer, which significantly improved the water vapor permeability of perovskite solar cells and extended their service life.
Smart Images
Figure CN224234108U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of perovskite solar cells, and more specifically, to a packaging structure for a perovskite device and a perovskite solar cell. Background Technology
[0002] During the encapsulation process of perovskite devices, conductive tape needs to be led out from the edge of the perovskite device glass to connect to external circuitry. However, in existing encapsulation technologies, because the conductive tape is directly bonded between the perovskite device glass and the butyl tape, the thickness of the conductive tape can easily cause bulges during lamination, resulting in tiny gaps between the encapsulation material (such as butyl tape) and the conductive tape (see [link to encapsulation technology]). Figure 2 Moisture can seep into the device through the gaps, causing degradation of the perovskite active layer and affecting the lifespan and performance of the perovskite device.
[0003] Therefore, there is an urgent need for a structure that can eliminate the encapsulation gaps in the butyl tape area. Utility Model Content
[0004] The purpose of this application is to provide a packaging structure for a perovskite device and a perovskite solar cell, which can prevent moisture intrusion into the perovskite device through structural optimization.
[0005] In a first aspect, this utility model provides a packaging structure for a perovskite device, which includes a glass substrate, a perovskite device, a conductive tape, a butyl tape, a packaging film, and a glass cover plate.
[0006] The perovskite device is deposited on the surface of the glass substrate, the conductive tape is attached to both sides of the perovskite device, the butyl tape is attached to the periphery of the glass substrate, the encapsulating film is attached to the inside of the butyl tape and the surface of the perovskite device, and the glass cover is disposed on the surface of the encapsulating film.
[0007] The conductive tape includes a conductive connecting section and a conductive lead-out section. The conductive connecting section is connected to the perovskite device. One end of the conductive lead-out section is connected to the conductive connecting section, and the other end extends along a direction away from the perovskite device to the outside of the glass substrate to connect to an external circuit. The glass substrate, the butyl tape, or the glass cover plate is provided with a groove, the groove corresponding to the conductive lead-out section, and the conductive lead-out section is embedded in the groove.
[0008] In an optional embodiment, a bending section is provided between the conductive connection section and the conductive lead-out section.
[0009] In an optional embodiment, the width of the groove is 0.1-3 mm wider than the width of the conductive tape, and the width of the groove is 4-8 mm.
[0010] In an optional embodiment, the depth of the groove is 0.06-0.2 mm.
[0011] In an optional embodiment, when the groove is provided on the glass substrate or the glass cover plate, the depth of the groove is 0.01-0.02 mm less than the thickness of the conductive tape, and the length of the groove is 4-7.5 mm.
[0012] In an optional embodiment, when the groove is disposed on the butyl tape, the depth of the groove is 1 / 8 to 1 / 2 of the thickness of the butyl tape, the depth of the groove is 0.01 to 0.02 mm greater than the thickness of the conductive tape, and the length of the groove is the width of the butyl tape.
[0013] In an optional embodiment, the butyl tape is quadrilateral, with the inner side of the butyl tape 4-7.5 mm away from the periphery of the perovskite device, and the outer side of the butyl tape 1-2 mm away from the periphery of the perovskite device.
[0014] In an optional embodiment, the perovskite device includes a PIN-type perovskite device or a NIP-type perovskite device.
[0015] In an optional embodiment, the PIN-type perovskite device includes a front electrode layer, a hole transport layer, a perovskite active layer, an electron transport layer, and a top electrode deposited sequentially on the glass substrate. After depositing each film layer, the device is etched with a laser to form a multi-cell series assembly.
[0016] Secondly, this utility model provides a perovskite solar cell, which includes the encapsulation structure of the perovskite device as described in any of the foregoing embodiments.
[0017] The beneficial effects of this utility model are:
[0018] This invention optimizes the structure of the glass substrate, butyl tape, or glass cover by pre-reserving grooves in these components to create a space for the conductive tape. This allows the conductive tape to be embedded, eliminating protrusions caused by tape thickness, rather than relying on traditional surface bonding. This fundamentally solves the problem of interface unevenness caused by the thickness of the conductive tape during encapsulation. The geometric design of the grooves (angle, depth, and shape) directly determines the tightness of the butyl tape's adhesion, physically blocking moisture penetration. Through structural optimization, the butyl tape tightly wraps around the conductive tape after lamination, forming a continuous, gapless sealing layer. This significantly improves the module's water and moisture permeability, extending the lifespan of the perovskite solar cell. Attached Figure Description
[0019] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments of this application will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.
[0020] Figure 1 A schematic diagram of the packaging structure of the perovskite device provided in the embodiments of this application;
[0021] Figure 2 This is a schematic diagram showing gaps (triangular areas in the diagram) in the existing packaging structure.
[0022] Figure 3 A schematic diagram of the conductive tape structure in the packaging structure of the perovskite device provided in the embodiments of this application;
[0023] Figure 4 A schematic diagram of the perovskite device encapsulation structure provided in Embodiment 1 of this application, showing a groove provided on the glass cover plate;
[0024] Figure 5 A schematic diagram of the encapsulation structure of the perovskite device provided in Embodiment 1 of this application, showing a groove on the glass cover plate filled with conductive tape;
[0025] Figure 6 This is a schematic diagram of the packaging structure of the perovskite device provided in Embodiment 2 of this application, showing a groove formed on a glass substrate.
[0026] Figure 7 This is a schematic diagram of the encapsulation structure of the perovskite device provided in Embodiment 2 of this application, in which grooves are formed on a glass substrate and filled with conductive tape.
[0027] Figure 8 This is a schematic diagram of the encapsulation structure of the perovskite device provided in Embodiment 3 of this application, showing a groove on the butyl tape.
[0028] Figure 9 This is a schematic diagram of the encapsulation structure of the perovskite device provided in Embodiment 3 of this application, in which grooves are formed on butyl tape and filled with conductive tape.
[0029] Icons: 100 - Packaging structure of perovskite device; 110 - Glass substrate; 120 - Perovskite device; 130 - Conductive tape; 131 - Conductive connection section; 132 - Conductive lead section; 133 - Bending section; 140 - Butyl tape; 150 - Encapsulation film; 160 - Glass cover plate; 170 - Groove. Detailed Implementation
[0030] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.
[0031] In the description of this application, it should be noted that the terms "inner" and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product is in use. They are used only for the convenience of describing this application and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.
[0032] In the description of this application, it should also be noted that, unless otherwise expressly specified and limited, the terms "setup" and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.
[0033] Please see Figure 1 This utility model provides a perovskite device encapsulation structure 100, which includes a glass substrate 110, a perovskite device 120, a conductive tape 130, a butyl tape 140, an encapsulation film 150, and a glass cover plate 160.
[0034] A perovskite device 120 is deposited on the surface of a glass substrate 110. Conductive adhesive tape 130 is attached to both sides of the perovskite device 120, and butyl adhesive tape 140 is attached to the perimeter of the glass substrate 110. Butyl adhesive tape 140 is quadrilateral, with its inner edge 4-7.5 mm from the perimeter of the perovskite device and its outer edge 1-2 mm from the perimeter of the perovskite device 120. An encapsulating film 150 is attached to the inner side of the butyl adhesive tape and to the surface of the perovskite device 120. The size of the encapsulating film 150 is the area enclosed by the butyl adhesive tape 140. A glass cover plate 160 is disposed on the surface of the encapsulating film 150. The size of the glass cover plate 160 is the same as that of the glass substrate 110 to ensure longitudinal alignment during encapsulation.
[0035] Please see Figure 3The conductive tape 130 includes a conductive connecting section 131 and a conductive lead-out section 132. The conductive connecting section 131 is connected to the perovskite device 120. One end of the conductive lead-out section 132 is connected to the conductive connecting section 131, and the other end extends along a direction away from the perovskite device 120 to the outside of the glass substrate 110 to connect to an external circuit. A groove 170 is provided on the glass substrate 110, the butyl tape 140, or the glass cover plate 160. The groove 170 corresponds to the conductive lead-out section 132. Part of the conductive lead-out section 132 is embedded in the groove 170, and part of it needs to be led out to the outside of the glass substrate 110.
[0036] In this invention, the glass cover plate 160, glass substrate or butyl tape 140 are structurally processed at the lead-out position of conductive tape 130, so that the conductive tape 130 is partially embedded in a specific groove 170 structure, reducing the protrusion height, avoiding the formation of gaps during encapsulation, improving the waterproof performance of the device, and thus extending the device life.
[0037] Specifically, a bending section 133 is provided between the conductive connection section 131 and the conductive lead-out section 132. After the conductive tape 130 is connected to the positive and negative electrodes of the perovskite device 120, the conductive tape 130 to be led out is bent upwards or downwards at a distance of 5-6 mm from the edge of the perovskite device 120, so that part of the conductive tape 130 is embedded in the groove 170. The part of the conductive tape 130 embedded in the groove 170 is the conductive lead-out section 132. The setting of the bending section 133 allows the conductive tape 130 to be bent at a certain position along the edge of the perovskite device 120, making the transition of the conductive tape 130 between the conductive connection section 131 and the conductive lead-out section 132 smoother. The direction of the groove 170 is consistent with the lead-out direction of the conductive tape 130, so that the upward or downward bent conductive tape 130 can be embedded into the cut groove 170, making the conductive tape 130 fit tightly with the groove 170.
[0038] In this invention, the groove 170 can be disposed on any one of the glass cover plate 160, the glass substrate, or the butyl tape 140. The width of the groove 170 is 0.1-3mm wider than the width of the conductive tape 130. Since the groove 170 is wider than the conductive tape 130, the conductive tape 130 is easier to be embedded in the groove 170.
[0039] The ratio of the depth of the groove 170 to the thickness of the conductive tape 130 needs to be determined based on the location of the groove 170.
[0040] When the groove 170 is provided on the glass substrate 110 or the glass cover plate 160, the depth of the groove 170 is 0.01-0.02mm less than the thickness of the conductive tape 130. This allows the conductive tape 130 to be mostly embedded in the groove 170 with a small portion protruding from it. Most of the thickness of the conductive tape 130 is accommodated by the structural space, effectively avoiding the accumulation of encapsulation material or gaps caused by the protrusion. The design of the small portion of the conductive tape 130 protruding from the groove 170 facilitates the subsequent encapsulation process, where the flowing butyl tape 140 tightly adheres to the conductive tape 130, forming a continuous sealing layer and blocking the path of water vapor penetration.
[0041] When the groove 170 is provided on the butyl tape 140, the depth of the groove 170 is 1 / 8 to 1 / 2 of the thickness of the butyl tape 140. The depth of the groove 170 is 0.01 to 0.02 mm greater than the thickness of the conductive tape 130. This arrangement ensures that the conductive tape 130 is completely embedded in the groove 170. Furthermore, the butyl tape 140 is in a flowing state during the encapsulation process. The deeper groove 170 ensures that the butyl tape 140 is tightly attached to the conductive tape 130, forming a continuous sealing layer and blocking the path of water vapor penetration.
[0042] Specifically, the width of the groove 170 is 4-8 mm, and the depth of the groove 170 is 0.06-0.2 mm. When the groove 170 is set on the glass substrate 110 or the glass cover plate 160, the length of the groove 170 is 4-7.5 mm. When the groove 170 is set on the butyl tape 140, the length of the groove 170 is the width of the butyl tape 140. The quantitative design of the groove 170 depth (accounting for 1 / 8-1 / 2 of the thickness of the butyl tape 140) balances the sealing performance of the butyl tape 140 with the embedding stability of the conductive tape 130, avoiding sealing failure caused by excessive cutting.
[0043] The perovskite device 120 of this utility model includes a PIN-type perovskite device 120 or a NIP-type perovskite device 120.
[0044] Taking the PIN-type perovskite device 120 as an example, the PIN-type perovskite device 120 includes a front electrode layer, a hole transport layer, a perovskite active layer, an electron transport layer, and a top electrode sequentially deposited on a glass substrate 110. After depositing each film layer, laser etching is used to form a multi-cell series assembly. The specific materials and thicknesses of the aforementioned front electrode layer, hole transport layer, perovskite active layer, electron transport layer, and top electrode can be conventionally adjusted according to actual conditions.
[0045] In addition, this utility model also provides a perovskite solar cell, which includes the encapsulation structure 100 of the above-mentioned perovskite device.
[0046] The present invention also provides several specific embodiments below, which describe in detail the specific configuration of the present invention.
[0047] Example 1: Glass cover plate with 160 groove and 170 structure (see also) Figure 4 and Figure 5 )
[0048] Materials preparation: Prepare 160 glass cover plates with dimensions of 50mm×50mm and a thickness of 3.2mm; 110 glass substrates with dimensions of 50mm×50mm and a thickness of 3.2mm; 130 conductive tapes with a width of 5mm and a thickness of 0.1mm; 140 butyl tapes with a thickness of 1.0mm and a width of 2mm; 120 POE film and perovskite devices.
[0049] Pre-treatment of glass cover plate 160: Using laser cutting equipment, a groove 170 is cut at the point where the conductive tape 130 leads out from the edge of the glass cover plate 160. The groove 170 is designed as a cuboid, with a width of 5.5mm, a depth of 0.08mm, and a length of 5mm. After cutting, the glass dust inside the groove 170 is cleaned.
[0050] Assembly process: First, attach conductive tape 130 to the positive and negative terminals of perovskite device 120. Bend the conductive tape 130 upwards 5mm from the edge of perovskite device 120. Then, lay butyl tape 140, with the outer edge of butyl tape 140 1mm from the edge of the device. The POE encapsulation film 150 is the area enclosed by butyl tape 140. Then, cover with glass cover plate 160. The size of glass cover plate 160 should be the same as that of glass substrate 110 so that it can be aligned with glass substrate 110 in the longitudinal direction during encapsulation. At the same time, ensure that the direction of groove 170 on glass cover plate 160 is consistent with the direction of conductive tape 130, so that the upwardly bent conductive tape 130 can be embedded into the cut groove 170, so that conductive tape 130 and groove 170 of glass cover plate 160 fit tightly.
[0051] Lamination encapsulation: The component is placed in a laminator, with the temperature set at 90℃, the pressure at 1.0MPa, and the lamination time at 15 minutes. After encapsulation, the component is inspected, and the conductive tape lead-out position is found to be securely sealed, with no risk of moisture intrusion.
[0052] Example 2: Glass substrate 110 groove 170 structure (see also) Figure 6 and Figure 7 )
[0053] Materials preparation: 160 glass cover plates with dimensions of 50mm×50mm and a thickness of 3.2mm; 110 glass substrates with dimensions of 50mm×50mm and a thickness of 3.2mm; 130 conductive tapes with a width of 5mm and a thickness of 0.08mm; 140 butyl tapes with a thickness of 1.0mm and a width of 4mm; 120 POE film and perovskite devices.
[0054] Pre-treatment of the perovskite device 120 glass: Using laser cutting equipment, a groove 170 is cut at the point where the conductive tape 130 leads out from the edge of the perovskite device 120 glass. The groove 170 is designed as a cuboid, with a width of 6mm, a depth of 0.07mm, and a length of 6mm. After cutting, the glass dust inside the groove 170 is cleaned.
[0055] Assembly process: Attach conductive tape 130 to the positive and negative terminals of the perovskite device 120. Bend the conductive tape 130 to be led out downwards and embed it into the groove 170 6mm from the edge of the perovskite device 120. Then, lay butyl tape 140, encapsulating film 150, and glass cover plate 160 on the perovskite device 120, ensuring that the butyl tape 140 covers the conductive tape 130 embedded in the groove 170 without contacting the conductive tape 130 in front of the groove 170. The outer edge of the butyl tape 140 is 2mm from the perimeter of the device. The size of the POE encapsulating film 150 is the area enclosed by the butyl tape 140. The size of the glass cover plate 160 should be the same as the size of the glass substrate 110 so that it can be aligned with the glass substrate 110 in the longitudinal direction during encapsulation.
[0056] Lamination encapsulation: The component is placed in a laminator, with the temperature set to 95℃, the pressure to 1.0MPa, and the lamination time to 15 minutes. After encapsulation, the component is inspected, and the conductive tape lead-out position (130) is found to be securely sealed, with no risk of moisture intrusion.
[0057] Example 3: Butyl tape with 140 groove and 170 structure (see also) Figure 8 and Figure 9 )
[0058] Materials preparation: 160 glass cover plates with dimensions of 50mm×50mm and a thickness of 2.2mm; 110 glass substrates with dimensions of 50mm×50mm and a thickness of 2.2mm; 130 conductive tapes with a width of 8mm and a thickness of 0.1mm; 140 butyl tapes with a thickness of 0.5mm and a width of 5mm; 120 POE film and perovskite devices.
[0059] Pre-treatment of butyl tape 140: At the position where the conductive tape 130 is led out from the butyl tape 140, a groove 170 is cut using a special tool. The groove 170 is 8.2mm wide, 0.12mm deep, and its length is equal to the width of the butyl tape 140, which is 5mm. Ensure the edges of the groove 170 are neat during cutting.
[0060] Assembly process: First, attach conductive tape 130 to the positive and negative terminals of the perovskite device 120. Then, lay butyl tape 140, encapsulating film 150, and glass cover plate 160 on the perovskite device 120. When laying butyl tape 140, the cut groove 170 should face downwards and be aligned with the direction of the conductive tape 130 so that the conductive tape 130 can be embedded in the groove 170. Lay it 6mm away from the edges of the device. After laying, the outer edge of butyl tape 140 should be 1mm away from the edge of the perovskite device 120. The size of the POE film is the area enclosed by butyl tape 140. Then, cover it with glass cover plate 160. The size of glass cover plate 160 should be the same as the size of glass substrate 110 so that it can be aligned with glass substrate 110 in the longitudinal direction during encapsulation.
[0061] Lamination encapsulation: The component is placed in a laminator and laminated at 100℃ and 0.8MPa for 20 minutes. The resulting encapsulated component is well-sealed at the conductive tape 130 lead-out position, effectively preventing gaps caused by the conductive tape 130.
[0062] In summary, this invention optimizes the structure of the glass substrate 110, butyl tape 140, or glass cover 160 by pre-reserving a groove 170 on the glass substrate 110, butyl tape 140, or glass cover 160 to form a space for the conductive tape 130. This allows the conductive tape 130 to be embedded, eliminating the protrusions caused by the tape thickness, rather than traditional surface bonding. This fundamentally solves the problem of uneven interface caused by the thickness of the conductive tape 130 during the encapsulation process. The geometric design (angle, depth, and shape) of the groove 170 directly determines the tightness of the butyl tape 140's adhesion, physically blocking the water vapor penetration path. Through structural optimization, the butyl tape 140 can tightly wrap the conductive tape 130 after lamination, forming a continuous, gapless sealing layer, significantly improving the module's water vapor penetration capability and extending the lifespan of the perovskite solar cell.
[0063] It should be noted that, where there is no conflict, the features in the embodiments of this application can be combined with each other.
[0064] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.
Claims
1. A packaging structure for a perovskite device, characterized in that, It includes a glass substrate, perovskite devices, conductive tape, butyl tape, encapsulating film, and glass cover. The perovskite device is deposited on the surface of the glass substrate, the conductive tape is attached to both sides of the perovskite device, the butyl tape is attached to the periphery of the glass substrate, the encapsulating film is attached to the inside of the butyl tape and the surface of the perovskite device, and the glass cover is disposed on the surface of the encapsulating film. The conductive tape includes a conductive connecting section and a conductive lead-out section. The conductive connecting section is connected to the perovskite device. One end of the conductive lead-out section is connected to the conductive connecting section, and the other end extends along a direction away from the perovskite device to the outside of the glass substrate to connect to an external circuit. The glass substrate, the butyl tape, or the glass cover plate is provided with a groove, the groove corresponding to the conductive lead-out section, and the conductive lead-out section is embedded in the groove.
2. The packaging structure of a perovskite device according to claim 1, characterized in that, A bending section is provided between the conductive connection section and the conductive lead-out section.
3. The packaging structure of a perovskite device according to claim 1, characterized in that, The width of the groove is 0.1-3mm wider than the width of the conductive tape, and the width of the groove is 4-8mm.
4. The packaging structure of a perovskite device according to claim 1, characterized in that, The depth of the groove is 0.06-0.2mm.
5. The packaging structure of a perovskite device according to claim 4, characterized in that, When the groove is provided on the glass substrate or the glass cover plate, the depth of the groove is 0.01-0.02 mm less than the thickness of the conductive tape, and the length of the groove is 4-7.5 mm.
6. The packaging structure of a perovskite device according to claim 4, characterized in that, When the groove is provided on the butyl tape, the depth of the groove is 1 / 8 to 1 / 2 of the thickness of the butyl tape, the depth of the groove is 0.01 to 0.02 mm greater than the thickness of the conductive tape, and the length of the groove is the width of the butyl tape.
7. The packaging structure of a perovskite device according to claim 1, characterized in that, The butyl tape is quadrilateral, with the inner side of the butyl tape being 4-7.5 mm away from the periphery of the perovskite device, and the outer side of the butyl tape being 1-2 mm away from the periphery of the perovskite device.
8. The packaging structure of the perovskite device according to claim 1, characterized in that, The perovskite devices include PIN-type perovskite devices or NIP-type perovskite devices.
9. The packaging structure of the perovskite device according to claim 8, characterized in that, The PIN-type perovskite device comprises a front electrode layer, a hole transport layer, a perovskite active layer, an electron transport layer, and a top electrode deposited sequentially on the glass substrate. After depositing each film layer, laser etching is used to form a multi-cell battery connected in series.
10. A perovskite solar cell, characterized in that, It includes the packaging structure of the perovskite device as described in any one of claims 1-9.