Detection device for front and back surfaces of wafer and turn-over cleaning equipment

Abstract

The utility model provides a wafer front and back side detection device and a turn-over cleaning device, comprising a detection mechanism, a temporary storage area arranged in the turn-over cleaning device and used for temporarily storing wafers, and used for detecting whether a detection surface of a wafer to be detected has core particles and groove structures on the front side of the wafer to be detected, and if yes, detecting whether the detection surface of the wafer to be detected has core particles and groove structures on the back side of the wafer to be detected. If so, judging that the detection surface is the front surface of the wafer; and if not, judging that the detection surface is the back surface of the wafer. According to the utility model, the detection mechanism is arranged in the turn-over cleaning equipment, so that when the turn-over cleaning equipment goes down, the detection device detects the front and back surfaces of the to-be-detected wafer taken out from the wafer forward washing chamber or the wafer back washing chamber; the wafer to be detected does not need to be conveyed to another sorting machine table or wafer conveying machine table for detection, cross contamination between different machine tables can be effectively prevented, and meanwhile the labor cost is reduced.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, and in particular to a wafer front and back detection device and a wafer flipping and cleaning device. Background Technology

[0002] As the required device geometry shrinks at advanced nodes, the depth of focus (DOF) and overlap tolerance decrease, necessitating pre-cleaning of the back side of the wafer before photolithography. Furthermore, the thin-film materials, chemicals, and integration schemes at advanced nodes become more complex. After multiple processes, particles and metal contamination on the back side and edges of the wafer can cause cross-contamination across different equipment, making back-side quality improvement a significant challenge. Defects on the back side of the wafer originate from various sources, including particles, residues, and scratches, leading to the development of back-side cleaning technology. Typical flip-over cleaning equipment involves flipping the wafer from front to back and back again. Due to factors such as equipment stability, wafer failure is highly likely when the equipment malfunctions. Therefore, verifying whether the wafer is returned to the wafer cassette with the front side facing up requires multiple confirmations. The current common detection method is that after the flipping cleaning equipment alarms, the wafer is removed into the wafer box and the sorting machine or transfer machine reads the ID identification code on the back of the wafer to determine the front and back of the wafer. If the wafer has contaminants, when detecting the ID identification code on the back of the wafer, if the wafer is face down, it will contaminate other machines, which not only increases labor costs, but also increases the probability of cross-contamination between machines.

[0003] In view of this, it is necessary to propose a wafer front and back inspection device and a wafer flipping and cleaning equipment to solve the above problems. Utility Model Content

[0004] The purpose of this invention is to provide a wafer front and back inspection device and a wafer flipping and cleaning equipment to improve the existing wafer front and back inspection methods, which not only increase labor costs but also increase the probability of cross-contamination between machines.

[0005] This utility model provides a device for detecting the front and back sides of a wafer, comprising:

[0006] The testing mechanism is located in the temporary storage area of ​​the wafer flipping and cleaning equipment. It is used to detect whether the testing surface of the wafer to be tested has the core and groove structure of the front side of the wafer to be tested. If so, the testing surface is determined to be the front side of the wafer; if not, the testing surface is determined to be the back side of the wafer.

[0007] In one possible embodiment, the detection mechanism includes:

[0008] A beam emitting assembly is disposed in the temporary storage area and is used to emit multiple parallel beams toward the detection surface;

[0009] A beam receiving component is disposed in the temporary storage area and is used to receive the reflected beam formed by the reflection of the detection surface.

[0010] In one possible embodiment, the beam emitting assembly includes a plurality of beam emitters spaced apart for emitting the beam; and / or,

[0011] The beam receiving assembly includes a plurality of beam receivers spaced apart for receiving the reflected beam.

[0012] In one possible embodiment, the projection points of the multiple beams on the wafer under test are distributed in a linear array, a ring array, or a rectangular array; or...

[0013] The projection points of the multiple beams on the wafer under test are distributed at intervals along the radial direction of the wafer under test; or,

[0014] The projection points of the multiple beams on the wafer under test cover the diameter region of the wafer under test.

[0015] In one possible embodiment, the detection device further includes:

[0016] The controller is communicatively connected to the beam receiving component and is used to process and analyze the signal of the reflected beam to determine whether the signal fluctuation of the reflected beam exceeds a preset range. If so, the detection surface is determined to be the front side of the wafer; otherwise, the detection surface is determined to be the back side of the wafer.

[0017] In one possible embodiment, the detection mechanism includes:

[0018] An image acquisition device is located in the temporary storage area and is used to acquire the detection image of the detection surface.

[0019] In one possible embodiment, the detection device further includes:

[0020] The controller is communicatively connected to the image acquisition unit and is used to compare the detected image with a standard image of the front side of the wafer under test, and determine whether the detected image matches the standard image. If yes, the detected surface is determined to be the front side of the wafer; if no, the detected surface is determined to be the back side of the wafer.

[0021] In one possible embodiment, the controller is controlled to connect to the wafer transfer mechanism. When the controller detects that the detection surface is the front side of the wafer, the controller controls the wafer transfer mechanism to transfer the wafer to be tested back to the wafer cassette.

[0022] In one possible embodiment, the controller is also connected to the robot arm and the flipping unit. When the controller detects that the detection surface is the back side of the wafer, the controller controls the robot arm to transfer the wafer to be tested to the flipping unit. The flipping unit flips the wafer to be tested so that the front side is facing up, and then controls the wafer transfer mechanism to transfer the wafer to be tested back to the wafer cassette.

[0023] In one possible embodiment, the flipping unit is divided into two types: one for processing uncleaned wafers and the other for processing cleaned wafers.

[0024] This utility model also provides a wafer flipping and cleaning device, including: a wafer front and back detection device as described in any of the above embodiments;

[0025] When the flipping and cleaning equipment malfunctions, the detection device performs a test on the front and back sides of the wafer taken out from the wafer front cleaning chamber or the wafer back cleaning chamber.

[0026] The beneficial effects of the wafer front and back detection device provided by this utility model are as follows: By setting a detection mechanism in the wafer flipping and cleaning equipment, when the wafer flipping and cleaning equipment malfunctions, the detection device can detect the front and back sides of the wafers taken from the wafer front cleaning chamber or the wafer back cleaning chamber. This eliminates the need to transfer the wafers to another sorting machine for detection, effectively preventing cross-contamination between different machines and reducing labor costs. In one improved embodiment, multiple beams are emitted towards the detection surface by the beam emitting component, and the reflected beams formed by the reflection from the detection surface are received by the beam receiving component. The controller determines whether the detection surface is the front or back side of the wafer based on whether the signal fluctuation exceeds a preset range. In another improved embodiment, the detection image of the detection surface is acquired by the image acquisition device, and the controller determines whether the detection surface is the front or back side of the wafer based on whether the acquired detection image matches a standard image of the front side of the wafer. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of one embodiment of the wafer front and back detection device of this utility model.

[0028] Figure 2 This is a logic block diagram of one embodiment of the wafer front and back detection device of this utility model.

[0029] Figure 3 This is a signal diagram of the reflected light beam from the back side of the wafer in the wafer front and back detection device of this utility model.

[0030] Figure 4This is a signal diagram of the reflected light beam from the front side of the wafer in the wafer front and back detection device of this utility model.

[0031] Figure 5 This is a schematic diagram of another embodiment of the wafer front and back detection device of this utility model.

[0032] Figure 6 This is a logic block diagram of another embodiment of the wafer front and back detection device of this utility model.

[0033] Figure 7 This is a schematic diagram of the flipping and cleaning equipment of this utility model.

[0034] Explanation of reference numerals in the attached drawings: 100, flipping and cleaning equipment; 110, detection device; 111, detection mechanism; 1111, beam emitting assembly; 1112, beam receiving assembly; 1113, image acquisition device; 112, controller; 120, temporary storage area; 130, wafer transfer mechanism; 140, robotic arm; 150, flipping unit; 160, wafer carrier stage; 170, wafer forward cleaning chamber; 180, wafer back cleaning chamber; 200, wafer. Detailed Implementation

[0035] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0036] To address the problems existing in the prior art, embodiments of this utility model provide a wafer front and back inspection device, see [link to relevant documentation]. Figure 1 , Figure 5 as well as Figure 7 The detection device 110 includes a detection mechanism 111 located in the temporary storage area 120 of the flipping and cleaning equipment 100 for temporarily storing wafers 200. The detection mechanism 111 is used to detect whether the detection surface of the wafer 200 to be tested has the core and groove structure of the front side of the wafer 200 to be tested. If so, the detection surface is determined to be the front side of the wafer 200; if not, the detection surface is determined to be the back side of the wafer 200.

[0037] Traditional inspection methods require transferring wafers 200 to other sorting machines, increasing the chances of wafers 200 being transferred between different machines and thus increasing the risk of cross-contamination. This application, however, directly integrates the inspection device 110 into the flipping and cleaning equipment 100. When the flipping and cleaning equipment 100 malfunctions, the inspection device 110 is automatically triggered to inspect the front and back sides of each incoming wafer 200, eliminating the need for other machines to perform this inspection, effectively avoiding cross-contamination and reducing labor costs.

[0038] In one embodiment, see Figure 1 and Figure 2 The detection mechanism 111 includes a beam emitting component 1111 and a beam receiving component 1112. The beam emitting component 1111 is located in the temporary storage area 120 and is used to emit multiple beams of light that are parallel to each other to the detection surface. The beam receiving component 1112 is located in the temporary storage area 120 and is used to receive the reflected beam formed by the reflection of the detection surface.

[0039] In this embodiment, multiple parallel beams are emitted towards the detection surface by the beam emitting component 1111, and the reflected beams formed by the reflection from the detection surface are received by the beam receiving component 1112. Since the front side of the wafer 200 has a core and groove structure, while the back side of the wafer 200 is relatively smooth, the signal spectrum of the reflected beam formed from the front side of the wafer 200 and the signal spectrum of the reflected beam formed from the back side of the wafer 200 are definitely different. Therefore, by analyzing the signal fluctuations in the signal spectrum, it can be determined whether the detection surface is the front side or the back side of the wafer 200.

[0040] In one embodiment, see Figure 1 The beam emitting assembly 1111 includes a plurality of beam emitters spaced apart for emitting beams, the beam emitters being positioned toward the wafer 200 to be tested.

[0041] In one embodiment, see Figure 1 The beam receiving assembly 1112 includes multiple beam receivers spaced apart for receiving reflected beams. The beam receivers are positioned toward the wafer 200 under test, and each beam receiver corresponds to a beam emitter.

[0042] In these embodiments, by setting up multiple beam emitters and multiple beam receivers, different positions on the detection surface of the wafer 200 under test are detected, thereby improving the accuracy of the detection.

[0043] In one specific embodiment, see Figure 1 The detection mechanism 111 also includes a first support, on which the beam emitting assembly 1111 and the beam receiving assembly 1112 are mounted.

[0044] In one specific embodiment, see Figure 1 The projection points of the multiple beams on the wafer 200 under test are distributed in a linear array, a ring array, or a rectangular array.

[0045] In one specific embodiment, see Figure 1 The projection points of the multiple beams on the wafer 200 under test are distributed at intervals along the radial direction of the wafer 200 under test.

[0046] In one specific embodiment, see Figure 1 The projection points of multiple beams on the wafer 200 under test cover the diameter area of ​​the wafer 200 under test.

[0047] In these embodiments, based on the distribution area of ​​the chip and groove structure on the front side of the wafer 200 under test, by reasonably setting the position distribution of multiple beam emitters and multiple beam receivers, it is ensured that the distribution position of the projection points of multiple beams on the wafer 200 under test can be aligned with more distribution areas of the chip and groove structure. Even if there is a slight positional deviation in the placement position of the wafer 200 under test, the chip and groove structure on the front side of the wafer 200 under test can still be effectively detected, avoiding the problem of inaccurate detection caused by the deviation of the beam projection position.

[0048] In some specific embodiments, the light beam is one of visible light, infrared light, or laser.

[0049] In one embodiment, see Figure 1 and Figure 2 The detection device 110 also includes a controller 112 that is communicatively connected to the beam receiving component 1112. The controller 112 is used to process and analyze the signal of the reflected beam, and determine whether the signal fluctuation of the reflected beam exceeds a preset range. If so, the detection surface is determined to be the front side of the wafer 200; if not, the detection surface is determined to be the back side of the wafer 200.

[0050] The controller 112 processes and analyzes the signal of the reflected beam. The chip and groove structure on the front side of wafer 200 cause large fluctuations in the signal of its reflected beam. Figure 3 As shown, the signal of the reflected beam exhibits a periodic curve; however, the back surface of wafer 200 is relatively smooth, resulting in smaller signal fluctuations in its reflected beam. Figure 4 As shown, the signal fluctuation amplitude of the reflected beam is relatively smooth.

[0051] Beforehand, light beams are emitted from a standard wafer 200 to both the front and back sides of the wafer 200. The corresponding reflected signal spectra are measured, and a preset range for identifying the front side of the wafer 200 is determined based on the signal fluctuations. This range serves as the standard for subsequent detection. If the signal fluctuation of the reflected beam exceeds the preset range, the detection surface is determined to be the front side of the wafer 200; if the signal fluctuation of the reflected beam is within the preset range, the detection surface is determined to be the back side of the wafer 200.

[0052] In another embodiment, see Figure 5 The testing organization 111 includes an image acquisition device 1113 located in the temporary storage area 120 and used to acquire testing images of the testing surface.

[0053] In this embodiment, the detection image of the detection surface is acquired by the image acquisition device 1113. By processing and analyzing the detection image, it can be determined whether it contains core particles and groove structures, and thus it can be determined whether the detection surface is the front side or the back side of the wafer 200.

[0054] In one embodiment, see Figure 5 and Figure 6 The detection device 110 also includes a controller 112 that is communicatively connected to the image acquisition unit 1113. The controller 112 is used to compare the detection image with a standard image of the front side of the wafer 200 to be tested, and to determine whether the detection image matches the standard image. If they match, the detection surface is determined to be the front side of the wafer 200; otherwise, the detection surface is determined to be the back side of the wafer 200.

[0055] In this embodiment, the controller 112 compares and analyzes the acquired detection image with a standard image of the front side of the wafer 200 to be tested. If the detection image contains the same core and groove structure as the standard image, that is, the detection image matches the standard image, then the detection surface is determined to be the front side of the wafer 200; if the detection image does not contain the same core and groove structure as the standard image, that is, the detection image does not match the standard image, then the detection surface is determined to be the back side of the wafer 200.

[0056] In one specific embodiment, see Figure 5 The testing mechanism 111 also includes a second support, and the image acquisition device 1113 is mounted on the second support and positioned facing the wafer 200 to be tested.

[0057] In one embodiment, see Figure 2 , Figure 6 as well as Figure 7 The controller 112 is connected to the wafer transfer mechanism 130. When the controller 112 detects that the detection surface is the front side of the wafer 200, the controller 112 controls the wafer transfer mechanism 130 to transfer the wafer 200 to be tested back to the wafer cassette.

[0058] In this embodiment, when the controller 112 detects that the detection surface is the front side of the wafer 200, that is, the wafer 200 under test is currently facing up, the controller 112 can directly control the wafer transfer mechanism 130 to transfer the wafer 200 under test back to the wafer cassette on the wafer carrier stage 160.

[0059] In one embodiment, see Figure 2 , Figure 6 as well as Figure 7 The controller 112 is also connected to the robot arm 140 and the flipping unit 150. When the controller 112 detects that the detection surface is the back of the wafer 200, the controller 112 controls the robot arm 140 to transfer the wafer 200 to be tested to the flipping unit 150. The flipping unit 150 flips the wafer 200 to be tested so that the front side is facing up, and then controls the wafer transfer mechanism 130 to transfer the wafer 200 back to the wafer cassette.

[0060] In this embodiment, when the controller 112 detects that the detection surface is the back side of the wafer 200, that is, the wafer 200 under test is currently facing up and cannot be directly placed back into the wafer cassette. The controller 112 controls the robot arm 140 to transfer the wafer 200 under test to the flipping unit 150. The flipping unit 150 flips the wafer 200 under test to adjust it so that the front side is facing up. The controller 112 then controls the wafer transfer mechanism 130 to transfer the wafer 200 under test back to the wafer cassette on the wafer carrier stage 160.

[0061] This utility model also provides a flipping and cleaning device, see [link]. Figure 2 , Figure 6 as well as Figure 7 The flipping and cleaning equipment 100 includes: multiple wafer front cleaning chambers 170, multiple wafer back cleaning chambers 180, and a wafer front and back detection device 110 as described in any of the above embodiments. When the flipping and cleaning equipment 100 malfunctions, the detection device 110 detects the front and back of the wafer 200 taken out from the wafer front cleaning chamber 170 or the wafer back cleaning chamber 180.

[0062] In one embodiment, see Figure 7 The flip unit 150 is divided into two types: one type of flip unit 150 is used to process the uncleaned wafer 200, and the other type of flip unit 150 is used to process the cleaned wafer 200.

[0063] In the description of this utility model, it should be understood that the terms "comprising" and "having" as used herein, and any variations thereof, are intended to cover non-exclusive inclusion, for example, a process, method, system, product, or device that includes a series of steps or units is not necessarily limited to those steps or units that are explicitly listed, but may include other steps or units that are not explicitly listed or that are inherent to such process, method, product, or device.

[0064] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0065] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0066] While the embodiments of this utility model have been described in detail above, it will be apparent to those skilled in the art that various modifications and variations can be made to these embodiments. However, it should be understood that such modifications and variations fall within the scope and spirit of this utility model as set forth in the claims. Furthermore, the utility model described herein may have other embodiments and can be implemented or realized in various ways. Unless otherwise defined, the technical or scientific terms used herein should have the ordinary meaning understood by one of ordinary skill in the art to which this utility model pertains.

Claims

1. A device for detecting the front and back sides of a wafer, characterized in that, include: The testing mechanism is located in the temporary storage area of ​​the wafer flipping and cleaning equipment. It is used to detect whether the testing surface of the wafer to be tested has the core and groove structure of the front side of the wafer to be tested. If so, the testing surface is determined to be the front side of the wafer; if not, the testing surface is determined to be the back side of the wafer.

2. The wafer front and back detection device according to claim 1, characterized in that, The testing institutions include: A beam emitting assembly is disposed in the temporary storage area and is used to emit multiple parallel beams toward the detection surface; A beam receiving component is disposed in the temporary storage area and is used to receive the reflected beam formed by the reflection of the detection surface.

3. The wafer front and back detection device according to claim 2, characterized in that, The beam emitting assembly includes a plurality of beam emitters spaced apart for emitting the beam; and / or, The beam receiving assembly includes a plurality of beam receivers spaced apart for receiving the reflected beam.

4. The wafer front and back detection device according to claim 2, characterized in that, The projection points of the multiple beams on the wafer under test are distributed in a linear array, a ring array, or a rectangular array; or, The projection points of the multiple beams on the wafer under test are distributed at intervals along the radial direction of the wafer under test; or, The projection points of the multiple beams on the wafer under test cover the diameter region of the wafer under test.

5. The wafer front and back inspection device according to claim 2, characterized in that, Also includes: The controller is communicatively connected to the beam receiving component and is used to process and analyze the signal of the reflected beam to determine whether the signal fluctuation of the reflected beam exceeds a preset range. If so, the detection surface is determined to be the front side of the wafer; otherwise, the detection surface is determined to be the back side of the wafer.

6. The wafer front and back detection device according to claim 1, characterized in that, The testing institutions include: An image acquisition device is located in the temporary storage area and is used to acquire the detection image of the detection surface.

7. The wafer front and back inspection device according to claim 6, characterized in that, Also includes: The controller is communicatively connected to the image acquisition unit and is used to compare the detected image with a standard image of the front side of the wafer under test, and determine whether the detected image matches the standard image. If yes, the detected surface is determined to be the front side of the wafer; if no, the detected surface is determined to be the back side of the wafer.

8. The wafer front and back inspection device according to claim 5 or 7, characterized in that, The controller is connected to the wafer transfer mechanism. When the controller detects that the detection surface is the front side of the wafer, the controller controls the wafer transfer mechanism to transfer the wafer to be tested back to the wafer cassette.

9. The wafer front and back inspection device according to claim 8, characterized in that, The controller is also connected to the robotic arm and the flipping unit. When the controller detects that the detection surface is the back side of the wafer, the controller controls the robotic arm to transfer the wafer to be tested to the flipping unit. The flipping unit flips the wafer to be tested so that the front side is facing up, and then controls the wafer transfer mechanism to transfer the wafer to be tested back to the wafer cassette.

10. A flipping and cleaning device, characterized in that, include: The wafer front and back detection device according to any one of claims 1-9, when the wafer flipping and cleaning equipment malfunctions, the detection device performs wafer front and back detection on the wafer to be tested taken from the wafer front cleaning chamber or the wafer back cleaning chamber.

Images