Packaging equipment of pressure sensor

Abstract

The utility model relates to the technical field of pressure sensors, in particular to packaging equipment of a pressure sensor, which comprises a support plate, the top of the support plate is provided with the pressure sensor, the pressure sensor comprises a ceramic substrate and a PCB (printed circuit board), and the PCB is fixed at the top of the ceramic substrate. A protection mechanism capable of moving up and down and a dispensing pipe are arranged above the pressure sensor; the protection mechanism comprises a protection plate, the top of the protection plate is provided with a through opening, and the protection plate moves downwards and is pressed on the ceramic substrate through the positioning ring before the pressure sensor is subjected to dispensing packaging, so that the pressure sensor is positioned, the PCB cannot be pressed, and the packaging efficiency is improved. And meanwhile, the limiting outer sleeve moves downwards along with the protection plate, an enclosure is formed on a to-be-dispensed area above the PCB, so that during dispensing, glue can be prevented from overflowing to a non-dispensing area or a sensitive element, it is ensured that the glue accurately covers a welding spot and a reinforcing area, and the yield of pressure sensor packaging is improved.

Description

Technical Field

[0001] This utility model relates to the field of pressure sensor technology, specifically a pressure sensor packaging device. Background Technology

[0002] Pressure sensors require adhesive encapsulation to provide multiple layers of protection for their components: such as forming a physical barrier to block moisture, dust, and chemical corrosion, ensuring the stability of sensitive components, and absorbing mechanical vibration energy after the adhesive cures.

[0003] In the prior art, such as the sensor packaging device proposed in patent application number "CN202223028248.8", a glue box and a glue dispensing tube are set as a glue dispensing mechanism. This not only allows for effective adjustment of the spacing between the glue dispensing components on both sides, but also enables the lifting and lowering of the glue dispensing components, thereby effectively dispensing the glue.

[0004] However, in the existing technology, the pressure sensor surface is directly dispensed by moving the dispensing tube downwards, which lacks protection for the pressure sensor surface. During dispensing, the adhesive may overflow into non-dispensed areas or sensitive components, affecting the packaging quality of the pressure sensor and causing some pressure sensors to fail the packaging test and need to be reworked. Utility Model Content

[0005] The purpose of this invention is to provide a packaging device for a pressure sensor to solve the problems mentioned in the background art.

[0006] The objective of this utility model can be achieved through the following technical solutions:

[0007] A pressure sensor packaging device includes a support plate, on the top of which a pressure sensor is disposed. The pressure sensor includes a ceramic substrate and a PCB board, with the PCB board fixed on the top of the ceramic substrate. Above the pressure sensor, there is a protective mechanism that can move up and down and a dispensing tube.

[0008] The protective mechanism includes a protective plate with a through opening at the top. The through opening is located above the area to be glued and encapsulated on the PCB board. The glue dispensing tube can pass through the through opening to dispense glue to the corresponding area on the PCB board. A limiting sleeve is fixedly connected to the bottom of the protective plate and below the through opening. When the protective plate moves down, the bottom of the limiting sleeve will fit against the surface of the PCB board, forming a protective enclosure for the area to be glued on the PCB board.

[0009] Preferably, the four corners of the PCB board are designed with arc-shaped notches, and the four corners of the ceramic substrate are provided with mounting holes. The top of the support plate is fixedly connected to a positioning shaft, and the top of the positioning shaft passes through the mounting hole and extends to the outside of the mounting hole.

[0010] Preferably, a positioning ring is fixedly connected to the bottom of the protective plate. The positioning ring is adapted to the arc-shaped notch, and a positioning hole is opened at the bottom of the positioning ring to cooperate with the positioning shaft.

[0011] Preferably, an electric telescopic rod is installed on the top of the support plate, a T-shaped bracket is fixedly connected to the top of the electric telescopic rod, a glue storage tank is fixedly installed on the T-shaped bracket, and a glue dispensing tube is installed at the bottom of the glue storage tank.

[0012] Preferably, an elastic connection mechanism is provided between the T-shaped bracket and the protective plate. The elastic connection mechanism includes a fixed sleeve, a return spring is fixedly connected to the top of the inner wall of the fixed sleeve, a connecting plate is fixedly connected to the bottom of the return spring, the bottom of the connecting plate extends to the outside of the fixed sleeve and is fixedly connected to the top of the protective plate, and the fixed sleeve is fixed to the T-shaped bracket.

[0013] The beneficial effects of this utility model are:

[0014] This invention achieves proper positioning of the pressure sensor by lowering the protective plate and pressing it onto the ceramic substrate with a positioning ring before dispensing the pressure sensor. This avoids compressing the PCB board. Furthermore, the limiting sleeve, moving down with the protective plate, forms a protective enclosure above the dispensing area on the PCB board, preventing adhesive overflow into non-dispensing areas or sensitive components. This ensures precise coverage of solder joints and reinforced areas, improving the yield rate of pressure sensor packaging and reducing rework rates. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0017] Figure 2 This is a utility model Figure 1 Schematic diagram of the top part of the PCB board;

[0018] Figure 3 This is a utility model Figure 1 Schematic diagram of the structure at the bottom of the middle protective plate;

[0019] Figure 4 This is a utility model Figure 1 A cross-sectional view of the flexible connection mechanism.

[0020] The attached figures are labeled as follows:

[0021] 1. Support plate; 201. Ceramic substrate; 202. PCB board; 3. Dispensing tube; 4. Protective plate; 5. Through opening; 6. Limiting sleeve; 7. Mounting hole; 8. Positioning shaft; 9. Positioning ring; 901. Positioning hole; 10. Electric telescopic rod; 11. T-shaped bracket; 12. Glue storage tank; 13. Elastic connection mechanism; 131. Fixing sleeve; 132. Return spring; 133. Connecting plate. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0023] like Figure 1 and Figure 2 A pressure sensor packaging device includes a support plate 1, which can be fixed on an external workbench. A pressure sensor is provided on the top of the support plate 1. The pressure sensor is a silicon resonant pressure sensor in the prior art. The pressure sensor includes a ceramic substrate 201 and a PCB board 202. The PCB board 202 is fixed on the top of the ceramic substrate 201. A protective mechanism that can move up and down and a dispensing tube 3 are provided above the pressure sensor.

[0024] like Figure 1 and Figure 2 The protection mechanism includes a protection plate 4, with a through opening 5 at the top of the protection plate 4. The through opening 5 is located above the area to be encapsulated by adhesive on the PCB board 202. For different pressure sensors, encapsulation equipment with through openings 5 ​​at different positions or of different sizes can be used for encapsulation. The dispensing tube 3 can pass through the through opening 5 to dispense adhesive to the corresponding area on the PCB board 202. A limiting sleeve 6 is fixedly connected to the bottom of the protection plate 4 and below the through opening 5. When the protection plate 4 moves down, the bottom of the limiting sleeve 6 will adhere to the surface of the PCB board 202, forming a protective enclosure on the area to be encapsulated above the PCB board 202, so that when dispensing adhesive, it can prevent the adhesive from overflowing into non-dispensing areas or sensitive components.

[0025] like Figure 1 and Figure 2The four corners of the PCB board 202 are designed with arc-shaped notches. The four corners of the ceramic substrate 201 are provided with mounting holes 7. The mounting holes 7 are built into the ceramic substrate 201 and are used to assist in fixing the pressure sensor. There is no need to make them separately. The top of the support plate 1 is fixedly connected to the positioning shaft 8. The top of the positioning shaft 8 passes through the mounting hole 7 and extends to the outside of the mounting hole 7. It can play the role of positioning the ceramic substrate 201 and the PCB board 202.

[0026] like Figure 1 , Figure 2 and Figure 3 The bottom of the protective plate 4 is fixedly connected to a positioning ring 9. The positioning ring 9 is adapted to the arc-shaped notch, so that when the protective plate 4 moves down, the arc surface of the positioning ring 9 can fit with the arc-shaped notch to assist in the positioning of the PCB board 202. The bottom of the positioning ring 9 has a positioning hole 901 that works with the positioning shaft 8. The thickness of the positioning ring 9 is greater than the thickness of the PCB board 202, so that when the positioning ring 9 moves down above the ceramic substrate 201, the top of the positioning shaft 8 can be inserted into the positioning hole 901, and a cavity is formed between the bottom of the protective plate 4 and the PCB board 202 to prevent the protective plate 4 from pressing on the existing components on the PCB board 202.

[0027] like Figure 1 and Figure 2 An electric telescopic rod 10 is installed on the top of the support plate 1. The electric telescopic rod 10 is connected to an external power source and controlled by an external switch. A T-shaped bracket 11 is fixedly connected to the top of the electric telescopic rod 10. A glue storage tank 12 is fixedly installed on the T-shaped bracket 11. The glue dispensing tube 3 is installed at the bottom of the glue storage tank 12. The method of dispensing glue by using the glue dispensing tube 3 and the glue storage tank 12 is the existing technology. The details of how the glue dispensing tube 3 and the glue storage tank 12 cooperate for dispensing will not be elaborated here.

[0028] like Figure 1 and Figure 4 An elastic connection mechanism 13 is provided between the T-shaped bracket 11 and the protective plate 4. The elastic connection mechanism 13 includes a fixed sleeve 131. A return spring 132 is fixedly connected to the top of the inner wall of the fixed sleeve 131. A connecting plate 133 is fixedly connected to the bottom of the return spring 132. The bottom of the connecting plate 133 extends to the outside of the fixed sleeve 131 and is fixedly connected to the top of the protective plate 4. The bottom of the connecting plate 133 is connected to the center of the top of the protective plate 4, which can drive the protective plate 4 to move up and down stably. The fixed sleeve 131 is fixed to the T-shaped bracket 11.

[0029] The working principle of the pressure sensor packaging device provided by this utility model is as follows:

[0030] When it is necessary to apply adhesive to the pressure sensor, place the pressure sensor in the corresponding area above the support plate 1 so that the positioning shaft 8 passes through the mounting hole 7 to position the pressure sensor.

[0031] Then the electric telescopic rod 10 retracts, causing the T-shaped bracket 11 to move down. The T-shaped bracket 11 moves the protective plate 4 down through the elastic connection mechanism 13. When the positioning ring 9 at the bottom of the protective plate 4 is pressed against the ceramic substrate 201, the limiting sleeve 6 will adhere to the surface of the PCB board 202, forming a protective enclosure for the area to be glued.

[0032] When the T-shaped bracket 11 moves downward, the protective plate 4 can no longer move downward. It will press the reset spring 132 upward through the connecting plate 133. The reset spring 132 retracts and does not affect the downward movement of the T-shaped bracket 11. The T-shaped bracket 11 drives the glue storage tank 12 and the glue dispensing tube 3 to continue to move downward. The glue dispensing tube 3 passes through the protective plate 4 from the through opening 5 and performs glue dispensing and sealing on the pressure sensor. After the glue dispensing and sealing is completed, the electric telescopic rod 10 extends and drives the T-shaped bracket 11 to move upward. The protective plate 4 and the glue dispensing tube 3 move upward accordingly.

[0033] Compared with related technologies, the pressure sensor packaging device provided by this utility model has the following advantages:

[0034] This invention, before the pressure sensor is encapsulated with adhesive, moves the protective plate 4 downward and presses it onto the ceramic substrate 201 via the positioning ring 9. This not only positions the pressure sensor but also prevents pressure on the PCB board 202. Simultaneously, the limiting sleeve 6, moving downward with the protective plate 4, forms a protective enclosure above the area to be encapsulated on the PCB board 202. This prevents adhesive from overflowing into non-encapsulated areas or sensitive components during encapsulation, ensuring accurate coverage of solder joints and reinforced areas, improving the yield rate of pressure sensor encapsulation, and reducing rework rates.

[0035] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model.

Claims

1. A pressure sensor packaging device, comprising a support plate (1), characterized in that, A pressure sensor is provided on the top of the support plate (1). The pressure sensor includes a ceramic substrate (201) and a PCB board (202). The PCB board (202) is fixed on the top of the ceramic substrate (201). A protective mechanism that can move up and down and a dispensing tube (3) are provided above the pressure sensor. The protective mechanism includes a protective plate (4), with a through opening (5) at the top of the protective plate (4). The through opening (5) is located above the area to be glued and encapsulated on the PCB board (202). The glue dispensing tube (3) can pass through the through opening (5) to perform glue dispensing and encapsulation on the corresponding area on the PCB board (202). A limiting sleeve (6) is fixedly connected to the bottom of the protective plate (4) and below the through opening (5). When the protective plate (4) moves down, the bottom of the limiting sleeve (6) will adhere to the surface of the PCB board (202) to form a enclosure on the area to be glued on the PCB board (202).

2. The packaging device for a pressure sensor according to claim 1, characterized in that, The PCB board (202) has arc-shaped notches at its four corners, and mounting holes (7) are provided at the four corners of the ceramic substrate (201). A positioning shaft (8) is fixedly connected to the top of the support plate (1). The top of the positioning shaft (8) passes through the mounting hole (7) and extends to the outside of the mounting hole (7).

3. The packaging device for a pressure sensor according to claim 2, characterized in that, The bottom of the protective plate (4) is fixedly connected to a positioning ring (9), which is adapted to the arc-shaped notch. The bottom of the positioning ring (9) is provided with a positioning hole (901) that works with the positioning shaft (8).

4. The packaging device for a pressure sensor according to claim 1, characterized in that, An electric telescopic rod (10) is installed on the top of the support plate (1). A T-shaped bracket (11) is fixedly connected to the top of the electric telescopic rod (10). A glue storage tank (12) is fixedly installed on the T-shaped bracket (11). A glue dispensing tube (3) is installed at the bottom of the glue storage tank (12).

5. The packaging device for a pressure sensor according to claim 4, characterized in that, An elastic connection mechanism (13) is provided between the T-shaped bracket (11) and the protective plate (4). The elastic connection mechanism (13) includes a fixed sleeve (131). A return spring (132) is fixedly connected to the top of the inner wall of the fixed sleeve (131). A connecting plate (133) is fixedly connected to the bottom of the return spring (132). The bottom of the connecting plate (133) extends to the outside of the fixed sleeve (131) and is fixedly connected to the top of the protective plate (4). The fixed sleeve (131) is fixed on the T-shaped bracket (11).

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