Semiconductor chip carrier tape dust removal equipment
By designing and combining components such as telescopic cylinders, support frames, and dust-absorbing brushes, efficient cleaning of semiconductor chip carrier tapes is achieved, solving the problem of incomplete cleaning by traditional equipment and improving the dust removal accuracy of carrier tapes and the chip welding quality.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- FUYU TECHNOLOGY (WUXI) CO LTD
- Filing Date
- 2025-05-21
- Publication Date
- 2026-05-15
AI Technical Summary
Traditional dust removal equipment is unable to thoroughly clean the tiny particles on the surface of semiconductor chip carrier tape, leading to defects such as poor soldering and short circuits during subsequent chip soldering.
The design incorporates components such as telescopic cylinders, support frames, dust removal and adsorption brushes, motors, and gears to clean and remove dust from each groove on the carrier belt body one by one. Combined with a clamping and positioning structure using bolts and springs, it ensures the stability and precision of dust removal.
It improves the dust removal accuracy and quality of the carrier tape body, ensuring the accuracy and yield of chip mounting, and avoiding defects such as cold solder joints and short circuits.
Smart Images
Figure CN224237634U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of carrier tape dust removal technology, specifically a semiconductor chip carrier tape dust removal device. Background Technology
[0002] In semiconductor chip packaging processes, the carrier tape serves as a crucial carrier for chip transport and delivery. Its surface cleanliness directly affects chip mounting accuracy and yield. Traditional dust removal equipment often relies on fixed brushes or air-blowing structures, which are insufficient to meet the deep cleaning requirements of the dense grooves on the carrier tape surface. Tiny particles such as metal shavings and dust on the carrier tape surface are easily left in the grooves. Conventional linear reciprocating cleaning paths can easily create cleaning blind spots, resulting in incomplete dust removal. This can lead to defects such as cold solder joints and short circuits during subsequent chip soldering, which require optimization. To address these issues, the inventors propose a semiconductor chip carrier tape dust removal device to solve the aforementioned problems. Utility Model Content
[0003] To solve the above technical problems, the present invention adopts the following technical solution: a semiconductor chip carrier tape dust removal device, including a processing table, a carrier tape body movably mounted on the top surface of the processing table, a support frame provided above the processing table, a threaded rod rotatably mounted on the inner side of the support frame, a cross block threadedly fitted on the outer side of the threaded rod, a connecting frame fixedly mounted on the lower part of the cross block, a rotating shaft rotatably inserted into one end of the connecting frame, an upper gear fixedly connected to the top end of the rotating shaft, a side gear provided on the inner side of the connecting frame, the side gear meshing with the upper gear, a fixed plate fixedly connected to the bottom end of the rotating shaft, a sliding plate slidably connected to one end of the fixed plate, a dust removal adsorption brush fixedly connected to one end of the sliding plate, symmetrically distributed first springs fixedly mounted on the end of the sliding plate away from the dust removal adsorption brush, one end of the first springs fixedly connected to the inner wall of the fixed plate, and symmetrically distributed telescopic cylinders fixedly mounted on the top surface of the processing table, the output end of the telescopic cylinders fixedly connected to the support frame.
[0004] Preferably, an L-shaped plate is fixedly installed at the top of the processing table, a bolt is threaded onto one end of the L-shaped plate, a connecting plate is rotatably connected to one end of the bolt, a clamping frame is fixedly connected to one end of the connecting plate, one end of the clamping frame is movably abutting against the carrier belt body, and a second spring is fixedly installed to one end of the connecting plate, the top end of the second spring is fixedly connected to the L-shaped plate.
[0005] Preferably, the inner side of the support frame is fixed with symmetrically distributed guide rods, and one end of the cross block is slidably sleeved on the outer side of the guide rods.
[0006] Preferably, a first motor is fixedly installed on the outer side of the support frame, the drive end of the first motor is fixedly connected to the threaded rod, and a second motor is fixedly installed on one end of the connecting frame, the drive end of the second motor is fixedly connected to the side gear.
[0007] Preferably, an adjusting block is fixedly connected to the top end of the bolt.
[0008] Preferably, the bottom surface of the processing table is fixedly equipped with an array of foot pads.
[0009] Compared with the prior art, the beneficial effects of this utility model are as follows:
[0010] 1. Through the cooperation of telescopic cylinder, support frame, dust removal and adsorption brush, second motor, side gear, upper gear, rotating shaft, first spring, sliding plate, fixed plate, first motor, threaded rod, and cross block, the dust removal of each groove on the carrier belt body can be achieved one by one, effectively improving the dust removal accuracy of the carrier belt body, and thus improving the dust removal quality of the carrier belt body.
[0011] 2. By adjusting the rotation of the bolt, the bolt rotates and drives the connecting plate to move down continuously. The connecting plate then drives the clamping frame to move down, thereby clamping and positioning the carrier belt body to ensure the stability of the carrier belt body during dust removal. The second spring is used to limit the position of the connecting plate and also to facilitate the retraction of the bolt, which can pull the connecting plate to reset. The operation is convenient and very practical. Attached Figure Description
[0012] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0013] Figure 1 This is a schematic diagram of the structure of this utility model.
[0014] Figure 2 This is a schematic diagram showing the disassembled structure of the support frame of this utility model.
[0015] Figure 3 This is a cross-sectional schematic diagram of the fixing plate structure of this utility model.
[0016] In the diagram: 1. Processing table; 11. Carrier belt body; 12. Support frame; 13. Threaded rod; 14. Cross block; 15. Connecting frame; 16. Rotating shaft; 17. Upper gear; 18. Side gear; 19. Fixing plate; 20. Sliding plate; 21. Dust removal and adsorption brush; 22. First spring; 23. L-shaped plate; 24. Bolt; 25. Connecting plate; 26. Clamping frame; 27. Second spring; 28. Guide rod; 29. First motor; 30. Second motor; 31. Adjusting block; 32. Foot pad; 33. Telescopic cylinder. Detailed Implementation
[0017] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0018] Example: Figure 1-3 As shown, this utility model provides a technical solution: a semiconductor chip carrier tape dust removal device, including a processing table 1, a carrier tape body 11 movably mounted on the top surface of the processing table 1, a support frame 12 above the processing table 1, a threaded rod 13 rotatably mounted on the inner side of the support frame 12, a cross block 14 threadedly fitted on the outer side of the threaded rod 13, a connecting frame 15 fixedly mounted on the lower part of the cross block 14, a rotating shaft 16 rotatably inserted into one end of the connecting frame 15, an upper gear 17 fixedly connected to the top end of the rotating shaft 16, and a side gear 17 fixedly mounted on the inner side of the connecting frame 15. Gear 18, side gear 18 meshes with upper gear 17, fixed plate 19 is fixedly connected to the bottom end of rotating shaft 16, sliding plate 20 is slidably connected to one end of fixed plate 19, dust removal and adsorption brush 21 is fixedly connected to one end of sliding plate 20, first spring 22 is fixedly installed at the end of sliding plate 20 away from dust removal and adsorption brush 21, one end of first spring 22 is fixedly connected to the inner wall of fixed plate 19, telescopic cylinders 33 are fixedly installed on the top surface of processing table 1, and the output end of telescopic cylinder 33 is fixedly connected to support frame 12.
[0019] An L-shaped plate 23 is fixedly installed at the top of the processing table 1. A bolt 24 is threaded onto one end of the L-shaped plate 23. A connecting plate 25 is rotatably connected to one end of the bolt 24. A symmetrically distributed clamping frame 26 is fixedly connected to one end of the connecting plate 25. One end of the clamping frame 26 is in movable contact with the carrier belt body 11. A symmetrically distributed second spring 27 is fixedly installed on one end of the connecting plate 25. The top of the second spring 27 is fixedly connected to the L-shaped plate 23.
[0020] By adopting the above technical solution, the bolt 24 is adjusted to rotate, which causes the connecting plate 25 to move down continuously. The connecting plate 25 then causes the clamping frame 26 to move down, thereby clamping and positioning the carrier body 11 to ensure the stability of the carrier body 11 during dust removal. The second spring 27 is used to limit the connecting plate 25 and also to facilitate the retraction of the bolt 24, which can pull the connecting plate 25 to reset. The operation is convenient and very practical.
[0021] The inner side of the support frame 12 is fixed with symmetrically distributed guide rods 28, and one end of the cross block 14 is slidably sleeved on the outer side of the guide rods 28.
[0022] By adopting the above technical solution, the cross block 14 slides on the guide rod 28 to help with its own guidance control.
[0023] A first motor 29 is fixedly installed on the outside of the support frame 12. The drive end of the first motor 29 is fixedly connected to the threaded rod 13. A second motor 30 is fixedly installed on one end of the connecting frame 15. The drive end of the second motor 30 is fixedly connected to the side gear 18.
[0024] By adopting the above technical solution, the first motor 29 is set to control the rotation of the threaded rod 13, and the second motor 30 is set to control the rotation of the side gear 18.
[0025] An adjusting block 31 is fixedly connected to the top of bolt 24.
[0026] By adopting the above technical solution, the adjustment block 31 is set to facilitate the adjustment of the rotation control bolt 24.
[0027] The bottom surface of the processing table 1 is fixedly equipped with an array of foot pads 32.
[0028] By adopting the above technical solution, the support effect of the processing table 1 is improved by setting foot pads 32.
[0029] Working principle: First, the carrier belt body 11 is placed on the processing table 1. By adjusting the bolt 24 and rotating it, the connecting plate 25 moves downward continuously. The connecting plate 25 then moves the clamping frame 26 downward, thereby clamping and positioning the carrier belt body 11 to ensure its stability during dust removal. The second spring 27 is used to limit the position of the connecting plate 25 and also allows the connecting plate 25 to be pulled back to its original position when the bolt 24 is retracted. The operation is convenient and very practical. Then, the telescopic cylinder 33 is activated to pull the support frame 12 downward, which in turn moves the dust removal adsorption brush 2. 1. Once inside the carrier belt body 11, the second motor 30 is activated to rotate the side gear 18. The side gear 18 drives the upper gear 17 to rotate, which in turn drives the rotating shaft 16 and the dust removal brush 21 to rotate for dust removal. The first spring 22 pushes the sliding plate 20 to slide in the fixed plate 19 for motion compensation. In conjunction with the first motor 29, the threaded rod 13 is rotated to make the cross block 14 translate, thereby achieving the cleaning and dust removal of each groove on the carrier belt body 11 one by one, effectively improving the dust removal accuracy of the carrier belt body 11, and thus improving the dust removal quality of the carrier belt body 11.
[0030] Obviously, those skilled in the art can make various modifications and variations to this utility model without departing from its spirit and scope. Therefore, if these modifications and variations fall within the scope of the claims of this utility model and their equivalents, this utility model also intends to include these modifications and variations.
Claims
1. A semiconductor chip carrier tape dust removal device, comprising a processing table (1), characterized in that: A carrier body (11) is movably mounted on the top surface of the processing table (1). A support frame (12) is provided above the processing table (1). A threaded rod (13) is rotatably mounted on the inner side of the support frame (12). A cross block (14) is threaded on the outer side of the threaded rod (13). A connecting frame (15) is fixedly mounted on the lower part of the cross block (14). A rotating shaft (16) is rotatably inserted into one end of the connecting frame (15). An upper gear (17) is fixedly connected to the top end of the rotating shaft (16). A side gear (18) is provided on the inner side of the connecting frame (15). The side gear (18) and the upper gear (17) are connected together. 7) Engaging connection: A fixed plate (19) is fixedly connected to the bottom end of the rotating shaft (16), and a sliding plate (20) is slidably connected to one end of the fixed plate (19). A dust removal and adsorption brush (21) is fixedly connected to one end of the sliding plate (20). A symmetrically distributed first spring (22) is fixedly installed at the end of the sliding plate (20) away from the dust removal and adsorption brush (21). One end of the first spring (22) is fixedly connected to the inner wall of the fixed plate (19). A symmetrically distributed telescopic cylinder (33) is fixedly installed on the top surface of the processing table (1). The output end of the telescopic cylinder (33) is fixedly connected to the support frame (12).
2. The semiconductor chip carrier dust removal device as described in claim 1, characterized in that, An L-shaped plate (23) is fixedly installed at the top of the processing table (1). A bolt (24) is threaded onto one end of the L-shaped plate (23). A connecting plate (25) is rotatably connected to one end of the bolt (24). A symmetrically distributed clamping frame (26) is fixedly connected to one end of the connecting plate (25). One end of the clamping frame (26) is movably abutting against the carrier belt body (11). A symmetrically distributed second spring (27) is fixedly installed on one end of the connecting plate (25). The top end of the second spring (27) is fixedly connected to the L-shaped plate (23).
3. The semiconductor chip carrier dust removal device as described in claim 1, characterized in that, The inner side of the support frame (12) is fixed with symmetrically distributed guide rods (28), and one end of the cross block (14) is slidably sleeved on the outer side of the guide rods (28).
4. The semiconductor chip carrier dust removal device as described in claim 1, characterized in that, A first motor (29) is fixedly installed on the outside of the support frame (12). The drive end of the first motor (29) is fixedly connected to the threaded rod (13). A second motor (30) is fixedly installed on one end of the connecting frame (15). The drive end of the second motor (30) is fixedly connected to the side gear (18).
5. The semiconductor chip carrier dust removal device as described in claim 2, characterized in that, An adjusting block (31) is fixedly connected to the top of the bolt (24).
6. The semiconductor chip carrier dust removal device as described in claim 1, characterized in that, The bottom surface of the processing table (1) is fixedly equipped with an array of foot pads (32).