Buffer cooling device for air separation seamless tube extrusion

By using a buffer cooling device consisting of a copper drum and ceramic fiber laminated cloth, the problems of uneven cooling and increased thermal stress after extrusion molding of seamless air separation tubes were solved, achieving efficient and uniform cooling and improving production efficiency.

CN224237927UActive Publication Date: 2026-05-15HARBIN EAST LIGHT METAL MATERIAL PROCESSING CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
HARBIN EAST LIGHT METAL MATERIAL PROCESSING CO LTD
Filing Date
2025-06-20
Publication Date
2026-05-15

AI Technical Summary

Technical Problem

The problem of uneven cooling and increased thermal stress after extrusion molding of air separation seamless tubes is addressed by the fact that existing technologies use long natural cooling times, which leads to low efficiency.

Method used

A buffer cooling device comprising a copper tank, heat dissipation fins, ceramic fiber laminate, and coolant is adopted. The copper tank and ceramic fiber laminate absorb heat from the seamless tube and transfer it to the coolant. Uniform cooling is achieved by using a circulating pump and a cooler.

Benefits of technology

It achieves uniform cooling, improves cooling efficiency, reduces thermal stress, and enhances production efficiency.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a buffer cooling device for air separation seamless tube extrusion, which comprises a cooling pond, mounting plates, a seamless tube copper-based buffer structure, cooling liquid, a connector, a circulating tube, a cooler and a circulating pump, the mounting plates are respectively fixed at the front end and the rear end of the cooling pond, the seamless tube copper-based buffer structure is mounted in the cooling pond through the mounting plates, and the cooling liquid is connected with the connector. The cooling liquid soaks the seamless tube copper-based buffer structure through the cooling pool, the connector is formed in the left end of the cooling pool, the circulating tube is installed at the connector, the cooler is connected to the connector through the circulating tube, and the circulating pump is installed on the circulating tube. The utility model solves the problems that the temperature of the seamless tube of the air separation unit can reach about 1000 DEG C after extrusion forming, the seamless tube needs to be properly cooled, and the common water cooling or forced air cooling can cause non-uniform cooling, increase of thermal stress and the like. And generally, long-time natural cooling is adopted.
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Description

Technical Field

[0001] This utility model relates to the field of air separation seamless tube processing, and in particular to a buffer cooling device for extruding air separation seamless tubes. Background Technology

[0002] Seamless steel pipe air separation systems in air separation equipment are responsible for conveying high-pressure, low-temperature, or corrosive gases, requiring extremely high material properties and manufacturing precision. Seamless pipe extrusion is a process that involves heating, piercing, and extruding metal billets to produce seamless steel pipes. It offers advantages such as high production efficiency, high material utilization, and good product performance.

[0003] The seamless tubes in air separation units reach temperatures of around 1000 degrees Celsius after extrusion molding, requiring appropriate cooling. Commonly used water cooling or forced air cooling can lead to uneven cooling and increased thermal stress. Natural cooling over a longer period is generally preferred. Utility Model Content

[0004] The purpose of this invention is to provide a buffer cooling device for extruding seamless air separation tubes to solve the above-mentioned technical problems.

[0005] To achieve the above objectives, this utility model adopts the following technical solution: a buffer cooling device for extruding seamless air separation tubes, comprising a cooling pool, a mounting plate, a copper-based buffer structure for seamless tubes, a coolant, an interface, a circulation pipe, a cooler, and a circulation pump. The mounting plate is fixed at both ends of the cooling pool. The copper-based buffer structure for seamless tubes is installed in the cooling pool through the mounting plate. The coolant immerses the copper-based buffer structure for seamless tubes in the cooling pool. The interface is located at the left end of the cooling pool. The circulation pipe is installed at the interface. The cooler is connected to the interface through the circulation pipe. The circulation pump is installed in the circulation pipe.

[0006] Based on the above technical solution, the seamless tube copper-based buffer structure includes a copper barrel, heat dissipation fins, a mounting head, ceramic fiber bonding cloth, a cover plate, and a buckle. The front and rear ends of the copper barrel are respectively fixed to the front and rear mounting plates. The heat dissipation fins are distributed on the side ends of the copper barrel. The mounting head is installed on the copper barrel through the front end of the front mounting plate. The ceramic fiber bonding cloth is distributed on the inner wall of the copper barrel and the mounting head. The cover plate is installed on the front end of the mounting head. The buckle is installed on the cover plate and the mounting head.

[0007] Based on the above technical solution, the copper barrel absorbs the heat of the seamless tube through ceramic fiber laminate and transfers it to the coolant.

[0008] Compared with the prior art, the present invention has the following advantages: The present invention places the extruded air separation seamless tube in the seamless tube copper-based buffer structure, so that the seamless tube is water-cooled under the buffer of the copper barrel and the ceramic fiber bonding cloth, thereby achieving the functions of uniform heat, slow cooling and thermal bridging, and improving cooling efficiency. Attached Figure Description

[0009] Figure 1 This is a schematic diagram of the appearance and structure of this utility model.

[0010] Figure 2 This is a schematic diagram showing the placement of the seamless tube of this utility model.

[0011] Figure 3 This is a schematic diagram of the seamless tube copper-based buffer structure of this utility model.

[0012] In the diagram: 1. Cooling pool, 2. Mounting bridge, 3. Seamless copper-based buffer structure, 4. Coolant, 5. Interface, 6. Circulation pipe, 7. Cooler, 8. Circulation pump, 9. Copper tank, 10. Heat dissipation fins, 11. Mounting head, 12. Ceramic fiber bonding cloth, 13. Cover plate, 14. Locking buckle. Detailed Implementation

[0013] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments.

[0014] like Figures 1 to 3 As shown, a buffer cooling device for extruding seamless air separation tubes includes a cooling pool 1, a mounting plate 2, a seamless tube copper-based buffer structure 3, a coolant 4, an interface 5, a circulation pipe 6, a cooler 7, and a circulation pump 8. The mounting plate 2 is fixed at both the front and rear ends of the cooling pool 1. The seamless tube copper-based buffer structure 3 is installed in the cooling pool 1 through the mounting plate 2. The coolant 4 soaks the seamless tube copper-based buffer structure 3 through the cooling pool 1. The interface 5 is located at the left end of the cooling pool 1. The circulation pipe 6 is installed in the interface 5. The cooler 7 is connected to the interface 5 through the circulation pipe 6. The circulation pump 8 is installed in the circulation pipe 6.

[0015] The seamless tube copper-based buffer structure 3 includes a copper barrel 9, heat dissipation fins 10, mounting head 11, ceramic fiber bonding cloth 12, cover plate 13, and latch 14. The front and rear ends of the copper barrel 9 are respectively fixed to the front and rear mounting plates 2. The heat dissipation fins 10 are distributed on the side ends of the copper barrel 9. The mounting head 11 is installed on the copper barrel 9 through the front end of the front mounting plate 2. The ceramic fiber bonding cloth 12 is distributed on the inner wall of the copper barrel 9 and the mounting head 11. The cover plate 13 is installed on the front end of the mounting head 11. The latch 14 is installed on the cover plate 13 and the mounting head 11.

[0016] The copper barrel 9 absorbs the heat from the seamless tube through the ceramic fiber bonding cloth 12 and transfers it to the coolant 4.

[0017] The working principle of this invention is as follows: An extruded seamless air separation tube is placed inside a copper drum 9 via an installation head 11. The cover plate 13 is closed and the locking buckle 14 is tightened. The seamless tube is bonded to the copper drum 9 via a ceramic fiber bonding cloth 12. The copper drum 9 absorbs the heat from the seamless tube through the ceramic fiber bonding cloth 12 and transfers it to the coolant 4. The circulating pump 8 cools the coolant through a cooler 7. This achieves the functions of uniform heating, slow cooling, and thermal bridging, thereby improving cooling efficiency.

[0018] The above description is a preferred embodiment of the present utility model. For those skilled in the art, any changes, modifications, substitutions and variations made to the implementation methods without departing from the principles and spirit of the present utility model, based on the teachings of the present utility model, still fall within the protection scope of the present utility model.

Claims

1. A buffer cooling device for extruding seamless air separation tubes, comprising a cooling pool (1), a mounting plate (2), a copper-based buffer structure for seamless tubes (3), a coolant (4), an interface (5), a circulation pipe (6), a cooler (7), and a circulation pump (8), characterized in that: The cooling pool (1) is fixed with mounting plates (2) at both ends. The seamless tube copper-based buffer structure (3) is installed in the cooling pool (1) through the mounting plates (2). The coolant (4) soaks the seamless tube copper-based buffer structure (3) in the cooling pool (1). The interface (5) is opened at the left end of the cooling pool (1). The circulation pipe (6) is installed in the interface (5). The cooler (7) is connected to the interface (5) through the circulation pipe (6). The circulation pump (8) is installed in the circulation pipe (6).

2. The buffer cooling device for extruding seamless air separation tubes according to claim 1, characterized in that: The seamless tube copper-based buffer structure (3) includes a copper barrel (9), heat dissipation fins (10), mounting head (11), ceramic fiber bonding cloth (12), cover plate (13), and buckle (14). The front and rear ends of the copper barrel (9) are respectively fixed to the front and rear mounting plates (2). The heat dissipation fins (10) are distributed on the side of the copper barrel (9). The mounting head (11) is installed on the copper barrel (9) through the front end of the front mounting plate (2). The ceramic fiber bonding cloth (12) is distributed on the inner wall of the copper barrel (9) and the mounting head (11). The cover plate (13) is installed on the front end of the mounting head (11). The buckle (14) is installed on the cover plate (13) and the mounting head (11).

3. The buffer cooling device for extruding seamless air separation tubes according to claim 2, characterized in that: The copper barrel (9) absorbs the heat from the seamless tube through the ceramic fiber bonding cloth (12) and transfers it to the coolant (4).