Computer rear cover rubberizing device
By designing a computer back cover adhesive application device, which uses a lower and upper pressure plate to clamp the adhesive strip, combined with an elastic structure and cylinder drive, the problems of high cost of automated equipment and poor consistency of manual adhesive application are solved. This achieves low-cost, high-consistency adhesive strip application and improves the precision of computer assembly.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SUZHOU GANGWANG METAL TECH CO LTD
- Filing Date
- 2025-06-11
- Publication Date
- 2026-05-15
AI Technical Summary
Existing automated adhesive application equipment for computer back covers is costly, while manual adhesive application suffers from inconsistent results, making it unsuitable for small-batch production and affecting assembly accuracy.
A computer back cover adhesive application device was designed, which uses a lower pressure plate and an upper pressure plate to clamp the adhesive strip, and achieves semi-automatic application through an elastic structure and cylinder drive, ensuring the precise positioning and consistency of the adhesive strip.
It achieves low-cost, highly consistent adhesive strip bonding, is suitable for small-batch production, and improves the precision of computer assembly.
Smart Images

Figure CN224240413U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of back cover adhesive technology, specifically relating to a computer back cover adhesive application device. Background Technology
[0002] Existing computer back covers are gradually being designed as an integrated structure, and aluminum alloy is used to reduce weight. After molding, they are shaped, ground, and polished. Then, for the assembly of the back cover, multiple adhesives need to be applied to the inside of the back cover to connect it to the body. The existing adhesive methods include automated adhesive application equipment and manual operation. Automated equipment is efficient, but the purchase, operation, and maintenance costs are high, which is not conducive to the application of small-batch production manufacturers. On the other hand, the labor cost is relatively low and flexible for small-batch processing. However, the consistency of manual adhesive application is not good, which can easily lead to uneven pasting and ultimately affect the assembly accuracy of the computer.
[0003] To address the aforementioned problems, this application proposes a device for applying adhesive to the back cover of a computer. Utility Model Content
[0004] To address the aforementioned problems in the existing technology, this utility model provides a computer back cover adhesive application device, which features cost control and improved adhesive application consistency.
[0005] To achieve the above objectives, this utility model provides the following technical solution: a computer back cover adhesive applicator for applying adhesive strips to a back cover, comprising a base and a top plate fixed to the upper end of one side of the base. A sliding mold base is provided on the base via a linear slide rail. The back cover is located in the mold base. A vertically moving lower pressure plate is elastically connected above the mold base. A vertically moving upper pressure plate is mounted on the top plate via an adhesive applicator cylinder. The adhesive strip is clamped by the lower pressure plate and the upper pressure plate under the drive of the adhesive applicator cylinder, and is then applied to the back cover again under the drive of the adhesive applicator cylinder.
[0006] As a preferred technical solution of this utility model, the lower pressure plate is provided with an adhesive groove for accommodating the film and a clamping groove for accommodating the auxiliary piece. A positioning rod that engages with the positioning hole is formed on the clamping groove. An adhesive plate that engages with the adhesive groove is fixed at the bottom of the upper pressure plate. A clamping plate that engages with the clamping groove is also fixed at the bottom of the upper pressure plate. An avoidance hole that engages with the positioning rod is provided in the clamping plate.
[0007] As a preferred technical solution of this utility model, when the bonding cylinder moves the upper pressure plate down to bond with the lower pressure plate, the auxiliary piece is clamped.
[0008] As a preferred technical solution of this utility model, the mold base is provided with a sunken mold groove for accommodating the back cover, and an avoidance groove is provided at the bottom of the mold groove.
[0009] As a preferred technical solution of this utility model, the mold base further includes a guide rod fixed on the side and a baffle fixed on the top of the guide rod. A transition plate is fixed on the side of the lower pressure plate. A guide hole is opened in the transition plate to slide with the guide rod. A spring is provided between the baffle and the transition plate for the lower pressure plate to reset upward.
[0010] As a preferred technical solution of this utility model, a linear cylinder is installed on the base, and the output end of the linear cylinder is fixed to the bottom of the mold base. The linear cylinder drives the mold base, the lower pressure plate, and the rear cover to move horizontally.
[0011] As a preferred embodiment of this utility model, the bonding cylinder is fixed on the top plate and its output end extends downward through the top plate, and the upper pressure plate is fixed to the output end of the bonding cylinder.
[0012] Compared with the prior art, the beneficial effects of this utility model are:
[0013] This utility model uses a lower pressure plate and an upper pressure plate to clamp and then apply the adhesive strip. The adhesive strip can be precisely positioned by the adhesive groove, clamping groove and positioning rod on the lower pressure plate, thereby ensuring the consistency of adhesive application on the back cover.
[0014] This invention uses a spring to set the lower pressure plate into an elastic structure, and then uses a bonding cylinder to drive the upper and lower pressure plates to apply adhesive, thus realizing semi-automatic adhesive application. Furthermore, the opening and closing coordination between the lower and upper pressure plates and the translation driven by the linear cylinder facilitate the placement of the adhesive strip and the removal of the auxiliary piece, making the adhesive application work more convenient. Attached Figure Description
[0015] The accompanying drawings are provided to further illustrate the present invention and form part of the specification. They are used together with the embodiments of the present invention to explain the present invention, but do not constitute a limitation thereof. In the drawings:
[0016] Figure 1 This is a schematic diagram of the structure of the present invention when the rear cover is located on the mold base and the adhesive strip is ready to be installed.
[0017] Figure 2 for Figure 1 A schematic diagram of the structure in which the middle rubber strip is inserted and the rear cover is pushed to the bottom of the upper pressure plate;
[0018] Figure 3 for Figure 2 A schematic diagram of the structure in which the upper and lower pressure plates are bonded together and the adhesive strip is clamped;
[0019] Figure 4 for Figure 3 A schematic diagram of the structure in which two pressure plates move down simultaneously and adhere the adhesive strip;
[0020] Figure 5 for Figure 4 A partial cross-sectional structural diagram of the bonding state of the middle rubber strip;
[0021] Figure 6 This is a structural diagram showing the disassembly of the lower pressure plate and mold base.
[0022] Figure 7 This is a structural schematic diagram of the upper pressure plate viewed from below;
[0023] Figure 8 This is an enlarged structural diagram of the adhesive strip;
[0024] In the diagram: 1. Base; 11. Top plate; 2. Linear slide rail; 3. Mold base; 31. Mold groove; 32. Clearance groove; 33. Guide rod; 34. Baffle; 4. Lower pressure plate; 41. Adhesive groove; 42. Clamping groove; 421. Positioning rod; 43. Adapter plate; 431. Guide hole; 5. Adhesive cylinder; 6. Upper pressure plate; 61. Adhesive plate; 62. Clamping plate; 621. Clearance hole; 7. Linear cylinder; 8. Spring; 9. Back cover; 10. Adhesive strip; 101. Film; 102. Auxiliary piece; 1021. Positioning hole. Detailed Implementation
[0025] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0026] Example
[0027] Please see Figures 1-8 The present invention provides the following technical solution: a computer back cover adhesive device for attaching adhesive strip 10 to back cover 9. The back cover 9 has an adhesive application position on the inside for assembly with the body. The adhesive strip 10 includes a film 101 and an auxiliary piece 102 located at the upper end of the film 101. The auxiliary piece 102 has an extension on its side, and the extension is provided with a positioning hole 1021. It should be noted that when the adhesive strip 10 is not attached, the lower end has a protective film, which works with the auxiliary piece 102 to protect the film 101.
[0028] Furthermore, the adhesive applicator includes a base 1 and a top plate 11 welded and fixed to the upper end of one side of the base 1. A sliding mold base 3 is provided on the base 1 via a linear slide rail 2. The linear slide rail 2 consists of two parts: the bottom is a track fixed to the base 1, and the top is a slide fixed to the bottom of the mold base 3. The slide slides on the track, thereby providing the mold base 3 to slide on the base 1.
[0029] Furthermore, the mold base 3 is provided with a recessed mold groove 31 for accommodating the rear cover 9, and the bottom of the mold groove 31 is provided with a relief groove 32, which facilitates the removal and placement of the rear cover 9 in the mold groove 31.
[0030] Specifically, a vertically movable lower pressure plate 4 is elastically connected above the mold base 3. The lower pressure plate 4 has an adhesive groove 41 for accommodating the film 101 and a clamping groove 42 for accommodating the auxiliary piece 102. A positioning rod 421 that engages with the positioning hole 1021 is formed on the clamping groove 42. An adhesive plate 61 is fixed at the bottom of the upper pressure plate 6 to cooperate with the adhesive groove 41. A clamping plate 62 is also fixed at the bottom of the upper pressure plate 6 to cooperate with the clamping groove 42. An clearance hole 621 that cooperates with the positioning rod 421 is formed in the clamping plate 62. When the bonding cylinder 5 moves the upper pressure plate 6 down to bond with the lower pressure plate 4, the auxiliary piece 102 is clamped.
[0031] Specifically, a vertically moving upper pressure plate 6 is installed on the top plate 11 via a bonding cylinder 5. The bonding cylinder 5 is fixed on the top plate 11 and its output end penetrates downward through the top plate 11. The upper pressure plate 6 is fixed to the output end of the bonding cylinder 5. After the bonding cylinder 5 is driven downward, the adhesive strip 10 is clamped by the lower pressure plate 4 and the upper pressure plate 6, and is then bonded to the back cover 9 again after the bonding cylinder 5 is driven downward. In this embodiment, the clamping and bonding of the adhesive strip 10, as well as the automatic tearing of the auxiliary piece 102, can be achieved by a single driving component, the bonding cylinder 5. At the same time, after it is completely moved upward, it is also convenient for the auxiliary piece 102 to be removed from the lower pressure plate 4.
[0032] Specifically, the mold base 3 also includes a guide rod 33 fixed on the side and a baffle 34 fixed on the top of the guide rod 33. A transition plate 43 is fixed on the side of the lower pressure plate 4. A guide hole 431 is opened in the transition plate 43 to slide with the guide rod 33. A spring 8 is provided between the baffle 34 and the transition plate 43 for the lower pressure plate 4 to reset upward.
[0033] Specifically, a linear cylinder 7 is installed on the base 1. The output end of the linear cylinder 7 is fixed to the bottom of the mold base 3. The linear cylinder 7 drives the mold base 3, the lower pressure plate 4, and the rear cover 9 to move horizontally. Through the cooperation of the linear cylinder 7 and the linear slide rail 2, the rear cover 9 can be moved to the bottom of the upper pressure plate 6 and to the side. When cooperating with the upper pressure plate 6, it ensures precise pressing. When moving to the side, it facilitates the placement of the adhesive strip 10 and the removal of the auxiliary piece 102.
[0034] The working principle and usage process of this utility model are as follows: Figure 1 As shown, the back cover 9 is placed in the mold groove 31 from the side, and the adhesive strip 10 is placed on the lower pressure plate 4. At this time, the adhesive sheet 101 is located in the adhesive groove 41, the auxiliary sheet 102 is located in the clamping groove 42, and the positioning hole 1021 is fitted onto the outside of the positioning rod 421; Figure 2 As shown, the linear cylinder 7 drives the mold base 3, lower pressure plate 4, and rear cover 9 to move directly below the upper pressure plate 6; as Figure 3The bonding cylinder 5 moves the upper pressure plate 6 down to bond with the lower pressure plate 4, the adhesive plate 61 enters the adhesive groove 41, the clamping plate 62 cooperates with the clamping groove 42 to clamp the adhesive strip 10, and the positioning rod 421 is inserted into the clearance hole 621; Figure 4 As shown, the bonding cylinder 5 continues to move downwards, at which point it causes the mold base 3, lower pressure plate 4, upper pressure plate 6, and rear cover 9 to press together. The spring 8 is stretched, and the adapter plate 43 slides downwards outside the guide rod 33 through the guide hole 431; this state is as follows. Figure 5 As shown, film 101 is attached to the adhesive application position of back cover 9;
[0035] At this time, the bonding cylinder 5 drives the lower pressure plate 4, the rear cover 9, and the upper pressure plate 6 to move upward. Under the clamping action of the lower pressure plate 4 and the upper pressure plate 6, the auxiliary piece 102 is peeled off from the film 101. Then the lower pressure plate 4 moves to the top, and the upper pressure plate 6 continues to move upward under the bonding cylinder 5, breaking free from the clamping of the auxiliary piece 102. The staff then removes the film 101 from the lower pressure plate 4.
[0036] Finally, it should be noted that the above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.
Claims
1. A computer back cover adhesive applicator for attaching adhesive strips (10) to a back cover (9), comprising a base (1) and a top plate (11) fixed to the upper end of one side of the base (1), characterized in that: The base (1) is provided with a sliding mold base (3) via a linear slide rail (2). The back cover (9) is located in the mold base (3). A vertically moving lower pressure plate (4) is elastically connected above the mold base (3). A vertically moving upper pressure plate (6) is installed on the top plate (11) via a bonding cylinder (5). The adhesive strip (10) is clamped by the lower pressure plate (4) and the upper pressure plate (6) under the drive of the bonding cylinder (5), and is bonded to the back cover (9) again under the drive of the bonding cylinder (5).
2. The computer back cover adhesive applicator according to claim 1, characterized in that: The lower pressure plate (4) has an adhesive groove (41) for accommodating the film (101) and a clamping groove (42) for accommodating the auxiliary piece (102). The clamping groove (42) has a positioning rod (421) that engages with the positioning hole (1021). The bottom of the upper pressure plate (6) has an adhesive plate (61) that engages with the adhesive groove (41). The bottom of the upper pressure plate (6) also has a clamping plate (62) that engages with the clamping groove (42). The clamping plate (62) has a clearance hole (621) that engages with the positioning rod (421).
3. The computer back cover adhesive applicator according to claim 2, characterized in that: When the bonding cylinder (5) moves the upper pressure plate (6) down to bond with the lower pressure plate (4), the auxiliary piece (102) is clamped.
4. The computer back cover adhesive applicator according to claim 1, characterized in that: The mold base (3) is provided with a recessed mold groove (31) for receiving the back cover (9), and an avoidance groove (32) is provided at the bottom of the mold groove (31).
5. The computer back cover adhesive applicator according to claim 1, characterized in that: The mold base (3) also includes a guide rod (33) fixed on the side and a baffle (34) fixed on the top of the guide rod (33). The lower pressure plate (4) has a transition plate (43) fixed on its side. The transition plate (43) has a guide hole (431) that slides with the guide rod (33). A spring (8) is provided between the baffle (34) and the transition plate (43) for the lower pressure plate (4) to reset upward.
6. The computer back cover adhesive applicator according to claim 1, characterized in that: A linear cylinder (7) is installed on the base (1). The output end of the linear cylinder (7) is fixed to the bottom of the mold base (3). The linear cylinder (7) drives the mold base (3), the lower pressure plate (4), and the rear cover (9) to move horizontally.
7. The computer back cover adhesive applicator according to claim 1, characterized in that: The bonding cylinder (5) is fixed on the top plate (11) and its output end extends downward through the top plate (11). The upper pressure plate (6) is fixed to the output end of the bonding cylinder (5).