Silicon wafer material frame separating and feeding mechanism

Abstract

The utility model relates to the technical field of silicon wafer processing, in particular to a silicon wafer material frame separating and feeding mechanism which comprises a separating groove, a material taking arm, a first conveying belt assembly and two second conveying belt assemblies, the first conveying belt assembly is arranged at the bottom of the separating groove, and material taking plates are arranged at the front end and the rear end of the material taking arm. First abutting blocks are arranged on the two sides of the bottom of the material taking plate, second abutting blocks are arranged on the two sides of the middle of the material taking plate, the material frame comprises two side plates, two first rollers and two second rollers, two first through grooves are formed in the bottoms of the two side plates, and two second through grooves are formed in the edges of the middles of the two side plates. The first abutting block corresponds to the first roller, and the second abutting block corresponds to the second roller. According to the utility model, efficient and safe separation and transmission of silicon wafers from the material frame are realized, the automation degree and the stability of the whole production line are improved, and the requirements of high-end manufacturing processes on a silicon wafer processing system are met.

Description

Technical Field

[0001] This utility model relates to the field of silicon wafer processing technology, and in particular to a silicon wafer material frame separation and feeding mechanism. Background Technology

[0002] In semiconductor manufacturing, the photovoltaic industry, and other precision electronic device processing fields, silicon wafers are a key basic material, and their handling, transmission, and loading processes have a significant impact on production efficiency and product yield. With the continuous improvement of automation levels, traditional manual or semi-automatic loading methods are no longer sufficient to meet the modern production demands for high precision, high cleanliness, and high efficiency. Especially during the process of removing silicon wafers from the feed frame and transferring them to subsequent conveying equipment, achieving stable, non-destructive, and efficient separation and loading operations has become a key focus of current technological research and development.

[0003] Currently, common silicon wafer loading devices typically use mechanical clamping or vacuum adsorption to pick up wafers, but these methods have certain limitations. For example, when using mechanical clamping, inaccurate positioning can easily damage the silicon wafer; while when using vacuum adsorption, insufficient adsorption force may lead to wafer picking failure or wafer detachment. Utility Model Content

[0004] This invention aims to at least solve the technical problems existing in the prior art. To this end, this invention proposes a silicon wafer frame separation and feeding mechanism, which realizes efficient and safe separation and transfer of silicon wafers from the frame, improves the automation level and stability of the entire production line, and meets the requirements of high-end manufacturing processes for silicon wafer processing systems.

[0005] A silicon wafer frame separation and feeding mechanism according to some embodiments of the present invention includes a separation trough, a picking arm, a first conveyor belt assembly, and two second conveyor belt assemblies. The first conveyor belt assembly is disposed at the bottom of the separation trough. Two first telescopic cylinders are disposed on both the front and rear sides of the separation trough. The front and rear ends of the second conveyor belt assemblies are respectively connected to the output ends of the two first telescopic cylinders. The front and rear ends of the picking arm are each provided with a second telescopic cylinder. A picking plate is disposed at the output end of the second telescopic cylinder. First abutment blocks are disposed on both sides of the bottom of the picking plate. The material receiving plate has two second abutment blocks on both sides of its middle section. The material frame includes two side plates, two first rollers, and two second rollers. The bottom of the two side plates has two first through slots, and the middle edge of the two side plates has two second through slots. The front and rear ends of the first rollers are provided with first connecting shafts, which extend into the first through slots. The front and rear ends of the second rollers are provided with second connecting shafts, which extend into the second through slots. The first abutment blocks are corresponding to the first rollers, and the second abutment blocks are corresponding to the second rollers.

[0006] A silicon wafer frame separation and feeding mechanism according to some embodiments of the present invention has at least the following beneficial effects:

[0007] This invention, through the coordinated operation of a separation trough, a picking arm, and multiple conveyor belt assemblies, can automatically complete the separation and transfer of silicon wafers from the material frame, significantly improving production efficiency. The first and second rollers provide bottom support and lateral clamping for the silicon wafers. During the picking process, the first and second abutment blocks on the picking plate gradually release the limiting force on the silicon wafers, allowing them to smoothly detach from the material frame and avoiding slippage, tilting, or breakage caused by forced removal, thus ensuring the integrity of the silicon wafers. This invention uses a telescopic cylinder to control the position of the conveyor belt assemblies, achieving flexible clamping and precise positioning of the silicon wafers, ensuring stable transport even during the removal of the material frame. The first conveyor belt assembly and two second conveyor belt assemblies form a multi-point clamping structure, completing stable support of the silicon wafers before the material frame is completely detached, ensuring an uninterrupted and continuous feeding process, which is beneficial for continuous production.

[0008] According to some embodiments of the present invention, a silicon wafer frame separation and feeding mechanism includes a first channel including a first positioning section and a second positioning section. The first positioning section is connected to the second positioning section. The horizontal height of the first positioning section near the second positioning section is higher than the horizontal height of the other end. The horizontal height of the second positioning section near the first positioning section is higher than the horizontal height of the other end. The first abutment block is used to drive the first connecting shaft to move from the first positioning section to the second positioning section.

[0009] According to some embodiments of the present invention, a silicon wafer frame separation and feeding mechanism is provided, wherein the second through groove is an arc shape with a gradually increasing horizontal height from the inside to the outside, the outer side of the second abutting block is provided with a V-shaped groove, and when the second connecting shaft is located at the outermost side of the second through groove, the second connecting shaft is located in the V-shaped groove.

[0010] According to some embodiments of the present invention, a silicon wafer frame separation and feeding mechanism is provided, wherein a groove is provided in the middle of the bottom of each side plate, the first conveyor belt assembly is disposed in the groove, and the horizontal height of the top of the groove is higher than the horizontal height of the first through groove.

[0011] According to some embodiments of the present invention, a silicon wafer frame separation and feeding mechanism is provided at the front and rear ends of the separation groove, respectively, with a first driving platform and a second driving platform, and four first telescopic cylinders are arranged in pairs on the first driving platform and the second driving platform.

[0012] According to some embodiments of the present invention, a silicon wafer frame separation and feeding mechanism is provided with a first connecting plate at the output end of the first telescopic cylinder, a first guide rail is provided at one end of the first driving platform and the second driving platform near the middle of the separation groove, a first slider is provided at the bottom of the first connecting plate, the first slider is slidably connected to the first guide rail, a second connecting plate is provided on the outer side of the first connecting plate, and the front and rear ends of the first conveyor belt assembly are connected to the bottom of the second connecting plate.

[0013] According to some embodiments of the present invention, a silicon wafer frame separation and feeding mechanism includes a first drive motor on a first drive platform, a first synchronous pulley at the output end of the first drive motor, and a first conveyor belt assembly comprising a first base, a second base, a second synchronous pulley, a third synchronous pulley, a fourth synchronous pulley, a first synchronous belt, and a first conveyor belt. The first base and the second base are respectively disposed at the front and rear ends of the separation groove. The second synchronous pulley and the fourth synchronous pulley are rotatably connected to the first base and the second base, respectively. A first rotating shaft is rotatably disposed on the first base. The second synchronous pulley and the third synchronous pulley are both disposed on the first rotating shaft. A second rotating shaft is fixedly disposed on the second base. The fourth synchronous pulley is rotatably disposed on the second rotating shaft. The first synchronous pulley and the second synchronous pulley are connected by a first synchronous belt, and the third synchronous pulley and the fourth synchronous pulley are connected by a first conveyor belt.

[0014] According to some embodiments of the present invention, a silicon wafer frame separation and feeding mechanism includes a second conveyor belt assembly comprising a connecting frame, two fifth synchronous pulleys, and a second conveyor belt. The front and rear ends of the connecting frame are respectively connected to two first telescopic cylinders. The two fifth synchronous pulleys are rotatably disposed at the front and rear ends of the connecting frame. The fifth synchronous pulleys are connected to each other via the second conveyor belt. A second drive motor is disposed at the front end of the connecting frame, and the output end of the second drive motor is connected to the fifth synchronous pulleys.

[0015] According to some embodiments of the present invention, a silicon wafer frame separation and feeding mechanism is provided with two support columns on the top outer side of the side plate.

[0016] According to some embodiments of the present invention, a silicon wafer frame separation and feeding mechanism is provided at the top of the picking arm, and assembly plates are provided on the front and rear sides of the connecting frame. A second telescopic cylinder is provided on the assembly plate, and positioning plates are provided at both ends of the top of the picking plate. Second guide rails are provided on both ends of the assembly plate, and second sliders are provided at the bottom of the positioning plates. The second guide rails and the second sliders are slidably connected one by one.

[0017] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0018] The above and / or additional aspects and advantages of this utility model will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0019] Figure 1 This is a structural schematic diagram of an embodiment of the present utility model.

[0020] Figure 2 This is a schematic diagram of the structure of this utility model with the material handling arm hidden.

[0021] Figure 3 This is a schematic diagram of the structure of this utility model with the material handling arm and separation tank hidden.

[0022] Figure 4 This is a schematic diagram of the material handling arm in an embodiment of the present invention.

[0023] Figure 5 This is a schematic diagram of the material picking plate and material frame according to an embodiment of the present utility model.

[0024] Reference numerals: 1. Separation trough; 2. Material handling arm; 3. First conveyor belt assembly; 4. Second conveyor belt assembly; 5. First telescopic cylinder; 6. Second telescopic cylinder; 7. Material handling plate; 8. First abutment block; 9. Second abutment block; 10. Material frame; 11. Side plate; 12. First roller; 13. Second roller; 14. First through groove; 15. Second through groove; 16. First connecting shaft; 17. Second connecting shaft; 18. First positioning section; 19. Second positioning section; 20. Groove; 21. First drive platform; 22. Second drive platform; 23. First connecting plate; 24. 25. First guide rail, 26. First slider, 27. Second connecting plate, 28. First drive motor, 29. First synchronous pulley, 30. Second base, 31. Second synchronous pulley, 32. Third synchronous pulley, 33. Fourth synchronous pulley, 34. First synchronous belt, 35. First transmission belt, 36. First rotating shaft, 37. Second rotating shaft, 38. Connecting frame, 39. Fifth synchronous pulley, 40. Second transmission belt, 41. Second drive motor, 42. Support column, 43. Connecting frame, 44. Assembly plate, 45. Positioning plate, 46. Second guide rail, 47. Second slider. Detailed Implementation

[0025] The embodiments of this utility model are described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0026] In the description of this utility model, it should be understood that the directional descriptions, such as up, down, left, right, front, and back, are based on the directional or positional relationships shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the module or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0027] In the description of this utility model, the use of "first" and "second" is only for the purpose of distinguishing technical features and should not be construed as indicating or implying relative importance or implicitly indicating the number of technical features or the order of the technical features.

[0028] In the description of this utility model, unless otherwise explicitly defined, terms such as "setting," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this utility model in conjunction with the specific content of the technical solution.

[0029] like Figures 1-5 As shown in the figure, this utility model embodiment provides a silicon wafer frame separation and feeding mechanism.

[0030] A silicon wafer material frame separation and feeding mechanism includes a separation tank 1, a picking arm 2, a first conveyor belt assembly 3, and two second conveyor belt assemblies 4. The first conveyor belt assembly 3 is disposed at the bottom of the separation tank 1. Two first telescopic cylinders 5 are disposed on the front and rear sides of the separation tank 1. The front and rear ends of the second conveyor belt assemblies 4 are respectively connected to the output ends of the two first telescopic cylinders 5. The front and rear ends of the picking arm 2 are each provided with a second telescopic cylinder 6. A picking plate 7 is disposed at the output end of the second telescopic cylinder 6. The bottom sides of the picking plate 7 are each provided with a first abutment block 8, and the middle sides of the picking plate 7 are each provided with a second abutment block 8. Block 9 and material frame 10 include two side plates 11, two first rollers 12 and two second rollers 13. The bottom of the two side plates 11 is provided with two first through grooves 14, and the middle edge of the two side plates 11 is provided with two second through grooves 15. The front and rear ends of the first rollers 12 are provided with first connecting shafts 16, which extend into the first through grooves 14. The front and rear ends of the second rollers 13 are provided with second connecting shafts 17, which extend into the second through grooves 15. The first abutting block 8 is provided corresponding to the first rollers 12, and the second abutting block 9 is provided corresponding to the second rollers 13.

[0031] This invention, through the coordinated operation of a separation groove 1, a material-picking arm 2, and multiple sets of conveyor belt assemblies, can automatically complete the separation and transfer of silicon wafers from the material frame 10, significantly improving production efficiency. The first roller 12 and the second roller 13 provide bottom support and lateral clamping for the silicon wafers. During the material picking process, the first abutment block 8 and the second abutment block 9 on the material picking plate 7 gradually release the limiting force on the silicon wafers, allowing them to smoothly detach from the material frame 10. This avoids slippage, tilting, or breakage caused by forced removal, ensuring the integrity of the silicon wafers. This invention uses a telescopic cylinder to control the position of the conveyor belt assembly, achieving flexible clamping and precise positioning of the silicon wafers, ensuring stable transport even during the removal of the material frame 10. The first conveyor belt assembly 3 and two second conveyor belt assemblies 4 form a multi-point clamping structure, completing stable support of the silicon wafers before the material frame 10 is completely detached, ensuring uninterrupted and continuous feeding, which is beneficial for continuous production.

[0032] The working principle of this utility model is as follows: Multiple silicon wafers are placed inside the material frame 10. During transport by the material handling arm 2, two first rollers 12 support the bottom of the silicon wafers, and two second rollers 13 clamp the silicon wafers from both sides. When the material handling arm 2 places the material frame 10 into the separation tank 1, the first conveyor belt assembly 3 at the bottom of the separation tank 1 extends into the material frame 10, lifting the silicon wafers from the first rollers 12. The material handling plate 7 moves upward, causing the first abutment block 8 to move the first connecting shaft 16 from one end of the first through groove 14 near the center to the other end, i.e., the first rollers 12 move away to both ends of the silicon wafers, no longer interfering with them. The second abutment block 9 of the material handling plate 7 abuts against the second connecting shaft 17, moving the second connecting shaft 17 from one end of the second through groove 15 near the center to the other end. At this time, the silicon wafers are no longer clamped, but the second rollers 13, located on both sides of the silicon wafers, still provide some support. Subsequently, the material picking plate 7 moves the entire material frame 10 upward by abutting against the bottom of the second connecting shaft 17. Before the silicon wafer is removed from the second roller 13, the second conveyor belt assembly 4 clamps the silicon wafer through the first telescopic cylinder 5, and the first conveyor belt assembly 3 clamps and positions the silicon wafer. At this time, the material frame 10 can be completely removed by the material picking arm 2, and the silicon wafer can be transported by the first conveyor belt assembly 3 and the second conveyor belt assembly 4.

[0033] This embodiment describes a silicon wafer frame separation and feeding mechanism. The first through groove 14 includes a first positioning section 18 and a second positioning section 19, which are connected. The horizontal height of the first positioning section 18 near the second positioning section 19 is higher than the horizontal height of the other end, and the horizontal height of the second positioning section 19 near the first positioning section 18 is higher than the horizontal height of the other end. The first abutment block 8 is used to drive the first connecting shaft 16 from the first positioning section 18 to the second positioning section 19. Specifically, the first through groove 14 includes a first positioning section 18 and a second positioning section 19, and the two positioning sections are inclined and connected. This structural design allows the first connecting shaft 16 to slide smoothly from the first positioning section 18 to the second positioning section 19 under the action of the first abutment block 8, thereby realizing automatic adjustment of the position of the first roller 12. This inclined guide structure not only improves the matching accuracy between the material frame 10 and the material picking mechanism, but also effectively avoids jamming or component wear caused by hard pushing, thus improving the stability and service life of the equipment. It is stable and durable because it relies on gravity for positioning.

[0034] This embodiment describes a silicon wafer frame separation and feeding mechanism. The second through-slot 15 is an arc shape with a gradually increasing horizontal height from the inside to the outside. The outer side of the second abutment block 9 is provided with a V-shaped groove. When the second connecting shaft 17 is located at the outermost edge of the second through-slot 15, it is situated within the V-shaped groove. Specifically, when the second connecting shaft 17 moves to the outermost edge of the second through-slot 15, it can accurately embed into the V-shaped groove, achieving precise positioning and stable support. This structure enhances the controllability of the movement of the second roller 13, ensuring that the silicon wafer can still be flexibly supported after the clamping state is released, preventing the silicon wafer from shifting or falling during the process of detaching from the frame 10.

[0035] Understandably, both the first abutting block 8 and the second abutting block 9 are inclined outwards to better push the first roller 12 and the second roller 13 outwards.

[0036] In this embodiment, a silicon wafer frame separation and feeding mechanism is described. Each side plate 11 has a groove 20 at its bottom center. The first conveyor belt assembly 3 is disposed within the groove 20, and the top of the groove 20 is at a higher level than the first through groove 14. Specifically, the first conveyor belt assembly 3 can smoothly extend into the material frame 10 to lift the silicon wafer without affecting its placement. Simultaneously, it avoids interference between the conveyor belt and the first roller 12 when not in operation, improving the space utilization and operational coordination of the equipment, and contributing to a more compact and efficient structural layout.

[0037] This embodiment describes a silicon wafer frame separation and feeding mechanism. The separation tank 1 has a first driving platform 21 and a second driving platform 22 at its front and rear ends, respectively. Four first telescopic cylinders 5 are arranged in pairs on the first driving platform 21 and the second driving platform 22. Specifically, this arrangement achieves symmetrical drive control of the second conveyor belt assembly 4, ensuring uniform force and smooth movement during operation, avoiding uneven loading or vibration, and improving the overall structural stability and response speed of the equipment.

[0038] In this embodiment, a silicon wafer frame separation and feeding mechanism is described. The output end of the first telescopic cylinder 5 is equipped with a first connecting plate 23. The first drive platform 21 and the second drive platform 22 are each equipped with a first guide rail 24 near the center of the separation groove 1. A first slider 25 is provided at the bottom of the first connecting plate 23, and the first slider 25 is slidably connected to the first guide rail 24. A second connecting plate 26 is provided on the outer side of the first connecting plate 23. The front and rear ends of the first conveyor belt assembly 3 are connected to the bottom of the second connecting plate 26. Specifically, the above configuration enhances the guiding accuracy and load-bearing capacity of the transmission system, ensuring that the conveyor belt assembly maintains good straightness and synchronization during lifting and lowering, which is beneficial for improving the repeatability and operational stability of the material picking and feeding actions.

[0039] This embodiment describes a silicon wafer frame separation and feeding mechanism. A first drive motor 27 is mounted on the first drive platform 21. A first synchronous pulley 28 is mounted on the output end of the first drive motor 27. The first conveyor belt assembly 3 includes a first base 29, a second base 30, a second synchronous pulley 31, a third synchronous pulley 32, a fourth synchronous pulley 33, a first synchronous belt 34, and a first conveyor belt 35. The first base 29 and the second base 30 are respectively located at the front and rear ends of the separation groove 1. The second synchronous pulley 31 and the fourth synchronous pulley 33 are respectively connected to... The first base 29 and the second base 30 are rotatably connected. A first rotating shaft 36 is rotatably mounted on the first base 29. The second synchronous pulley 31 and the third synchronous pulley 32 are both mounted on the first rotating shaft 36. A second rotating shaft 37 is fixedly mounted on the second base 30. The fourth synchronous pulley 33 is rotatably mounted on the second rotating shaft 37. The first synchronous pulley 28 and the second synchronous pulley 31 are connected by a first synchronous belt 34, and the third synchronous pulley 32 and the fourth synchronous pulley 33 are connected by a first transmission belt 35. Specifically, the first drive motor 27 drives the combined transmission structure of multiple synchronous pulleys and synchronous belts to achieve efficient and synchronous operation of the first transmission belt assembly 3. This transmission method has the advantages of compact structure, high transmission efficiency, and low noise. It can ensure that the silicon wafers obtain stable driving force during the transmission process, avoid slippage or misalignment, and improve the continuity and stability of the entire feeding process.

[0040] This embodiment describes a silicon wafer frame separation and feeding mechanism. The second conveyor belt assembly 4 includes a connecting frame 38, two fifth synchronous pulleys 39, and a second conveyor belt 40. The front and rear ends of the connecting frame 38 are respectively connected to two first telescopic cylinders 5. The two fifth synchronous pulleys 39 are rotatably mounted at the front and rear ends of the connecting frame 38, respectively. The fifth synchronous pulleys 39 are connected to each other via the second conveyor belt 40. A second drive motor 41 is located at the front end of the connecting frame 38, and the output end of the second drive motor 41 is connected to the fifth synchronous pulleys 39. Specifically, the second conveyor belt assembly 4 adopts a combination structure of the connecting frame 38 and the fifth synchronous pulleys 39, and drives the synchronous belt through the second drive motor 41 to form a clamping and conveying function for silicon wafers. This structure is reasonably designed, easy to maintain, and allows for flexible adjustment of the clamping width according to different sizes of silicon wafers, enhancing the versatility and adaptability of the equipment and achieving fast and accurate transfer of silicon wafers.

[0041] In this embodiment, a silicon wafer frame separation and feeding mechanism is described, wherein two support columns 42 are provided on the top outer side of the side plate 11. It can be understood that the support columns 42 on both top sides of the frame 10 facilitate the positioning of the material handling plate 7 and the handling of the frame 10.

[0042] This embodiment describes a silicon wafer frame separation and feeding mechanism. The top of the picking arm 2 is equipped with a connecting frame 43. Assembly plates 44 are located on both the front and rear sides of the connecting frame 43. A second telescopic cylinder 6 is mounted on the assembly plate 44. Positioning plates 45 are located at both ends of the top of the picking plate 7. Second guide rails 46 are located on both sides of the ends of the assembly plate 44. Second sliders 47 are located at the bottom of each positioning plate 45. The second guide rails 46 and the second sliders 47 are slidably connected. Specifically, the picking arm 2 forms a modular structure with the connecting frame 43 and the assembly plate 44. Positioning plates 45 and second sliders 47 are located on the top of the picking plate 7 and are slidably connected to the second guide rails 46 on the assembly plate 44. This structure achieves precise guidance and stable sliding of the picking plate 7 during lifting, improves the repeatability and positioning accuracy of the picking action, and facilitates disassembly and replacement, enhancing the maintainability and flexibility of the equipment.

[0043] Although embodiments of the present invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A silicon wafer frame separation and feeding mechanism, characterized in that: The system includes a separation tank, a material handling arm, a first conveyor belt assembly, and two second conveyor belt assemblies. The first conveyor belt assembly is located at the bottom of the separation tank. Two first telescopic cylinders are provided on both the front and rear sides of the separation tank. The front and rear ends of the second conveyor belt assemblies are respectively connected to the output ends of the two first telescopic cylinders. The front and rear ends of the material handling arm are provided with second telescopic cylinders. A material handling plate is provided at the output end of the second telescopic cylinder. First abutment blocks are provided on both sides of the bottom of the material handling plate, and second abutment blocks are provided on both sides of the middle of the material handling plate. The material frame includes two side plates, two first rollers, and two second rollers. Two first through slots are provided at the bottom of the two side plates, and two second through slots are provided at the middle edges of the two side plates. First connecting shafts are provided on both the front and rear ends of the first rollers, and the first connecting shafts extend into the first through slots. Second connecting shafts are provided on both the front and rear ends of the second rollers, and the second connecting shafts extend into the second through slots. The first abutment blocks are correspondingly arranged with the first rollers, and the second abutment blocks are correspondingly arranged with the second rollers.

2. The silicon wafer frame separation and feeding mechanism according to claim 1, characterized in that: The first through slot includes a first positioning section and a second positioning section. The first positioning section is connected to the second positioning section. The horizontal height of the first positioning section near the second positioning section is higher than the horizontal height of the other end. The horizontal height of the second positioning section near the first positioning section is higher than the horizontal height of the other end. The first abutment block is used to drive the first connecting shaft to move from the first positioning section to the second positioning section.

3. The silicon wafer frame separation and feeding mechanism according to claim 1, characterized in that: The second through groove is an arc shape with a gradually increasing horizontal height from the inside to the outside. The outer side of the second abutment block is provided with a V-shaped groove. When the second connecting shaft is located at the outermost side of the second through groove, the second connecting shaft is located in the V-shaped groove.

4. The silicon wafer frame separation and feeding mechanism according to claim 1, characterized in that: The bottom center of each side plate has a groove, and the first conveyor belt assembly is disposed in the groove. The top of the groove is at a higher level than the first through groove.

5. The silicon wafer frame separation and feeding mechanism according to claim 1, characterized in that: The front and rear ends of the separation tank are respectively provided with a first drive platform and a second drive platform, and four first telescopic cylinders are arranged in pairs on the first drive platform and the second drive platform.

6. The silicon wafer frame separation and feeding mechanism according to claim 5, characterized in that: The output end of the first telescopic cylinder is provided with a first connecting plate. The first drive platform and the second drive platform are provided with a first guide rail at one end near the middle of the separation groove. The bottom of the first connecting plate is provided with a first slider, which is slidably connected to the first guide rail. The outer side of the first connecting plate is provided with a second connecting plate. The front and rear ends of the first conveyor belt assembly are connected to the bottom of the second connecting plate.

7. The silicon wafer frame separation and feeding mechanism according to claim 5, characterized in that: The first drive platform is equipped with a first drive motor, and the output end of the first drive motor is equipped with a first synchronous pulley. The first conveyor belt assembly includes a first base, a second base, a second synchronous pulley, a third synchronous pulley, a fourth synchronous pulley, a first synchronous belt, and a first conveyor belt. The first base and the second base are respectively located at the front and rear ends of the separation groove. The second synchronous pulley and the fourth synchronous pulley are rotatably connected to the two first bases and the second base, respectively. A first rotating shaft is rotatably mounted on the first base. The second synchronous pulley and the third synchronous pulley are both mounted on the first rotating shaft. A second rotating shaft is fixedly mounted on the second base. The fourth synchronous pulley is rotatably mounted on the second rotating shaft. The first synchronous pulley and the second synchronous pulley are connected by a first synchronous belt, and the third synchronous pulley and the fourth synchronous pulley are connected by a first conveyor belt.

8. The silicon wafer frame separation and feeding mechanism according to claim 1, characterized in that: The second conveyor belt assembly includes a connecting frame, two fifth synchronous pulleys, and a second conveyor belt. The front and rear ends of the connecting frame are respectively connected to two first telescopic cylinders. The two fifth synchronous pulleys are rotatably disposed at the front and rear ends of the connecting frame. The fifth synchronous pulleys are connected to each other by the second conveyor belt. A second drive motor is disposed at the front end of the connecting frame, and the output end of the second drive motor is connected to the fifth synchronous pulleys.

9. The silicon wafer frame separation and feeding mechanism according to claim 1, characterized in that: Two support columns are provided on the top outer side of the side plate.

10. A silicon wafer frame separation and feeding mechanism according to claim 1, characterized in that: The top of the material-retrieving arm is provided with a connecting frame, and the front and rear sides of the connecting frame are provided with assembly plates. The second telescopic cylinder is provided on the assembly plate. The top two ends of the material-retrieving plate are provided with positioning plates. The two ends of the assembly plate are provided with second guide rails. The bottom of the positioning plate is provided with second sliders. The second guide rails and the second sliders are slidably connected one by one.

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