Excitation electrode plate and thin film deposition equipment

Abstract

The utility model relates to an excitation electrode plate and thin film deposition equipment, and the excitation electrode plate comprises a first discharge plate, a second discharge plate and an energy input plate; the first discharge plate and the second discharge plate are arranged on the two sides of the energy input plate respectively; the energy input plate is provided with a plurality of uniformly distributed energy feed-in points; the first discharge plate and the second discharge plate are connected with the energy input plate through energy feed-in points. The problem of non-uniform CCP deposition caused by an electromagnetic wave standing wave effect and an electromagnetic field edge effect can be reduced, meanwhile, multiple films can be generated at a time, and the production efficiency is improved.

Description

Technical Field

[0001] This application relates to the field of photovoltaic manufacturing technology, and in particular to an excitation electrode plate and a thin film deposition device. Background Technology

[0002] Plasma-enhanced chemical vapor deposition (PECVD) is a method for preparing thin films of semiconductor materials and other materials (such as photovoltaic materials) by chemically depositing them on a substrate through glow discharge ionization in a deposition chamber. Specifically, in the processing of semiconductor or photovoltaic materials, PECVD typically uses capacitively coupled plasma (CCP) generated by parallel electrode plates with capacitive coupling.

[0003] In traditional PECVD equipment, when the wavelength of the electromagnetic wave from the excitation power source of the CCP in vacuum is approximately 1 / 10 of the size of the discharge electrode plate (also known as the "ground electrode plate"), significant electromagnetic standing wave effects and electromagnetic field edge effects occur. This leads to uneven electric field distribution or potential difference distribution between the parallel electrode plates, resulting in uneven CCP deposition and affecting film quality. Furthermore, in traditional PECVD equipment, typically one electrode plate of the parallel electrode plates serves as the discharge electrode plate, while the other serves as the energy input plate. Therefore, film growth can only occur on the discharge electrode plate, resulting in low production efficiency. Utility Model Content

[0004] In view of the above, it is necessary to provide an excitation electrode plate and a thin film deposition equipment that can reduce the problem of uneven CCP deposition caused by electromagnetic wave standing wave effect and electromagnetic field edge effect, and at the same time, can generate multiple thin films at one time, thereby improving production efficiency.

[0005] This application provides an excitation electrode plate, including a first discharge plate, a second discharge plate, and an energy input plate; the first discharge plate and the second discharge plate are respectively disposed on both sides of the energy input plate; the energy input plate is provided with a plurality of uniformly distributed energy feed points; the first discharge plate and the second discharge plate are both connected to the energy input plate through the energy feed points.

[0006] In the excitation electrode plate of this application, after the energy input plate is connected to the high-frequency excitation power supply, the electromagnetic wave energy introduced from the excitation power supply is transmitted to the first discharge plate and the second discharge plate disposed on both sides of the energy input plate through multiple uniformly distributed energy feed points. A standing wave is formed on the opposite side of the midpoint of the line connecting two adjacent energy feed points. That is, a standing wave is formed on the opposite side of the midpoint of the line connecting feed points with the same characteristic position. This balances the edge effect electric field and controls the position of the standing wave, making the overall electric field distribution on the CCP excitation electrode plate more uniform. This reduces the problem of uneven CCP deposition caused by electromagnetic wave standing wave effects and electromagnetic field edge effects. Furthermore, the first discharge plate and the second discharge plate are respectively disposed on both sides of the energy input plate. Therefore, when the excitation electrode plate is connected to the high-frequency excitation power supply, both the first discharge plate and the second discharge plate can deposit CCP to form a thin film. That is, the excitation electrode plate of this application can simultaneously generate multiple thin films, thereby improving production efficiency.

[0007] In some embodiments, the excitation electrode plate is in the shape of a longitudinal plate, and the first discharge plate and the second discharge plate are formed with a plurality of uniformly arranged hollow holes along the length direction. At least one energy feed point is connected to the first discharge plate, and / or, at least one of the energy feed points is connected to the second discharge plate between two hollow holes.

[0008] In some embodiments, the number of perforations increases as the length of the excitation electrode plate increases.

[0009] In some embodiments, a plurality of substrates are disposed on the side of the first discharge plate away from the energy input plate, the substrates corresponding to the positions of the cutout holes and at least partially covering the cutout holes; and / or, a plurality of substrates are disposed on the side of the second discharge plate away from the energy input plate, the substrates corresponding to the positions of the cutout holes and at least partially covering the cutout holes.

[0010] In some embodiments, an insulating material is disposed within the perforated hole; wherein the insulating material includes one of ceramic, plastic or glass.

[0011] In some embodiments, a plurality of insulating edging layers are provided on the outer side of the first discharge plate and / or the second discharge plate; wherein the material of the insulating edging layer includes one of ceramic, plastic or glass.

[0012] In some embodiments, an electrical connection block is formed on the side of the energy input board, the energy feed point is electrically connected to the electrical connection block, and the electrical connection block is used to electrically connect to the excitation power supply.

[0013] In some embodiments, an insulating material is provided between the first discharge plate and the energy input plate; and / or, an insulating material is provided between the second discharge plate and the energy input plate; wherein the insulating material includes one of ceramic, plastic or glass.

[0014] In some embodiments, multiple excitation electrode plates are electrically connected to an excitation power supply, and the multiple excitation electrode plates are isolated from each other by an insulating material; wherein the insulating material includes one of ceramic, plastic or glass.

[0015] This application also provides a thin film deposition apparatus having a process chamber in which an excitation electrode plate as described in any of the above embodiments of this application is installed. Attached Figure Description

[0016] Figure 1 This is a side view of the excitation electrode plate according to an embodiment of this application.

[0017] Figure 2 This application Figure 1 A front view of the first discharge plate in the embodiment.

[0018] Figure 3 This is a front view of the first discharge plate according to another embodiment of this application.

[0019] Figure 4 This application Figure 1 A front view of the energy input panel in the embodiment.

[0020] Figure 5 This is a simplified circuit diagram showing the electrical connection between the excitation electrode plate and the excitation power supply in an embodiment of this application.

[0021] Figure 6 This is a schematic diagram of the structure of the excitation electrode plate according to another embodiment of this application.

[0022] Figure 7 This is a schematic diagram of the structure of yet another embodiment of the present application.

[0023] Figure 8 This is a schematic diagram of the structure of the excitation electrode assembly according to an embodiment of this application.

[0024] Explanation of key component symbols:

[0025] 1. Excitation electrode plate; 2. Excitation power supply; 11. First discharge plate; 12. Energy input plate; 13. Second discharge plate; 111. Insulating edging layer; 112. Hole; 113. Substrate; 121. Energy feed point; 122. Electrical connection block; 100. Excitation electrode assembly.

[0026] The following detailed description, in conjunction with the accompanying drawings, will further illustrate this application. Detailed Implementation

[0027] In the description of the embodiments in this application, the words "exemplary," "or," and "for example" are used to indicate examples, illustrations, or descriptions. Any embodiment or design scheme described as "exemplary" or "for example" in the embodiments of this application should not be construed as being more preferred or advantageous than other embodiments or design schemes. Specifically, the use of the words "exemplary," "or," and "for example" is intended to present the relevant concepts in a specific manner.

[0028] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in this application's specification is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. "At least one" means one or more. "More than one" means two or more. For example, at least one of a, b, or c can represent seven cases: a, b, c, a and b, a and c, b and c, and a, b, and c.

[0029] It should also be noted that the terms "first" and "second" in the specification, claims and drawings of this application are used to distinguish similar objects, rather than to describe a specific order or sequence.

[0030] Semiconductor and photovoltaic materials are widely used in industries such as electronics and new energy. Semiconductor and photovoltaic materials typically require chemical processing for fabrication, and chemical vapor deposition (CVD) is one such method. Currently, common CVD equipment includes PECVD (Plasma Enhanced Chemical Vapor Deposition), LPCVD (Low Pressure Chemical Vapor Deposition), and APCVD (Atmospheric Pressure Chemical Vapor Deposition). The appropriate equipment can be selected based on specific processing requirements. In the processing of semiconductor or photovoltaic materials, sheet-like materials are usually fed into a reactor and reacted under specific temperature and pressure conditions. PECVD, however, uses capacitively coupled plasma (CCP) generated by parallel electrode plates to achieve chemical reaction deposition.

[0031] PECVD (Peak-to-Concentrate Continuous Electrochemical Deposition) is a method for preparing thin films of semiconductor materials and other materials (such as photovoltaic materials) by chemically depositing them on a substrate using glow discharge in a deposition chamber. Specifically, in the processing of semiconductor or photovoltaic materials, PECVD typically uses parallel electrode plates or boat-type capacitive coupling to generate capacitively coupled plasma (CCP). In traditional PECVD equipment, when the wavelength of the electromagnetic wave from the excitation power source in vacuum is approximately 1 / 10 of the size of the discharge electrode plate, significant electromagnetic standing wave effects and electromagnetic field edge effects occur. This leads to uneven electric field distribution or potential difference distribution between the parallel electrode plates, resulting in uneven CCP deposition and affecting film quality.

[0032] Furthermore, in traditional PECVD equipment, one of the parallel electrode plates is usually used as the discharge electrode plate, while the other electrode plate is used as the energy input plate. Therefore, thin films can only be grown on the discharge electrode plate, resulting in low production efficiency.

[0033] Furthermore, when the size of the electrode plate or boat increases significantly, it becomes difficult to achieve a uniform energy distribution across the entire large-size energy input electrode plate or boat using a single-point feed method connected to the high-frequency excitation power supply. This leads to a more uneven electric field distribution or potential difference distribution between parallel electrode plates in large-size applications, which in turn causes uneven CCP deposition and affects film quality. Specifically, assuming a single standing wave is at the very center of the electrode plate or boat, the center is where the antinode of the electromagnetic wave is located, where the electric field strength or voltage is highest. As the wave propagates further away from this standing wave point, the electric field strength or potential gradually decreases. When this distance reaches 1 / 4 or 1 / 10 of the wavelength in the CCP plasma, it reaches the node of the electromagnetic wave, which is where the electric field or potential is zero. Even if the distance from the standing wave point is close to the node, the electric field or potential between the parallel CCP electrode plates will be significantly reduced relative to the standing wave point or antinode, resulting in uneven plasma density and energy distribution excited by the electric field, and uneven deposition or processing of the substrate surface.

[0034] Therefore, this application provides an excitation electrode plate and a thin film deposition apparatus, which can reduce the problem of uneven CCP deposition caused by electromagnetic wave standing wave effect and electromagnetic field edge effect, and can generate multiple thin films at once, improving production efficiency. Some embodiments will be described below with reference to the accompanying drawings. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0035] Figure 1 This is a side view of the excitation electrode plate 1 according to an embodiment of this application. Figure 2 This application Figure 1 A front view of the first discharge plate 11 in the embodiment.

[0036] Please see Figure 1 This application provides an excitation electrode plate 1, which may include a first discharge plate 11, a second discharge plate 13, and an energy input plate 12. The first discharge plate 11 and the second discharge plate 13 are both used to receive electrons and perform ground discharge. The energy input plate 12 is used to connect to a high-frequency excitation power supply 2 and feed high-frequency electrical energy from the excitation power supply 2 (see subsequent embodiments). Figure 5 or Figure 8 In the embodiment, the first discharge plate 11 and the second discharge plate 13 are respectively disposed on both sides of the energy input plate 12. The energy input plate 12 is provided with energy feed points 121. There are multiple energy feed points 121 and they are evenly distributed on the energy input plate 12. The first discharge plate 11 and the second discharge plate 13 are both connected to the energy input plate 12 through the energy feed points 121.

[0037] In the embodiments of this application, the structures of the first discharge plate 11 and the second discharge plate 13 can be the same. Therefore, the following embodiments of this application only show the structure of the first discharge plate 11. The structure of the second discharge plate 13 can be completely referred to the structure of the first discharge plate 11, and will not be described again below.

[0038] In the excitation electrode of this embodiment, after the energy input plate 12 is connected to the high-frequency excitation power supply 2, the electromagnetic wave energy introduced from the excitation power supply 2 is transmitted to the first discharge plate 11 and the second discharge plate 13 disposed on both sides of the energy input plate 12 through multiple uniformly distributed energy feed points 121. A standing wave is formed at the opposite position of the midpoint of the connecting line between two adjacent energy feed points 121. For example, please refer to... Figure 2 Energy feed points 121a and 121b, 121a and 121c, 121b and 121d, and 121c and 121d. That is, feed points with the same characteristic position will form a standing wave on the opposite side of the midpoint of the line connecting them. Therefore, the energy of the RF or high-frequency excitation power supply 2 can be evenly distributed between the parallel electrode plates formed by the first discharge plate 11 and the energy input plate 12 or the second discharge plate 13 and the energy input plate 12. This balances the edge effect electric field and controls the standing wave position, making the overall electric field distribution on the CCP excitation electrode plate 1 more uniform. This reduces the problem of uneven plasma discharge and deposition caused by electromagnetic wave standing wave effects and electromagnetic field edge effects.

[0039] In addition, a first discharge plate 11 and a second discharge plate 13 are respectively provided on both sides of the energy input plate 12. Therefore, when the excitation electrode plate 1 is connected to the high-frequency excitation power supply 2, both the first discharge plate 11 and the second discharge plate 13 can deposit CCP to form a thin film. That is, the excitation electrode plate 1 of this application can generate multiple thin films at the same time, thereby improving production efficiency.

[0040] In some embodiments, the distance between the first discharge plate 11 and the energy input plate 12 may be less than a preset value, and the distance between the second discharge plate 13 and the energy input plate 12 may also be less than a preset value. The preset value is defined as the sheath thickness of the capacitively coupled plasma excited by the excitation power supply 2, where the sheath thickness is the thickness of the space charge layer formed at the interface between the capacitively coupled plasma and the first discharge plate 11 or the second discharge plate 13. In this case, the distance between the first discharge plate 11 and the energy input plate 12 is maintained within the sheath thickness of the capacitively coupled plasma, and the distance between the second discharge plate 13 and the energy input plate 12 is also maintained within the sheath thickness of the capacitively coupled plasma. This can reduce the problem of uneven discharge caused by parasitic discharge between the first discharge plate 11 and the energy input plate 12 or between the second discharge plate 13 and the energy input plate 12.

[0041] In some embodiments, the first discharge plate 11, the second discharge plate 13, and the energy input plate 12 may be boats used in the processing of semiconductor or photovoltaic materials. For example, the first discharge plate 11, the second discharge plate 13, and the energy input plate 12 may be graphite boats or quartz boats.

[0042] In some embodiments, the dimensions of the first discharge plate 11, the second discharge plate 13, and the energy input plate 12 can be approximately the same. For example, the first discharge plate 11, the second discharge plate 13, and the energy input plate 12 can all be disc-shaped or cube-shaped, and the size of the disc or the cube can be the same. In other embodiments, since the energy input plate 12 is mainly used for energy feeding, the shape and size of the energy input plate 12 can be different from the first discharge plate 11 or the second discharge plate 13. For example, the first discharge plate 11 or the second discharge plate 13 can be provided with a perforated hole 112, while the energy input plate 12 may not be provided with a perforated hole 112.

[0043] In some embodiments, the number of energy feed points 121 can be even. In this case, the even number of energy feed points 121 can be evenly distributed on the energy input plate 12 of various shapes, thereby achieving a uniform distribution of the fed energy.

[0044] In other embodiments, the number of energy feed points 121 can be odd. For example, on a disc-shaped energy input plate 12, one energy feed point 121 can be set at the center position, and an even number of energy feed points 121 can be evenly set at the outer circumferential position, thereby achieving a uniform distribution of the fed energy; or, for example, an odd number of energy feed points 121 can be evenly set according to parameters such as length and width. For example, if there are 9 energy feed points 121, the 9 energy feed points 121 can be arranged in a 3*3 array.

[0045] Figure 3 This is a front view of the first discharge plate 11 according to another embodiment of this application. Figure 4 This application Figure 1 A front view of the energy input panel 12 in the embodiment. Figure 5 This is a simplified circuit diagram showing the electrical connection between the excitation electrode plate 1 and the excitation power supply 2 in an embodiment of this application.

[0046] Please see Figure 3 In some embodiments, multiple insulating edging layers 111 may be provided on the outer sides of both the first discharge plate 11 and the second discharge plate 13. The insulating edging layers 111 may be made of a material selected from ceramic, plastic, or glass. In this case, the electrical insulation of the outer sides of the first discharge plate 11 and the second discharge plate 13 can be improved, thereby enhancing the discharge accuracy of the first discharge plate 11 or the second discharge plate 13.

[0047] Please see Figure 4 In some embodiments, an electrical connection block 122 may be formed on the side of the energy input plate 12, and the energy feed point 121 may be electrically connected to the electrical connection block 122, which is used to electrically connect to the excitation power supply 2. In this case, the energy of the excitation power supply 2 can be input into the energy input plate 12, and then input to the first discharge plate 11 or the second discharge plate 13 through the energy feed point 121 to form a coupling capacitor. This allows the activity of the chemical vapor phase reactants to be enhanced through plasma activation, thereby increasing the surface reaction rate to form a thin film.

[0048] Please see Figure 5 In some embodiments, multiple energy feed points 121 of the same energy input board 12 can be electrically connected to the same excitation power supply 2. This can improve the consistency of energy feed.

[0049] In some embodiments, an insulating material may be provided between the first discharge plate 11 and the energy input plate 12, and an insulating material may also be provided between the second discharge plate 13 and the energy input plate 12. The insulating material includes one of ceramic, plastic, or glass. In this case, the first discharge plate 11 and the energy input plate 12, and the second discharge plate 13 and the energy input plate 12, can be mutually isolated and insulated, thereby improving the accuracy of energy input at the energy feed point 121.

[0050] Figure 6 This is a schematic diagram of the structure of the excitation electrode plate 1 according to another embodiment of this application.

[0051] Please see Figure 6 In the embodiments of this application, the excitation electrode plate 1 can be in the shape of a longitudinally elongated plate, and multiple longitudinally elongated excitation electrode plates 1 can be combined to form an excitation electrode assembly 100 plate.

[0052] In the embodiments of this application, please refer to Figure 6 The first discharge plate 11 and the second discharge plate 13 can be formed with perforated holes 112. Specifically, the first discharge plate 11 and the second discharge plate 13 can be formed with a plurality of uniformly arranged perforated holes 112 along the length direction. The connection point between the energy feed point 121 and the first discharge plate 11 or the second discharge plate 13 can be located between two perforated holes 112. In this case, after the size of the excitation electrode plate 1 is significantly increased in the length direction, the first discharge plate 11 and the second discharge plate 13 are divided into a plurality of small-sized discharge units by the perforated holes 112 that are uniformly distributed in the length direction. These small discharge units can still be connected to each other at the edges. For each small-sized discharge unit, an independent standing wave can be formed on the outer surface of its reverse side through the back side of the corresponding uniformly distributed energy feed point 121 at the center position. By balancing the edge effect electric field and controlling the position of the standing wave, the overall electric field distribution on the excitation electrode plate 1 of the CCP is made more uniform, thereby reducing the problem of uneven deposition.

[0053] Please see Figure 6 In some embodiments, the number of connection points between the energy feed point 121 located between the two perforations 112 and the first discharge plate 11, and / or the number of connection points between the energy feed point 121 located between the two perforations 112 and the second discharge plate 13, is at least one. In this embodiment, the problem of uneven deposition caused by uneven plasma discharge due to electromagnetic wave standing wave effect and electromagnetic field edge effect can be reduced by forming perforations 112 on the first discharge plate 11 and the second discharge plate 13. In other words, in this case, regardless of whether the number of energy feed points 121 is odd or even, the problem of uneven deposition can be reduced by combining the above-mentioned perforations 112.

[0054] In some embodiments, the number of perforations 112 increases with the length of the excitation electrode plate 1. In other embodiments, the number of perforations 112 can also be determined based on the standing wave characteristics formed on the excitation electrode plate 1 by the excitation power supply 2.

[0055] In some embodiments, the perforation 112 extends along the width direction of the excitation electrode plate 1. In other embodiments, the shape of the perforation 112 can also be determined according to the shape of the excitation electrode plate 1 and the standing wave characteristics formed on the excitation electrode plate 1 by the excitation power supply 2. In this case, the perforation 112 can adapt to the shape of the excitation electrode plate 1 and the standing wave characteristics formed on the excitation electrode plate 1 by the excitation power supply 2, thereby enabling precise balancing of the edge effect electric field and control of the standing wave position to make the overall electric field distribution on the excitation electrode plate 1 of the CCP more uniform, thereby reducing the problem of uneven deposition.

[0056] Figure 7 This is a schematic diagram of the structure of yet another embodiment of the present application.

[0057] Please see Figure 7 In some embodiments, a plurality of substrates 113 may be provided on the side of the first discharge plate 11 away from the energy input plate 12, and the substrates 113 may correspond to the position of the cutout hole 112 and at least partially cover the cutout hole 112.

[0058] In some embodiments, referring to the first discharge plate 11, the second discharge plate 13 also has a plurality of substrates 113 on the side away from the energy input plate 12, the substrates 113 corresponding to the position of the cutout hole 112 and at least partially covering the cutout hole 112.

[0059] In some embodiments, the substrate 113 may be a substrate made of silicon wafer material. In other embodiments, the substrate 113 may also be made of quartz or polymer material.

[0060] Specifically, for example, the substrate 113 can cover most or all of the area of ​​the perforated hole 112 on the first discharge plate 11 and the second discharge plate 13, thereby reducing the problems of increased maintenance work and discharge instability caused by the parasitic deposition of capacitively coupled plasma through the perforated hole 112 on the surface of the energy input plate 12.

[0061] In some embodiments, a substrate 113 can cover multiple perforated holes 112, for example, a substrate 113 can cover two perforated holes 112. This can increase the coverage of the perforated holes 112, thereby improving production efficiency. In addition, since there is an energy feed point 121 between two perforated holes 112, the energy feed point 121 covered by the substrate 113 can be set to not input energy or set to be used for energy feed of another discharge plate. For example, the energy feed point 121e covered by the substrate 113 can be used for energy feed of the second discharge plate 13, while the energy feed point 121f not covered by the substrate 113 can be used for energy feed of the first discharge plate 11.

[0062] In some embodiments, an insulating material may be disposed within the perforated hole 112. This insulating material includes one of ceramic, plastic, or glass. In this case, the electrical insulation at the perforated hole 112 can be improved, thereby enhancing the discharge accuracy of the first discharge plate 11 or the second discharge plate 13.

[0063] Figure 8 This is a schematic diagram of the structure of the excitation electrode assembly 100 according to an embodiment of this application.

[0064] In some embodiments, multiple excitation electrode plates 1 can be electrically connected to the excitation power supply 2, and the multiple excitation electrode plates 1 are isolated from each other by an insulating material. The insulating material includes one of ceramic, plastic, or glass. In this case, please refer to... Figure 8 Multiple excitation electrode plates 1 can form a large-sized excitation electrode assembly 100, and the multiple excitation electrode plates 1 are insulated from each other, allowing for the generation of large-sized thin films in a single operation, thereby improving production efficiency. In addition, multiple excitation electrode plates 1 can be electrically connected to the excitation power supply 2, and when energy is fed into the excitation power supply 2, the uniformity and consistency of the energy distribution of the entire excitation electrode assembly 100 can be maintained, thereby improving the quality of the generated film.

[0065] This application also provides a thin film deposition apparatus having a process chamber in which an excitation electrode plate as described in any of the above embodiments of this application is installed.

[0066] In summary, the excitation electrode plate 1 and thin film deposition equipment of this application embodiment can reduce the problem of uneven CCP deposition caused by electromagnetic wave standing wave effect and electromagnetic field edge effect, and can generate multiple thin films at one time, thereby improving production efficiency.

[0067] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application and are not intended to limit it. Although this application has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of this application without departing from the spirit and scope of the technical solutions of this application.

Claims

1. An excitation electrode plate, characterized in that, It includes a first discharge plate, a second discharge plate, and an energy input plate; the first discharge plate and the second discharge plate are respectively disposed on both sides of the energy input plate; the energy input plate is provided with a plurality of evenly distributed energy feed points; the first discharge plate and the second discharge plate are both connected to the energy input plate through the energy feed points.

2. The excitation electrode plate according to claim 1, characterized in that, The excitation electrode plate is in the shape of a longitudinal plate. The first discharge plate and the second discharge plate have a plurality of uniformly arranged hollow holes along the length direction. At least one of the energy feed points is connected to the first discharge plate, and / or at least one of the energy feed points is connected to the second discharge plate between two of the hollow holes.

3. The excitation electrode plate according to claim 2, characterized in that, The number of perforations increases as the length of the excitation electrode plate increases.

4. The excitation electrode plate according to claim 2, characterized in that, The first discharge plate has a plurality of substrates disposed on the side away from the energy input plate, the substrates corresponding to the positions of the cutout holes and at least partially covering the cutout holes; and / or, The second discharge plate has a plurality of substrates disposed on the side away from the energy input plate, the substrates corresponding to the position of the cutout hole and at least partially covering the cutout hole.

5. The excitation electrode plate according to claim 2, characterized in that, An insulating material is provided inside the perforated hole; wherein the insulating material includes one of ceramic, plastic or glass.

6. The excitation electrode plate according to claim 1, characterized in that, The first discharge plate and / or the second discharge plate are provided with a plurality of insulating edging layers on their periphery; wherein the material of the insulating edging layers includes one of ceramic, plastic or glass.

7. The excitation electrode plate according to claim 1, characterized in that, An electrical connection block is formed on the side of the energy input plate, the energy feed point is electrically connected to the electrical connection block, and the electrical connection block is used to electrically connect to the excitation power supply.

8. The excitation electrode plate according to claim 1, characterized in that, An insulating material is disposed between the first discharge plate and the energy input plate; and / or, An insulating material is provided between the second discharge plate and the energy input plate; The insulating material includes one of ceramics, plastics, or glass.

9. The excitation electrode plate according to claim 7, characterized in that, The plurality of excitation electrode plates are electrically connected to the excitation power supply, and the plurality of excitation electrode plates are isolated from each other by an insulating material; wherein, the insulating material includes one of ceramic, plastic or glass.

10. A thin film deposition apparatus, characterized in that, The thin film deposition apparatus has a process chamber in which the excitation electrode plate as described in any one of claims 1-9 is installed.

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