Light source assembly, laser, projection module and electronic equipment

Abstract

The utility model relates to the technical field of optical measurement, in particular to a light source assembly, a laser, a projection module and electronic equipment. The light source assembly comprises a heat dissipation shell and a laser light source, the heat dissipation shell is constructed to form a containing cavity to install the laser light source, and a light transmitting hole is formed in the heat dissipation shell and is opposite to a light transmitting cover plate of the laser light source, so that laser rays are emitted out; a threading hole is further formed in the heat dissipation shell so that a pin of the laser light source can penetrate out of the threading hole. The protective cover of which the heat dissipation shell partially covers the laser light source is arranged on the end face of the light-transmitting cover plate, so that other positions of the laser light source except the light-transmitting cover plate and the pins are all covered by the heat dissipation shell, the area of the contact surface of the heat dissipation shell and the laser light source is increased, the heat dissipation performance of the laser light source is improved, the temperature of the laser light source is reduced, and the service life of the laser light source is prolonged. The light power consumption intensity of the laser light source is improved, and the test precision of a camera using the light source assembly is improved.

Description

Technical Field

[0001] This disclosure relates to the field of optical measurement technology, and in particular to a light source assembly, a laser, a projection module, and an electronic device. Background Technology

[0002] A structured light camera is a depth sensing device based on active optical projection and 3D imaging technology. Its core principle is to project a specific light pattern onto the surface of a target object, then capture the deformed pattern using a camera, and finally calculate the object's 3D shape using algorithms. Due to its advantages such as high precision, non-contact operation, and high measurement efficiency, it has become an important method for 3D measurement.

[0003] In related technologies, the optical power of the laser diode light source (LD light source) of the structured light camera decreases as the temperature rises, affecting the test accuracy. Utility Model Content

[0004] This disclosure provides a light source assembly, a laser, a projection module, and an electronic device to improve the heat dissipation effect of a laser diode light source.

[0005] To achieve the above objectives, the present disclosure adopts the following technical solution:

[0006] A first aspect of this disclosure provides a light source assembly, which includes: a laser light source and a heat sink, the heat sink being configured to form a receiving cavity;

[0007] The heat dissipation shell is provided with a light-transmitting hole and a wire-passing hole that are respectively connected to the receiving cavity;

[0008] The laser source is installed inside the receiving cavity, and the pins of the laser source extend out of the receiving cavity through the wire hole; the protective cover of the laser source has a light-transmitting cover plate at the end opposite to the pins, and the light-transmitting cover plate and the light-transmitting hole are opposite to the axis of the laser source.

[0009] The heat dissipation shell partially covers the end face of the protective cover where the light-transmitting cover plate is located.

[0010] Compared with the prior art, the light source assembly provided by the first aspect of this disclosure has the following advantages:

[0011] The light source assembly disclosed herein includes a heat sink and a laser light source. The heat sink is constructed to form a cavity for housing the laser light source, and a light-transmitting hole is provided on the heat sink, which faces the light-transmitting cover plate of the laser light source, allowing the laser line to be emitted. A wire-passing hole is also provided on the heat sink, allowing the pins of the laser light source to pass through. The heat sink partially covers the end face of the light-transmitting cover plate of the protective shield of the laser light source, ensuring that all parts of the laser light source except for the light-transmitting cover plate and the pins are covered by the heat sink. This increases the contact area between the heat sink and the laser light source, thereby improving the heat dissipation performance of the laser light source, reducing its temperature, and increasing its light power consumption intensity, ultimately improving the testing accuracy of cameras using this light source assembly.

[0012] As an improvement to the light source assembly described above, the heat dissipation shell includes a first shell and a second shell, which are fixedly connected and enclose the receiving cavity.

[0013] The first housing is provided with the light-transmitting hole, and the second housing is provided with the wire-passing hole;

[0014] A heat-conducting layer is provided between at least one of the first housing and the second housing and the laser light source.

[0015] As an improvement to the light source assembly described above, the first housing is configured to form a first receiving groove, and the bottom wall of the first receiving groove is configured to form the light-transmitting hole; the bottom wall of the first receiving groove abuts against the end face of the protective cover where the light-transmitting cover plate is provided; the side wall of the first receiving groove contacts the side of the protective cover, and the end of the first housing away from the light-transmitting hole abuts against the substrate of the laser light source.

[0016] As an improvement to the light source assembly described above in this disclosure, the first housing and the second housing are threadedly connected.

[0017] As an improvement to the light source assembly described above in this disclosure, the first housing and the second housing are fixedly connected by a first fastener.

[0018] As an improvement to the light source assembly described above, the second housing is configured to form a mounting groove, the sidewall of the mounting groove being configured to form a connecting thread that is threadedly connected to the first housing; the bottom wall of the mounting groove is configured to form the wire hole.

[0019] The outer end face of the first housing does not protrude from the opening end of the mounting groove, and the outer end face of the first housing is configured to form a mounting operation hole.

[0020] A second aspect of this disclosure provides a laser comprising: a carrier and a light source assembly as described in the first aspect; the light source assembly is fixedly connected to the carrier; a collimating lens is disposed within the carrier and is located on the light emission side of the light source assembly.

[0021] The laser provided in the second aspect of this disclosure, since it includes the light source assembly described in the first aspect, also has the same advantages as the light source assembly described in the first aspect.

[0022] As an improvement to the light source assembly described above, the support base and the first housing of the light source assembly are integrally formed as a single piece.

[0023] As an improvement to the light source assembly described above, the support base is cylindrical.

[0024] A third aspect of this disclosure provides a projection module comprising: a galvanometer mounting base, a second fastener, and a laser as described in the second aspect, wherein the galvanometer mounting base has a mounting hole and the laser is mounted in the mounting hole;

[0025] The laser is configured to be rotatable relative to the mounting hole to adjust the perpendicularity of the laser line; and after adjusting the perpendicularity of the laser line, the second fastener securely connects the laser and the galvanometer mount.

[0026] The projection module provided in the third aspect of this disclosure, since it includes the laser described in the second aspect, also has the same advantages as the laser described in the second aspect.

[0027] A fourth aspect of this disclosure provides an electronic device comprising: a lens and a projection module as described in the third aspect, the lens being configured to acquire light projected by the projection module onto a target; or...

[0028] Includes: a lens and the laser described in the second aspect, the lens being configured to acquire light projected by the laser onto the target; or,

[0029] It includes: a lens, a collimating lens, and the light source assembly described in the first aspect, wherein the laser emitted by the light source assembly is directed toward the target body after passing through the collimating lens; the lens is configured to acquire the laser light on the target body.

[0030] The electronic device provided by the fourth aspect of this disclosure, since it includes the light source assembly described in the first aspect, also has the same advantages as the light source assembly described in the first aspect. Attached Figure Description

[0031] To more clearly illustrate the technical solutions in the embodiments of this disclosure or the prior art, the accompanying drawings used in the description of the embodiments of this disclosure or the prior art will be briefly introduced below. Obviously, the accompanying drawings described below are only a part of the embodiments of this disclosure. These drawings and text descriptions are not intended to limit the scope of the concept of this disclosure in any way, but to illustrate the concept of this disclosure to those skilled in the art by referring to specific embodiments. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0032] Figure 1 This is a schematic diagram of the structure of the light source assembly provided in the embodiments of this disclosure;

[0033] Figure 2 A schematic diagram of the end face of the light source assembly provided in an embodiment of this disclosure;

[0034] Figure 3 for Figure 2 AA section view in the middle;

[0035] Figure 4 An exploded cross-sectional view of a light source assembly provided in an embodiment of this disclosure;

[0036] Figure 5 A schematic diagram of the structure of a laser provided in an embodiment of this disclosure;

[0037] Figure 6 A left view of a laser provided in an embodiment of this disclosure;

[0038] Figure 7 for Figure 6 BB section view in the middle;

[0039] Figure 8 This is a schematic diagram of the projection module provided in an embodiment of the present disclosure;

[0040] Figure 9 A left view of the projection module provided in an embodiment of this disclosure;

[0041] Figure 10 for Figure 9 CC section view in the middle;

[0042] Figure 11 This is a schematic diagram of the structure of a laser provided in another embodiment of the present disclosure;

[0043] Figure 12 A left view of a laser provided in another embodiment of this disclosure;

[0044] Figure 13 for Figure 12 DD section view in the image.

[0045] Explanation of reference numerals in the attached figures:

[0046] 100: Light source assembly; 110: Heat sink; 111: Receiving cavity; 112: First housing; 1121: Light-transmitting hole; 1122: First receiving groove; 1123: Mounting operation hole; 113: Second housing; 1131: Wiring hole; 1132: Second receiving groove; 1133: Mounting groove; 1134: Flange; 1135: Positioning part; 120: Laser light source; 121: Protective cover; 122: Substrate; 123: Light-transmitting cover plate; 124: Pin;

[0047] 200: Support; 210: Collimating lens; 220: Prism; 230: Fourth fastener; 240: Positioning notch;

[0048] 300: Galvanometer mount; 301: Mounting hole;

[0049] 400: Circuit board. Detailed Implementation

[0050] Embodiments of this disclosure are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this disclosure, and should not be construed as limiting this disclosure.

[0051] Combination Figures 1 to 3 This disclosure provides a light source assembly 100, which includes a laser light source 120 and a heat sink 110. The laser light source 120 is capable of emitting laser light, and the heat sink 110 is disposed on the outside of the laser light source 120 to protect the laser light source 120 and improve the heat dissipation performance of the laser light source 120.

[0052] Reference Figure 4 In some embodiments of this disclosure, the laser source 120 may include a laser chip, a substrate 122, a protective cover 121, and a light-transmitting cover 123. The laser chip is made of semiconductor material and formed on the substrate 122. The protective cover 121 is disposed on the substrate 122 and serves to protect the laser chip, electrodes, etc. A through-hole is provided at the end of the protective cover 121 facing away from the substrate 122 to allow laser light to escape. The light-transmitting cover 123 is fixed to the protective cover 121 and seals the through-hole, providing both light transmission and protection.

[0053] like Figure 4As shown, in some implementations, the protective cover 121 includes a side wall portion and an end wall portion. One end of the side wall portion is connected to the substrate 122, and the other end of the side wall portion is connected to the end wall portion. The end wall portion can be arranged parallel to the substrate 122. The end wall portion is provided with a through hole and is connected to the light-transmitting cover plate 123.

[0054] The substrate 122 has pins 124 on the side opposite to the protective cover 121 to supply power to the laser chip.

[0055] Combination Figure 2 and Figure 3 The heat dissipation shell 110 is constructed to form a receiving cavity 111 for accommodating the laser source 120.

[0056] The heat sink 110 is provided with a light-transmitting hole 1121 and a wire-passing hole 1131, which are respectively connected to the receiving cavity 111. The light-transmitting hole 1121 and the wire-passing hole 1131 are located on both sides of the receiving cavity 111 along the axial direction of the laser source 120.

[0057] In some embodiments, the heat sink 110 is a metal shell, which facilitates heat dissipation.

[0058] The laser source 120 is installed inside the receiving cavity 111, and the pins 124 of the laser source 120 extend out of the receiving cavity 111 through the wire hole 1131 for easy electrical connection with the power supply device. The protective cover 121 of the laser source 120 has a light-transmitting cover 123 at the end opposite to the pins 124. The light-transmitting cover 123 and the light-transmitting hole 1121 are opposite to each other along the axis of the laser source 120, so that the laser light can be emitted through the light-transmitting hole 1121 to the outside of the heat sink 110.

[0059] The heat sink 110 partially covers the protective cover 121 with a light-transmitting cover plate 123 on the end face. This allows the heat sink 110 to cover the laser light source 120 except for the light-transmitting cover plate 123 and the pins 124, increasing the contact area between the heat sink 110 and the laser light source 120, thereby improving the heat dissipation performance of the laser light source 120 and thus helping to improve the testing accuracy of the camera using the light source component.

[0060] In this embodiment, the heat sink 110 and the laser source 120 are in surface contact, so that the heat from the laser source 120 can be directly transferred to the heat sink 110, thereby improving the heat dissipation effect.

[0061] A thermally conductive layer, such as a thermally conductive adhesive layer, is provided between the heat sink 110 and the laser source 120 to ensure surface contact between the heat sink 110 and the laser source 120 and improve the heat dissipation effect.

[0062] Continue to refer to Figure 3 and Figure 4In some embodiments of this disclosure, the heat sink 110 includes a first housing 112 and a second housing 113, which are fixedly connected and enclose a receiving cavity 111. This facilitates the installation of the laser light source 120 inside the heat sink 110.

[0063] There are multiple ways to fix the first housing 112 and the second housing 113.

[0064] For example, the first housing 112 and the second housing 113 are threaded together, with one of the first housing 112 and the second housing 113 forming an external thread and the other forming an internal thread, so that the first housing 112 and the second housing 113 are threaded together, and the connection method is simple and reliable.

[0065] For example, the first housing 112 and the second housing 113 are fixedly connected by a first fastener. The first fastener can be a screw, bolt, etc. The first housing 112 and the second housing 113 are respectively provided with connection holes, and the first fastener is fixedly connected to the first housing 112 and the second housing 113 through the connection holes. The connection method is stable and reliable.

[0066] The first housing 112 has a light-transmitting hole 1121, and the second housing 113 has a wire-passing hole 1131. The first housing 112 partially covers the outer side of the protective cover 121 of the laser light source 120, and the second housing 113 partially covers the outer side of the substrate 122 of the laser light source 120.

[0067] At least one of the first housing 112 and the second housing 113 is provided with a heat-conducting layer between itself and the laser source 120. For example, only the first housing 112 is provided with a heat-conducting layer between itself and the laser source 120; another example is that only the second housing 113 is provided with a heat-conducting layer between itself and the laser source 120; yet another example is that both the first housing 112 and the second housing 113 are provided with heat-conducting layers between themselves and the laser source 120.

[0068] The heat dissipation shell 110 of this embodiment is formed by a fixed connection of a first shell 112 and a second shell 113, which facilitates fixing the laser light source 120 in the receiving cavity 111. At least one of the first shell 112 and the second shell 113 is provided with a heat-conducting layer between itself and the laser light source 120, ensuring that at least a part of the heat dissipation shell 110 is in surface contact with the laser light source 120, which helps to improve the heat dissipation effect.

[0069] When the thermal conductive layer is a thermally conductive adhesive layer, the setting of the thermal conductive layer also helps to improve the stability of the laser light source 120 installed in the heat sink 110.

[0070] Continue to refer to Figure 3 and Figure 4The first housing 112 is configured to form a first receiving groove 1122, which opens toward the second housing 113. The first housing 112 includes a bottom wall and a side wall disposed on the bottom wall, which together form the first receiving groove 1122.

[0071] The bottom wall of the first receiving groove 1122 is opposite to the opening of the first receiving groove 1122, and the bottom wall of the first receiving groove 1122 is constructed to form a light-transmitting hole 1121. The bottom wall of the first receiving groove 1122 abuts against the end face of the protective cover 121 where the light-transmitting cover plate 123 is provided. It can be understood that the bottom wall of the first receiving groove 1122 abuts against the end wall of the protective cover 121 and makes surface contact, which helps to increase the contact area between the first housing 112 and the laser light source 120.

[0072] The sidewall of the first receiving groove 1122 contacts the side of the protective cover 121. This can be understood as the sidewall of the first receiving groove 1122 contacting the sidewall portion of the protective cover 121. Furthermore, the end of the first housing 112 facing away from the light-transmitting hole 1121 abuts against the substrate 122 of the laser light source 120. That is, the end of the sidewall of the first receiving groove 1122 facing away from the bottom wall abuts against the substrate 122, thereby confining the laser light source 120 within the first receiving groove 1122.

[0073] In some embodiments, the second housing 113 is configured to form a second receiving groove 1132, which opens toward the first housing 112, such that the second housing 113 and the first housing 112 open toward each other. The second receiving groove 1132 and the first receiving groove 1122 enclose a receiving cavity 111. The second housing 113 may include a bottom wall and a side wall disposed on the bottom wall, which enclose the second receiving groove 1132.

[0074] The bottom wall of the second receiving groove 1132 is opposite to the opening of the second receiving groove 1132, and the bottom wall of the second receiving groove 1132 is configured to form a wire through hole 1131. The bottom wall of the second receiving groove 1132 abuts against the end of the substrate 122 away from the protective cover 121. The side wall of the second receiving groove 1132 abuts against the side of the substrate 122.

[0075] In some embodiments, the end face of the second receiving groove 1132 facing away from the bottom wall is flush with the end face of the substrate 122 facing the protective cover 121, so that the substrate 122 is embedded in the second receiving groove 1132. The end face of the first receiving groove 1122 facing away from the bottom wall abuts against the end face of the substrate 122 facing the protective cover 121; at the same time, the side wall of the first receiving groove 1122 abuts against the side wall of the second receiving groove 1132 to confine the laser light source 120 within the receiving cavity 111.

[0076] In some embodiments of this disclosure, a heat-conducting layer is provided between the bottom wall of the second receiving groove 1132 and the substrate 122; and / or, a heat-conducting layer is provided between the first housing 112 and the protective cover 121. Thus, the heat from the laser source 120 can be quickly dissipated through the heat-conducting layer, improving the heat dissipation effect.

[0077] Continue to refer to Figure 3 and Figure 4 In some embodiments of this disclosure, the second housing 113 is configured to form a mounting groove 1133, which opens toward the first housing 112. The mounting groove 1133 is formed by a groove sidewall and a groove bottom wall. The groove bottom wall of the mounting groove 1133 is configured to form a wire hole 1131; a second receiving groove 1132 is disposed on the groove bottom wall of the mounting groove 1133.

[0078] The sidewall of the mounting groove 1133 is configured to form a connecting thread for threaded connection with the first housing 112. The connecting thread is an internal thread. The first housing 112 is configured to form an external thread. Thus, the first housing 112 is fitted into the mounting groove 1133.

[0079] The outer end face of the first housing 112 does not protrude from the opening end of the mounting groove 1133. For example, the outer end face of the first housing 112 is flush with the opening end of the mounting groove 1133. The end face of the first housing 112 is the end face of the first housing 112 that is away from the opening of the first receiving groove 1122.

[0080] The outer end face of the first housing 112 is configured to form an installation operation hole 1123, which allows the operating tool to be inserted into the installation operation hole 1123 to achieve a threaded connection between the first housing 112 and the second housing 113.

[0081] The second housing 113 of this embodiment is threadedly connected to the first housing 112 by providing a mounting groove 1133 and a connecting thread on the side wall of the mounting groove 1133. Furthermore, the outer end face of the first housing 112 does not protrude from the opening end of the mounting groove 1133, allowing the first housing 112 to be fitted into the mounting groove 1133, resulting in a compact structure; it also facilitates the installation of other components, such as the circuit board 400.

[0082] Continue to refer to Figure 3 and Figure 4 In some embodiments of this disclosure, the outer side of the second housing 113 extends radially away from the central axis of the second housing 113 to form a flange 1134. The flange 1134 is used to fix the light source assembly to other structures of the laser by fasteners such as screws or bolts.

[0083] Combination Figure 5This disclosure also provides a laser, which includes a carrier 200 and a light source assembly 100 as described in the above embodiments. The structure, function and effect of the light source assembly 100 provided in this embodiment are the same as those in the above embodiments. For details, please refer to the above embodiments, and they will not be described again here.

[0084] The light source assembly 100 is fixedly connected to the carrier 200, wherein the second housing 113 of the light source assembly 100 is fixedly connected to the carrier 200. The connection method includes, but is not limited to, threaded connection, snap-fit, etc.

[0085] For example, the flange 1134 of the second housing 113 is fixedly connected to the support 200 by a third fastener, and the connection method is simple and reliable.

[0086] In some embodiments, the support 200 is cylindrical, which facilitates not only the installation of the light source assembly but also the installation of other optical devices.

[0087] Combination Figure 6 and Figure 7 A collimating lens 210 is provided inside the support 200, and the collimating lens 210 is located on the light emission side of the light source assembly 100. The collimating lens 210 is mainly used to adjust the propagation direction of the light beam, so that the laser light emitted by the light source assembly 100 becomes parallel light, that is, collimated light.

[0088] In some embodiments, a prism 220 is further disposed within the support 200. The prism 220 is located on the side of the collimating lens 210 facing away from the light source assembly 100, and the prism 220 and the collimating lens 210 are coaxially arranged. The prism 220 may be a Powell prism. The prism 220 is mainly used to convert the laser beam into a uniformly distributed linear light plate, i.e., a line laser.

[0089] The laser provided in this embodiment includes the light source assembly 100 of the above embodiment. Therefore, the laser provided in this embodiment also has the same advantages as the light source assembly 100 of the above embodiment, and will not be described again here.

[0090] In some embodiments of this disclosure, the support 200 is cylindrical, which allows the support 200 to rotate relative to the structure on which it is mounted, facilitating the adjustment of the light source assembly 100.

[0091] Combination Figures 8 to 10 Some embodiments of this disclosure also provide a projection module, which includes: a galvanometer mounting base 300, a second fastener, and a laser as described in the above embodiments. The galvanometer mounting base 300 has a mounting hole, and the laser is mounted in the mounting hole.

[0092] The galvanometer mount 300 also houses the galvanometer, which is located on the laser beam emission side. The main function of the galvanometer is to dynamically control the beam direction and scanning path. The galvanometer is a high-speed deflecting mirror based on the electromagnetic drive principle, which can precisely control the deflection angle and speed of the mirror through electrical signals, thereby achieving rapid adjustment of the laser beam direction.

[0093] The laser is configured to rotate relative to the mounting hole to adjust the perpendicularity of the laser beam. The laser beam emitted by the laser is reflected by the galvanometer and then strikes the target. By rotating the laser relative to the mounting hole, the laser beam is made to be perfectly balanced with the target, thus adjusting the perpendicularity of the laser beam. After adjusting the perpendicularity of the laser beam, a second fastener securely connects the laser and the galvanometer mounting base 300, thereby fixing the laser to the galvanometer mounting base 300.

[0094] For example, the galvanometer mounting base 300 is provided with a fixing hole 301, which extends radially along the mounting hole. The second fastener is fixedly connected to the fixing hole 301 and abuts against the laser carrier 200, thereby fixing the laser to the galvanometer mounting base 300.

[0095] Reference Figure 11 In some embodiments of this disclosure, the laser may further include a circuit board 400, which may be electrically connected to the laser source 120.

[0096] Combination Figure 12 and Figure 13 In some embodiments of this disclosure, the support 200 and the first housing 112 of the light source assembly 100 are integrally formed.

[0097] Thus, the support 200 is fixedly connected to the second housing 113 of the light source assembly 100 to form a receiving cavity 111 for mounting the laser light source 120, which helps to simplify the structure of the laser.

[0098] In some embodiments, the second housing 113 can be embedded in the support 200, such that the end of the second housing 113 facing away from the substrate 122 is flush with the end face of the support 200, making the structure of the laser compact.

[0099] The second housing 113 and the support 200 can be connected by threads, snap-fit, etc.

[0100] For example, the support 200, the second housing 113 and the circuit board 400 are fixedly connected by the fourth fastener 230, and the connection method is stable and reliable.

[0101] Combination Figure 11In some embodiments of this disclosure, the support 200 is provided with a positioning notch 240, and the side of the second housing 113 is provided with a radially protruding positioning part 1135. The positioning part 1135 cooperates with the positioning notch 240 to improve the convenience of fixing the support 200 and the second housing 113.

[0102] This disclosure provides an electronic device comprising: a lens and a projection module as described above, wherein the lens is configured to acquire light projected onto a target by the projection module.

[0103] Some embodiments of this disclosure also provide an electronic device, which includes: a lens and a laser as described in the above embodiments, the lens being configured to acquire light projected by the laser onto a target.

[0104] Some embodiments of this disclosure also provide an electronic device, which includes: a lens, a collimating lens 210, and a light source assembly as described in the above embodiments, wherein the laser emitted by the light source assembly is directed toward a target body after passing through the collimating lens 210; the lens is configured to acquire the laser light on the target body.

[0105] Among them, electronic devices can be structured light cameras, 3D cameras, etc.

[0106] The electronic device provided in this disclosure includes the light source component of the above embodiments. Therefore, the electronic device provided in this disclosure also has the same advantages as the light source component of the above embodiments, which will not be repeated here.

[0107] In the above description, the use of terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refers to a specific feature, structure, material, or characteristic described in connection with that embodiment or example, which is included in at least one embodiment or example of this disclosure. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0108] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this disclosure, and are not intended to limit them. Although this disclosure has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this disclosure.

Claims

1. A light source assembly, characterized in that, include: A laser source and a heat sink, wherein the heat sink is configured to form a receiving cavity; The heat dissipation shell is provided with a light-transmitting hole and a wire-passing hole that are respectively connected to the receiving cavity; The laser source is installed inside the receiving cavity, and the pins of the laser source extend out of the receiving cavity through the wire hole; the protective cover of the laser source has a light-transmitting cover plate at the end opposite to the pins, and the light-transmitting cover plate and the light-transmitting hole are opposite to the axis of the laser source. The heat dissipation shell partially covers the end face of the protective cover where the light-transmitting cover plate is located.

2. The light source assembly according to claim 1, characterized in that, The heat dissipation shell includes a first shell and a second shell, which are fixedly connected and enclose the receiving cavity. The first housing is provided with the light-transmitting hole, and the second housing is provided with the wire-passing hole; A heat-conducting layer is provided between at least one of the first housing and the second housing and the laser light source.

3. The light source assembly according to claim 2, characterized in that, The first housing is configured to form a first receiving groove, and the bottom wall of the first receiving groove is configured to form the light-transmitting hole; the bottom wall of the first receiving groove abuts against the end face of the protective cover where the light-transmitting cover plate is provided; the side wall of the first receiving groove contacts the side of the protective cover, and the end of the first housing away from the light-transmitting hole abuts against the substrate of the laser light source.

4. The light source assembly according to claim 2 or 3, characterized in that, The first housing and the second housing are threaded together; or, the first housing and the second housing are fixedly connected by a first fastener.

5. The light source assembly according to claim 2 or 3, characterized in that, The second housing is configured to form a mounting groove, and the sidewall of the mounting groove is configured to form a connecting thread that is threaded to the first housing; the bottom wall of the mounting groove is configured to form the through hole. The outer end face of the first housing does not protrude from the opening end of the mounting groove, and the outer end face of the first housing is configured to form a mounting operation hole.

6. A laser, characterized in that, include: The carrier and the light source assembly according to any one of claims 1-5; the light source assembly is fixedly connected to the carrier; a collimating lens is provided inside the carrier, and the collimating lens is located on the light emission side of the light source assembly.

7. The laser according to claim 6, characterized in that, The support base and the first housing of the light source assembly are integrally formed as a single piece.

8. The laser according to claim 6, characterized in that, The support base is cylindrical.

9. A projection module, characterized in that, include: The galvanometer mounting base, the second fastener, and the laser as described in claim 8, wherein the galvanometer mounting base has a mounting hole and the laser is mounted in the mounting hole; The laser is configured to be rotatable relative to the mounting hole to adjust the perpendicularity of the laser line. After adjusting the verticality of the laser line of the laser, the second fastener securely connects the laser and the galvanometer mounting base.

10. An electronic device, characterized in that, include: The lens and the projection module of claim 9, wherein the lens is configured to acquire light projected onto the target by the projection module; or, Includes: a lens and a laser as described in any one of claims 6-8, wherein the lens is configured to acquire light rays projected by the laser rays onto the target; or, It includes: a lens, a collimating lens, and a light source assembly as described in any one of claims 1-5, wherein the laser emitted by the light source assembly is directed toward a target body after passing through the collimating lens; the lens is configured to acquire the laser light on the target body.

Images