Electronic component for digital signal output

Abstract

The utility model discloses an electronic component for digital signal output, which relates to the technical field of electronic components and comprises a packaging shell, a screw rod and a connecting rod, a mounting seat is mounted on the inner side of the packaging shell, a chip is mounted on the inner side above the mounting seat, a cover body is mounted above the packaging shell, and the connecting rod is mounted on the cover body. Heat conducting plates are uniformly mounted at the top end of the cover body, lead screws are mounted on the inner walls of the two sides of the cover body, movable rods are mounted on the outer walls of one ends of the lead screws, lock rods are connected to the lower portions of one ends of the movable rods, and lock grooves matched with the lock rods are formed in the outer walls of positioning rods. According to the utility model, heat is absorbed by the heat conducting pad and the radiating fins and transmitted to the plurality of heat conducting plates, the plurality of heat conducting plates are contacted with air for heat dissipation, the plurality of heat absorbing blocks absorb heat in the packaging shell, the heat is transmitted to the heat conducting air pipe, and the heat is dissipated through air flowing in the heat conducting air pipe. The problem that an effective heat dissipation structure does not exist is solved.

Description

Technical Field

[0001] This utility model relates to the field of electronic components technology, specifically to an electronic component for digital signal output. Background Technology

[0002] Digital signal output electronic components are key parts of modern electronic systems, widely used in communications, computers, consumer electronics, industrial control, and other fields. Digital signal processing refers to the processing and analysis of signals using digital computing technology, and is widely used in audio processing, image processing, communication systems, radar systems, etc. Digital signal output electronic components typically consist of a housing, a chip, and filler. These parts work together to protect the internal components and ensure their normal operation. The housing is the external protective structure of the component, used to encapsulate the internal chip and circuit, provide mechanical support, and protect the environment. Some existing digital signal output electronic components are inconvenient to disassemble and reassemble, thus preventing recycling, and the internal heat cannot be effectively dissipated, affecting performance. In view of this, this case was developed to address the above problems through in-depth research. Utility Model Content

[0003] The purpose of this invention is to provide an electronic component for digital signal output, in order to solve the problem mentioned in the background art that the existing electronic component for digital signal output does not have an easy-to-disassemble and effective heat dissipation structure.

[0004] To achieve the above objectives, this utility model provides the following technical solution: an electronic component for digital signal output, comprising a package housing, a lead screw, and a connecting rod. A mounting base is installed on the inner side of the package housing, and a chip is installed on the inner side above the mounting base. A cover is installed on the top of the package housing, and a sealing ring is installed on the inner wall of the cover. A heat-conducting plate is evenly installed on the top of the cover, and the bottom end of the heat-conducting plate extends through the cover into the interior of the package housing. Positioning rods are connected to the inner walls on both sides of the cover. Positioning grooves that cooperate with the positioning rods are provided on both sides of the top of the package housing. A lead screw is installed on the inner walls on both sides of the cover, and a movable rod is installed on the outer wall of one end of the lead screw. A locking rod is connected to the lower part of one end of the movable rod, and a locking groove that cooperates with the locking rod is provided on the outer wall of the positioning rod.

[0005] Preferably, a return spring is installed on the outer wall of both sides of the mounting base, and a connecting rod is movably installed on the inner side of each return spring. One end of each connecting rod is connected to a pull plate, and the other end of each connecting rod is connected to a clamping plate.

[0006] Preferably, a thermal pad is mounted on top of the chip, and a heat sink is mounted on top of the thermal pad, with the top of the heat sink connected to the thermal plate.

[0007] Preferably, heat-conducting air ducts are installed through both sides of the encapsulation shell, and heat-absorbing blocks are uniformly installed inside the encapsulation shell on the outer wall of the heat-conducting air ducts.

[0008] Preferably, the thermal pad is made of soft silicone material, and the heat sink, thermal plate, heat absorber and thermal duct are made of copper.

[0009] Preferably, the inner wall of the movable rod is provided with an internal thread, and a threaded connection structure is formed between the movable rod and the lead screw.

[0010] Preferably, knobs are connected to both sides of the top of the cover, and the bottom of each knob is connected to a second bevel tooth. A first bevel tooth is installed on the outer wall of one end of the lead screw, and the first bevel tooth and the second bevel tooth form a meshing transmission structure.

[0011] Compared with the prior art, the beneficial effects of this utility model are:

[0012] This utility model provides a heat-conducting plate, a heat-conducting pad, and a heat sink. The heat-conducting pad and heat sink absorb heat and transfer it to multiple heat-conducting plates. Then, the heat-conducting plates contact the air to dissipate heat. At the same time, multiple heat-absorbing blocks absorb heat from the inside of the encapsulation shell. Then, the heat is transferred to the heat-conducting air duct and dissipated by the air flowing in the heat-conducting air duct. This solves the problem of ineffective heat dissipation structure.

[0013] This utility model provides a cover, a knob, and a locking groove. By placing the cover on the encapsulation housing and positioning the positioning rod in the positioning groove, the knob is then turned forcefully to rotate the second bevel gear. The second bevel gear meshes with the first bevel gear, causing the lead screw to rotate. The threaded engagement causes the movable rod to move the locking rod towards the inside of the locking groove, thus achieving cover installation. For disassembly, the knob is turned in the opposite direction to move the locking rod away from the locking groove, solving the problem of inconvenient disassembly and assembly. Attached Figure Description

[0014] Figure 1 This is a cross-sectional view of the packaging shell of this utility model;

[0015] Figure 2 This is a schematic cross-sectional view of the cover of this utility model;

[0016] Figure 3 This is a top view of the heat-conducting plate structure of this utility model;

[0017] Figure 4 This utility model Figure 1 Enlarged structural diagram at point A in the middle.

[0018] In the diagram: 1. Heat-absorbing block; 2. Heat-conducting air duct; 3. Heat-conducting plate; 4. Cover; 5. Sealing ring; 6. Encapsulation shell; 7. Mounting base; 8. Heat-conducting pad; 9. Chip; 10. Heat sink; 11. Movable rod; 12. Lead screw; 13. First bevel tooth; 14. Second bevel tooth; 15. Knob; 16. Locking rod; 17. Locking groove; 18. Positioning rod; 19. Positioning groove; 20. Return spring; 21. Pull plate; 22. Connecting rod; 23. Clamping plate. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0020] Example 1: Please refer to Figures 1-4 An electronic component for digital signal output includes a housing 6, a lead screw 12, and a connecting rod 22. A mounting base 7 is installed on the inner side of the housing 6, and a chip 9 is installed on the inner side above the mounting base 7. A cover 4 is installed on the top of the housing 6, and a sealing ring 5 is installed on the inner wall of the cover 4. A heat-conducting plate 3 is evenly installed on the top of the cover 4, and the bottom end of the heat-conducting plate 3 extends through the cover 4 into the interior of the housing 6. Positioning rods 18 are connected to the inner walls on both sides of the cover 4. Positioning grooves 19 that cooperate with the positioning rods 18 are provided on both sides of the top of the housing 6. Lead screws 12 are installed on the inner walls on both sides of the cover 4, and movable rods 11 are installed on the outer wall of one end of the lead screw 12. A locking rod 16 is connected to the lower part of one end of the movable rod 11. Locking grooves 17 that cooperate with the locking rod 16 are provided on the outer wall of the positioning rod 18.

[0021] Both sides of the mounting base 7 are equipped with a return spring 20 on the outer wall, and a connecting rod 22 is movably installed on the inner side of the return spring 20. One end of the connecting rod 22 is connected to a pull plate 21, and the other end of the connecting rod 22 is connected to a clamping plate 23.

[0022] A thermal pad 8 is mounted on top of the chip 9, and a heat sink 10 is mounted on top of the thermal pad 8. The top of the heat sink 10 is connected to the thermal plate 3.

[0023] Heat-conducting air pipes 2 are installed through both sides of the encapsulation shell 6, and heat-absorbing blocks 1 are evenly installed inside the encapsulation shell 6 on the outer wall of the heat-conducting air pipes 2.

[0024] The thermal pad 8 is made of soft silicone, and the heat sink 10, the heat conduction plate 3, the heat absorption block 1 and the heat conduction air duct 2 are made of copper.

[0025] Specifically, such as Figure 1 and Figure 3 As shown, when using this structure, heat is absorbed by the thermal pad 8 and the heat sink 10 and transferred to multiple thermal plates 3. Then, the multiple thermal plates 3 contact the air to dissipate heat. At the same time, multiple heat-absorbing blocks 1 absorb heat from the inside of the encapsulation shell 6. Then, the heat is transferred to the thermal duct 2 and dissipated by the air flowing in the thermal duct 2, thus achieving effective heat dissipation.

[0026] Example 2: The inner wall of the movable rod 11 is provided with an internal thread, and a threaded connection structure is formed between the movable rod 11 and the lead screw 12;

[0027] Both sides of the top of the cover 4 are connected to knobs 15, and the bottom of each knob 15 is connected to a second bevel tooth 14. The outer wall of one end of the lead screw 12 is equipped with a first bevel tooth 13, and the first bevel tooth 13 and the second bevel tooth 14 form a meshing transmission structure.

[0028] Specifically, such as Figure 1 , Figure 2 and Figure 4 As shown, when using this structure, the cover 4 is placed on the encapsulation housing 6, and the positioning rod 18 is positioned in the positioning groove 19. Then, the knob 15 is turned forcefully to rotate the second bevel tooth 14. The second bevel tooth 14 meshes with the first bevel tooth 13, causing the lead screw 12 to rotate. The threaded engagement causes the movable rod 11 to drive the locking rod 16 to move towards the inside of the locking groove 17, thus realizing the installation of the cover 4. When disassembling, the knob 15 is turned in the opposite direction to move the locking rod 16 away from the locking groove 17, which facilitates the disassembly and assembly work.

[0029] Working principle: When using this device, firstly, by pulling the pull plate 21 outward, the return spring 20 is stretched and deformed, and then the chip 9 is installed in the mounting base 7. After releasing the pull plate 21, the return spring 20 returns to its original position, causing the clamping plate 23 to clamp and fix the chip 9 inward. Then, a thermal pad 8 is placed on the chip 9 to provide good thermal contact. Then, various filler materials are filled into the encapsulation housing 6 to ensure its performance, reliability and durability. Then, the top cover 4 is installed for encapsulation.

[0030] Implementation steps for the first innovation point:

[0031] Step 1: Place the cover 4 on the encapsulation housing 6, while positioning rod 18 is positioned in positioning groove 19. Then, forcefully rotate knob 15 to rotate second bevel tooth 14. Through the engagement of second bevel tooth 14 with first bevel tooth 13, screw 12 rotates. The threaded engagement causes movable rod 11 to drive locking rod 16 to move inward to the inside of locking groove 17, thus realizing the installation of cover 4.

[0032] Step 2: When disassembling, turn knob 15 in the opposite direction to move locking bar 16 away from locking groove 17.

[0033] Implementation steps for the second innovation point:

[0034] Step 1: Heat is absorbed by the thermal pad 8 and the heat sink 10 and transferred to multiple thermal plates 3, and then the heat is dissipated by contacting the air through the multiple thermal plates 3.

[0035] Step 2: Simultaneously, multiple heat-absorbing blocks 1 absorb heat from the inside of the encapsulation shell 6, and then the heat is transferred to the heat-conducting air duct 2, and the heat is dissipated by the air flowing inside the heat-conducting air duct 2.

[0036] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0037] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An electronic component for digital signal output, comprising a housing (6), a lead screw (12), and a connecting rod (22), characterized in that: An mounting base (7) is installed on the inner side of the encapsulation housing (6), and a chip (9) is installed on the inner side above the mounting base (7). A cover (4) is installed on the top of the encapsulation housing (6), and a sealing ring (5) is installed on the inner wall of the cover (4). A heat-conducting plate (3) is evenly installed on the top of the cover (4), and the bottom end of the heat-conducting plate (3) extends through the cover (4) into the interior of the encapsulation housing (6). A positioning rod (18) is connected to the inner wall on both sides of the cover (4). A positioning groove (19) that cooperates with the positioning rod (18) is provided on both sides of the top of the encapsulation housing (6). A lead screw (12) is installed on the inner wall on both sides of the cover (4), and a movable rod (11) is installed on the outer wall of one end of the lead screw (12). A locking rod (16) is connected to the bottom of one end of the movable rod (11). A locking groove (17) that cooperates with the locking rod (16) is provided on the outer wall of the positioning rod (18).

2. The electronic component for digital signal output according to claim 1, characterized in that: The outer walls on both sides of the mounting base (7) are equipped with reset springs (20), and the inner side of the reset springs (20) is movably equipped with connecting rods (22). One end of the connecting rods (22) is connected to a pull plate (21), and the other end of the connecting rods (22) is connected to a clamping plate (23).

3. The electronic component for digital signal output according to claim 1, characterized in that: A thermal pad (8) is installed on top of the chip (9), and a heat sink (10) is installed on top of the thermal pad (8). The top of the heat sink (10) is connected to the heat-conducting plate (3).

4. The electronic component for digital signal output according to claim 1, characterized in that: Both sides of the encapsulation shell (6) are equipped with heat-conducting air pipes (2), and heat-absorbing blocks (1) are uniformly installed inside the encapsulation shell (6) on the outer wall of the heat-conducting air pipes (2).

5. The electronic component for digital signal output according to claim 3, characterized in that: The heat-conducting pad (8) is made of soft silicone material, and the heat sink (10), heat-conducting plate (3), heat-absorbing block (1) and heat-conducting air duct (2) are made of copper.

6. The electronic component for digital signal output according to claim 1, characterized in that: The inner wall of the movable rod (11) is provided with an internal thread, and a threaded connection structure is formed between the movable rod (11) and the lead screw (12).

7. The electronic component for digital signal output according to claim 1, characterized in that: Both sides of the top of the cover (4) are connected to knobs (15), and the bottom of each knob (15) is connected to a second bevel tooth (14). The outer wall of one end of the lead screw (12) is equipped with a first bevel tooth (13), and the first bevel tooth (13) and the second bevel tooth (14) form a meshing transmission structure.

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