High-voltage rectification module with high insulation grade

Abstract

The utility model discloses a high-voltage rectification module with high insulation grade, which comprises a containing box, an insulation structure is arranged on the left side of the containing box, the insulation structure is formed by combining a cover plate, a threaded rod, a glue injection port and a plug, and the lower side of the cover plate is rotatably connected with the containing box through a hinge. According to the high-voltage rectification module with the high insulation grade, the connecting plates are slidably connected with the open grooves through the connecting blocks, the connecting plates are moved by moving the moving handles, and then the inner sides of the heat dissipation fins are cleaned through the cleaning pieces, so that the heat dissipation effect of the heat dissipation fins is prevented from being affected by dust and other impurities; the position relation can be adjusted by making the rotating disc not tightly attached to the adjusting plate, so that the containing box can be conveniently installed, during glue injection, the plug and the glue injection opening are disconnected, pouring sealant can be conveniently and evenly smeared between the containing box and the cover plate, and therefore the insulation grade is enhanced.

Description

Technical Field

[0001] This utility model relates to the field of high voltage rectifier module technology, specifically a high insulation level high voltage rectifier module. Background Technology

[0002] High-voltage rectifier modules belong to the category of rectifier modules. A rectifier module is a power electronic device that converts alternating current (AC) into direct current (DC). Its core function is to convert and regulate electrical energy, providing a stable and reliable DC power supply to the load. High-voltage rectifier modules are the core components of high-voltage DC power supply systems, and their performance directly affects the stability and efficiency of the entire system. With the development of power electronics technology, high-voltage rectifier modules are developing towards higher power density, intelligence, green environmental protection, and high reliability. In practical applications, it is necessary to select appropriate products according to specific needs and pay attention to safety and maintainability.

[0003] Referring to Chinese Patent Publication No. CN222169599U, with the publication date of the publication date being December 13, 2024, a rectifier module is disclosed. This rectifier module seals the rectifier circuit board with potting compound, which serves to prevent water and moisture. Filling the entire receiving groove with potting compound also provides support and shock absorption for the rectifier circuit board. The thermal conductivity of the potting compound itself allows the heat generated by the rectifier circuit board during operation to be quickly conducted to the receiving box and discharged through the receiving box, avoiding the long-term accumulation of heat in the receiving groove and its impact on the rectifier circuit board.

[0004] However, during use, it is inconvenient to clean the heat dissipation fins on the upper side of this utility model. Dust easily accumulates between the heat dissipation fins, which affects the heat dissipation efficiency and thus the performance of the high voltage rectifier module. Furthermore, when the rectifier circuit board is sealed with potting compound, its front side is not sealed. If the potting compound is damaged, it will affect the insulation level. Therefore, there is still room for further improvement.

[0005] Therefore, we propose a high-insulation-level high-voltage rectifier module to solve the problems mentioned above. Utility Model Content

[0006] The purpose of this invention is to provide a high-insulation-level high-voltage rectifier module to solve the problems mentioned in the background art. In the current invention, it is inconvenient to clean the heat dissipation fins on the upper side during use, and dust easily accumulates between the fins, affecting heat dissipation efficiency and consequently the performance of the high-voltage rectifier module. Furthermore, when using potting compound to seal the rectifier circuit board, its front side is not sealed; if the potting compound is damaged, it will affect the insulation level. Therefore, there is still room for further improvement.

[0007] To achieve the above objectives, this utility model provides the following technical solution: a high-voltage rectifier module with a high insulation level, comprising:

[0008] The container has an insulating structure on its left side, which is composed of a cover plate, a threaded rod, an injection port and a plug. The lower side of the cover plate is rotatably connected to the container via a hinge.

[0009] Also includes:

[0010] The upper side of the container is provided with a cleaning mechanism to enhance heat dissipation, and the upper side of the container is provided with heat dissipation fins, which are arranged in an array and are symmetrical about the horizontal central axis of the container.

[0011] The right side of the container is provided with a connecting mechanism for installation, and a lead screw is provided on the right side of the container, and the lead screw is symmetrical about the vertical central axis of the container.

[0012] Preferably, the cleaning mechanism is composed of a slot, a connecting block, a connecting plate and a cleaning plate, and the inside of the receiving box is provided with a slot, and the slot is symmetrical about the vertical central axis of the receiving box.

[0013] Preferably, the slot has a connecting block that slides inside it, and the slot and the connecting block correspond one-to-one, and the upper side of the connecting block is fixedly connected to the connecting plate.

[0014] Preferably, a cleaning plate is provided on the lower side of the connecting plate, and the outer side of the cleaning plate is in close contact with the side of the heat dissipation fins. A moving handle is provided on the upper side of the connecting plate. Moreover, the slot, connecting block, connecting plate, cleaning plate and moving handle are all symmetrical about the horizontal central axis of the receiving box.

[0015] Preferably, the connecting mechanism is composed of a lead screw, a turntable, a sliding groove, an adjusting plate, and a connecting hole, and the lead screw is threadedly connected to the turntable, with a one-to-one correspondence between the lead screw and the turntable.

[0016] Preferably, the turntable is slidably connected to the sliding groove, and the sliding groove is opened inside the adjusting plate. A connecting hole is opened on the upper part of the interior of the adjusting plate, and the sliding groove, adjusting plate, and connecting hole correspond one-to-one with the turntable.

[0017] Preferably, the upper side of the cover plate is threadedly connected to the threaded rod, and the threaded rod is slidably connected to the receiving box, and the threaded rod is symmetrical about the vertical central axis of the receiving box.

[0018] Preferably, the cover plate has an injection port starting from the left side, and the injection ports are distributed in an array.

[0019] Preferably, a stopper is slidably connected inside the glue injection port, and the glue injection port and the stopper correspond one-to-one.

[0020] Preferably, the inner side of the receiving box is provided with a connecting groove, and the connecting groove is symmetrical about the vertical central axis of the receiving box, and a rectifier circuit board is slidably connected inside the connecting groove.

[0021] Compared with the prior art, the beneficial effects of this utility model are as follows: In this high insulation level high voltage rectifier module, the connecting plate is slidably connected to the slot through the connecting block. The connecting plate is moved by moving the moving handle, thereby allowing the cleaning plate to clean the inner side of the heat dissipation fins, thus preventing dust and other debris from affecting the heat dissipation effect of the heat dissipation fins. When it is necessary to adjust the position of the receiving box in front of the adjusting plate, the position relationship can be adjusted by not tightly fitting the turntable with the adjusting plate, thus facilitating the installation of the receiving box. During the glue injection, the plug is disconnected from the glue injection port, which facilitates the even application of the potting compound between the receiving box and the cover plate, thereby enhancing the insulation level.

[0022] 1. It is equipped with a receiving box, heat dissipation fins and slots. The upper side of the receiving box is provided with heat dissipation fins, which can enhance the heat dissipation effect of the receiving box, thereby facilitating heat dissipation.

[0023] 2. It is equipped with a connecting block, a connecting plate and a cleaning plate. The inside of the receiving box has a slot. The connecting plate is slidably connected to the slot through the connecting block. The connecting plate is moved by moving the moving handle, so that the cleaning plate can clean the inside of the heat dissipation fins, thereby preventing dust and other debris from affecting the heat dissipation effect of the heat dissipation fins.

[0024] 3. It is equipped with a lead screw, a turntable and an adjusting plate. The lead screw is threadedly connected to the turntable. When it is necessary to adjust the position of the receiving box in front of the adjusting plate, the turntable and the adjusting plate are not tightly fitted, so that the position relationship can be adjusted, thus facilitating the installation of the receiving box.

[0025] 4. It is equipped with a cover plate, a glue inlet, and a stopper. During glue injection, the stopper is disconnected from the glue inlet to facilitate the even application of potting compound between the container and the cover plate, thereby enhancing the insulation level.

[0026] 5. It is equipped with a housing, a connecting slot and a rectifier circuit board. The rectifier circuit board is connected to the housing through the connecting slot, which facilitates installation. Attached Figure Description

[0027] Figure 1 This is a left-side stereoscopic structural diagram of the present invention;

[0028] Figure 2 This is a right-side three-dimensional structural diagram of the present invention;

[0029] Figure 3 This is a schematic diagram of the internal structure of the container box of this utility model;

[0030] Figure 4 This is an exploded view of the heat dissipation fins and cleaning plate of this utility model;

[0031] Figure 5 This is a schematic diagram of the exploded structure of the glue injection port and stopper of this utility model.

[0032] In the diagram: 1. Receiving box; 2. Heat dissipation fins; 3. Slot; 4. Connecting block; 5. Connecting plate; 6. Cleaning plate; 7. Moving handle; 8. Lead screw; 9. Turntable; 10. Sliding groove; 11. Adjusting plate; 12. Connecting hole; 13. Cover plate; 14. Threaded rod; 15. Glue injection port; 16. Plug; 17. Connecting groove; 18. Rectifier circuit board. Detailed Implementation

[0033] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0034] It should be noted that the rectifier module seals the rectifier circuit board 18 with potting compound, which serves to prevent water and moisture damage. The interior of the housing box 1 is completely filled with potting compound, which also provides support and shock absorption for the rectifier circuit board 18. The thermal conductivity of the potting compound itself allows the heat generated by the rectifier circuit board 18 during operation to be quickly conducted to the housing box 1 and discharged through the housing box 1, thus preventing heat from accumulating inside the housing box 1 for a long time and affecting the rectifier circuit board 18.

[0035] like Figure 1 and Figure 3 As shown, during use, first rotate the threaded rod 14. Since the threaded rod 14 is slidably connected to the receiving box 1 and threadedly connected to the cover plate 13, and the lower side of the cover plate 13 is rotatably connected to the receiving box 1 via a hinge, all the threaded rods 14 are disconnected from the cover plate 13, allowing the cover plate 13 and the receiving box 1 to rotate open. After opening the cover plate 13, the connecting groove 17 located inside the receiving box 1 can be seen. The rectifier circuit board 18 can then be slid into the connecting groove 17. The connecting groove 17 is located on the front and rear sides inside the receiving box 1, so the connecting groove 17 can place the rectifier circuit board 18 inside the receiving box 1. Then, a portion of the potting compound is injected into the receiving box 1, and the position of the rectifier circuit board 18 inside the receiving box 1 is adjusted so that there is a gap between the side of the rectifier circuit board 18 and the inner wall of the receiving box 1, so that the potting compound can cover the side of the rectifier circuit board 18, preventing the rectifier circuit board 18 from contacting the receiving box 1, thereby enhancing insulation.

[0036] like Figure 1 , Figure 3 and Figure 5 As shown, after the potting compound added inside the container 1 has cured, the potting compound is then filled into the container 1. During the filling process, low-frequency vibration is applied to the container 1, such as using a vibration table, to accelerate the rise of air bubbles, thereby avoiding air bubbles in the potting compound inside the container 1 and facilitating heat conduction. After this portion of the potting compound has cured, the cover plate 13 is tightly fitted to the left side of the container 1, and a "U"-shaped sealing gasket is provided on the right side of the cover plate 13. The sealing gasket has insulation and sealing properties, thereby facilitating subsequent injection. After the container 1 and the cover plate 13 are tightly fitted, the plug 16 is removed from the injection port 15, and then the potting compound is added into the container 1 from the injection port 15. Low-frequency vibration is applied to the container 1 again to accelerate the rise of air bubbles, thereby reducing the presence of air bubbles. Then, potting compound is gradually added into the container 1 and the cover plate 13, and vibration is used to remove air bubbles. Finally, the plug 16 is engaged with the injection port 15 to enhance the insulation level.

[0037] like Figure 2 As shown, to facilitate the assembly of the rectifier module onto the corresponding electrical appliance, two lead screws 8 are provided on the right side of the housing box 1. When assembling the housing box 1 with the electrical appliance, the adjusting plate 11 is first connected to the electrical appliance through the connecting hole 12. Then, the position of the housing box 1 on the front side of the adjusting plate 11 is adjusted. Since the lead screw 8 is threadedly connected to the turntable 9, the turntable 9 is not tightly fitted to the adjusting plate 11. Since the lead screw 8 is slidably connected to the sliding groove 10 inside the adjusting plate 11, the position of the housing box 1 on the adjusting plate 11 can be adjusted by the lead screw 8. After adjustment, the turntable 9 is tightly fitted to the side of the adjusting plate 11. In addition, the lead screw 8, turntable 9, sliding groove 10, adjusting plate 11 and connecting hole 12 are all symmetrical about the vertical central axis of the housing box 1, so the housing box 1 can be stably connected to the electrical appliance.

[0038] like Figure 1 and Figure 4 As shown, the cleaning mechanism is composed of a slot 3, a connecting block 4, a connecting plate 5, and a cleaning plate 6. Although the heat dissipation fins 2 can dissipate heat from the housing 1, they are exposed to the air. Therefore, dust easily accumulates between the heat dissipation fins 2, affecting the heat dissipation effect. The connecting plate 5 is slidably connected to the slot 3 through the connecting block 4. The connecting plate 5 is moved by the moving handle 7. Since the side of the cleaning plate 6 is in close contact with the heat dissipation fins 2, the cleaning plate 6 on the side of the connecting plate 5 cleans the inside of the heat dissipation fins 2, thereby preventing dust and other debris from affecting the heat dissipation effect of the heat dissipation fins 2. In addition, the slot 3, connecting block 4, connecting plate 5, cleaning plate 6, and moving handle 7 are all symmetrical about the vertical central axis of the housing 1, so the heat dissipation fins 2 on the upper and lower sides of the housing 1 can be cleaned.

[0039] The contents not described in detail in this specification are existing technologies known to those skilled in the art. All standard parts used in this utility model can be purchased from the market, and irregular parts can be customized according to the description and drawings. The specific connection methods of each part adopt conventional methods such as bolts, rivets, and welding that are mature in the prior art. The machinery, parts and equipment adopt conventional models in the prior art, and the circuit connection adopts conventional connection methods in the prior art, which will not be described in detail here.

[0040] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A high-insulation-level high-voltage rectifier module, comprising: The container (1) has an insulating structure on its left side. The insulating structure is composed of a cover plate (13), a threaded rod (14), an injection port (15), and a plug (16). The lower side of the cover plate (13) is rotatably connected to the container (1) via a hinge. Its characteristic is that it further includes: The upper side of the container (1) is provided with a cleaning mechanism to enhance heat dissipation, and the upper side of the container (1) is provided with heat dissipation fins (2), and the heat dissipation fins (2) are arranged in an array, and the heat dissipation fins (2) are symmetrical about the horizontal central axis of the container (1). The right side of the container (1) is provided with a connecting mechanism for installation, and the right side of the container (1) is provided with a lead screw (8), which is symmetrical about the vertical central axis of the container (1).

2. The high-insulation-level high-voltage rectifier module according to claim 1, characterized in that: The cleaning mechanism is composed of a slot (3), a connecting block (4), a connecting plate (5) and a cleaning plate (6), and the interior of the receiving box (1) is provided with a slot (3), and the slot (3) is symmetrical about the vertical central axis of the receiving box (1).

3. The high-insulation-level high-voltage rectifier module according to claim 2, characterized in that: The slot (3) is slidably connected to a connecting block (4), and the slot (3) and the connecting block (4) correspond one-to-one. The upper side of the connecting block (4) is fixedly connected to the connecting plate (5).

4. The high-insulation-level high-voltage rectifier module according to claim 3, characterized in that: A cleaning plate (6) is provided on the lower side of the connecting plate (5), and the outer side of the cleaning plate (6) is closely attached to the side of the heat dissipation fins (2). A moving handle (7) is provided on the upper side of the connecting plate (5). The slot (3), connecting block (4), connecting plate (5), cleaning plate (6) and moving handle (7) are all symmetrical about the horizontal central axis of the receiving box (1).

5. A high-insulation-level high-voltage rectifier module according to claim 1, characterized in that: The connecting mechanism is composed of a lead screw (8), a turntable (9), a sliding groove (10), an adjusting plate (11), and a connecting hole (12). The lead screw (8) is threadedly connected to the turntable (9), and the lead screw (8) and the turntable (9) correspond one-to-one.

6. A high-insulation-level high-voltage rectifier module according to claim 5, characterized in that: The turntable (9) is slidably connected to the sliding groove (10), and the sliding groove (10) is opened inside the adjusting plate (11). A connecting hole (12) is opened on the upper part of the interior of the adjusting plate (11). The sliding groove (10), the adjusting plate (11) and the connecting hole (12) correspond one-to-one with the turntable (9).

7. A high-insulation-level high-voltage rectifier module according to claim 1, characterized in that: The upper side of the cover plate (13) is threadedly connected to the threaded rod (14), and the threaded rod (14) is slidably connected to the receiving box (1), and the threaded rod (14) is symmetrical about the vertical central axis of the receiving box (1).

8. A high-insulation-level high-voltage rectifier module according to claim 7, characterized in that: The cover plate (13) has glue injection ports (15) starting from the left side, and the glue injection ports (15) are distributed in an array.

9. A high-insulation-level high-voltage rectifier module according to claim 8, characterized in that: The glue injection port (15) is internally slidably connected to a stopper (16), and the glue injection port (15) and the stopper (16) correspond one-to-one.

10. A high-insulation-level high-voltage rectifier module according to claim 1, characterized in that: The inner side of the receiving box (1) is provided with a connecting groove (17), and the connecting groove (17) is symmetrical about the vertical central axis of the receiving box (1). A rectifier circuit board (18) is slidably connected inside the connecting groove (17).

Images