Lifting pressure maintaining device and wafer-level aging test device

Abstract

The utility model discloses a lifting pressure maintaining device and a wafer level aging test device, the lifting pressure maintaining device comprises a bearing platform, a lifting mechanism, a driving device and at least one first transmission member, and the bearing platform is used for bearing a heat sink assembly; the lifting mechanism comprises a first lifting assembly and at least one second lifting assembly, the driving device is in transmission connection with the first lifting assembly, and the first lifting assembly is in transmission connection with any one of the at least one second lifting assembly through a first transmission piece. The first lifting assembly and the second lifting assembly are in transmission connection with the bearing platform. The first lifting assembly and the at least one second lifting assembly cooperatively drive the bearing platform bearing the heat sink assembly to move towards or away from the probe plate assembly. All the lifting assemblies can cooperatively move to drive the heat sink assembly to ascend and descend, and the lifting precision and stability under high air pressure are improved.

Description

Technical Field

[0001] This application relates to the field of semiconductor equipment technology, and in particular to a boost-and-hold device and a wafer-level aging test device. Background Technology

[0002] In existing wafer-level aging test equipment, a test chamber is formed by a lifting structure between the probe plate assembly located above and the heat sink assembly located below. Inert gas is introduced into the test chamber to create a high-pressure test environment to achieve wafer aging test under high temperature and high pressure conditions. However, under high pressure conditions, the upward force of the high-pressure gas puts a lot of pressure on the probe plate assembly and the downward force puts a lot of pressure on the heat sink assembly. The existing lifting structure is unstable and noisy when closing the mold, resulting in poor alignment accuracy when the probe plate assembly and the heat sink assembly are closed to form the test chamber. Furthermore, it is difficult to withstand the high pressure required by the aging test equipment during the wafer aging test process, which is detrimental to the overall stability and safety of the equipment. Utility Model Content

[0003] To address the problems existing in the prior art, this application provides a lifting and holding pressure device and a wafer-level aging test device; the technical solution is as follows:

[0004] This application provides a lifting and pressure holding device for a wafer-level aging test apparatus, the wafer-level aging test apparatus including a heat sink assembly and a probe plate assembly; the lifting and pressure holding device includes a load-bearing platform, a lifting mechanism, a drive device and at least one first transmission component, the load-bearing platform being used to support the heat sink assembly;

[0005] The lifting mechanism includes a first lifting component and at least one second lifting component. The driving device is driven to the first lifting component. The first lifting component is driven to any one of the at least one second lifting component through the first transmission component. The first lifting component and the second lifting component are driven to the load-bearing platform respectively.

[0006] The first lifting component and the at least one second lifting component work together to move the load-bearing platform carrying the heat sink component toward or away from the probe plate component.

[0007] Further, the first lifting assembly includes a second transmission member and a first lifting member that are movably connected, the output end of the drive device is driven to the input end of the first lifting member, and the first lifting member is connected to the load-bearing platform; the second lifting assembly includes a third transmission member and a second lifting member that are movably connected, the input end of any second lifting member is driven to the output end of the first lifting member, and / or, the input end of any second lifting member is driven to the output end of an adjacent second lifting member, and any second lifting member is connected to the load-bearing platform;

[0008] Driven by the drive device, the first lifting member and all the second lifting members synchronously drive the load-bearing platform carrying the heat sink assembly to rise and fall.

[0009] Furthermore, the connection points between the first lifting component and the load-bearing platform and at least one connection point between the second lifting component and the load-bearing platform are respectively located on the periphery of the heat sink component.

[0010] Furthermore, the torque that the drive device can withstand is greater than the load torque of the load-bearing platform, and the torque of the first transmission component is greater than the torque of the drive device.

[0011] Furthermore, it also includes multiple guide components, each of which includes a guide member and a slider that are slidably connected, each of which is vertically arranged, and each of which is fixedly connected to the load-bearing platform.

[0012] Furthermore, it also includes a guide platform, with any of the guide components fixedly connected to the guide platform.

[0013] Furthermore, the guide platform is fixedly connected to the second transmission component and any of the third transmission components.

[0014] Furthermore, it also includes multiple limiting members, any one of which is located on the load-bearing platform. When the heat sink assembly and the probe plate assembly are molded together, the limiting member can abut against the side of the probe plate assembly facing the load-bearing platform.

[0015] Furthermore, it also includes multiple support components, which are fixedly disposed and are also used to connect with the probe plate assembly to define the longitudinal position of the probe plate assembly.

[0016] On the other hand, this application also provides a wafer-level aging test apparatus, including a probe plate assembly, a heat sink assembly, and a lifting and holding pressure device as described in any of the above claims. The probe plate assembly is fixedly positioned longitudinally, and the heat sink assembly and the lifting and holding pressure device are detachably and fixedly connected to the side of the probe plate assembly facing the probe plate assembly.

[0017] Implementing this application will have the following beneficial effects:

[0018] This application provides a lifting mechanism on the side of the load-bearing platform supporting the heat sink assembly away from the probe plate assembly. The drive device is connected to the first lifting assembly, and the first lifting assembly is connected to at least one second lifting assembly through a first transmission component. The first lifting assembly and all the second lifting assemblies can achieve coordinated movement through the same drive device, driving the load-bearing platform and the heat sink assembly to rise and fall synchronously. This effectively improves the lifting accuracy and stability of the heat sink assembly during the lifting process and reduces noise. Furthermore, the mutual coordination between the first lifting assembly and all the second lifting assemblies helps to distribute the force, resulting in good overall support and greatly improving the accuracy and stability of the lifting and pressure-holding device under high air pressure conditions during mold closing, with good pressure resistance. Attached Figure Description

[0019] To more clearly illustrate the technical solutions of this application, the accompanying drawings used in the embodiments will be briefly described below, wherein the same components are represented by the same reference numerals. Obviously, the drawings described below are merely some embodiments of this application, and those skilled in the art can obtain other drawings based on these drawings without any creative effort.

[0020] Figure 1 This is a three-dimensional structural diagram of a lifting and pressure-holding device provided in an embodiment of this application;

[0021] Figure 2 This is a schematic diagram of the structure of a lifting platform provided in an embodiment of this application;

[0022] Figure 3 A bottom view of a probe plate assembly provided in an embodiment of this application;

[0023] Figure 4 This is a schematic diagram of the assembly of a probe plate assembly and a support assembly provided in an embodiment of this application;

[0024] Figure 5 This is a schematic diagram of an overall drive structure for raising and lowering a heat sink assembly, provided in an embodiment of this application.

[0025] Figure 6 An assembly diagram of various components on a guide platform provided for an embodiment of this application;

[0026] Figure 7 A schematic diagram showing the relative positional arrangement of a driving device, a first transmission component, and a guide platform, provided for an embodiment of this application;

[0027] Figure 8 This is a schematic diagram of the transmission structure between a drive device, a first transmission component, and a lifting mechanism, provided as an embodiment of this application.

[0028] The corresponding reference numerals in the figure are as follows:

[0029] 1-Heat sink assembly, 2-Probe plate assembly, 21-Fixing plate, 22-Needle plate, 3-Bearing platform, 31-Connecting part, 4-Lifting mechanism, 41-First lifting assembly, 410-Second transmission component, 411-First lifting component, 42-Second lifting assembly, 420-Third transmission component, 421-Second lifting component, 5-Drive device, 51-First transmission component, 6-Guide assembly, 61-Guide component, 62-Sliding component, 63-Guide platform, 7-First moving assembly, 71-Base plate, 8-Second moving assembly, 9-Support assembly, 91-First support component, 92-Second support component. Detailed Implementation

[0030] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. It should be noted that the terms "upper," "lower," "left," "right," "inner," "outer," "front," "rear," "both ends," "one end," and "the other end," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application, and do not indicate or imply that the device or structure referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the described embodiments are only some embodiments of this application, not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0031] In existing wafer-level aging test equipment, the lifting structure for closing the probe plate assembly and heat sink assembly has poor pressure resistance, unstable operation, high noise, poor overall closing accuracy, and poor safety. Furthermore, there is a spring floating mechanism between the probe plate and the fixed plate inside the probe plate assembly, which is intended to make the probe plate and heat sink assembly self-adaptively parallel. However, the self-adaptation effect is not good, which leads to the instability of the probe plate position and reduces the contact accuracy between the probes in the probe plate and the wafers placed in the heat sink assembly.

[0032] To solve at least one of the above technical problems, such as Figure 1As shown in the figure, this application provides a lifting and holding pressure device and a wafer-level aging test device. The lifting and holding pressure device is used in the wafer-level aging test device, which includes a heat sink assembly 1, a probe plate assembly 2 and the lifting and holding pressure device. The longitudinal position of the probe plate assembly 2 is fixed. The heat sink assembly 1 and the lifting and holding pressure device are detachably and fixedly connected to the side of the lifting and holding pressure device facing the probe plate 2. The lifting and holding pressure device can drive the heat sink assembly 1 to rise and fall, so that the heat sink assembly 1 can be molded with the probe plate assembly 2 to form a wafer test cavity for wafer-level aging test.

[0033] The lifting and pressure-holding device includes a load-bearing platform 3, a lifting mechanism 4, a drive device 5, and at least one first transmission component 51. The load-bearing platform 3 is used to support the heat sink assembly 1. The lifting mechanism 4 includes multiple lifting components, specifically a first lifting component 41 and at least one second lifting component 42. The drive device 5 is drivenly connected to the first lifting component 41. The first lifting component 41 is drivenly connected to any one of the at least one second lifting component 42 via the first transmission component 51. The first lifting component 41 and the second lifting component 42 are respectively drivenly connected to the load-bearing platform 3. The first lifting component 41 and at least one second lifting component 42 can work together to move the load-bearing platform 3, which carries the heat sink assembly 1, toward or away from the probe plate assembly 2. When the probe plate assembly 2 moves, the load-bearing platform can move to the point where the heat sink assembly 1 and the probe plate assembly 2 are molded together to form a wafer testing cavity. In this way, multiple lifting assemblies 4 are driven to lift synchronously by the same drive device 5, resulting in good consistency in lifting stroke. The multiple lifting assemblies cooperate with each other to lift, which can effectively improve lifting accuracy, ensure smooth operation, reduce noise, and improve the mold-closing accuracy of the heat sink assembly 1 and the probe plate assembly 2, thereby improving the overall safety of the lifting and pressure-holding device. Moreover, the first lifting assembly 41 and at least one second lifting assembly 42 are distributed among the multiple lifting assemblies, which can provide multiple support points, which can help to distribute the force. This allows the load-bearing platform 3 and the heat sink assembly 1 to still have high positional accuracy and stability under high air pressure, and strong resistance to deformation, which greatly improves the mold-closing accuracy and stability.

[0034] In some exemplary embodiments, the lifting and pressure-holding device includes a base plate 71, which can be connected to the probe plate assembly 2 to fix the longitudinal position of the probe plate assembly 2. The load-bearing platform 3 and the lifting mechanism 4 are located between the base plate 71 and the probe plate assembly 2, and can be collectively referred to as the lifting platform.

[0035] Among them, such as Figure 2 As shown, the side of the heat sink assembly 1 facing the probe plate assembly 2 is a cavity for accommodating the wafer to be tested. After the heat sink assembly 1 and the probe plate assembly 2 are molded together, the cavity forms a sealed wafer test cavity. Furthermore, the heat sink assembly 1 is equipped with a heating wire, which can heat the wafer test cavity to simulate a high-temperature environment.

[0036] Specifically, the heat sink assembly 1 is provided with an inflation port, which can be located on the side wall or the bottom of the heat sink assembly 1. The inflation port can be connected to an external air pipe for introducing gas into the wafer testing cavity when the probe plate assembly 2 and the heat sink assembly 1 are closed, to simulate high pressure conditions and perform aging tests on the wafer placed in the heat sink assembly 1. For example, the other end of the air pipe can be connected to an inert gas storage device, and the inert gas can be nitrogen or the like, so that the inert gas is introduced into the wafer testing cavity through the air pipe and the inflation port to increase the pressure in the wafer testing cavity and form a high-pressure testing environment. In some preferred embodiments, the inflation port is a through hole located at the bottom of the heat sink assembly 1.

[0037] Specifically, such as Figure 3 As shown, the probe plate assembly 2 includes a fixed plate 21 and a needle plate 22. The needle plate 22 is located on the side of the fixed plate 21 facing the heat sink assembly 1. The heat sink assembly 1 can be molded with the needle plate 22, thereby effectively improving the alignment accuracy between the needle plate 22 and the heat sink assembly 1. A probe is installed on the needle plate 22. After the probe plate assembly 2 and the heat sink assembly 1 are molded, that is, after the needle plate 22 and the heat sink assembly 1 are aligned and molded, the probe can make high-precision contact with the wafer and the probe is embedded in the wafer. The fixed plate 21 is fixedly positioned in the longitudinal direction and can be connected to the base plate 71. The needle plate 22 and the fixed plate 21 are detachably fixedly connected. A spring floating mechanism is also provided between the two to make... The adaptive parallel structure of the two, with the needle plate 22 and the fixing plate 21 directly fixedly connected, can effectively improve the positional accuracy of the needle plate 22, avoid the wobbling of the needle plate 22 in the horizontal and vertical directions, and form a more efficient force transmission path. The force exerted by the high pressure in the wafer test cavity on the needle plate 22 is effectively dispersed to the larger area of ​​the fixing plate 21, so that the probe plate assembly 2 as a whole can resist the high pressure of the wafer test cavity without deformation, preventing the relative movement between the probe and the wafer caused by deformation, and greatly improving the alignment accuracy. In some optional embodiments, the needle plate 22 and the fixing plate 21 are connected by bolts, which has a good locking effect.

[0038] Furthermore, in some exemplary embodiments, the probe plate assembly 2 is movably connected to the base plate 71 in the horizontal direction, so that in the early stage of wafer aging test, the probe plate assembly 2 can move horizontally backward relative to the base plate 71, which is beneficial to improve the alignment accuracy between the heat sink assembly 1 and the probe plate assembly 2 before lifting and lowering, while the longitudinal position of the probe plate assembly 2 remains unchanged, which is beneficial to improve the mold closing accuracy.

[0039] Specifically, such as Figure 1As shown, the lifting and pressure-holding device also includes multiple support components 9, distributed on both sides of the load-bearing platform 3. The support components 9 are fixedly installed, specifically, they can be fixedly connected to the base plate 71. The support components 9 are also connected to the probe plate assembly 2, specifically, they can be movably connected to the probe plate assembly 2 in the horizontal direction to effectively support the probe plate assembly 2, improve the overall strength of the probe plate assembly 2, and limit the longitudinal position of the probe plate assembly 2. In some exemplary embodiments, the support component 9 is an integral structure, which can be formed by welding, resulting in high overall support strength and effectively improving the strength and deformation resistance of the probe plate assembly 2.

[0040] Specifically, in some exemplary embodiments, multiple support components 9 are symmetrically arranged about the center of the load-bearing platform 3 or the probe plate assembly 2 to improve the support balance of the probe plate assembly 2 and further improve the deformation resistance and structural stability of the probe plate assembly 2 and the lifting and pressure holding device; for example, in some embodiments, the lifting and pressure holding device includes two support components 9, which are symmetrically arranged on both sides of the probe plate assembly 2.

[0041] Specifically, in some optional embodiments, the support component 9 includes a plurality of first support members 91. One end of the first support member 91 is fixedly disposed, specifically it can be fixedly connected to the base plate 71, and the other end is connected to the probe plate assembly 2, specifically it can be movably connected to the probe plate assembly 2 in the horizontal direction. The plurality of first support members 91 cooperate with each other to effectively support the probe plate assembly 2. For example, the lifting and pressure holding device includes two support components 9, each support component 9 including two first support members 91, and the four first support members 91 are respectively distributed at the four corners of the lifting and pressure holding device to improve the support strength of the probe plate assembly 2.

[0042] In some optional embodiments, the support assembly 9 further includes at least one second support member 92, each second support member 92 being fixedly connected to a plurality of first support members 91, and the first support members 91 and the second support members 92 forming an interlaced structure, which can be a transverse longitudinal interlaced structure or an oblique interlaced structure, so that the plurality of first support members 91 cooperate with each other to further enhance the support strength of the first support members 91 for the probe plate assembly 2.

[0043] The number of first support members 91 can be two, three, four, etc., and the number of second support members 92 can be one, two, three, four, etc., to cooperate and enhance the overall support strength of the support assembly 9 for the probe plate assembly 2; for example, Figure 4 As shown, the support component 9 includes three longitudinally arranged first support members 91 and two laterally arranged second support members 92. Each second support member 92 spans across the three first support members 91 to form an integrated and coordinated structure, thereby enhancing the overall strength of the support component 9.

[0044] In some preferred embodiments, multiple first support members 91 and at least one second support member 92 are welded together in the same support assembly 9, resulting in high support strength.

[0045] Specifically, such as Figure 5 As shown, the first lifting assembly 41 includes a second transmission member 410 and a first lifting member 411 that are movably connected. The longitudinal position of the second transmission member 410 is fixed, and the first lifting member 411 is connected to the load-bearing platform 3. The second lifting assembly 42 includes a third transmission member 420 and a second lifting member 421 that are movably connected. The longitudinal position of the third transmission member 420 is fixed, which serves to fix the second lifting assembly 42. Any second lifting member 421 is connected to the load-bearing platform 3. Thus, under the drive of the drive device 5, the first lifting member 411 and all the second lifting members 421 synchronously drive the load-bearing platform 3 carrying the heat sink assembly to rise and fall, which can effectively improve the lifting accuracy, run smoothly, reduce noise, and help improve the mold closing accuracy of the heat sink assembly 1 and the probe plate assembly 2.

[0046] In some exemplary embodiments, both the first lifting assembly 41 and the second lifting assembly 42 can be screw jacks. Accordingly, the first lifting member 411 and the second lifting member 421 are screws, which are convenient to drive, have high precision, and good stability. In some exemplary embodiments, the second transmission member 410 and the third transmission member 420 are speed reducers. The input end of the speed reducer in the first lifting assembly 41 is driven and connected to the output end of the drive device 5. The input end of the speed reducer in the second lifting assembly 42 is driven and connected to the output end of the adjacent first lifting assembly 41 or the output end of the adjacent second lifting assembly 42, so as to further improve the lifting precision of the lifting mechanism 4.

[0047] In some exemplary implementations, such as Figure 5 As shown, the output end of the drive device 5 is driven to the input end of the first lifting member 410, the input end of any second lifting member 421 is driven to the output end of the first lifting member 411, and / or, the input end of any second lifting member 421 is driven to the output end of an adjacent second lifting member 421, so that when the first lifting assembly 41 is driven to two or more second lifting assemblies 42 through the first transmission member 51, the two or more second lifting assemblies 42 are connected in parallel or in series, resulting in high transmission efficiency and transmission accuracy.

[0048] Specifically, such as Figure 5As shown, in some exemplary embodiments, the lifting and pressure-holding device further includes a guide platform 63, on which the lifting mechanism 4 is disposed. Specifically, the second transmission member 410 is fixedly connected to the guide platform 63, and any third transmission member 420 is fixedly connected to the guide platform and is connected to the base plate 71 through the guide platform 63. The guide platform 63 is provided with a plurality of first through holes. The second transmission member 410 and any third transmission member 420 are located on the side of the guide platform 63 away from the load-bearing platform 3. The first lifting member 411 and any second lifting member 421 respectively pass through their respective first through holes and are connected to the load-bearing platform 3, so that during the lifting and lowering process of the first lifting member 411 relative to the second transmission member 410, and during the lifting and lowering process of any second lifting member 421 relative to the third transmission member 420, the load-bearing platform 3 and the heat sink assembly 1 are driven to lift and lower together.

[0049] like Figure 6 As shown, in some exemplary embodiments, the load-bearing platform 3 is provided with a plurality of connecting portions 31 on the side facing the guide platform 63. Any one of these connecting portions 31 is rotatably connected to the end of the first lifting member 411 away from the second transmission member 410, and the diameter of the connecting portion 31 is larger than the diameter of the first lifting member 411, so as to increase the contact area between the first lifting member 411 and the load-bearing platform 3, improve the connection strength between the first lifting member 411 and the load-bearing platform 3, and help improve the lifting accuracy and lifting stability of the load-bearing platform 3 and the heat sink assembly 1. Similarly, any one of these connecting portions 31 is rotatably connected to the end of any second lifting member 421 away from the third transmission member 420, and the diameter of the connecting portion 31 is larger than the diameter of any second lifting member 421, so as to increase the contact area between any second lifting member 421 and the load-bearing platform 3, improve the connection strength between any second lifting member 421 and the load-bearing platform 3, and help improve the lifting accuracy and lifting stability of the load-bearing platform 3 and the heat sink assembly 1.

[0050] In some exemplary embodiments, the second transmission member 410 and the first lifting member 411 are rotatably connected; further, the second transmission member 410 and the first lifting member 411 are threadedly connected; during the lifting process, the second transmission member 410 is fixed and does not transmit power, while the first lifting member 411 rotates relative to the second transmission member 410. During the process of the driving device 5 driving the first lifting member 411 to rotate and converting the rotational motion into its own longitudinal translational motion, the second transmission member 410 is prevented from hindering the rotation of the first lifting member 411. The first lifting member 411 is rotatably connected to the connecting part 31 and will not drive the load-bearing platform 3 to rotate, but will drive the load-bearing platform 3 to lift and lower; the third transmission member 420 and the second lifting member 421 can adopt the same structure, which will not be described in detail here; in this way, the first lifting member 411 and all the second lifting members 421 cooperate with each other, resulting in high lifting accuracy and good lifting stability.

[0051] Specifically, in the horizontal direction, the connection points of the first lifting component 41 and the load-bearing platform 3 and at least one connection point of the second lifting component 42 and the load-bearing platform 3 are respectively located on the periphery of the heat sink component 1, so as to form a relatively balanced lifting force on the heat sink component 1 in the circumferential direction and improve the lifting stability.

[0052] Specifically, in some exemplary embodiments, the lifting mechanism 4 is arranged symmetrically about the center of the load-bearing platform 3 to improve the lifting balance and stability of the load-bearing platform 3 during the lifting process of the first lifting member 411 and each of the second lifting members 421. It can also effectively prevent the load-bearing platform 3 from tilting when the mold is closed, and greatly improve the mold closing accuracy and mold closing stability of the heat sink assembly 1 and the pin plate 22.

[0053] Specifically, such as Figure 6 As shown, in some optional embodiments, the ratio between the horizontal distance between adjacent first lifting members 411 and second lifting members 421 near the same edge of the guide platform 63 and the side length of the guide platform 63 is greater than or equal to a preset ratio, and the ratio between the horizontal distance between two adjacent second lifting members 421 near the same edge of the guide platform 63 and the side length of the guide platform 63 is greater than or equal to a preset ratio, which is 0.7 to 0.9; it can be understood that the preset ratio can be any value from 0.7 to 0.9; for example, the preset ratio can be 0.7, 0.72, 0.75, 0.8, 0.85, or 0.9; thus, the ratio between the horizontal distance between adjacent first lifting members 411 and second lifting members 421 near the same edge of the guide platform 63 and the side length of the guide platform 63 is greater than or equal to a preset ratio, which is 0.7 to 0.9; it can be understood that the preset ratio can be any value from 0.7 to 0.9; for example, the ratio between the horizontal distance between adjacent second lifting members 421 near the same edge of the guide platform 63 is greater than or equal to a preset ratio, which is 0.7 to 0.9. The increased horizontal span between adjacent first lifting members 411 and second lifting members 421, and between adjacent second lifting members 431, effectively increases the stability of the lifting mechanism 4, the load-bearing platform 3, and the heat sink assembly 1, resulting in better deformation resistance and improved lifting accuracy as well as the mold closing accuracy between the heat sink assembly 1 and the probe plate assembly 2. For example, in some embodiments, the preset ratio is 0.85, meaning that the ratio between the horizontal distance between adjacent first lifting members 411 and second lifting members 421 near the edge of the same guide platform 63 and the side length of the edge of the guide platform 63 is greater than or equal to 0.85, effectively increasing the horizontal span and improving balance stability.

[0054] Specifically, such as Figure 7As shown, the drive device 5 and the first transmission component 51 are located on the side of the guide platform 63 away from the load-bearing platform 3. The drive device 5 is used to drive the first lifting component 411 in the lifting mechanism 4 to lift and lower. The first transmission component 51 is used to drive and connect two or more lifting components. Specifically, it can drive and connect the first lifting component 411 and the second lifting component 421 on the same edge, or drive and connect two second lifting components 421 on the same edge, so that multiple lifting components can move in coordination. In some optional embodiments, the drive device 5 is a motor. Further, the drive device 5 is a servo motor, which has high precision and is beneficial to improving the lifting precision of the first lifting component 411, the second lifting component 421, the load-bearing platform 3 and the heat sink component 1. In some optional embodiments, the first transmission component 51 can be a coupling, which has high transmission precision and good reliability.

[0055] For example, three lifting components are evenly distributed in the guide platform 63, including a first lifting component 41 and two second lifting components 42. The drive device 5 is connected to the first lifting component 41. The first lifting component 41 and two adjacent second lifting components 42 near the edge of the same guide platform 63 are connected to each other through the first transmission member 51 to realize the synchronous lifting of the three lifting components.

[0056] For example, such as Figure 8 As shown, four lifting components are evenly distributed in the guide platform 63, including one first lifting component 41 and three second lifting components 42, which are located at the four corners of the guide platform 63 respectively. The drive device 5 is connected to the first lifting component 41. The first lifting component 41 is connected to two adjacent second lifting components 42 near the same edge of the guide platform 63 through the first transmission component 51. The third second lifting component 42 is connected to one of the two adjacent second lifting components 42 near the same edge of the guide platform 63, so as to realize the synchronous lifting of the four lifting components.

[0057] Specifically, the torque of the drive device 5 can withstand a load greater than that of the load-bearing platform 3, and the torque of the first transmission component 51 is greater than that of the drive device 5, so as to effectively improve the stability and accuracy of the drive and transmission, improve the movement accuracy and stability of the first lifting component 411 and the second lifting component 421 during the lifting process, and at the same time help to reduce noise; for example, by filling the wafer testing cavity with 0.3MPa of inert gas through the air inlet, after converting the pressure into pressure, the load of the load-bearing platform 3 is about 2T, then the torque of the drive device 5 corresponds to a load greater than 2T, and the torque of the first transmission component 51 is further greater than that of the drive device 5, so as to effectively improve the transmission accuracy and stability.

[0058] Specifically, in some exemplary embodiments, the load of the drive device 5 is greater than or equal to a preset load, which refers to the load that the drive device 5 can withstand. The preset load is 1.8T to 2.8T. It can be understood that the preset load can be any value among 1.8T to 2.8T. For example, the preset load can be 1.8T, 1.85T, 1.9T, 2T, 2.2T, 2.5T, 2.8T, etc. In this way, the torque of the drive device 5 corresponds to a larger load that can withstand, which can effectively improve the accuracy and stability of the lifting of the first lifting member 411 and the second lifting member 421. For example, in one specific embodiment, the preset load can be selected as 2.2T, and correspondingly, the load of the drive device 5 is greater than or equal to 2.2T. In some preferred embodiments, the load of the drive device 5 is greater than the preset load.

[0059] Specifically, such as Figure 6 As shown, the lifting and pressure-holding device also includes multiple guide components 6. Each guide component 6 includes a guide member 61 and a sliding member 62 that are slidably connected. Each guide member 61 is vertically arranged. Further, the guide member 61 can be fixedly connected to the guide platform 63, and each sliding member 62 can be fixedly connected to the load-bearing platform 3. Specifically, it can be fastened with screws. Multiple sliding members 62 can slide together to limit the lifting direction of the load-bearing platform 3 and the heat sink component 1, effectively improving the balance and stability of the load-bearing platform 3 and the heat sink component 1 during lifting and after mold closing. In some exemplary embodiments, the guide member 61 is a linear guide rail, and the sliding member 62 is slidably connected to the linear guide rail. In other exemplary embodiments, the guide member 61 is a linear bearing, and the sliding member 62 is a guide shaft. The linear bearing and the guide shaft are slidably connected, effectively limiting the lifting direction of the load-bearing platform 3 and providing good guiding effect. In other optional embodiments, the guide member 61 is arranged around the sliding member 62, which can circumferentially limit the sliding member 62 during lifting and lowering, effectively preventing the sliding member 62 from shaking, and further improving the accuracy and stability of the lifting and lowering of the heat sink component 1 and mold closing.

[0060] In some exemplary embodiments, multiple guide components 6 are arranged symmetrically about the center of the load-bearing platform 3, or multiple guide components 6 are evenly distributed on the guide platform 63, effectively improving guide balance and guide stability.

[0061] Specifically, in some exemplary embodiments, the diameter of the slider 62 is larger than the diameter of the first lifting member 411, and / or the diameter of the slider 62 is larger than the diameter of the second lifting member 421. The slider 62 has higher structural strength and can further improve guiding accuracy and guiding stability by cooperating with the first lifting member 411 and the second lifting member 421.

[0062] Specifically, such as Figure 6As shown, the ratio between the horizontal distance between two adjacent sliding members 62 near the edge of the same guide platform 63 and the side length of the edge of the guide platform 63 is greater than or equal to a desired ratio, which is 0.7 to 0.9. It can be understood that the desired ratio can be any value between 0.7 and 0.9. For example, the desired ratio can be 0.7, 0.72, 0.75, 0.8, 0.85, or 0.9. In this way, the horizontal span between two adjacent sliding members 62 near the edge of the same guide platform 63 is increased, which can effectively increase the stability of the lifting mechanism 4, the load-bearing platform 3, and the heat sink assembly 1, and improve the deformation resistance. This is beneficial to improving the lifting accuracy and the mold closing accuracy between the heat sink assembly 1 and the probe plate assembly 2. For example, in some embodiments, the desired ratio is 0.88, that is, the ratio between the horizontal distance between two sliding members 62 near the edge of the same guide platform 63 and the side length of the edge of the guide platform 63 is greater than or equal to 0.88. The horizontal span is effectively increased, and the balance stability is good.

[0063] Specifically, in some preferred embodiments, in the horizontal direction, the guide assembly 6 is located on the periphery of the lifting mechanism 4. On the one hand, the increased horizontal span between the guide assemblies 6 is beneficial to improving the guiding balance and guiding stability. On the other hand, it is convenient to assemble and also avoids interference between the guide assembly 6 and the drive device 5 and the first transmission component 51 during the movement, which is beneficial to improving the overall operational stability and operational reliability.

[0064] Specifically, the lifting and pressure-holding device also includes multiple limiting members. Any limiting member is located on the load-bearing platform 3. When the heat sink assembly 1 and the probe plate assembly 2 are closed, the limiting member can abut against the side of the probe plate assembly 2 facing the load-bearing platform 3. In some exemplary embodiments, any limiting member can also be located on the side of the probe plate assembly 2 facing the load-bearing platform 3. When the heat sink assembly 1 and the probe plate assembly 2 are closed, the limiting member can abut against the side of the load-bearing platform 3 facing the probe plate assembly 2. In this way, it can effectively prevent the lifting mechanism 4 from lifting too high, causing excessive pressure between the heat sink assembly 1 and the probe plate assembly 2 and damaging them to each other, thereby improving the overall stability and reliability of the lifting and pressure-holding device.

[0065] Furthermore, it should be noted that the first vertical distance between the heat sink assembly 1 and the probe plate assembly 2 is smaller than the second vertical distance between the limiting member and the probe plate assembly 2, so that the heat sink assembly 1 and the probe plate assembly 2 can be effectively and reliably molded to form a wafer testing cavity. However, the first vertical distance and the second vertical distance are only slightly different, so as to effectively play a limiting role without affecting the mold closing between the heat sink assembly 1 and the probe plate assembly 2. For example, in some exemplary embodiments, the vertical distance between the end face of the heat sink assembly 1 near the probe plate assembly 2 and the end face of the limiting member near the probe plate assembly 2 is 0.01mm to 0.03mm.

[0066] In some exemplary embodiments, when the mold is closed, a height adjustment component, such as a gap plate, can also be provided between the limiting component and the probe plate assembly 2 to adjust the longitudinal distance between the load-bearing platform 3 and the probe plate assembly 2, so that the sealing between the needle plate 22 and the heat sink assembly 1 is good when the mold is closed, while avoiding damage to the heat sink assembly 1, thus ensuring good reliability.

[0067] Specifically, in some exemplary embodiments, the lifting and pressure-holding device further includes a pressure sensing element, which is used to detect the pressure between the probe plate assembly 2 and the load-bearing platform 3 during the lifting and lowering process of the load-bearing platform 3. The pressure sensing element is located on the side of the probe plate assembly 2 facing the load-bearing platform 3, or the pressure sensing element is located on the side of the load-bearing platform 3 facing the probe plate assembly 2. This can effectively prevent excessive displacement during the lifting and lowering process from damaging the heat sink assembly 1 and other structures, which is beneficial to extending the overall life of the lifting and pressure-holding device and improving the accuracy and reliability of the aging test.

[0068] Specifically, such as Figure 2 As shown, the lifting and pressure-holding device also includes a first moving component 7 and a second moving component 8. The first moving component 7 is located between the base plate 71 and the second moving component 8, and the lifting mechanism 4, the heat sink component 1, and the guide platform 63 are located on the second moving component 8. The first moving component 7 is movably connected to the base plate 71 and can drive the second moving component 8, the lifting mechanism 4, the guide platform 63, and the load-bearing platform 3 to move together in a first horizontal direction. The second moving component 8 is movably connected to the first moving component 7 and can drive the lifting mechanism 4, the guide platform 63, and the load-bearing platform 3 to move in a second horizontal direction. The first horizontal direction and the second horizontal direction intersect. Through the first moving component 7 and the second moving component 8, the heat sink component 1 can be driven to move freely in the horizontal direction, providing good mobility. In some exemplary embodiments, the first horizontal direction can be the X direction and the second horizontal direction can be the Y direction; or, in other exemplary embodiments, the first horizontal direction can be the Y direction and the second horizontal direction can be the X direction, to improve the flexibility of the setting of the first moving component 7 and the second moving component 8.

[0069] Specifically, the relative position of the heat sink assembly 1 and the load-bearing platform 3 in the longitudinal direction is fixed. The heat sink assembly 1 is rotatably connected to the load-bearing platform 3, that is, the heat sink assembly 1 can rotate relative to the load-bearing platform 3. In conjunction with the lifting mechanism 4, the first moving assembly 7 and the second moving assembly 8, the heat sink assembly 1 can rotate and translate in three dimensions, realizing four degrees of freedom of movement, driving the wafer to move below the needle plate 22 for high-precision alignment and mold closing, while the probe plate assembly 2 and the probe position remain unchanged. This lifting and pressure holding device can achieve a high needle insertion accuracy of 10μm, that is, the positional accuracy between the probe and the wafer is within 10μm, so as to facilitate wafer testing under high temperature and high pressure environment, with good stability and strong resistance to deformation.

[0070] On the other hand, this application provides a control method for a lifting and pressure-holding device to control the movement of the lifting and pressure-holding device as described above, the control method comprising:

[0071] In response to the alignment completion signal of the probe plate assembly and the heat sink assembly, the control drive device drives the first lifting assembly and at least one second lifting assembly to move, so as to coordinate the movement of the load-bearing platform carrying the heat sink assembly toward the probe plate assembly to form a wafer testing cavity. The alignment completion signal is used to indicate the longitudinal alignment of the probe plate assembly and the heat sink assembly.

[0072] Furthermore, in some exemplary embodiments, before the control drive device drives the first lifting assembly and at least one second lifting assembly to move in response to the alignment completion signal of the probe plate assembly and the heat sink assembly, the control method further includes:

[0073] In response to the alignment signal, the first moving component and the second moving component are controlled to move, so as to move the load-bearing platform in the horizontal direction until the heat sink component and the probe plate component are aligned in the longitudinal direction; the alignment signal is used to indicate that the probe plate component and the heat sink component are misaligned in the longitudinal direction.

[0074] The alignment signal can be obtained by setting a monitoring element between the heat sink assembly and the probe plate assembly. For example, in some embodiments, the monitoring element may include a camera element to capture a positional image between the heat sink assembly and the probe plate assembly, send it to the controller for logical analysis, and generate an alignment signal when the probe plate assembly and the heat sink assembly are misaligned in the longitudinal direction. In response to the alignment signal, the first moving assembly and the second moving assembly are driven to move to align the heat sink assembly and the probe plate assembly. Furthermore, when the probe plate assembly and the heat sink assembly are aligned in the longitudinal direction, an alignment completion signal is generated. In response to the alignment completion signal, the drive device is controlled to drive the first lifting assembly and at least one second lifting assembly to move, thereby realizing mold closing.

[0075] On the other hand, this application also provides a wafer-level aging test equipment, including multiple wafer-level aging test devices. The multiple wafer-level aging test devices can be arranged horizontally or vertically, which is beneficial to improving aging efficiency and the convenience of loading and unloading. Alternatively, the multiple wafer-level aging test devices can be arranged in an array, which can further save space and improve space utilization. For example, in a specific embodiment, the aging test equipment includes nine wafer-level aging test devices, which can be arranged in three columns in the vertical direction and three columns in the horizontal direction, improving aging efficiency while effectively saving space.

[0076] On the other hand, this application provides a wafer-level aging test system, including a wafer-level loading and unloading device, a wafer-level transport device, and a wafer-level aging test device as described above. The wafer-level transport device is disposed in the loading and unloading path between the wafer-level loading and unloading device and the wafer-level aging test device to facilitate the transport of wafers between the wafer-level loading and unloading device and the wafer-level aging test device.

[0077] The above description is merely some embodiments of this application and is not intended to limit this application. Those skilled in the art should understand that various changes and improvements may be made to this application, and any modifications, equivalent substitutions and improvements made in accordance with this application fall within the scope of protection claimed by this application.

Claims

1. A lifting and holding pressure device for a wafer-level aging test apparatus, the wafer-level aging test apparatus comprising a heat sink assembly and a probe plate assembly; characterized in that, The lifting and pressure-holding device includes a load-bearing platform, a lifting mechanism, a driving device, and at least one first transmission component. The load-bearing platform is used to support the heat sink assembly. The lifting mechanism includes a first lifting component and at least one second lifting component. The driving device is driven to the first lifting component. The first lifting component is driven to any one of the at least one second lifting component through the first transmission component. The first lifting component and the second lifting component are driven to the load-bearing platform respectively. The first lifting component and the at least one second lifting component work together to move the load-bearing platform carrying the heat sink component toward or away from the probe plate component.

2. The lifting and pressure-holding device according to claim 1, characterized in that, The first lifting assembly includes a second transmission member and a first lifting member that are movably connected. The output end of the driving device is driven to the input end of the first lifting member, and the first lifting member is connected to the load-bearing platform. The second lifting assembly includes a third transmission member and a second lifting member that are movably connected. The input end of any second lifting member is driven to the output end of the first lifting member, and / or, the input end of any second lifting member is driven to the output end of an adjacent second lifting member, and any second lifting member is connected to the load-bearing platform. Driven by the drive device, the first lifting member and all the second lifting members synchronously drive the load-bearing platform carrying the heat sink assembly to rise and fall.

3. The lifting and pressure-holding device according to claim 1, characterized in that, The connection points between the first lifting component and the load-bearing platform and at least one connection point between the second lifting component and the load-bearing platform are respectively located on the periphery of the heat sink component.

4. The lifting and pressure-holding device according to claim 1, characterized in that, The torque that the drive device can withstand is greater than the load torque of the load-bearing platform, and the torque of the first transmission component is greater than the torque of the drive device.

5. The lifting and pressure-holding device according to claim 2, characterized in that, It also includes multiple guide components, each of which includes a guide member and a slider that are slidably connected, each of which is vertically arranged, and each of which is fixedly connected to the load-bearing platform.

6. The lifting and pressure-holding device according to claim 5, characterized in that, It also includes a guide platform, with any of the guide components fixedly connected to the guide platform.

7. The lifting and pressure-holding device according to claim 6, characterized in that, The guide platform is fixedly connected to the second transmission component and any of the third transmission components.

8. The lifting and pressure-holding device according to any one of claims 1-7, characterized in that, It also includes multiple limiting members, any one of which is located on the load-bearing platform. When the heat sink assembly and the probe plate assembly are molded together, the limiting member can abut against the side of the probe plate assembly facing the load-bearing platform.

9. The lifting and pressure-holding device according to any one of claims 1-7, characterized in that, It also includes multiple support components, which are fixedly arranged and are also used to connect with the probe plate assembly to define the longitudinal position of the probe plate assembly.

10. A wafer-level aging test apparatus, characterized in that, It includes a probe plate assembly, a heat sink assembly, and a lifting and pressure holding device as described in any one of claims 1 to 9, wherein the probe plate assembly is fixedly positioned longitudinally, and the heat sink assembly is detachably and fixedly connected to the side of the lifting and pressure holding device facing the probe plate assembly.

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