IC chip packaging support

Abstract

The utility model discloses an integrated circuit (IC) chip packaging support, which relates to the technical field of IC chip packaging and comprises a cylindrical table, a pressing mechanism, a support frame, a support frame and a support frame, and is characterized in that the pressing mechanism is arranged above one side of the cylindrical table; the bearing plate is rotationally arranged at the top of the inner side of the cylindrical table, and a plurality of positioning grooves are formed in the edge side of the bearing plate at intervals; the storage plate is connected to the positioning groove in a sliding mode, and the bottom end of the storage plate is fixedly connected with an ejector rod extending downwards; and the fixing plate is located below the bearing plate and fixed to the inner wall of the cylindrical table, and the side edge of the top end of the fixing plate is fixedly connected with a jacking slope block. The rotation of the bearing plate in the cylindrical table is matched with the sliding of the upper object placing plate in the positioning groove and the jacking action of the jacking slope block on the fixing plate on the jacking rod, so that when the bearing plate drives the positioning groove to rotate to a preset position, the jacking rod is in contact with the jacking slope block and is passively jacked, the object placing plate is jacked upwards, and the object placing plate is fixed. The packaging chips borne on the object placing plate can be ejected out of the positioning grooves, and therefore a user can take the packaging chips conveniently.

Description

Technical Field

[0001] This utility model relates to the field of IC chip packaging technology, and in particular to an IC chip packaging bracket. Background Technology

[0002] A packaged chip is a type of IC chip that is encapsulated and stored in a casing. Currently, IC chip packaging is mainly accomplished through a packaging substrate.

[0003] Existing chip packaging brackets mainly consist of a stage with positioning grooves, a suction cup, and a pressing mechanism that drives the suction cup to rise and fall. The lower housing containing the chip is placed in the positioning groove of the stage, the suction cup adsorbs the upper housing, and the pressing mechanism drives the suction cup to press the upper housing and the lower housing together to achieve chip packaging.

[0004] However, in the chip packaging brackets currently in use, the positioning grooves on the stage have a certain depth to ensure the stable placement of the lower housing and the accurate pressing position of the upper and lower housings. This makes it difficult for users to remove the packaged chip from the positioning groove due to the depth of the positioning groove, thus reducing the convenience of chip unloading. Therefore, an IC chip packaging bracket with convenient unloading is proposed. Utility Model Content

[0005] The purpose of this invention is to provide an IC chip packaging bracket to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution: an IC chip packaging bracket, comprising:

[0007] A cylindrical platform, wherein a pressing mechanism is provided on the upper side of one side of the cylindrical platform;

[0008] A support plate is rotatably mounted on the top of the inner side of the cylindrical platform, and multiple positioning grooves are provided at intervals on the side of the support plate.

[0009] A shelf, which is slidably connected to a positioning groove, and a downwardly extending top rod is fixedly connected to the bottom end of the shelf;

[0010] A fixing plate is located below the bearing plate and fixed to the inner wall of the cylindrical platform. A lifting ramp is fixedly connected to the top edge of the fixing plate.

[0011] Preferably, the bottom of the positioning groove is provided with a connecting groove that connects to the bottom end of the bearing plate, the bottom of the top rod passes through the connecting groove and extends downward to the top edge of the fixed plate, and a protective pad is fixedly connected to the top of the shelf.

[0012] Preferably, the bottom of the top rod has an upwardly recessed groove, and a roller is rotatably connected in the groove. The outer wall of the roller is movably fitted to the top of the fixed plate.

[0013] Preferably, a spring seat is fixedly connected to the outer wall of the top rod at a position below the bearing plate, and an elastic compression spring is fixedly connected between the spring seat and the bottom end of the bearing plate.

[0014] Preferably, a rotating shaft is rotatably connected to the middle of the fixed plate, the rotating shaft extends upward and is fixedly connected to the middle of the bearing plate, and a servo geared motor for driving the rotating shaft to rotate is fixedly connected to the bottom end of the fixed plate.

[0015] Preferably, the pressing mechanism includes:

[0016] A bracket is fixedly connected to the side wall of the cylindrical platform, and the top of the bracket protrudes horizontally toward the center of the cylindrical platform.

[0017] A pneumatic suction cup is located below the protrusion on the top of the bracket, and an electric telescopic rod for driving the pneumatic suction cup to rise and fall is fixedly connected between the pneumatic suction cup and the bracket.

[0018] Compared with the prior art, the technical effects of this utility model are as follows:

[0019] This invention utilizes the rotation of the support plate within the cylindrical platform, combined with the sliding of the placement plate within the positioning groove and the lifting action of the lifting ramp on the fixed plate on the top rod. When the support plate drives the positioning groove to rotate to a preset position, the top rod contacts the lifting ramp and is passively lifted, pushing the placement plate upwards. This allows the packaged chip carried on the placement plate to be ejected from the positioning groove, thus facilitating the user's removal of the packaged chip. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the overall structure of this utility model.

[0021] Figure 2 This is a three-dimensional sectional view of the support plate of this utility model.

[0022] Figure 3 This utility model Figure 2 A magnified schematic diagram of the structure at point A.

[0023] Figure 4 This is a three-dimensional structural diagram of the fixing plate of this utility model.

[0024] In the diagram: 100, cylindrical platform; 101, bearing plate; 102, positioning groove; 103, shelf; 104, connecting through groove; 105, top rod; 106, roller; 107, fixing plate; 108, lifting ramp; 109, spring seat; 110, elastic compression spring; 111, protective pad; 112, rotating shaft; 113, servo geared motor; 114, bracket; 115, electric telescopic rod; 116, pneumatic suction cup. Detailed Implementation

[0025] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0026] This utility model provides, for example Figures 1-4 The image shows an IC chip packaging bracket.

[0027] Example 1 includes a cylindrical stage 100. A pressing mechanism is located on one side of the cylindrical stage 100. The pressing mechanism picks up the upper housing and moves it down to press it against the lower housing containing the IC chip, thus completing the chip packaging. A carrier plate 101 is rotatably mounted on the top inner side of the cylindrical stage 100. Multiple positioning grooves 102 are spaced apart on the side of the carrier plate 101. A placement plate 103 is slidably connected to the positioning grooves 102. By setting multiple positioning grooves 102 on the carrier plate 101 and placing the placement plate 103 in each positioning groove 102 to support the lower housing, the carrier plate 101 can switch work positions by rotating, thereby meeting the continuous packaging work of multiple chips and improving work efficiency. A downwardly extending top rod 105 is fixedly connected to the bottom end of the placement plate 103. 7 is located below the support plate 101 and fixed to the inner wall of the cylindrical platform 100. The top edge of the fixed plate 107 is fixedly connected to the lifting ramp 108. The lifting ramp 108 is located below the discharge position. When the support plate 101 rotates, when the bottom of the push rod 105 moves to the position of the lifting ramp 108 along with the rotation of the support plate 101, the lifting ramp 108 lifts the push rod 105 upward, so that the push rod 105 provides an upward pushing force on the placement plate 103, thereby causing the placement plate 103 to move upward and lift the packaged chip from the positioning groove 102, so that the user can directly pick it up for unloading. Compared with picking up the packaged chip inside the positioning groove 102, the method of lifting the placement plate 103 by the push rod 105 to push the packaged chip out of the positioning groove 102 is more convenient and efficient.

[0028] Furthermore, a protective pad 111 is fixedly connected to the top of the placement plate 103. The protective pad 111 has a protective function, which can increase the stability and protection of the packaged chip. The bottom of the positioning groove 102 is provided with a connecting groove 104 that connects to the bottom of the support plate 101. The bottom of the push rod 105 passes through the connecting groove 104 and extends downward to the top edge of the fixing plate 107. The bottom of the push rod 105 is provided with an upwardly recessed groove. A roller 106 is rotatably connected in the groove. The outer wall of the roller 106 is movably fitted to the top of the fixing plate 107. The setting of the roller 106 can reduce the frictional resistance of the push rod 105 during the movement along the surface of the fixing plate 107 and improve the smoothness of operation.

[0029] In addition, a rotating shaft 112 is rotatably connected to the middle of the fixed plate 107. The rotating shaft 112 extends upward and is fixedly connected to the middle of the support plate 101. A servo geared motor 113 for driving the rotating shaft 112 to rotate is fixedly connected to the bottom of the fixed plate 107. The servo geared motor 113 can be driven by a controller or control switch in the prior art, so that the servo geared motor 113 drives the rotating shaft 112 to rotate intermittently, thereby driving the support plate 101 to rotate and move by an angle and then stop, so that each positioning groove 102 on the support plate 101 can move to the position below the pressing mechanism and stop, so as to perform chip packaging operation.

[0030] The pressing mechanism includes a bracket 114 and a pneumatic suction cup 116. The bracket 114 is fixedly connected to the side wall of the cylindrical platform 100. The top of the bracket 114 protrudes horizontally towards the center of the cylindrical platform 100. The pneumatic suction cup 116 is located below the protrusion on the top of the bracket 114. An electric telescopic rod 115 for driving the pneumatic suction cup 116 to rise and fall is fixedly connected between the pneumatic suction cup 116 and the bracket 114. The pneumatic suction cup 116 clamps the upper shell of the chip package through negative pressure suction, and then is controlled by an external controller. The electric telescopic rod 115 extends, causing the pneumatic suction cup 116 to move downward. At this time, the lower housing containing the IC chip is placed in the positioning groove 102 located below the pneumatic suction cup 116. Thus, the downward pressure provided by the electric telescopic rod 115 causes the pneumatic suction cup 116 to press and seal the upper housing with the lower housing in the positioning groove 102. Then, the suction force on the pneumatic suction cup 116 is released, allowing the carrier plate 101 to continue rotating until the next positioning groove 102 moves below the pneumatic suction cup 116, at which point the next chip can be packaged.

[0031] Example 2, based on Example 1, further describes that a spring seat 109 is fixedly connected to the outer wall of the top rod 105 and located below the support plate 101. An elastic compression spring 110 is fixedly connected between the spring seat 109 and the bottom end of the support plate 101. By setting the spring seat 109 on the outer wall of the top rod 105, the elastic compression spring 110 is installed between the spring seat 109 and the support plate 101. This allows the top rod 105 to compress the elastic compression spring 110 during upward movement, generating an elastic thrust. This not only allows the subsequent shelf 103 to move smoothly downward using the thrust of the elastic compression spring 110, but also further improves the stability of the top rod 105 driving the shelf 103 to move up and down, avoiding jamming.

[0032] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. An IC chip packaging bracket, characterized in that, include: A cylindrical platform (100) is provided with a pressing mechanism on one side above the cylindrical platform (100); A support plate (101) is rotatably mounted on the top of the inner side of the cylindrical platform (100), and a plurality of positioning grooves (102) are provided on the side of the support plate (101) at intervals; A shelf (103) is slidably connected to a positioning groove (102), and a downwardly extending top rod (105) is fixedly connected to the bottom end of the shelf (103). A fixing plate (107) is located below the bearing plate (101) and fixed to the inner wall of the cylindrical platform (100). A lifting ramp (108) is fixedly connected to the top edge of the fixing plate (107).

2. The IC chip packaging bracket according to claim 1, characterized in that, The bottom of the positioning groove (102) is provided with a connecting groove (104) that connects to the bottom of the bearing plate (101). The bottom of the top rod (105) passes through the connecting groove (104) and extends downward to the top edge of the fixing plate (107). The top of the shelf (103) is fixedly connected with a protective pad (111).

3. The IC chip packaging bracket according to claim 1, characterized in that, The bottom of the top rod (105) is provided with an upwardly recessed groove, and a roller (106) is rotatably connected in the groove. The outer wall of the roller (106) is movably fitted to the top of the fixing plate (107).

4. The IC chip packaging bracket according to claim 1, characterized in that, A spring seat (109) is fixedly connected to the outer wall of the top rod (105) and below the bearing plate (101). An elastic compression spring (110) is fixedly connected between the spring seat (109) and the bottom end of the bearing plate (101).

5. An IC chip packaging bracket according to claim 1, characterized in that, A rotating shaft (112) is rotatably connected to the middle of the fixed plate (107). The rotating shaft (112) extends upward and is fixedly connected to the middle of the bearing plate (101). A servo geared motor (113) for driving the rotating shaft (112) to rotate is fixedly connected to the bottom end of the fixed plate (107).

6. The IC chip packaging bracket according to claim 1, characterized in that, The pressing mechanism includes: A bracket (114) is fixedly connected to the side wall of the cylindrical platform (100), and the top of the bracket (114) protrudes horizontally toward the center of the cylindrical platform (100). A pneumatic suction cup (116) is located below the top protrusion of the bracket (114). An electric telescopic rod (115) for driving the pneumatic suction cup (116) to rise and fall is fixedly connected between the pneumatic suction cup (116) and the bracket (114).

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