Bonding device and bonding system

Abstract

The utility model discloses a bonding device and a bonding system, and belongs to the technical field of semiconductor material processing equipment. The bonding device comprises a heating assembly, a cooling assembly, a first driving assembly and a second driving assembly. The heating assembly comprises a heating member, the heating member comprises a bonding side, and the bonding side of the heating member is configured to face the side where the semiconductor material is arranged. The cooling assembly is arranged on the side, back to the bonding side, of the heating piece. The first driving assembly comprises a first driving piece and a first transmission piece, the first driving piece is configured to drive the first transmission piece to move in the first direction so as to at least drive the heating assembly to move in the first direction, and the first direction is perpendicular to the plane where the bonding side is located. The second driving assembly is fixedly connected to the first transmission part and is configured to drive the cooling assembly to move in the first direction so as to be close to or away from the heating part. According to the utility model, the heating uniformity of the heating element can be improved, the cooling efficiency of the heating element is improved, the bonding period is shortened, and the production efficiency is improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor material processing equipment technology, and in particular to a bonding device and bonding system. Background Technology

[0002] In semiconductor manufacturing, wafer bonding is a process that uses a heating pad to precisely control the temperature of wafers to achieve reliable connections. It is widely used in the fabrication of integrated circuits and MEMS devices. During bonding, the wafers need to be heated to a target temperature to promote interface bonding. After bonding, the heating pad needs to be cooled rapidly so that the bonding process can be repeated. Therefore, heating uniformity and cooling efficiency directly affect bonding quality and production efficiency.

[0003] Existing heating pad cooling solutions have significant drawbacks: traditional designs incorporate liquid cooling devices on the back of the heating pad, but this alters the heat conduction path, leading to uneven temperature distribution during heating, particularly at wafer edges where temperature deviations can occur, affecting bonding interface consistency. Furthermore, the heating pad requires a lifting mechanism to align with the bonding pressure head; the stringent requirements for load-bearing and movement precision limit the integration of complex liquid cooling devices. This makes it impossible to simultaneously achieve heating uniformity and integrate a complex liquid cooling system, thus leading to the frequent use of air cooling. However, air's low thermal conductivity results in slow heating pad cooling, significantly extending the bonding cycle and limiting production line capacity.

[0004] This section provides background information related to this application, which is not necessarily prior art. Utility Model Content

[0005] The purpose of this invention is to provide a bonding device and a bonding system that can improve the heating uniformity of the heating element, improve the cooling efficiency of the heating element, shorten the bonding cycle, and improve production efficiency.

[0006] To achieve the above objectives, the following technical solution is provided:

[0007] A bonding device, comprising:

[0008] A heating assembly includes a heating element, the heating element having a bonding side configured to face a side on which a semiconductor material is disposed;

[0009] A cooling assembly is disposed on the side of the heating element opposite to the bonding side;

[0010] A first driving assembly includes a first driving member and a first transmission member. The first driving member is configured to drive the first transmission member to move along a first direction to at least drive the heating assembly to move along the first direction, the first direction being perpendicular to the plane where the bonding side is located.

[0011] A second drive assembly is fixedly connected to the first transmission member, and the second drive assembly is configured to drive the cooling assembly to move along the first direction to approach or move away from the heating member.

[0012] As an alternative to the bonding device, the second driving assembly includes a second driving member and a second transmission assembly. The second driving member is fixedly connected to the first transmission member, and the second transmission assembly is fixedly connected to the cooling assembly. The second driving member is configured to drive the second transmission assembly to move along the first direction.

[0013] As an alternative to the bonding device, the second transmission assembly includes a first connecting plate and a plurality of transmission rods, the plurality of transmission rods connecting the cooling assembly and the first connecting plate, and the second driving member driving the first connecting plate to move along the first direction.

[0014] As an optional solution for the bonding device, the second driving member includes a fluid transmission device, and the second driving assembly further includes a second connecting plate. The second connecting plate is fixedly connected to the first transmission member. The second connecting plate is provided with mounting holes. The fluid transmission device is disposed on the side of the second connecting plate facing away from the bonding side. The driving rod of the fluid transmission device is connected to the first connecting plate through an adapter.

[0015] Wherein, the radial dimension of the end of the adapter that extends into the mounting hole is less than or equal to the radial dimension of the mounting hole.

[0016] As an optional embodiment of the bonding device, the heating assembly further includes a seal disposed on the side of the heating element facing away from the bonding side, and a receiving space is formed between the seal and the heating element, and the cooling assembly is disposed within the receiving space;

[0017] The second drive assembly includes a second drive member and a second transmission assembly, the second transmission assembly passing through the seal and moving relative to the seal along the first direction.

[0018] As an alternative to the bonding device, the heating assembly further includes a support rod connected to the seal, with the end of the support rod away from the seal abutting against the side of the heating element opposite to the bonding side.

[0019] As an alternative to the bonding device, the cooling assembly is provided with a clearance structure, through which the support rod passes.

[0020] As an alternative to the bonding device, the first transmission member is fixedly connected to the seal.

[0021] As an optional solution for the bonding device, a pressure detection device is provided between the first driving member and the first transmission member, and the pressure detection device is used to detect the bonding pressure.

[0022] A bonding system is also provided, the bonding system including a preparation chamber, including a housing and a receiving cavity within the housing;

[0023] As in any of the foregoing embodiments of the bonding apparatus, at least a portion of the heating assembly and the cooling assembly are located within the receiving cavity, the first transmission member and the second drive assembly pass through the housing to move relative to the housing in the first direction, and the first drive assembly is fixedly connected to the housing.

[0024] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0025] The bonding apparatus and bonding system provided by this utility model include a heating component, a cooling component, a first driving component, and a second driving component. The heating element in the heating component is used to heat the semiconductor material. The first driving component can drive the heating component to move along a first direction to realize the wafer bonding process carried by the heating element. Simultaneously, when the second driving component drives the cooling component closer to or even against the heating element, it can dissipate heat from the heating element; when the second driving component drives the cooling component away from the heating element, it can reduce the influence of the cooling component on the heating element during the heating process, improving the heating uniformity of the heating element. Furthermore, when the first driving component drives the heating component to move along the first direction, it can simultaneously drive the second driving component and the cooling component to move, thereby reducing the risk of interference between the heating element and the cooling component during the bonding process. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments of this utility model will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the content of the embodiments of this utility model and these drawings without creative effort.

[0027] Figure 1 This is a side view of a bonding device according to an embodiment of the present invention;

[0028] Figure 2 This is a front view schematic diagram of a bonding device according to an embodiment of the present utility model;

[0029] Figure 3 This is a cross-sectional schematic diagram of a bonding device according to an embodiment of the present utility model;

[0030] Figure 4 for Figure 3A magnified schematic diagram of P in the middle;

[0031] Figure 5 for Figure 3 A magnified schematic diagram of the Q-axis.

[0032] Figure label:

[0033] 100. Outer shell; 1. Heating assembly; 10. Heating element; 10a. Bonding side; 11. Sealing element; 12. Support rod; 13. Positioning element; 2. Cooling assembly; 20. Cooling element; 21. Heat-conducting plate; 3. First drive assembly; 30. First drive element; 31. First transmission element; 32. Base plate; 4. Second drive assembly; 41. Second drive element; 42. Second transmission assembly; 421. First connecting plate; 422. Transmission rod; 423. Second connecting plate; 424. Adapter; 4241. Rod body; 4242. End; 5. Pressure detection device; 61. First adapter joint; 62. Second adapter joint; H. Mounting hole; E. Accommodation space; X. First direction. Detailed Implementation

[0034] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0035] In the description of this utility model, it should be noted that the terms "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this utility model is in use. They are used only for the convenience of describing this utility model and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first," "second," and "third," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0036] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set" and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0037] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0038] Figure 1 This is a side view of a bonding device according to an embodiment of the present invention. Figure 2 This is a front view schematic diagram of a bonding device according to an embodiment of the present utility model. Figure 3 This is a cross-sectional schematic diagram of a bonding device according to an embodiment of the present utility model. Figure 4 for Figure 3 A magnified schematic diagram of P. Figure 5 for Figure 3 A magnified schematic diagram of the Q-axis.

[0039] Please see Figures 1 to 5 This utility model provides a bonding device, which includes a heating assembly 1, a cooling assembly 2, a first driving assembly 3, and a second driving assembly 4. The heating assembly 1 includes a heating element 10, which includes a bonding side 10a, configured to face the side where a semiconductor material is disposed. The cooling assembly 2 is disposed on the side of the heating element 10 facing away from the bonding side 10a. The first driving assembly 3 includes a first driving member 30 and a first transmission member 31. The first driving member 30 is configured to drive the first transmission member 31 to move along a first direction X to at least move the heating assembly 1 along the first direction X, which is perpendicular to the plane containing the bonding side 10a. The second driving assembly 4 is fixedly connected to the first transmission member 31 and is configured to drive the cooling assembly 2 to move along the first direction X to approach or move away from the heating element 10.

[0040] Optionally, the heating element 10 includes a bonding side 10a, which can directly or indirectly support semiconductor material. For example, the heating element 10 can support semiconductor material through an intermediate structure such as a chuck. Optionally, the semiconductor material includes either a chip or a wafer.

[0041] Exemplarily, the heating assembly 1 further includes graphite paper disposed on the bonding side 10a of the heating element 10, and semiconductor material may be disposed on the graphite paper. Further, the heating assembly 1 also includes a carrier disposed on the side of the graphite paper facing away from the bonding side 10a. Semiconductor material may be disposed on the carrier.

[0042] Optionally, the heating assembly 1 further includes a positioning element 13, which is disposed on the periphery of the heating element 10. The positioning element 13 can be used to position the carrier, the semiconductor material, or the pressure head. Optionally, the positioning element 13 includes a positioning pin. Optionally, the number of positioning elements 13 may include one or more.

[0043] Optionally, the cooling assembly 2 may include a cooling element 20, which is used to cool the heating element 10. This application embodiment does not limit the structure of the cooling element 20 or the cooling method. For example, the cooling element 20 may have a heat exchange space connected to an external water cooling system.

[0044] Optionally, the cooling assembly 2 may also include graphite paper disposed between the cooling element 20 and the heating element 10 to improve thermal conductivity.

[0045] Optionally, the cooling assembly 2 may further include a heat-conducting plate 21, which is disposed between the cooling component 20 and the heating component 10 to improve heat conduction efficiency. Further, graphite paper and the heat-conducting plate 21 may be sequentially disposed between the cooling component 20 and the heating component 10. Optionally, the heat-conducting plate 21 may include a copper plate.

[0046] Optionally, the first drive unit 30 may include a servo electric cylinder.

[0047] Optionally, the first drive assembly 3 may further include a base plate 32, with the first drive member 30 fixedly connected to the base plate 32 for positioning and fixing. The first drive member 30 may be located on the outside of the preparation chamber housing 100, and the base plate 32 may be fixedly connected to the housing 100 so that the first drive member 30 is fixedly connected to the outside of the housing 100. Optionally, the base plate 32 and the housing 100 may be connected by one or more connecting rods.

[0048] The first driving member 30 can drive the first transmission member 31 to move along the first direction X to bring the heating assembly 1 closer to or away from the bonding material disposed on other equipment. The first driving member 30 can also drive the first transmission member 31 to move along the first direction X to apply pressure to the semiconductor material and the bonding material carried on the heating member 10 to realize the bonding process. Optionally, the bonding material includes semiconductor material, such as a wafer or chip.

[0049] The first direction X is perpendicular to the plane where the bonding side 10a is located. This can be understood as the movement direction of the heating element 10 being perpendicular to the plane where the bonding side 10a is located, so that the pressure of the first driving element 30 on the semiconductor material carried by the heating element 10 is perpendicular to the bonding surface of the semiconductor material. Here, the "bonding surface" refers to the interface between the semiconductor material on the heating element 10 and the material being bonded.

[0050] The second drive assembly 4 is fixedly connected to the first transmission member 31 so that when the first drive member 30 drives the first transmission member 31 to move along the first direction X, the second drive assembly 4 moves synchronously with the movement of the first transmission member 31, thereby making the cooling assembly 2 move synchronously with the movement of the first transmission member 31, thereby reducing the possibility of interference between the heating assembly 1 and the cooling assembly 2 when they move.

[0051] The second driving component 4 can drive the cooling component 2 to move along the first direction X to approach or move away from the heating element 10. When the heating element 10 is heating, the second driving component 4 can drive the cooling component 2 to move away from the heating element 10 along the first direction X, thereby reducing the impact of the cooling component 2 on the heating effect of the heating element 10. When the heating element 10 needs to be cooled, the second driving component 4 can drive the cooling component 2 to approach or even touch the heating element 10 along the first direction X, thereby accelerating the cooling rate of the heating element 10.

[0052] In these alternative embodiments, the bonding apparatus includes a heating component 1, a cooling component 2, a first driving component 3, and a second driving component 4. The heating element 10 in the heating component 1 is used to heat the semiconductor material. The first driving component 30 can drive the heating component 1 to move along a first direction X to realize the wafer bonding process carried by the heating element 10. Simultaneously, when the second driving component 4 drives the cooling component 2 close to or even against the heating element 10, it can dissipate heat from the heating element 10; when the second driving component 4 drives the cooling component 2 away from the heating element 10, it can reduce the influence of the cooling component 2 on the heating element 10 during the heating process, improving the heating uniformity of the heating element 10. Furthermore, when the first driving component 30 drives the heating component 1 to move along the first direction X, it can simultaneously drive the second driving component 4 and the cooling component 2 to move, thereby reducing the risk of interference between the heating element 10 and the cooling component 2 during the bonding process.

[0053] In some alternative embodiments, the second drive assembly 4 includes a second drive member 41 and a second transmission assembly 42. The second drive member 41 is fixedly connected to the first transmission member 31, and the second transmission assembly 42 is fixedly connected to the cooling assembly 2. The second drive member 41 is configured to drive the second transmission assembly 42 to move along a first direction X.

[0054] In some examples, the second drive element 41 may be directly or indirectly connected to the first drive element 31.

[0055] The second transmission component 42 can move along the first direction X to drive the cooling component 2 to move along the first direction X, thereby allowing the cooling component 2 to move closer to or further away from the heating element 10, simplifying the connection mechanism of the second drive component 4 and reducing the space occupied by the second drive component 4.

[0056] In some alternative embodiments, the second transmission assembly 42 includes a first connecting plate 421 and a plurality of transmission rods 422, the plurality of transmission rods 422 connecting the cooling assembly 2 and the first connecting plate 421, and the second driving member 41 driving the first connecting plate 421 to move along the first direction X.

[0057] Multiple transmission rods 422 can be spaced apart and arranged sequentially along the edge of the cooling component 20, thereby achieving multi-point support for the cooling component 20. In addition, the multiple transmission rods 422 can also play a role in positioning and guiding the lifting and lowering of the cooling component 20, so as to improve the moving accuracy of the cooling component 20 and reduce the risk of the cooling component 20 shaking.

[0058] Multiple transmission rods 422 connect the cooling assembly 2 and the first connecting plate 421, so that when the second driving member 41 drives the first connecting plate 421 to move along the first direction X, the multiple transmission rods 422 can rise and fall synchronously, which helps to reduce the number of the second driving member 41, reduce manufacturing costs, and reduce the space required for the second driving member 41.

[0059] In some optional embodiments, the second drive member 41 includes a fluid transmission device, and the second drive assembly 4 further includes a second connecting plate 423. The second connecting plate 423 is fixedly connected to the first transmission member 31, and the second connecting plate 423 has a mounting hole. The fluid transmission device is disposed on the side of the second connecting plate 423 facing away from the bonding side 10a. The drive rod of the fluid transmission device is connected to the first connecting plate 421 through an adapter 424. The radial dimension of the end 4242 of the adapter 424 extending into the mounting hole is less than or equal to the radial dimension of the mounting hole.

[0060] Optionally, the fluid transmission device may include a lifting cylinder or a lifting hydraulic cylinder.

[0061] Optionally, the second connecting plate 423 can be sleeved on the first transmission member 31, and the fluid transmission device is fixed on the second connecting plate 423. The second connecting plate 423 may be provided with one or more mounting positions for mounting the fluid transmission device.

[0062] As an example, the end 4242 of the adapter 424 is located within the mounting hole, and the main body of the adapter 424 is located on the side of the second connecting plate 423 facing the bonding side 10a. The fluid transmission device is fixed on the second connecting plate 423, and the drive rod of the fluid transmission device is connected to the first connecting plate 421 through the adapter 424. When the drive rod of the fluid transmission device moves along the first direction X, it can drive the adapter 424 and the first connecting plate 421 to move along the first direction X, thereby driving the transmission rod 422 and the cooling assembly 2 to move along the first direction X.

[0063] Optionally, the adapter 424 may include a rod body 4241 and an end portion 4242 extending into a mounting hole, wherein the rod body 4241 and the end portion 4242 may be separate structures.

[0064] When the radial dimension of the end 4242 of the adapter 424 that extends into the mounting hole is smaller than the radial dimension of the mounting hole, when the drive rod moves along the first direction X and shakes due to the fluid transmission device itself or external load, the interaction force between the drive rod and the mounting hole can be reduced, thereby reducing the possibility of the drive rod being subjected to lateral force.

[0065] When the radial dimension of the end 4242 of the adapter 424 that extends into the mounting hole is equal to the radial dimension of the mounting hole, the mounting hole can limit the swaying range of the adapter 424 when the fluid transmission device shakes under its own action or external load, thereby reducing the possibility of the cooling assembly 2 shaking and reducing the possibility of the cooling assembly 2 interfering with other structures during movement.

[0066] Optionally, the adapter 424 is slidably connected to the mounting hole so that the adapter 424 is movable along the first direction X.

[0067] In some optional embodiments, the heating assembly 1 further includes a seal 11 disposed on the side of the heating assembly 10 opposite to the bonding side 10a, forming a receiving space between the seal 11 and the heating assembly 10, and the cooling assembly 2 disposed within the receiving space. The second driving assembly 4 includes a second driving member 41 and a second transmission assembly 42, the second transmission assembly 42 passing through the seal 11 and moving relative to the seal 11 along a first direction X.

[0068] Optionally, a sealed containment space is formed between the seal 11 and the heating element 10 to reduce the impact of the external environment on the heating element 10 and the cooling assembly 2.

[0069] The second transmission assembly 42 can extend through the seal 11 into the receiving space, and the second transmission assembly 42 is movable relative to the seal 11 along the first direction X under the drive of the second drive member 41, so that the cooling assembly 2 moves within the receiving space along the first direction X. For example, the second transmission assembly 42 is slidably disposed through the seal 11.

[0070] Optionally, the sealing element 11 includes a first flange, a second flange, and a bellows, with the bellows located between the first and second flanges and disposed on the side of the heating element 10 facing away from the bonding side 10a. Optionally, the heating element 10 may include a heating plate and a heating shell, with the heating plate disposed between the heating shell and the bellows. Optionally, the first flange is connected to the heating shell. Optionally, the second flange can be used to connect to the inner wall of the outer shell of the preparation chamber.

[0071] Optionally, the seal 11 may further include a sealing ring disposed between the bellows and the heating element 10. Optionally, the sealing ring may include a metal C-ring.

[0072] Optionally, one end of the seal 11 is connected to the side of the heating element 10 facing away from the bonding side, and the other end of the seal 11 is connected to the inner wall of the preparation chamber shell 100, so as to isolate the preparation chamber space from the outside world and maintain a specific environment in the preparation chamber, such as a vacuum environment. The second transmission assembly 42 extends into the receiving space through the seal 11, which facilitates the connection between the second transmission assembly 42 and the cooling assembly 2, while reducing the possibility that the connection between the second transmission assembly 42 and the cooling assembly 2 will disrupt the specific environment in the preparation chamber. Furthermore, the seal 11 can also separate the heating element 10 and the cooling assembly 2 from the specific environment in the preparation chamber, reducing the sealing structure and improving the integration of the bonding device.

[0073] Optionally, the heating assembly 1 also includes a heat insulation element disposed around the heating element 10, thereby reducing heat loss from the heating element 10.

[0074] In some alternative embodiments, the heating assembly 1 further includes a support rod 12 connected to the seal 11, and the end of the support rod 12 away from the seal 11 is disposed in contact with the side of the heating assembly 10 opposite to the bonding side 10a.

[0075] Optionally, the number of support rods 12 may include one or more.

[0076] Optionally, the seal 11 includes a hole structure, one end of the support rod 12 extends into the hole structure, and the other end of the support rod 12 abuts against the side of the heating element 10 opposite to the bonding side 10a, thereby supporting the heating element 10 and distributing the bonding force on the heating element 10. Optionally, the support rod 12 is adjustable relative to the seal 11; for example, the size of the support rod 12 within the receiving space is adjustable to increase or decrease the distance between the heating element 10 and the seal 11.

[0077] In some alternative embodiments, the cooling assembly 2 is provided with a clearance structure, through which the support rod 12 passes.

[0078] For example, the avoidance structure includes a through-hole structure so that the support rod 12 can pass through the through-hole structure. Optionally, the radial dimension of the support rod 12 is smaller than the radial dimension of the through-hole structure, so that the avoidance structure can avoid the support rod 12, reducing the possibility of interference between the support rod 12 and the cooling assembly 2. At the same time, the support rod 12 also acts as a limit, further reducing the possibility of the cooling assembly 2 shaking.

[0079] In some alternative embodiments, the first transmission member 31 is fixedly connected to the seal member 11. The movement of the first transmission member 31 along the first direction X can drive the seal member 11 to move along the first direction X, so that the heating member 10 connected to the seal member 11 moves along the first direction X, thereby reducing the risk of the heating area being reduced due to the first transmission member 31 being directly connected to the heating member 10, and increasing the heating area.

[0080] In some alternative embodiments, a pressure detection device 5 is provided between the first driving member 30 and the first transmission member 31, the pressure detection device 5 being used to detect the bonding pressure.

[0081] Optionally, the first drive unit 30 and the pressure detection device 5 can be connected via the first adapter 61.

[0082] Optionally, the first transmission component 31 and the pressure detection device 5 can be connected via a second adapter 62.

[0083] Optionally, the second adapter 62 can also connect the second connecting plate 423 and the first transmission member 31 to further increase the connection reliability of the first transmission member 31 and the second connecting plate 423.

[0084] In these alternative embodiments, the bonding pressure can be accurately fed back by setting the pressure detection device 5, so that the pressure control forms a closed loop and the pressure control accuracy is improved.

[0085] This embodiment provides a bonding system, including a preparation chamber and a bonding apparatus according to any of the above embodiments. The preparation chamber includes a housing 100 and a receiving cavity within the housing 100. At least a portion of the heating assembly 1 and the cooling assembly 2 are located within the receiving cavity. A first transmission member 31 and a second drive assembly 4 pass through the housing 100 to move relative to the housing 100 along a first direction X. The first drive assembly 31 is fixedly connected to the housing 100.

[0086] Alternatively, the preparation chamber can be a cavity that maintains a specific environment. For example, the preparation chamber can be a vacuum environment.

[0087] Heating component 1 and cooling component 2 can be located within the receiving cavity. Heating component 1 moves along a first direction X under the drive of first driving component 3 to achieve bonding of semiconductor materials. First driving component 30 can be fixedly connected to housing 100 via base plate 32. Housing 100 can be provided with multiple through-hole structures, which can be used for first transmission component 31 to pass through housing 100 and second driving component 4 to pass through housing 100. Optionally, transmission rod 422 in second driving component 4 can pass through housing 100 via through-hole structures.

[0088] Since the bonding system provided in this application includes the bonding apparatus of any of the above embodiments, the bonding system provided in this application has the beneficial effects of the bonding apparatus of any of the above embodiments, which will not be repeated here.

[0089] Note that the above description is merely a preferred embodiment of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and various obvious changes, readjustments, and substitutions can be made without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments. Many other equivalent embodiments may be included without departing from the concept of the present invention, and the scope of the present invention is determined by the scope of the appended claims.

Claims

1. A bonding device, characterized in that, include: A heating assembly (1) includes a heating element (10), the heating element (10) including a bonding side (10a), the bonding side (10a) of the heating element (10) being configured to face the side on which the semiconductor material is disposed; A cooling assembly (2) is disposed on the side of the heating element (10) facing away from the bonding side (10a); The first drive assembly (3) includes a first drive member (30) and a first transmission member (31). The first drive member (30) is configured to drive the first transmission member (31) to move along a first direction (X) to at least drive the heating assembly (1) to move along the first direction (X). The first direction (X) is perpendicular to the plane where the bonding side (10a) is located. A second drive assembly (4) is fixedly connected to the first transmission member (31). The second drive assembly (4) is configured to drive the cooling assembly (2) to move along the first direction (X) to approach or move away from the heating member (10).

2. The bonding apparatus according to claim 1, characterized in that, The second drive assembly (4) includes a second drive member (41) and a second transmission assembly (42). The second drive member (41) is fixedly connected to the first transmission member (31), and the second transmission assembly (42) is fixedly connected to the cooling assembly (2). The second drive member (41) is configured to drive the second transmission assembly (42) to move along the first direction (X).

3. The bonding apparatus according to claim 2, characterized in that, The second transmission assembly (42) includes a first connecting plate (421) and a plurality of transmission rods (422), the plurality of transmission rods (422) connecting the cooling assembly (2) and the first connecting plate (421), and the second driving member (41) driving the first connecting plate (421) to move along the first direction (X).

4. The bonding apparatus according to claim 3, characterized in that, The second drive member (41) includes a fluid transmission device, and the second drive assembly (4) further includes a second connecting plate (423). The second connecting plate (423) is fixedly connected to the first transmission member (31). The second connecting plate (423) is provided with a mounting hole (H). The fluid transmission device is disposed on the side of the second connecting plate (423) facing away from the bonding side (10a). The drive rod of the fluid transmission device is connected to the first connecting plate (421) through an adapter (424). Wherein, the radial dimension of the end of the adapter (424) that extends into the mounting hole (H) is less than or equal to the radial dimension of the mounting hole (H).

5. The bonding apparatus according to claim 1, characterized in that, The heating assembly (1) further includes a sealing member (11), which is disposed on the side of the heating member (10) facing away from the bonding side (10a). A receiving space is formed between the sealing member (11) and the heating member (10), and the cooling assembly (2) is disposed within the receiving space. The second drive assembly (4) includes a second drive member (41) and a second transmission assembly (42), the second transmission assembly (42) passing through the seal (11) and moving relative to the seal (11) in the first direction (X).

6. The bonding apparatus according to claim 5, characterized in that, The heating assembly (1) further includes a support rod (12), which is connected to the seal (11), and the end of the support rod (12) away from the seal (11) is abutted against the side of the heating element (10) facing away from the bonding side (10a).

7. The bonding apparatus according to claim 6, characterized in that, The cooling assembly (2) is provided with a clearance structure, and the support rod (12) passes through the clearance structure.

8. The bonding apparatus according to claim 5, characterized in that, The first transmission component (31) is fixedly connected to the sealing component (11).

9. The bonding apparatus according to claim 1, characterized in that, A pressure detection device (5) is provided between the first driving member (30) and the first transmission member (31), and the pressure detection device (5) is used to detect the bonding pressure.

10. A bonding system, comprising: The preparation chamber includes a housing (100) and a receiving cavity within the housing (100); In the bonding apparatus according to any one of claims 1 to 9, at least a portion of the heating assembly (1) and the cooling assembly (2) are located within the receiving cavity, the first transmission member (31) and the second drive assembly (4) pass through the housing (100) to move relative to the housing (100) in the first direction (X), and the first drive assembly (3) is fixedly connected to the housing (100).

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