Refrigeration water cup with top refrigeration function

Abstract

The utility model discloses a refrigerating water cup with a top refrigerating function, and belongs to the field of water cups. Comprising a cup body and a cup cover, a refrigeration module and a cooling capacity conduction piece are arranged in the cup cover, the cup body is provided with an inner container, the cup cover is detachably connected with the cup body, one end of the cooling capacity conduction piece is connected with the refrigeration module, and the other end of the cooling capacity conduction piece is tightly attached to the wall body of the inner container. Compared with the prior art, the cup has the advantages that the refrigeration module and the cooling capacity conduction piece are arranged in the cup cover, the cooling capacity conduction piece abuts against the inner container of the cup body, cooling capacity generated by the refrigeration module can be conducted to the inner container, hot water can be rapidly cooled, the inner container can be sealed, and the cup is convenient to use.

Description

Technical Field

[0001] This utility model belongs to the field of water cups, and specifically relates to a cooling water cup with top cooling. Background Technology

[0002] Ordinary water cups on the market typically only have the basic function of holding liquids and lack active cooling capabilities. When a user pours boiling water into the cup, the water temperature can only drop naturally. This process is affected by multiple factors such as ambient temperature, airflow speed, and the thermal conductivity of the cup material, and usually takes 30 minutes to 1 hour to reach a suitable drinking temperature (approximately 40-50℃). This passive cooling method has several significant problems:

[0003] First, from a user experience perspective, this lengthy waiting process contradicts the fast-paced lifestyle of modern society. In office settings, business professionals often only have short breaks between meetings; in medical environments, patients need immediate access to warm water to take medication; and in outdoor sports settings, athletes urgently need to replenish fluids after training. These scenarios all place high demands on the timeliness of hydration, which the natural cooling mechanism of traditional water cups clearly cannot meet.

[0004] Secondly, from a health and safety perspective, excessively long cooling times may lead to two potential risks: firstly, prolonged exposure of hot water to air may increase the risk of microbial growth; secondly, some users, due to extreme thirst, may choose to drink the hot water directly, potentially causing burns to the oral and esophageal mucosa. The World Health Organization (WHO) recommends a safe drinking water temperature below 50°C, but in reality, cases of burns caused by excessively long waiting times occur frequently. Utility Model Content

[0005] To address the aforementioned problems, the purpose of this invention is to provide a top-cooled water cup that can achieve rapid cooling through semiconductor technology and is convenient to use.

[0006] To achieve the above objectives, the technical solution of this utility model is as follows:

[0007] This utility model provides a top-cooled water cup, comprising: a cup body and a cup lid, wherein a cooling module and a cold energy conduction component are disposed inside the cup lid, the cup body has an inner liner, the cup lid and the cup body are detachably connected, and one end of the cold energy conduction component is connected to the cooling module, and the other end is tightly fitted to the wall of the inner liner.

[0008] In this application, by setting a cooling module and a cold energy conduction component inside the cup lid, and the cold energy conduction component abutting against the inner liner of the cup body, the cold energy generated by the cooling module can be conducted to the inner liner, and the inner liner can be sealed, making it more convenient to use.

[0009] Furthermore, the end of the cold energy conducting component that contacts the inner liner has an inwardly inclined first contact surface, and the upper end of the inner liner has an outwardly expanding second contact surface, with the first contact surface and the second contact surface in close contact. When the cold energy conducting component contacts the inner liner, the first contact surface can be tightly attached to the second contact surface, thus achieving both cold energy conduction and sealing of the inner liner.

[0010] Furthermore, a cooling bracket is provided inside the cup lid, and the cold energy conduction component is installed on the cooling bracket.

[0011] Furthermore, the inner wall of the cup lid extends horizontally inward to form a support boss, and a positioning protrusion is provided above the support boss. A positioning groove is provided on the side wall of the refrigeration bracket, and the refrigeration bracket is disposed on the support boss and is engaged with the positioning protrusion through the positioning groove.

[0012] Furthermore, the refrigeration bracket has a mounting hole in the middle, and a support step is provided on the side wall of the mounting hole. The outer side wall of the cold energy conduction component extends outward to form an overlapping boss that matches the support step. The lower end of the cold energy conduction component passes through the mounting hole and connects to the inner liner, and the overlapping boss overlaps the support step.

[0013] Furthermore, the refrigeration module includes a semiconductor refrigeration component and a heat insulation component. The heat insulation component is disposed above the cold energy conduction component, and the semiconductor refrigeration component is mounted on the heat insulation component, with the cold end of the semiconductor refrigeration component in contact with the cold energy conduction component.

[0014] Furthermore, a heat dissipation module is also provided inside the cup lid. The heat dissipation module includes a heat sink, a cooling fan, and a fan bracket. The fan bracket is installed on the cup lid, the cooling fan is installed on the fan bracket, the heat sink is disposed between the cooling fan and the semiconductor cooling device, and the hot end of the semiconductor cooling device is in contact with the heat sink. The cup lid also has an air inlet on the side near the cooling fan and an air outlet above the cooling fan.

[0015] Furthermore, the heat insulation component has a hole in the middle, and the semiconductor cooling component is installed in the hole. The upper end of the semiconductor cooling component is in contact with the heat sink, and the lower end is in contact with the cold conduction component.

[0016] Furthermore, a main control module is also installed on the cup lid. The main control module includes a main control circuit board and a display screen. The main control circuit board is fixed inside the cup lid, and the display screen is mounted on the main control circuit board. The display screen, the cooling fan, and the semiconductor cooling chip are electrically connected to the main control circuit board. A lens is also provided on the display screen, and the lens is mounted on the cup lid.

[0017] Furthermore, the cup lid is also equipped with a power supply module, which includes a charging control board, a battery, and a charging interface. The charging control board is connected to the main control circuit board, and the battery and the charging interface are both connected to the charging control board.

[0018] Furthermore, the cup lid includes a front shell and a bottom shell, the front shell and the bottom shell are detachably connected by a snap fastener, the bottom shell is threadedly connected to the cup body, and a sealing ring is also provided between the bottom shell and the cup body.

[0019] The beneficial effects of this utility model are: compared with the prior art, by setting a cooling module and a cold energy conduction component inside the cup lid, and the cold energy conduction component abutting against the inner liner of the cup body, the cold energy generated by the cooling module can be conducted to the inner liner to achieve rapid cooling of hot water, and the inner liner can be sealed, making it more convenient to use. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the structure of a cooling water cup.

[0021] Figure 2 This is an exploded view of a chilled water cup.

[0022] Figure 3 This is a cross-sectional view of a chilled water cup.

[0023] Figure 4 yes Figure 3 A magnified view of a portion of point A in the middle.

[0024] Figure 5 This is a schematic diagram of the structure of the cold energy conduction component.

[0025] Figure 6 This is a structural diagram of the cooling bracket.

[0026] In the diagram: 1. Cup body; 2. Cup lid; 21. Support boss; 22. Positioning protrusion; 23. Front shell; 24. Bottom shell; 3. Cooling module; 31. Semiconductor cooling component; 32. Heat insulation component; 33. Hole; 4. Cold conduction component; 41. First contact surface; 42. Overlapping boss; 5. Inner liner; 51. Second contact surface; 6. Cooling bracket; 61. Positioning groove; 62. Mounting hole; 63. Support step; 7. Heat dissipation module; 71. Heat sink; 72. Cooling fan; 73. Fan bracket; 74. Air inlet; 75. Air outlet; 8. Main control module; 81. Main control circuit board; 82. Display screen; 83. Lens; 9. Power supply module; 91. Charging control board; 92. Charging interface. Detailed Implementation

[0027] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0028] To achieve the above objectives, the technical solution of this utility model is as follows:

[0029] See Figure 1-6 As shown, this embodiment provides a top-cooled water cup, including: a cup body 1 and a cup lid 2. The cup lid 2 is provided with a cooling module 3 and a cold energy conduction component 4. The cup body 1 has an inner liner 5. The cup lid 2 and the cup body 1 are detachably connected by a threaded structure. One end of the cold energy conduction component 4 is connected to the cooling module 3, and the other end is tightly fitted to the wall of the inner liner 5.

[0030] In this embodiment, by setting a cooling module 3 and a cold energy conduction component 4 inside the cup lid 2, the cold energy conduction component 4 abuts against the inner liner 5 of the cup body 1, which can both conduct the cold energy generated by the cooling module 3 to the inner liner 5 and achieve the sealing of the inner liner 5, making it more convenient to use.

[0031] Furthermore, the end of the cold energy conducting component 4 that contacts the inner liner 5 has an inwardly inclined first contact surface 41, and the upper end of the inner liner 5 has an outwardly expanding second contact surface 51. The first contact surface 41 and the second contact surface 51 are tightly fitted together. Both the first contact surface 41 and the second contact surface 51 are large-area inclined surfaces. During the process of screwing the cup lid 2 onto the cup body 1 through the threaded structure, the first contact surface 41 can be gradually squeezed and fitted onto the second contact surface 51. The tighter the cup lid 2 is screwed on, the larger the contact area between the first contact surface 41 and the second contact surface 51, and the tighter the squeeze and fit. This achieves both rapid and efficient cold energy conduction through large-area contact and sealing of the inner liner 5 through tight fit, thus providing a dual effect.

[0032] Furthermore, a cooling bracket 6 is provided inside the cup lid 2, and the cold energy conduction component 4 is installed on the cooling bracket 6.

[0033] Furthermore, a support boss 21 extends horizontally inward from the inner wall of the cup lid 2, and a positioning protrusion 22 is provided above the support boss 21. A positioning groove 61 is provided on the side wall of the cooling bracket 6. The cooling bracket 6 is set on the support boss 21 and is engaged with the positioning protrusion 22 through the positioning groove 61. When the cooling bracket 6 is installed on the cup lid 2, it is supported by the support boss 21 and fixed by the positioning protrusion 22, thereby improving the structural stability of the cooling bracket 6 and the cold energy conduction component 4.

[0034] Furthermore, a mounting hole 62 is provided in the middle of the refrigeration bracket 6, and a supporting step 63 is provided on the side wall of the mounting hole 62. The outer side wall of the cold air conduction component 4 extends outward to form an overlapping boss 42 that matches the supporting step 63. The lower end of the cold air conduction component 4 passes through the mounting hole 62 and connects to the inner liner 5, and the overlapping boss 42 overlaps on the supporting step 63. The above structure not only enables the stable installation of the cold air conduction component 4, but also facilitates the connection between the cold air conduction component 4 and the inner liner 5.

[0035] Furthermore, the refrigeration module 3 includes a semiconductor refrigeration component 31 and a heat insulation component 32. The heat insulation component 32 is disposed above the cold energy conduction component 4, and the semiconductor refrigeration component 31 is mounted on the heat insulation component 32, with the cold end of the semiconductor refrigeration component 31 in contact with the cold energy conduction component 4.

[0036] Furthermore, a heat dissipation module 7 is also provided inside the cup lid 2. The heat dissipation module 7 includes a heat sink 71, a cooling fan 72, and a fan bracket 73. The fan bracket 73 is installed on the cup lid 2, the cooling fan 72 is installed on the fan bracket 73, the heat sink 71 is disposed between the cooling fan 72 and the semiconductor cooling element 31, and the hot end of the semiconductor cooling element 31 is in contact with the heat sink 71. The cup lid 2 also has an air inlet 74 on the side near the cooling fan 72 and an air outlet 75 above the cooling fan 72.

[0037] Furthermore, a hole 33 is provided in the middle of the heat insulation component 32, and the semiconductor cooling component 31 is installed in the hole 33. The upper end of the semiconductor cooling component 31 is attached to the heat sink 71, and the lower end is attached to the cold energy conduction component 4. The heat insulation component 32 surrounds the semiconductor cooling component 31, which can protect the semiconductor cooling component 31 and has a heat insulation effect, so that the cold energy of the semiconductor cooling component 31 can only be transferred to the cold energy conduction component 4 through the cold end, and the heat can only be transferred to the heat sink 71 through the hot end.

[0038] Furthermore, a main control module 8 is also installed on the cup lid 2. The main control module 8 includes a main control circuit board 81 and a display screen 82. The main control circuit board 81 is fixed inside the cup lid 2, and the display screen 82 is installed on the main control circuit board 81. The display screen 82, the cooling fan 72, the semiconductor cooling chip and the main control circuit board 81 are electrically connected. A lens 83 is also provided on the display screen 82 and is installed on the cup lid 2.

[0039] Furthermore, a power supply module 9 is also provided on the cup lid 2. The power supply module 9 includes a charging control board 91, a battery, and a charging interface 92. The charging control board 91 is connected to the main control circuit board 81, and the battery and the charging interface 92 are both connected to the charging control board 91.

[0040] Furthermore, the cup lid 2 includes a front shell 23 and a bottom shell 24. The front shell 23 and the bottom shell 24 are detachably connected by a snap fastener. The bottom shell 24 is threadedly connected to the cup body 1, and a sealing ring is also provided between the bottom shell 24 and the cup body 1.

[0041] The above are merely preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A top-cooled water cup, characterized in that, include: The cup body and the cup lid are provided. The cup lid is equipped with a refrigeration module and a cold energy conduction component. The cup body has an inner liner. The cup lid and the cup body are detachably connected. One end of the cold energy conduction component is connected to the refrigeration module, and the other end is tightly fitted to the wall of the inner liner.

2. A top-cooled water cup as described in claim 1, characterized in that, The end of the cold air conducting component that contacts the inner liner has an inwardly inclined first contact surface, and the upper end of the inner liner has an outwardly expanding second contact surface, with the first contact surface and the second contact surface in close contact.

3. A top-cooled water cup as described in claim 2, characterized in that, A cooling bracket is also provided inside the cup lid, and the cold energy conduction component is installed on the cooling bracket.

4. A top-cooled water cup as described in claim 3, characterized in that, The inner wall of the cup lid extends horizontally inward to form a support boss, and a positioning protrusion is provided above the support boss. A positioning groove is provided on the side wall of the refrigeration bracket. The refrigeration bracket is set on the support boss and is engaged with the positioning protrusion through the positioning groove.

5. A top-cooled water cup as described in claim 4, characterized in that, The refrigeration bracket has a mounting hole in the middle, and a support step is provided on the side wall of the mounting hole. The outer side wall of the cold energy conduction component extends outward to form an overlapping boss that matches the support step. The lower end of the cold energy conduction component passes through the mounting hole and connects to the inner liner, and the overlapping boss overlaps the support step.

6. A top-cooled water cup as described in claim 1, characterized in that, The refrigeration module includes a semiconductor refrigeration component and a heat insulation component. The heat insulation component is disposed above the cold energy conduction component, and the semiconductor refrigeration component is mounted on the heat insulation component, with the cold end of the semiconductor refrigeration component in contact with the cold energy conduction component.

7. A top-cooled water cup as described in claim 6, characterized in that, The cup lid is also equipped with a heat dissipation module, which includes a heat sink, a cooling fan, and a fan bracket. The fan bracket is installed on the cup lid, the cooling fan is installed on the fan bracket, the heat sink is disposed between the cooling fan and the semiconductor cooling device, and the hot end of the semiconductor cooling device is in contact with the heat sink. The cup lid also has an air inlet on the side near the cooling fan and an air outlet above the cooling fan.

8. A top-cooled water cup as described in claim 7, characterized in that, The heat insulation component has a hole in the middle, and the semiconductor cooling component is installed in the hole. The upper end of the semiconductor cooling component is in contact with the heat sink, and the lower end is in contact with the cold conduction component.

9. A top-cooled water cup as described in claim 7, characterized in that, The cup lid is also equipped with a main control module, which includes a main control circuit board and a display screen. The main control circuit board is fixed inside the cup lid, and the display screen is mounted on the main control circuit board. The display screen, the cooling fan, and the semiconductor cooling chip are electrically connected to the main control circuit board. The display screen is also equipped with a lens, which is mounted on the cup lid.

10. A top-cooled water cup as described in claim 9, characterized in that, The cup lid is also equipped with a power supply module, which includes a charging control board, a battery, and a charging interface. The charging control board is connected to the main control circuit board, and the battery and the charging interface are both connected to the charging control board.

Images