An uninterruptible power supply

Abstract

The application relates to the field of power supplies, and discloses an uninterruptible power supply, which comprises a first power board, a liquid cooling plate, a second power board, a first power device group arranged on the first power board, and a second power device group arranged on the second power board; the liquid cooling plate is arranged between the first power board and the second power board and is used for heat dissipation of the first power device group and the second power device group; the liquid cooling plate comprises an inlet, an outlet and a cooling flow channel communicated between the inlet and the outlet, and the cooling flow channel is used for containing cooling liquid; the first power device group and / or the second power device group comprises temperature-sensitive components and a plurality of power components; along the flow direction of the cooling liquid in the cooling flow channel, the plurality of power components are located in front of the temperature-sensitive components. The application gives priority to heat dissipation of the temperature-sensitive components with high temperature sensitivity to ensure the service life of the entire uninterruptible power supply, and then heat dissipation is performed on other power components, so that liquid cooling heat dissipation of all the power components is considered.

Description

Technical Field

[0001] This application relates to the field of power supply technology, and in particular to an uninterruptible power supply. Background Technology

[0002] Uninterruptible power supply (UPS) modules are critical infrastructure that provides continuous power to critical equipment. They ensure that loads continue to operate normally during grid failures or power fluctuations, and are widely used in data centers, hospitals, financial institutions, and other locations with extremely high power stability requirements. The power layout design of a UPS module directly affects its performance, efficiency, and reliability. Power layout refers to the rational arrangement and configuration of the location and connection methods of the various power processing components within the UPS. A good power layout design can improve system efficiency, heat dissipation performance, and overall reliability.

[0003] Currently, UPS modules primarily use air cooling, and the layout of power components is designed according to the airflow pattern of air cooling. However, with the application of liquid cooling, how to rationally distribute heat-generating components, ensure effective heat dissipation, avoid localized overheating, and extend the lifespan of components is a technical problem that urgently needs to be solved by those skilled in the art. Summary of the Invention

[0004] This application discloses an uninterruptible power supply for liquid cooling of all power components.

[0005] To achieve the above objectives, this application provides the following technical solution:

[0006] An uninterruptible power supply includes: a first power board, a liquid cooling plate, a second power board, a first power device group disposed on the first power board, and a second power device group disposed on the second power board.

[0007] The liquid cooling plate is stacked between the first power plate and the second power plate to dissipate heat for the first power device group and the first power device group; the liquid cooling plate includes an inlet, an outlet, and a cooling channel connecting the inlet and the outlet, the cooling channel being used to contain coolant;

[0008] The first power device group and / or the second power device group includes a temperature-sensitive component and a plurality of power components, and the plurality of power components are located in front of the temperature-sensitive component along the flow direction of the coolant in the cooling channel.

[0009] The uninterruptible power supply (UPS) provided in this embodiment includes two power boards, namely a first power board and a second power board, on which power components are arranged to enable the operation of the UPS. The two power boards employ liquid cooling, with a liquid cooling plate located between the first and second power boards to dissipate heat from all power components on the first and / or second power boards. The liquid cooling plate includes an inlet, an outlet, and a cooling channel; coolant enters the cooling channel from the inlet and exits from the outlet. When arranging all components on the power boards, temperature-sensitive components with higher temperature sensitivity are prioritized for liquid cooling, followed by other power components. Therefore, in arranging the power components of the UPS in this embodiment, according to the cooling channel design, priority is given to dissipating heat from temperature-sensitive components with higher temperature sensitivity to ensure the overall service life of the UPS, followed by dissipation of heat from other power components, thus ensuring liquid cooling for all power components.

[0010] In some embodiments, the inlet and the outlet are located on the same side of the liquid cooling plate;

[0011] The cooling channel includes an inlet channel, an outlet channel, and a plurality of bend channels connecting the inlet channel and the outlet channel.

[0012] The liquid inlet channel extends along a first direction, and the plurality of bent channels include a first bent channel, which is adjacent to the liquid inlet channel; the orthographic projection of the temperature-sensitive component on the liquid cooling plate overlaps with the orthographic projection of the first bent channel on the liquid cooling plate.

[0013] In some embodiments, the liquid outlet channel extends along the first direction, and the liquid inlet channel and the liquid outlet channel are arranged along the second direction on both sides of the plurality of bend channels; the plurality of bend channels are arranged along the first direction, and the second direction is perpendicular to the first direction.

[0014] In some embodiments, the plurality of power components include a first power component and a second power component;

[0015] The first power component, the second power component, and the temperature-sensitive component are arranged along the first direction; and the orthographic projection of the temperature-sensitive component on the liquid cooling plate covers the orthographic projection of the first bend channel on the liquid cooling plate.

[0016] In some embodiments, the plurality of power components include a first power component and a second power component;

[0017] The first power component and the second power component are arranged along the first direction; the temperature-sensitive component is arranged along the second direction with the first power component and the second power component; and there is an overlap between the orthographic projection of the temperature-sensitive component on the liquid cooling plate and the orthographic projection of the liquid inlet channel on the liquid cooling plate.

[0018] In some embodiments, the outlet channel extends along the first direction and along the second direction, and the plurality of bend channels are located between the inlet channel and the outlet channel; the plurality of bend channels further include a plurality of second bend channels and at least one third bend channel, the first bend channel and the plurality of second bend channels are arranged along the second direction; the at least one third bend channel and the plurality of second bend channels are arranged along the first direction; the second direction is perpendicular to the first direction.

[0019] In some embodiments, the plurality of power components include a first power component and a second power component;

[0020] The temperature-sensitive component and the first power component are arranged along the first direction, and the second power component and the first power component are arranged along the first direction; and there is an overlapping area between the orthographic projection of the temperature-sensitive component on the liquid cooling plate and the orthographic projection of the liquid inlet channel on the liquid cooling plate.

[0021] In some embodiments, the power of the first power component is less than the power of the second power component;

[0022] In the first direction, the temperature-sensitive component and the second power component are located on both sides of the first power component.

[0023] In some embodiments, the power of the second power component is less than the power of the first power component;

[0024] In the first direction, the temperature-sensitive component and the first power component are located on both sides of the second power component.

[0025] In some embodiments, the plurality of power components further includes a third power component;

[0026] The third power component is located on the side of the temperature-sensitive component near the inlet or outlet. Attached Figure Description

[0027] Figure 1 A schematic diagram of a stacked structure of an uninterruptible power supply provided in an embodiment of this application;

[0028] Figure 2A schematic diagram of the structure of a liquid cooling plate in an uninterruptible power supply provided in this application embodiment. Figure 1 ;

[0029] Figure 3 A schematic diagram of component layout on a first power board in an uninterruptible power supply provided in an embodiment of this application. Figure 1 ;

[0030] Figure 4 A schematic diagram of component layout on a second power board in an uninterruptible power supply provided in this application embodiment. Figure 1 ;

[0031] Figure 5 A schematic diagram of component layout on a first power board in an uninterruptible power supply provided in an embodiment of this application. Figure 2 ;

[0032] Figure 6 A schematic diagram of component layout on a second power board in an uninterruptible power supply provided in an embodiment of this application. Figure 2 ;

[0033] Figure 7 A schematic diagram of the structure of a liquid cooling plate in an uninterruptible power supply provided in this application embodiment. Figure 2 ;

[0034] Figure 8 A schematic diagram of component layout on a first power board in an uninterruptible power supply provided in an embodiment of this application. Figure 3 ;

[0035] Figure 9 A schematic diagram of component layout on a second power board in an uninterruptible power supply provided in this application embodiment. Figure 3 ;

[0036] Figure 10 A schematic diagram of component layout on a first power board in an uninterruptible power supply provided in an embodiment of this application. Figure 4 ;

[0037] Figure 11 A schematic diagram of component layout on a second power board in an uninterruptible power supply provided in an embodiment of this application. Figure 4 ;

[0038] Icons: M1 - First power board; M2 - Second power board; A - Cold plate coverage area; 1 - Housing; 11 - Reinforcing rib plate; 2 - Control board; 3 - Liquid cooling plate; 4 - Temperature sensitive component; 5 - First power component; 6 - Second power component; 7 - Third power component; 31 - Inlet; 32 - Outlet; 33 - Cooling channel; 331 - Liquid inlet channel; 332 - Liquid outlet channel; 333 - Bent channel; 333a - First bent channel; 333b - Second bent channel; 333c - Third bent channel. Detailed Implementation

[0039] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application. In the description of the embodiments of this application, unless otherwise stated, " / " means "or", for example, A / B can mean A or B; "and / or" in the text is merely a description of the relationship between related objects, indicating that there can be three relationships, for example, A and / or B can represent: A alone, A and B at the same time, and B alone. In addition, in the description of the embodiments of this application, "multiple" means two or more.

[0040] Hereinafter, the terms "first" and "second" are used for descriptive purposes only and should not be construed as implying or suggesting relative importance or implicitly indicating the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature, and in the description of the embodiments of this application, unless otherwise stated, "multiple" means two or more.

[0041] like Figures 1 to 4 As shown, this application embodiment provides an uninterruptible power supply, including: a first power board M1, a liquid cooling plate 3, a second power board M2, a first power device group arranged on the first power board M1, and a second power device group arranged on the second power board M2.

[0042] The liquid cooling plate 3 is stacked between the first power plate M1 and the second power plate M2 to dissipate heat for the first power device group and the first power device group; the liquid cooling plate 3 includes an inlet 31, an outlet 32 ​​and a cooling channel 33 connecting the inlet 31 and the outlet 32, and the cooling channel 33 is used to contain the coolant.

[0043] The first power device group and / or the second power device group include a temperature-sensitive component 4 and multiple power components. Along the flow direction of the coolant in the cooling channel 33, the multiple power components are located in front of the temperature-sensitive component 4.

[0044] The uninterruptible power supply (UPS) provided in this embodiment includes two power boards, namely a first power board M1 and a second power board M2. Power components are arranged on the power boards to enable the operation of the UPS. The two power boards employ liquid cooling, with a liquid cooling plate 3 located between the first power board M1 and the second power board M2. This liquid cooling plate 3 provides heat dissipation for all power components on the first power board M1 and / or the second power board M2, i.e., double-sided heat dissipation. The liquid cooling plate 3 includes an inlet 31, an outlet 32, and a cooling channel 33. Coolant enters the cooling channel 33 from the inlet 31 and exits the liquid cooling plate 3 from the outlet 32. When arranging all components on the power boards, temperature-sensitive components 4, which are highly temperature-sensitive, are given priority for liquid cooling, followed by other power components. Therefore, in arranging the power components of the UPS in this embodiment, the cooling channel 33 design prioritizes heat dissipation for temperature-sensitive components 4 to ensure the overall lifespan of the UPS, followed by heat dissipation for other power components, thus ensuring liquid cooling for all power components.

[0045] In one embodiment, such as Figure 1 As shown, the uninterruptible power supply includes a first power board M1 and a second power board M2 connected together, and a liquid cooling plate 3 located between the first power board M1 and the second power board M2. Figure 3 and Figure 4 As shown, both the first power board M1 and the second power board M2 include a housing 1, and the two housings 1 are fastened together to form the outer casing of the uninterruptible power supply. To ensure the strength of the housing 1, multiple reinforcing ribs 11 are formed on the housing 1. A control board 2 is also arranged on the housing 1. The orthographic projection of the liquid cooling plate 3 onto the first power board M1, i.e., the area A covered by the cooling plate, is shown below. Figure 3 and Figure 4 As shown, multiple power components are evenly distributed on the first power board M1 and the second power board M2, and the cold plate coverage area A covers the area where the multiple power components are distributed to ensure that the liquid cooling plate 3 provides liquid cooling heat dissipation for all power components. Among them, the lifespan of the temperature-sensitive component 4 is inversely proportional to the temperature rise, so it needs to be prioritized for heat dissipation. In one embodiment, the temperature-sensitive component 4 is a bus electrolytic capacitor.

[0046] It is understood that the uninterruptible power supply provided in this application provides power components arranged according to the power flow direction, and the power components are arranged at an angle in conjunction with liquid cooling. In one embodiment, the power components of the uninterruptible power supply are arranged along the flow direction of the cooling channel 33, and priority is given to heat dissipation for the temperature-sensitive components 4.

[0047] In some embodiments, such as Figure 2 As shown, inlet 31 and outlet 32 ​​are located on the same side of liquid cooling plate 3;

[0048] Cooling channel 33 includes inlet channel 331, outlet channel 332, and multiple bend channels 333 connecting inlet channel 331 and outlet channel 332.

[0049] The inlet flow channel 331 is along the first direction, i.e. Figure 2 Extending in the Y direction, multiple bends 333 include a first bend 333a, which is adjacent to the liquid inlet channel 331; the orthographic projection of the temperature-sensitive component 4 on the liquid cooling plate 3 overlaps with the orthographic projection of the first bend 333a on the liquid cooling plate 3.

[0050] In one embodiment, such as Figure 2 As shown, the overall shape of the cold plate is a flat cuboid, with a rectangular heat dissipation surface. The inlet 31 and outlet 32 ​​are located on the same side of the rectangle. Cooling channels 33, communicating with the inlet 31 and outlet 32, are arranged along the rectangular surface. The cooling channels 33 include an inlet channel 331, an outlet channel 332, and multiple bends 333; the inlet channel 331 is a straight channel and flows along a first direction... Figure 2 Extending in the Y direction, multiple bends in the flow channel 333 can reduce the flow rate of the coolant and extend its residence time, thereby improving heat dissipation efficiency. Among the multiple bends in the flow channel 333, the bend in the flow channel 333 that is directly connected to the inlet flow channel 331 is the first bend in the flow channel 333a. When the temperature-sensitive component 4 is arranged on the first power board M1 and the second power board M2, there is an overlap between the orthographic projection of the temperature-sensitive component 4 on the liquid cooling plate 3 and the orthographic projection of the first bend in the flow channel 333a on the liquid cooling plate 3. This allows the low-temperature coolant flowing in from the inlet flow channel 331 to preferentially dissipate heat for the temperature-sensitive component 4, thereby improving the service life of the temperature-sensitive component 4.

[0051] In some embodiments, such as Figure 2 As shown, the liquid outlet channel 332 extends along a first direction, and the liquid inlet channel 331 and the liquid outlet channel 332 are arranged along a second direction on both sides of the plurality of bend channels 333; the plurality of bend channels 333 are arranged along the first direction, and the second direction is perpendicular to the first direction. The first direction is... Figure 2 In the Y direction, the second direction is Figure 2 In the X direction.

[0052] In one embodiment, such as Figure 2 As shown, in the cooling channel 33, the liquid inlet channel 331 and the liquid outlet channel 332 both extend along the long side of the liquid cooling plate 3, and each of the multiple bend channels 333 extends along the short side of the liquid cooling plate 3, and the multiple bend channels 333 are arranged along the long side of the liquid cooling plate 3.

[0053] In some embodiments, the bent flow channel 333 has at least one bend, the presence of which can reduce the coolant flow rate, thereby prolonging the residence time of the coolant at the bend and improving heat dissipation efficiency. In one embodiment, the bent flow channel 333 is L-shaped; in another embodiment, the bent flow channel 333 is U-shaped; in yet another embodiment, the bent flow channel 333 is N-shaped; and in yet another embodiment, the bent flow channel 333 is M-shaped.

[0054] It should be noted that the shape and / or size of each of the multiple bent flow channels 333 may be the same or different.

[0055] In some embodiments, the plurality of power components include a first power component 5 and a second power component 6;

[0056] The first power component 5, the second power component 6, and the temperature-sensitive component 4 are arranged along the first direction; and the orthogonal projection of the temperature-sensitive component 4 on the liquid cooling plate 3 covers the orthogonal projection of the first bent flow channel 333a on the liquid cooling plate 3.

[0057] In some embodiments, such as Figure 3 As shown, the layout surface of the power components on the first power board M1 is rectangular. Temperature-sensitive component 4, first power component 5, and second power component 6 are arranged on the first power board M1; (Refer to...) Figure 2 The liquid inlet channel 331 extends along the long side of the liquid cooling plate 3 from the upper short side to near the bottom short side. The temperature-sensitive component 4 is positioned close to the bottom short side of the first power board M1 and covers the corresponding area of ​​the first bent channel 333a in the cold plate coverage area A. Definition Figure 3 The four temperature-sensitive components are arranged horizontally. (Along) Figure 3 In the Y-direction, the second power component 6 is located between the first power component 5 and the temperature-sensitive component 4. The heat dissipation priority order on the first power board M1 is: temperature-sensitive component 4 - second power component 6 - first power component 5.

[0058] In one embodiment, the temperature-sensitive component 4 is a bus electrolytic capacitor, the first power component 5 is a power inductor, and the second power component 6 is a power switch and a heat sink. The heat dissipation priority on the first power board M1 is: bus electrolytic capacitor - power switch and heat sink - power inductor.

[0059] In some embodiments, such as Figure 4 As shown, the layout surface of the power components on the second power board M2 is rectangular. The second power board M2 contains a temperature-sensitive component 4, a first power component 5, and a second power component 6. (Refer to...) Figure 2The liquid inlet channel 331 extends along the long side of the liquid cooling plate 3 from the upper short side to near the bottom short side. The temperature-sensitive component 4 is positioned close to the bottom short side of the first power board M1 and covers the corresponding area of ​​the first bent channel 333a in the cold plate coverage area A. Definition Figure 4 The four temperature-sensitive components are arranged horizontally. (Along) Figure 4 In the Y-direction, the second power component 6 is located between the first power component 5 and the temperature-sensitive component 4. The heat dissipation priority order on the second power board M2 is: temperature-sensitive component 4 - second power component 6 - first power component 5.

[0060] In one embodiment, the temperature-sensitive component 4 is a bus electrolytic capacitor, the first power component 5 is a power inductor, and the second power component 6 is a power switch and a heat sink. The heat dissipation priority on the second power board M2 is: bus electrolytic capacitor - power switch and heat sink - power inductor.

[0061] Understandably, this should be taken into consideration as well. Figure 3 and Figure 4 The first power board M1 and the second power board M2 are flipped and joined together with the liquid cooling plate 3 in the Y direction to form a "sandwich" structure.

[0062] In some embodiments, the plurality of power components include a first power component 5 and a second power component 6;

[0063] The first power component 5 and the second power component 6 are arranged along the first direction; the temperature-sensitive component 4 is arranged along the second direction with the first power component 5 and the second power component 6; and the orthographic projection of the temperature-sensitive component 4 on the liquid cooling plate 3 overlaps with the orthographic projection of the liquid inlet channel 331 on the liquid cooling plate 3.

[0064] In some embodiments, such as Figure 5 As shown, the layout surface of the power components on the first power board M1 is rectangular. Temperature-sensitive component 4, first power component 5, and second power component 6 are arranged on the first power board M1; (Refer to...) Figure 2 The liquid inlet channel 331 extends along the long side of the liquid cooling plate 3 from the upper short side to near the bottom short side. The temperature-sensitive component 4 is positioned close to the bottom short side of the first power board M1, and overlaps with the first bent channel 333a and its connection point with the liquid inlet channel 331 in the corresponding area of ​​the cold plate coverage region A. Figure 3 Different placement directions define Figure 5 The temperature-sensitive components are arranged vertically. (Along) Figure 5In the Y-direction, the first power component 5 is located above the second power component 6, and the temperature-sensitive component 4 is located to the left of the first power component 5 and the second power component 6. The heat dissipation priority order on the first power board M1 is: temperature-sensitive component 4 - second power component 6 - first power component 5.

[0065] In one embodiment, the temperature-sensitive component 4 is a bus electrolytic capacitor, the first power component 5 is a power inductor, and the second power component 6 is a power switch and a heat sink. The heat dissipation priority on the first power board M1 is: bus electrolytic capacitor - power switch and heat sink - power inductor.

[0066] In some embodiments, such as Figure 6 As shown, the layout surface of the power components on the second power board M2 is rectangular. The second power board M2 contains a temperature-sensitive component 4, a first power component 5, and a second power component 6. (Refer to...) Figure 2 The liquid inlet channel 331 extends along the long side of the liquid cooling plate 3 from the upper short side to near the bottom short side. The temperature-sensitive component 4 is positioned close to the bottom short side of the first power board M1, and overlaps with the first bent channel 333a and its connection point with the liquid inlet channel 331 in the corresponding area of ​​the cold plate coverage region A. Figure 4 Different placement directions define Figure 6 The temperature-sensitive components are arranged vertically. (Along) Figure 6 In the Y-direction, the first power component 5 is located above the second power component 6, and the temperature-sensitive component 4 is located to the right of the first power component 5 and the second power component 6. The heat dissipation priority order on the second power board M2 is: temperature-sensitive component 4 - second power component 6 - first power component 5.

[0067] In one embodiment, the temperature-sensitive component 4 is a bus electrolytic capacitor, the first power component 5 is a power inductor, and the second power component 6 is a power switch and a heat sink. The heat dissipation priority on the second power board M2 is: bus electrolytic capacitor - power switch and heat sink - power inductor.

[0068] Understandably, this should be taken into consideration as well. Figure 5 and Figure 6 The first power board M1 and the second power board M2 are flipped and joined together with the liquid cooling plate 3 in the Y direction to form a "sandwich" structure.

[0069] In some embodiments, such as Figure 7As shown, the outlet flow channel 332 extends along a first direction and along a second direction, with multiple bends 333 located between the inlet flow channel 331 and the outlet flow channel 332; the multiple bends 333 further include multiple second bends 333b and at least one third bend 333c, the first bends 333a and the multiple second bends 333b arranged along the second direction; the at least one third bend 333c and the multiple second bends 333b arranged along the first direction; the second direction is perpendicular to the first direction. The first direction is... Figure 7 In the Y direction, the second direction is Figure 7 In the X direction.

[0070] In one embodiment, such as Figure 7 As shown, in the cooling channel 33, both the inlet channel 331 and the outlet channel 332 extend along the long side of the liquid cooling plate 3. The plurality of bent channels 333 include a plurality of second bent channels 333b and at least one third bent channel 333c. Each second bent channel 333b extends along the long side of the liquid cooling plate 3, and the plurality of second bent channels 333b are arranged along the short side of the liquid cooling plate 3. The third bent channel 333c extends along the short side of the liquid cooling plate 3, and when there are multiple third bent channels 333c, the plurality of third bent channels 333c are arranged along the long side of the liquid cooling plate 3.

[0071] In some embodiments, the plurality of power components include a first power component 5 and a second power component 6;

[0072] Temperature-sensitive component 4 and first power component 5 are arranged along the first direction, and second power component 6 is arranged along the first power component 5; and the orthographic projection of temperature-sensitive component 4 on liquid cooling plate 3 overlaps with the orthographic projection of liquid inlet channel 331 on liquid cooling plate 3.

[0073] In some embodiments, the power of the first power component 5 is less than the power of the second power component 6;

[0074] In the first direction, the temperature-sensitive component 4 and the second power component 6 are located on both sides of the first power component 5.

[0075] In some embodiments, such as Figure 8 As shown, the layout surface of the power components on the first power board M1 is rectangular. Temperature-sensitive component 4, first power component 5, and second power component 6 are arranged on the first power board M1; (Refer to...) Figure 7 The liquid inlet channel 331 extends along the long side of the liquid cooling plate 3 from the upper short side to the bottom short side, and the first bent channel 333a also extends along the long side of the liquid cooling plate 3. The temperature-sensitive component 4 is positioned close to the bottom short side of the first power board M1 and covers the corresponding area of ​​the first bent channel 333a in the cold plate coverage area A. Figure 8The temperature-sensitive component 4 is placed vertically. Because the power of the first power component 5 is less than the power of the second power component 6, along... Figure 8 In the X-direction, the first power component 5 is located between the second power component 6 and the temperature-sensitive component 4. The heat dissipation priority order on the first power board M1 is: temperature-sensitive component 4 - first power component 5 - second power component 6.

[0076] In one embodiment, the temperature-sensitive component 4 is a bus electrolytic capacitor, the first power component 5 is a power inductor, and the second power component 6 is a power switch and a heat sink. The heat dissipation priority on the first power board M1 is: bus electrolytic capacitor - power inductor - power switch and heat sink.

[0077] In some embodiments, such as Figure 9 As shown, the layout surface of the power components on the second power board M2 is rectangular. The second power board M2 contains a temperature-sensitive component 4, a first power component 5, and a second power component 6. (Refer to...) Figure 7 The liquid inlet channel 331 extends along the long side of the liquid cooling plate 3 from the upper short side to the bottom short side, and the first bent channel 333a also extends along the long side of the liquid cooling plate 3. The temperature-sensitive component 4 is positioned close to the bottom short side of the first power board M1 and covers the corresponding area of ​​the first bent channel 333a in the cold plate coverage area A. Figure 9 The temperature-sensitive component 4 is placed vertically. Because the power of the first power component 5 is less than the power of the second power component 6, along... Figure 9 In the X-direction, the first power component 5 is located between the second power component 6 and the temperature-sensitive component 4. The heat dissipation priority order on the second power board M2 is: temperature-sensitive component 4 - first power component 5 - second power component 6.

[0078] In one embodiment, the temperature-sensitive component 4 is a bus electrolytic capacitor, the first power component 5 is a power inductor, and the second power component 6 is a power switch and a heat sink. The heat dissipation priority on the second power board M2 is: bus electrolytic capacitor - power inductor - power switch and heat sink.

[0079] Understandably, this should be taken into consideration as well. Figure 8 and Figure 9 The first power board M1 and the second power board M2 are flipped and joined together with the liquid cooling plate 3 in the Y direction to form a "sandwich" structure.

[0080] In some embodiments, the power of the second power component 6 is less than the power of the first power component 5;

[0081] In the first direction, the temperature-sensitive component 4 and the first power component 5 are located on both sides of the second power component 6.

[0082] In some embodiments, such as Figure 10 As shown, the layout surface of the power components on the first power board M1 is rectangular. Temperature-sensitive component 4, first power component 5, and second power component 6 are arranged on the first power board M1; (Refer to...) Figure 7 The liquid inlet channel 331 extends along the long side of the liquid cooling plate 3 from the upper short side to the bottom short side, and the first bent channel 333a also extends along the long side of the liquid cooling plate 3. The temperature-sensitive component 4 is positioned close to the bottom short side of the first power board M1 and covers the corresponding area of ​​the first bent channel 333a in the cold plate coverage area A. Figure 10 The temperature-sensitive component 4 is placed vertically. Because the power of the second power component 6 is less than the power of the first power component 5, along... Figure 10 In the X-direction, the second power component 6 is located between the first power component 5 and the temperature-sensitive component 4. The heat dissipation priority order on the first power board M1 is: temperature-sensitive component 4 - second power component 6 - first power component 5.

[0083] In one embodiment, the temperature-sensitive component 4 is a bus electrolytic capacitor, the first power component 5 is a power inductor, and the second power component 6 is a power switch and a heat sink. The heat dissipation priority on the first power board M1 is: bus electrolytic capacitor - power switch and heat sink - power inductor.

[0084] In some embodiments, such as Figure 11 As shown, the layout surface of the power components on the second power board M2 is rectangular. The second power board M2 contains a temperature-sensitive component 4, a first power component 5, and a second power component 6. (Refer to...) Figure 7 The liquid inlet channel 331 extends along the long side of the liquid cooling plate 3 from the upper short side to the bottom short side, and the first bent channel 333a also extends along the long side of the liquid cooling plate 3. The temperature-sensitive component 4 is positioned close to the bottom short side of the first power board M1 and covers the corresponding area of ​​the first bent channel 333a in the cold plate coverage area A. Figure 11 The temperature-sensitive component 4 is placed vertically. Because the power of the second power component 6 is less than the power of the first power component 5, along... Figure 11 In the X-direction, the second power component 6 is located between the first power component 5 and the temperature-sensitive component 4. The heat dissipation priority order on the second power board M2 is: temperature-sensitive component 4 - second power component 6 - first power component 5.

[0085] In one embodiment, the temperature-sensitive component 4 is a bus electrolytic capacitor, the first power component 5 is a power inductor, and the second power component 6 is a power switch and a heat sink. The heat dissipation priority on the second power board M2 is: bus electrolytic capacitor - power switch and heat sink - power inductor.

[0086] Understandably, this should be taken into consideration as well. Figure 10 and Figure 11 The first power board M1 and the second power board M2 are flipped and joined together with the liquid cooling plate 3 in the Y direction to form a "sandwich" structure.

[0087] In some embodiments, the plurality of power components further include a third power component 7; the third power component 7 is located on the side of the temperature-sensitive component 4 near the inlet 31 or the outlet 32.

[0088] In some embodiments, the third power component 7 on the first power board M1 includes a fuse, a relay, and an electromagnetic interference device. The third power component 7 on the first power board M1 includes a fuse, a relay, and an auxiliary power supply.

[0089] In one embodiment, such as Figure 3 As shown, the heat dissipation priority order on the first power board M1 is: inlet 31 - temperature-sensitive component 4 - second power component 6 - first power component 5 - third power component 7 - outlet 32. Figure 4 As shown, the heat dissipation priority order on the second power board M2 is: inlet 31 - temperature-sensitive component 4 - second power component 6 - first power component 5 - third power component 7 - outlet 32. In another embodiment, the heat dissipation priority order on the first power board M1 is: inlet 31 - bus electrolytic capacitor - power switch and heat sink - power inductor - fuse / relay / electromagnetic interference device - outlet 32. The heat dissipation priority order on the second power board M2 is: inlet 31 - bus electrolytic capacitor - power switch and heat sink - power inductor - fuse / relay / auxiliary power supply - outlet 32.

[0090] In one embodiment, such as Figure 5 As shown, the heat dissipation priority order on the first power board M1 is: inlet 31 - temperature-sensitive component 4 - second power component 6 - first power component 5 - third power component 7 - outlet 32. Figure 6 As shown, the heat dissipation priority order on the second power board M2 is: inlet 31 - temperature-sensitive component 4 - second power component 6 - first power component 5 - third power component 7 - outlet 32. In another embodiment, the heat dissipation priority order on the first power board M1 is: inlet 31 - bus electrolytic capacitor - power switch and heat sink - power inductor - fuse / relay / electromagnetic interference device - outlet 32. The heat dissipation priority order on the second power board M2 is: inlet 31 - bus electrolytic capacitor - power switch and heat sink - power inductor - fuse / relay / auxiliary power supply - outlet 32.

[0091] In one embodiment, such as Figure 8As shown, the heat dissipation priority order on the first power board M1 is: inlet 31 - temperature-sensitive component 4 - first power component 5 - second power component 6 - third power component 7 - outlet 32. Figure 9 As shown, the heat dissipation priority order on the second power board M2 is: inlet 31 - temperature-sensitive component 4 - first power component 5 - second power component 6 - third power component 7 - outlet 32. In another embodiment, the heat dissipation priority order on the first power board M1 is: inlet 31 - bus electrolytic capacitor - power inductor - power switch and heat sink - fuse / relay / electromagnetic interference device - outlet 32. The heat dissipation priority order on the second power board M2 is: inlet 31 - bus electrolytic capacitor - power inductor - power switch and heat sink - fuse / relay / auxiliary power supply - outlet 32.

[0092] In one embodiment, such as Figure 10 As shown, the heat dissipation priority order on the first power board M1 is: inlet 31 - temperature-sensitive component 4 - second power component 6 - first power component 5 - third power component 7 - outlet 32. Figure 11 As shown, the heat dissipation priority order on the second power board M2 is: inlet 31 - temperature-sensitive component 4 - second power component 6 - first power component 5 - third power component 7 - outlet 32. In another embodiment, the heat dissipation priority order on the first power board M1 is: inlet 31 - bus electrolytic capacitor - power switch and heat sink - power inductor - fuse / relay / electromagnetic interference device - outlet 32. The heat dissipation priority order on the second power board M2 is: inlet 31 - bus electrolytic capacitor - power switch and heat sink - power inductor - fuse / relay / auxiliary power supply - outlet 32.

[0093] The uninterruptible power supply provided in this application decouples the heat sink of the power switching transistor and the bus electrolytic capacitor and places them separately, giving priority to heat dissipation of temperature-sensitive devices; after passing through the bus electrolytic capacitor, the coolant flows to the power switching transistor and heat sink with higher heat generation, or the power inductor; finally, the flow channel dissipates heat for components with relatively low heat generation but high temperature derating, taking into account the heat dissipation of all heat-generating components, such as auxiliary power supply, electromagnetic interference devices, fuses, relays, Hall sensors, etc.

[0094] Obviously, those skilled in the art can make various modifications and variations to the embodiments of this application without departing from the spirit and scope of this application. Therefore, if these modifications and variations of this application fall within the scope of the claims of this application and their equivalents, this application also intends to include these modifications and variations.

Claims

1. An uninterruptible power supply, characterized in that, include: A first power board, a liquid cooling plate, a second power board, a first power device group disposed on the first power board, and a second power device group disposed on the second power board. The liquid cooling plate is stacked between the first power plate and the second power plate to dissipate heat for the first power device group and the first power device group; the liquid cooling plate includes an inlet, an outlet, and a cooling channel connecting the inlet and the outlet, the cooling channel being used to contain coolant; The first power device group and / or the second power device group includes a temperature-sensitive component and a plurality of power components, and the plurality of power components are located in front of the temperature-sensitive component along the flow direction of the coolant in the cooling channel.

2. The uninterruptible power supply according to claim 1, characterized in that, The inlet and the outlet are located on the same side of the liquid cooling plate; The cooling channel includes an inlet channel, an outlet channel, and a plurality of bend channels connecting the inlet channel and the outlet channel. The liquid inlet channel extends along a first direction, and the plurality of bent channels include a first bent channel, which is adjacent to the liquid inlet channel; the orthographic projection of the temperature-sensitive component on the liquid cooling plate overlaps with the orthographic projection of the first bent channel on the liquid cooling plate.

3. The uninterruptible power supply according to claim 2, characterized in that, The liquid outlet channel extends along the first direction, and the liquid inlet channel and the liquid outlet channel are arranged along the second direction on both sides of the plurality of bend channels; the plurality of bend channels are arranged along the first direction, and the second direction is perpendicular to the first direction.

4. The uninterruptible power supply according to claim 3, characterized in that, The plurality of power components include a first power component and a second power component. The first power component, the second power component, and the temperature-sensitive component are arranged along the first direction; and the orthographic projection of the temperature-sensitive component on the liquid cooling plate covers the orthographic projection of the first bend channel on the liquid cooling plate.

5. The uninterruptible power supply according to claim 3, characterized in that, The plurality of power components include a first power component and a second power component. The first power component and the second power component are arranged along the first direction; the temperature-sensitive component is arranged along the second direction with the first power component and the second power component; and there is an overlap between the orthographic projection of the temperature-sensitive component on the liquid cooling plate and the orthographic projection of the liquid inlet channel on the liquid cooling plate.

6. The uninterruptible power supply according to claim 2, characterized in that, The outlet flow channel extends along the first direction and along the second direction, and the plurality of bends are located between the inlet flow channel and the outlet flow channel; the plurality of bends further includes a plurality of second bends and at least one third bend, the first bend and the plurality of second bends are arranged along the second direction; the at least one third bend and the plurality of second bends are arranged along the first direction; the second direction is perpendicular to the first direction.

7. The uninterruptible power supply according to claim 6, characterized in that, The plurality of power components include a first power component and a second power component. The temperature-sensitive component and the first power component are arranged along the first direction, and the second power component and the first power component are arranged along the first direction; and there is an overlapping area between the orthographic projection of the temperature-sensitive component on the liquid cooling plate and the orthographic projection of the liquid inlet channel on the liquid cooling plate.

8. The uninterruptible power supply according to claim 7, characterized in that, The power of the first power component is less than the power of the second power component; In the first direction, the temperature-sensitive component and the second power component are located on both sides of the first power component.

9. The uninterruptible power supply according to claim 7, characterized in that, The power of the second power component is less than the power of the first power component; In the first direction, the temperature-sensitive component and the first power component are located on both sides of the second power component.

10. The uninterruptible power supply according to any one of claims 1-9, characterized in that, The plurality of power components also includes a third power component; The third power component is located on the side of the temperature-sensitive component near the inlet or outlet.

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