Multiband UV curing system

Abstract

A multiband UV curing system relates to the technical field of UV curing, and comprises a UV curing lamp holder, the UV curing lamp holder comprises a main control board, a driving board, a UV-LED lamp panel and a UV energy sensor, the UV-LED lamp panel is divided into multiple band units which are arranged in rows and have different light-emitting bands, each band unit is independently connected to the driving board, the on-off state and current of each band unit are controlled by the driving board, and the UV energy sensor is connected with the main control board; each waveband unit supports independent PWM dimming, and the UV energy sensor is used for monitoring UV power and UV energy in real time; and the dynamic allocation control device is used for dynamically controlling the on-off state and the optical power output proportion of each wave band unit according to the UV power and the UV energy data. The multi-band combination design can be matched with the absorption peak values of different photoinitiators in the ink, each band unit performs independent dimming, and the on-off state and the optical power output proportion are dynamically adjusted by the dynamic allocation control device, so that the problems of non-uniform curing, rapid surface curing shrinkage or incomplete bottom layer curing and the like are effectively avoided; the curing requirements of different types of printing ink can be met.

Description

Technical Field

[0001] This application relates to the field of ultraviolet curing technology, specifically to a multi-band UV curing system. Background Technology

[0002] UV (Ultraviolet) curing technology is widely used in printing, electronics manufacturing and surface treatment. Its core principle is to use a UV curing device to generate ultraviolet light of a specific wavelength to irradiate UV-curable inks or resins, causing the photoinitiator to decompose and triggering a polymerization reaction, ultimately achieving rapid curing of the material.

[0003] Current UV curing systems mostly use single-band UV-LEDs (such as 365nm, 385nm, 395nm, or 405nm), which have the advantages of low energy consumption and long lifespan, but have the following problems in curing screen printing inks:

[0004] 1. Uneven curing problem. Single-band UV photons have limited energy, making it difficult to match the absorption peaks of different photoinitiators in the ink. Specifically, this manifests as:

[0005] Short wavelengths (such as 365nm): have strong penetrating power, but the surface ink absorbs too much energy, causing the surface to solidify and shrink rapidly, while the bottom layer is not completely solidified, resulting in a "floating oil" phenomenon.

[0006] Mid-wave band (e.g., 385nm, 395nm): Penetration is between short-wave and long-wave, but for high-octane inks (e.g., white, black) or thicker ink layers (>20μm), there may still be problems with insufficient curing of the underlying layer and slow curing speed;

[0007] Long wavelengths (e.g., 405nm): weak penetration, energy concentrated on the surface, insufficient curing of the underlying layer, which can easily lead to decreased ink adhesion and contamination of the PCB board (e.g., ink residue in the solder pad area).

[0008] 2. Ink compatibility issues. Screen printing inks of different colors and compositions (such as white ink, green ink, and transparent ink) require specific wavelengths for excitation. However, single-band UV curing systems have poor ink compatibility and cannot dynamically adapt, requiring frequent changes of light sources, which reduces production efficiency. Utility Model Content

[0009] In view of this, the purpose of this application is to provide a multi-band UV curing system to solve at least one of the above-mentioned technical problems.

[0010] This application provides a multi-band UV curing system, including: a UV curing lamp head, comprising a main control board, a driver board, a UV-LED lamp board, and a UV energy sensor. The LEDs on the UV-LED lamp board are arranged in multiple rows, with one or more rows of LEDs forming a band unit. Each band unit has a different emission band. Each band unit is individually connected to the driver board, which controls its switching state and current. Each band unit achieves independent dimming by executing a PWM signal generated by the main control board through the driver board. The UV energy sensor monitors the UV power and UV energy of the UV-LED lamp board in real time and transmits the UV power and UV energy data to the main control board. A dynamic adjustment control device, communicatively connected to the main control board, dynamically controls the switching state and light power output ratio of each band unit on the UV-LED lamp board based on the UV power and UV energy data fed back from the main control board.

[0011] In some optional implementations, the dynamic allocation control device includes a host computer, an industrial control touch screen, and a command arbitrator. Both the host computer and the industrial control touch screen are communicatively connected to the command arbitrator, which is communicatively connected to the main control board.

[0012] In some alternative implementations, the band units include shortwave units, mediumwave units, and longwave units.

[0013] In some alternative implementations, the short-wave unit includes LEDs with a wavelength of 365 nm, the mid-wave unit includes LEDs with a wavelength of 385 nm and / or LEDs with a wavelength of 395 nm, and the long-wave unit includes LEDs with a wavelength of 405 nm.

[0014] In some optional implementations, there is at least one main control board, each main control board controls one or more driver boards, and each driver board controls one or more UV-LED lamp boards. When there are multiple main control boards, the multiple main control boards are connected in a cascade mode and coordinated by a dynamic allocation control device.

[0015] In some alternative implementations, a microlens array is provided in front of or near the UV-LED lamp panel, and / or, a diffuse reflection coating is provided on the inner surface of the UV curing lamp head. Both the microlens array and the diffuse reflection coating are used to reduce interference patterns in the UV curing area and optimize the light intensity distribution in the UV curing area.

[0016] In some optional implementations, the UV curing lamp head also includes a temperature sensor for real-time monitoring of the operating temperature of the UV-LED lamp panel and transmitting the temperature data to the main control board, which then feeds it back to the dynamic adjustment control device.

[0017] In some optional implementations, the UV curing lamp head also includes a current detection module, which is used to monitor the current in the relevant circuits of the driver board in real time and transmit the current data to the main control board, which then feeds it back to the dynamic adjustment control device.

[0018] In some alternative implementations, a power supply module is also included for supplying power to the UV curing lamp head and the dynamic adjustment control device.

[0019] In some alternative embodiments, the device further includes a liquid cooling system, comprising a liquid cooling component and a liquid cooling unit, wherein the liquid cooling component is connected to the UV-LED lamp panel, and the liquid cooling unit is connected to the liquid cooling component and is used to supply coolant to the liquid cooling component to cool the UV-LED lamp panel.

[0020] Based on the above technical solution, the multi-band UV curing system provided in this application employs a multi-band combined design for the UV-LED lamp board, which can match the absorption peak values ​​of different photoinitiators in the ink. Each band unit supports independent PWM dimming, ensuring that the light energy emitted by each band unit matches the absorption peak values ​​of different photoinitiators in the ink. The dynamic adjustment control device dynamically adjusts the switching state and light power output ratio of each band unit based on the UV power and UV energy data monitored by the UV energy sensor, ensuring that the ink absorbs light energy uniformly and appropriately during the curing process, effectively avoiding problems such as uneven curing, rapid surface curing shrinkage, or incomplete curing of the underlying layer. Through the above design, this multi-band UV curing system can meet the curing requirements of different types of inks. Attached Figure Description

[0021] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a structural block diagram of a multi-band UV curing system provided in an embodiment of this application.

[0023] Figure 2 This is a schematic diagram of the arrangement of LED beads on a UV-LED lamp board provided in an embodiment of this application.

[0024] Figure 3 This is a schematic diagram of the structure of a UV-LED lamp panel provided in an embodiment of this application.

[0025] Figure 4 This is a schematic diagram of the structure of a liquid cooling component provided in an embodiment of this application.

[0026] Reference numerals: 100, Multi-band UV curing system; 10, UV curing lamp head; 11, Main control board; 12, Driver board; 13, UV-LED lamp board; 14, UV energy sensor; 15, Temperature sensor; 16, Current detection module; 20, Dynamic adjustment control device; 21, Host computer; 22, Industrial control touch screen; 23, Command arbitrator; 30, Power supply module; 31, First power supply module; 32, Second power supply module; 40, Liquid cooling device; 41, Liquid cooling component; 411, Liquid cooling plate; 4111, Cooling channel; 412, Liquid inlet interface; 413, Liquid outlet interface; 42, Liquid cooling unit. Detailed Implementation

[0027] The specific embodiments of this application will now be described in detail with reference to the accompanying drawings. Obviously, the described embodiments are merely a part of the embodiments of this application, and not all of them. Based on the description of this application, all other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of this application.

[0028] In the description of this application, unless otherwise expressly specified and limited, the terms "connection," "setup," "installation," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0029] The terms “upper,” “lower,” “left,” “right,” “front,” “back,” “center,” “top,” “bottom,” “inner,” “outer,” “vertical,” “horizontal,” “clockwise,” “counterclockwise,” “axial,” “radial,” and “circumferential” indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product is in use. They are used only for the convenience of description and simplification, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0030] The terms “first,” “second,” “third,” etc., are used only to distinguish elements with similar properties, and do not indicate or imply relative importance or a specific order, unless otherwise explicitly stated or limited.

[0031] The terms “comprising,” “including,” “having,” or any other variations thereof are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase “comprising one…” does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0032] The term "multiple" means two or more (including two).

[0033] The term "and / or" describes the relationship between related objects, indicating that there can be three relationships. For example, A and / or B can represent three cases: A exists alone, A and B exist simultaneously, and B exists alone.

[0034] The terms "an embodiment," "as an example," and "in one implementation" refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which may be included in at least one embodiment or example of this application. These illustrative expressions do not necessarily refer to the same embodiment, nor are they independent or alternative embodiments mutually exclusive with other embodiments. Where there is no conflict, the embodiments and features described in these embodiments can be combined in a suitable manner.

[0035] Figure 1 A structural block diagram of a multi-band UV curing system 100 provided in this application embodiment is shown below. Figure 1 As shown in the figure, this application embodiment provides a multi-band UV curing system 100, including a UV curing lamp head 10, a dynamic adjustment control device 20, a power supply module 30, and a liquid cooling device 40. The details of each part are described below.

[0036] The UV curing lamp head 10 is responsible for the emission and precise control of UV light. The UV curing lamp head 10 includes a main control board 11, a driver board 12, a UV-LED lamp board 13, a UV energy sensor 14, a temperature sensor 15, and a current detection module 16.

[0037] The system includes at least one main control board 11, each of which can control one or more driver boards 12, and each driver board 12 can control one or more UV-LED lamp boards 13. When there are two or more main control boards 11, they can be connected in a cascaded manner to control more driver boards 12, and thus more UV-LED lamp boards 13, thereby flexibly expanding the UV curing range and meeting the needs of UV curing operations of different scales and requirements.

[0038] As an example, such as Figure 1 As shown, each main control board 11 communicates with five driver boards 12 via an RS485 bus, thus enabling simultaneous control of these five driver boards 12. Each driver board 12 is configured with a unique communication address via the Modbus protocol and dedicated software, ensuring that the main control board 11 can accurately identify and control a specific driver board 12. Each driver board 12 is connected to and controls a UV-LED lamp board 13 via a communication interface.

[0039] The LEDs on each UV-LED panel 13 are arranged in multiple rows, with one or more rows of LEDs forming an independent wavelength unit. There are multiple wavelength units in total, and the emission wavelengths of each wavelength unit are different. This multi-wavelength combination design can match the absorption peaks of different photoinitiators in the ink.

[0040] As an example, such as Figure 2 As shown, on the UV-LED lamp board 13, every two rows of LEDs form a band unit, and each band unit is individually connected to the driver board 12 via physical wiring or a specific circuit interface. The gaps between the band units shown in the illustration are for illustrative purposes only. In actual applications, the spacing between all LEDs is consistent, and the LED arrangement must strictly meet multi-dimensional physical constraints such as heat dissipation performance, optical uniformity, and driver circuit layout.

[0041] Each band unit is individually connected to its corresponding driver board 12, which controls its switching state and current. Each band unit achieves independent dimming by executing the PWM (Pulse Width Modulation) signal generated by the main control board 11 through its corresponding driver board 12. By adjusting the optical power of each band unit through PWM, it is ensured that the light energy emitted by each band unit matches the absorption peak of different photoinitiators in the ink. Furthermore, by adjusting the switching state and optical power output ratio of each band unit, it is ensured that the ink absorbs light energy uniformly and appropriately during the curing process, effectively avoiding problems such as uneven curing, rapid surface curing shrinkage, or incomplete curing of the underlying layer. This independent light control design allows the multi-band UV curing system 100 to meet the curing requirements of different types of inks. In practical applications, the light source parameters can be quickly adjusted according to the ink type without frequent replacement of the light source, thereby improving curing efficiency and reducing production costs.

[0042] As an example, such as Figure 3As shown, each UV-LED lamp panel 13 has three wavelength units, with each pair of LED beads forming a wavelength unit. These three wavelength units emit different wavelengths: a short-wavelength unit, a medium-wavelength unit, and a long-wavelength unit. The short-wavelength unit consists of two rows of 365nm LED beads (A). Short-wavelength UV light penetrates deep into the ink for deep curing, enhancing the adhesion between the ink and the substrate. The medium-wavelength unit consists of two rows of 385nm or 395nm LED beads (B). Medium-wavelength UV light balances penetration depth and surface reaction rate, contributing to a dynamic balance in the curing process. The long-wavelength unit consists of two rows of 405nm LED beads (C). Long-wavelength light acts on the ink surface, rapidly initiating the curing reaction and mitigating the effects of oxygen inhibition. The short-wavelength unit, medium-wavelength unit, and long-wavelength unit all support 0%-100% continuous PWM dimming. The main control board 11 generates a PWM signal to adjust the duty cycle, and the driver board 12 performs current adjustment, thereby achieving precise output of optical power. It can adapt to the curing requirements of different types of inks such as white ink, green ink, and transparent ink.

[0043] Furthermore, it should be noted that although the combined design of multi-band units can match the absorption characteristics of different ink photoinitiators and improve curing efficiency, interference patterns are easily generated in the UV curing area when multiple band light sources are superimposed, affecting the uniformity of light intensity distribution. To address this issue, a microlens array composed of multiple microlenses can be placed in front of or near the UV-LED lamp panel 13, or a high-reflectivity diffuse reflection coating can be coated on the inner surface of the UV curing lamp head 10. Alternatively, a combination of the microlens array and the diffuse reflection coating can be used. All of these methods can effectively reduce interference patterns in the UV curing area, optimize the light intensity distribution in the UV curing area, and improve curing quality.

[0044] like Figure 1 As shown, the UV energy sensor 14 is electrically connected to the main control board 11. The UV energy sensor 14 is used to monitor the UV power and UV energy of the UV-LED lamp board 13 in real time and transmit the data to the main control board 11. The main control board 11 then feeds the data back to the dynamic allocation control device 20. Based on this data, the dynamic allocation control device 20 dynamically controls the switching status and light power output ratio of each band unit on the corresponding UV-LED lamp board 13 through the main control board 11.

[0045] As an example, the UV energy sensor 14 is an ultraviolet intensity detection probe, which is installed on the light-emitting surface of the UV curing lamp head 10. The ultraviolet intensity detection probe supports RS485 communication and Modbus protocol, and its detection range covers the emission bands of different band units on the UV-LED lamp board 13 (such as 365nm, 385nm, 395nm, 405nm). It can also distinguish different bands and monitor their UV power and UV energy respectively.

[0046] like Figure 1 As shown, the temperature sensor 15 is electrically connected to the main control board 11 and is preferably located near the heat-generating core area of ​​the UV-LED lamp board 13. The temperature sensor 15 is used to monitor the operating temperature of the UV-LED lamp board 13 in real time and transmit the temperature data to the main control board 11, which then feeds it back to the dynamic adjustment control device 20.

[0047] As an example, temperature sensor 15 is a single-bus digital temperature sensor that can convert temperature data into digital signals and transmit them to the main control board 11 for real-time reading. Each temperature sensor 15 monitors a UV-LED lamp board 13, ensuring the range and accuracy of the detection.

[0048] like Figure 1 As shown, the current detection module 16 is electrically connected to the main control board 11 and the drive board 12. The current detection module 16 is used to monitor the current in the relevant circuit of the drive board 12 in real time and transmit the current data to the main control board 11, which then feeds it back to the dynamic adjustment control device 20.

[0049] As an example, each current detection module 16 monitors a corresponding driver board 12, used to monitor the current in the relevant circuits of the driver board 12, and transmits the current data to the main control board 11. Each current detection module 16 includes a current detection chip and an ADC sampling chip. The current detection chip is used to convert the current in the relevant circuits of the driver board 12 into a corresponding analog voltage signal, and the ADC sampling chip is used to convert the analog voltage signal into a digital signal and transmit it to the main control board 11 for real-time reading.

[0050] like Figure 1As shown, the main control board 11 is communicatively connected to the dynamic allocation control device 20. The dynamic allocation control device 20 uses the main control board 11 to dynamically control the switching status and optical power output ratio of each band unit on the UV-LED lamp board 13. The dynamic allocation control device 20 includes a host computer 21, an industrial control touch screen 22, and a command arbitrator 23. Both the host computer 21 and the industrial control touch screen 22 are communicatively connected to the command arbitrator 23, which is communicatively connected to the main control board 11. Both the host computer 21 and the industrial control touch screen 22 can send commands to the command arbitrator 23 and receive data returned by the command arbitrator 23. The host computer 21 is responsible for the overall control logic; the industrial touch screen 22 serves as the human-machine interface terminal, allowing operators to monitor and control the main control board 11, enabling remote monitoring and operation of the system; the command arbitrator 23 is responsible for receiving commands from the host computer 21 and the industrial touch screen 22, sorting and arbitrating them to ensure that only one command is sent to the main control board 11 at a time, preventing command conflicts. After receiving the command, the main control board 11 executes the corresponding operation and returns data such as the equipment status (including the main control board 11's operating status, communication status, etc.), UV power and UV energy monitored by the UV energy sensor 14, temperature monitored by the temperature sensor 15, and current monitored by the current detection module 16 to the command arbitrator 23. The command arbitrator 23 then forwards these data to the host computer 21 and the industrial touch screen 22.

[0051] As an example, the industrial control touch screen 22 is an RS485 touch screen. The host computer 21 and the industrial control touch screen 22 are connected to the command arbitrator 23 via an RS485 bus. The command arbitrator 23 adopts a command arbitration board and is connected to the main control board 11 via an RS485 communication interface.

[0052] Furthermore, the host computer 21 can dynamically adjust control parameters based on real-time monitored data and preset algorithms to achieve closed-loop feedback control, thereby improving system stability and curing quality. The host computer 21 can pre-store an ink database containing different ink curing parameters (such as band ratio, energy density, etc.), which supports one-click recall and enables rapid configuration and UV curing operations.

[0053] Furthermore, when there are two or more main control boards 11, each main control board 11 is communicatively connected to the command arbitrator 23 of the dynamic allocation control device 20, so that these main control boards 11 can work collaboratively under the control of the dynamic allocation control device 20. Each main control board 11 is equipped with a DIP switch, which is used to set the communication address of the main control board 11, ensuring that the dynamic allocation control device 20 can accurately identify and control a specific main control board 11.

[0054] like Figure 1As shown, the power supply module 30 supplies power to the UV curing lamp head 10, the dynamic adjustment control device 20, and the liquid cooling device 40 to meet the power requirements of each part of the multi-band UV curing system 100 and ensure the stable operation of the multi-band UV curing system 100.

[0055] As an example, the power supply module 30 includes a first power supply module 31 and a second power supply module 32. The first power supply module 31 is a 220V AC power supply, which powers the host computer 21 of the dynamic allocation control device 20 and the liquid cooling unit 42 of the liquid cooling device 40. The second power supply module 32 is a 54V DC power supply, which provides the required operating voltage to the UV curing lamp head 10 through a step-down circuit, and powers the industrial control touch screen 22 and command arbitration board of the dynamic allocation control device 20.

[0056] like Figure 1 As shown, the liquid cooling device 40 includes a liquid cooling component 41 and a liquid cooling unit 42. The liquid cooling component 41 is connected to the UV-LED lamp panel 13, and the liquid cooling unit 42 provides coolant to the liquid cooling component 41. The coolant carries away the heat generated by the UV-LED lamp panel 13 during operation, reducing the operating temperature of the UV-LED lamp panel 13 and thus ensuring the normal operation of the UV curing lamp head 10. The coolant can be water, alcohol-based solution, fluorinated liquid, or other liquid media.

[0057] As an example, such as Figure 4 As shown, the liquid cooling assembly 41 includes a liquid cooling plate 411 and a liquid inlet 412 and a liquid outlet 413 disposed on the liquid cooling plate 411. The liquid cooling plate 411 has a cooling channel 4111 inside. The cooling channel 4111 is S-shaped and its two ends are connected to the liquid inlet 412 and the liquid outlet 413 respectively. The S-shaped cooling channel 4111 can increase the contact area of ​​the coolant and better remove heat. In use, the UV-LED lamp panel 13 is tightly bonded to the liquid cooling plate 411 with thermally conductive adhesive (such as silicone grease). When the UV-LED lamp panel 13 is working, the liquid cooling unit 42 delivers low-temperature coolant to the interior of the liquid cooling plate 411 through the liquid inlet 412. The coolant flows in the cooling channel 4111, fully absorbing the heat generated by the UV-LED lamp panel 13 conducted from the liquid cooling plate 411. Then, the high-temperature coolant flows out from the liquid outlet 413 and returns to the liquid cooling unit 42 for cooling and temperature reduction. This process is repeated to achieve rapid cooling and ensure that each UV-LED lamp panel 13 operates stably within a suitable temperature range.

[0058] In summary, the multi-band UV curing system provided in this application employs a multi-band combination design for the UV-LED lamp panel, which can match the absorption peak values ​​of different photoinitiators in the ink. Each band unit supports independent PWM dimming, ensuring that the light energy emitted by each band unit matches the absorption peak values ​​of different photoinitiators in the ink. The dynamic adjustment control device dynamically adjusts the switching state and light power output ratio of each band unit based on the UV power and UV energy data monitored by the UV energy sensor, ensuring that the ink absorbs light energy uniformly and appropriately during the curing process, effectively avoiding problems such as uneven curing, rapid surface curing shrinkage, or incomplete curing of the underlying layer. Through the above design, this multi-band UV curing system can meet the curing requirements of different types of inks.

[0059] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any person skilled in the art can easily conceive of various variations or substitutions within the technical scope disclosed in this application, and these should all be included within the scope of protection of this application.

Claims

1. A multi-band UV curing system, characterized in that, include: The UV curing lamp head includes a main control board, a driver board, a UV-LED lamp board, and a UV energy sensor. The LEDs on the UV-LED lamp board are arranged in multiple rows, with one or more rows of LEDs forming a band unit. The emission bands of each band unit are different. Each band unit is individually connected to the driver board, which controls its switching state and current. Each band unit achieves independent dimming by executing the PWM signal generated by the main control board through the driver board. The UV energy sensor is used to monitor the UV power and UV energy of the UV-LED lamp board in real time and transmit the UV power and UV energy data to the main control board. A dynamic adjustment control device is communicatively connected to the main control board and is used to dynamically control the switching state and light power output ratio of each band unit on the UV-LED lamp board according to the UV power and UV energy data fed back by the main control board.

2. The multi-band UV curing system according to claim 1, characterized in that, The dynamic allocation control device includes a host computer, an industrial control touch screen, and a command arbitrator. The host computer and the industrial control touch screen are both communicatively connected to the command arbitrator, and the command arbitrator is communicatively connected to the main control board.

3. The multi-band UV curing system according to claim 1, characterized in that, The band units include shortwave units, mediumwave units, and longwave units.

4. The multi-band UV curing system according to claim 3, characterized in that, The short-wavelength unit includes LEDs with a wavelength of 365nm, the medium-wavelength unit includes LEDs with a wavelength of 385nm and / or LEDs with a wavelength of 395nm, and the long-wavelength unit includes LEDs with a wavelength of 405nm.

5. The multi-band UV curing system according to claim 1, characterized in that, The number of main control boards is at least one, each main control board controls one or more drive boards, and each drive board controls one or more UV-LED lamp boards. When there are multiple main control boards, the multiple main control boards are connected in a cascade mode and are coordinated by the dynamic allocation control device.

6. The multi-band UV curing system according to claim 1, characterized in that, A microlens array is provided in front of or near the UV-LED lamp panel, and / or a diffuse reflection coating is provided on the inner surface of the UV curing lamp head. Both the microlens array and the diffuse reflection coating are used to reduce interference patterns in the UV curing area and optimize the light intensity distribution in the UV curing area.

7. The multi-band UV curing system according to claim 1, characterized in that, The UV curing lamp head also includes a temperature sensor, which is used to monitor the working temperature of the UV-LED lamp board in real time and transmit the temperature data to the main control board, which then feeds it back to the dynamic adjustment and control device.

8. The multi-band UV curing system according to claim 1, characterized in that, The UV curing lamp head also includes a current detection module, which is used to monitor the current in the relevant circuits of the driver board in real time and transmit the current data to the main control board, which then feeds it back to the dynamic adjustment and control device.

9. The multi-band UV curing system according to claim 1, characterized in that, Also includes: The power supply module is used to supply power to the UV curing lamp head and the dynamic adjustment control device.

10. The multi-band UV curing system according to claim 1, characterized in that, Also includes: A liquid cooling device includes a liquid cooling component and a liquid cooling unit. The liquid cooling component is connected to the UV-LED lamp panel, and the liquid cooling unit is connected to the liquid cooling component and is used to supply coolant to the liquid cooling component to cool the UV-LED lamp panel.

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