Packaging tool for high-performance MEMS pressure sensor chip

Abstract

The utility model discloses a packaging tool for a high-performance MEMS pressure sensor chip, which comprises a base, a tube socket fixing assembly and a vertical movable assembly, the base is used for bearing the tube socket fixing assembly and the vertical movable assembly, the tube socket fixing assembly is used for fixing a packaging tube socket, the vertical movable assembly can move horizontally and vertically relative to the base, and the tube socket fixing assembly is used for fixing the packaging tube socket. Therefore, the flattening operation of the MEMS pressure sensor chip in the packaging tube socket is realized. According to the packaging tool provided by the utility model, the height of the chip chamber wall is matched with the structures of the flattening column and the horizontal arm, so that the thickness of the fixing glue is accurately controlled, and the consistency of the thickness of the fixing glue is ensured; fixing glue is prevented from diffusing to the vent holes through the anti-overflow columns, and the vent holes are prevented from being blocked; the tube socket cavity can be matched with products with different sizes or shapes through the lining, so that the packaging efficiency is improved; an anti-static gasket on the bottom surface of the flattening column avoids mechanical and static damage to the chip; positioning and pressing are achieved through horizontal sliding and vertical pressing, the operation difficulty is reduced, and the packaging yield is improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor packaging technology, and in particular to a packaging fixture for high-performance MEMS pressure sensor chips, which aims to improve the mounting accuracy and efficiency between MEMS pressure sensor chips and packaging sockets. Background Technology

[0002] In semiconductor packaging processes, especially MEMS chip packaging, die attachment between the chip and the socket is a critical step, its quality directly affecting the device's performance, mechanical strength, and long-term reliability. The die attachment process requires precisely placing the chip in the designated position on the socket and securing it with adhesive materials (such as silver paste, silicone, epoxy resin, etc.). MEMS pressure sensor chips are miniature chips that sense environmental pressure and are the most widely used MEMS chips. They need to be packaged in different types of sockets depending on the application scenario and customer requirements. Stress caused by various packaging defects can lead to performance degradation of the chip. High-performance MEMS gas pressure sensors are high-performance sensors that measure gas pressure with an accuracy of one ten-thousandth. The sensor chip needs to be mounted in a stainless steel socket with a vent, and the signal is connected to the external circuit PCB board fixed on the socket using alloy wire bonding. The chip thickness is typically about 4mm, and the inner diameter of the socket is only 0.5mm larger than the diagonal of the chip, resulting in a compact size. Commercially available automated die-loading machines do not meet the required vertical travel. Even when modified into automated die-loading machines, frequent switching of mounting bases and equipment adjustments are necessary to accommodate various types of packaging sockets, resulting in low efficiency. In traditional packaging methods for high-performance MEMS gas pressure sensor chips, the thickness control precision of the fixing adhesive is poor, switching between products with different shapes is troublesome, vent holes are easily blocked, and product consistency is poor. Utility Model Content

[0003] The technical problem this utility model aims to solve is that existing packaging methods suffer from poor control accuracy of adhesive thickness, inapplicability to various types of packaging sockets, and unstable product quality and low efficiency due to easy blockage of vent holes. It proposes a packaging fixture for high-performance MEMS pressure sensor chips, used to install MEMS pressure sensor chips in packaging sockets, ensuring uniformity and consistency of adhesive thickness, preventing adhesive blockage of vent holes, and adapting to chip packaging for various types of packaging sockets.

[0004] To solve the above-mentioned technical problems, this utility model provides a packaging fixture for high-performance MEMS pressure sensor chips, including a base, a tube fixing assembly, and a vertical movable assembly.

[0005] The base is used to support the tube seat fixing assembly and the vertical movable assembly, and provides a horizontal reference surface including a base plate, on which a horizontal slide rail is fixed;

[0006] The tube socket fixing assembly includes a fixing base, the upper surface of which is formed with a tube socket cavity for mounting the encapsulated tube socket, and an anti-overflow post is installed inside the tube socket cavity;

[0007] A vertical movable component, mounted on a horizontal slide rail, can slide horizontally along the slide rail. It includes a column, a horizontal support plate at the top of the column, and two vertical slots on the side. A vertical guide hole is made on the horizontal support plate, and a vertical guide post passes through the vertical guide hole. A button is made on the top of the vertical guide post, and a vertical connecting rod is fixedly installed at the bottom. A vertical guide rail is installed on the side of the vertical connecting rod facing the column, and the vertical guide rail engages with the vertical slot. A horizontal arm is fixed on the side of the vertical connecting rod facing the tube seat fixing component. A vertical threaded hole is made on the horizontal arm, and a flattening post for pressing down the MEMS pressure sensor chip is installed in the threaded hole.

[0008] During encapsulation, the vertical movable component is first moved horizontally along the horizontal slide rail to the pre-working position. At this time, there are no components obstructing the space above the socket cavity. The vent hole of the encapsulation socket coated with fixative is aligned with the anti-overflow post and installed into the socket cavity. The MEMS pressure sensor chip is aligned with the anti-overflow post and placed in the chip chamber of the encapsulation socket with the chip back facing down, with the back of the chip contacting the fixative. The vertical movable component is then moved horizontally to the working position. At this time, the flattening post is directly above the socket cavity. Pressing the button downwards causes the vertical connecting rod to move downwards along the vertical guide rail. The horizontal arm on the vertical connecting rod also moves downwards, pressing the flattening post firmly onto the MEMS pressure sensor chip until the lower surface of the horizontal arm is blocked by the upper surface of the chip chamber wall. The height of the chip chamber wall and the height difference between the bottom surface of the flattening post and the lower surface of the horizontal arm determine the final thickness of the fixative. After being compressed, the fixative diffuses outwards, but is blocked by the chip chamber wall when diffused outwards and by the anti-overflow post when diffused inwards. Only a small portion may be squeezed into the vent hole of the encapsulation socket, without blocking the vent hole.

[0009] As a further description of the above technical solution: a stop block is also fixed on the base plate. The stop block is fixed at the edge of the base plate away from the tube seat fixing assembly, which is used to limit the extreme position of the vertical moving assembly along the horizontal slide rail and determine the pre-working position of the vertical moving assembly.

[0010] As a further description of the above technical solution: a limit screw is also installed on the side of the fixed base facing the horizontal slide rail. The extension length of the limit screw can be adjusted by rotating it as needed to limit the sliding distance of the vertical movable component along the horizontal slide rail and determine the working position of the vertical movable component.

[0011] As a further description of the above technical solution: the end of the horizontal arm has a horizontal threaded through hole communicating with the threaded hole, and a fixing screw is installed in the horizontal threaded through hole to fix the position of the flattening column.

[0012] As a further description of the above technical solution: the anti-overflow column consists of a lower anti-overflow column and an upper anti-overflow column. Both the lower and upper anti-overflow columns are cylindrical, and the cross-sectional diameter of the lower anti-overflow column is larger than that of the upper anti-overflow column. The top of the anti-overflow column extends above the bottom surface of the tube seat cavity to block the fixing adhesive and prevent the fixing adhesive from clogging the vent hole of the encapsulated tube seat.

[0013] As a further description of the above technical solution: the lower part of the anti-overflow column has external threads, which can be fixed in the threaded hole at the bottom of the tube seat cavity by means of threaded connection, so as to realize the purpose of replacing the anti-overflow column individually according to the size.

[0014] As a further description of the above technical solution: a slot is made on the top surface of the flattening column, and its height can be adjusted by rotating it with a screwdriver. The bottom surface of the flattening column is flat and its area is larger than that of the MEMS pressure sensor chip. An antistatic pad (rubber sheet) is attached to the bottom surface of the flattening column to prevent the flattening column, which is made of stainless steel, from directly contacting the chip and causing mechanical damage to the chip surface, as well as to prevent damage to the chip's electrical performance caused by static electricity.

[0015] As a further description of the above technical solution: a reset spring is fitted on the vertical guide post. The reset spring is located between the button and the horizontal support plate and is used to automatically reset after the button is pressed down, without the need for manual reset.

[0016] As a further description of the above technical solution: a bushing is also installed inside the tube seat cavity to adapt to encapsulation tube seats of different sizes or shapes.

[0017] The method of using the above-mentioned packaging fixture includes the following steps:

[0018] Step 1: Apply a ring of fixing adhesive around the vent hole on the bottom surface of the chip chamber of the packaging socket. The width, thickness and distance of the fixing adhesive from the vent hole are precisely controlled by an automatic dispensing device.

[0019] Step 2: Install the packaging tube socket into the socket cavity, so that the anti-overflow post extends into the chip chamber through the vent hole;

[0020] Step 3: Place the MEMS pressure sensor chip with the back side down in the chip chamber, with the back side of the chip in contact with the fixing adhesive, and the upper part of the anti-overflow post extending into the chip pores but not in contact with the MEMS pressure sensor chip.

[0021] Step 4: Move the vertical movable component horizontally along the horizontal slide rail to the working position so that the flattening column is directly above the MEMS pressure sensor chip.

[0022] Step 5: Press the button down to press the flattening column downwards until it is blocked by the chip chamber wall on the lower surface of the horizontal arm. Hold for 3 seconds and then release the button. The flattening column will move upwards to reset.

[0023] Step 6: Move the vertical moving component back to the pre-working position, remove the packaged socket, and complete the installation of the high-performance MEMS pressure sensor chip.

[0024] In summary, due to the adoption of the above technical solution, the beneficial effects of this utility model are:

[0025] This invention's packaging fixture precisely controls the final thickness of the fixative by coordinating the height of the chip chamber wall of the packaging socket with the structure of the flattening post and horizontal arm, ensuring consistent fixative thickness. The anti-overflow post prevents the fixative from diffusing into the vent, avoiding vent blockage. The socket cavity can be adapted to products of different sizes or shapes via bushings, eliminating the need for frequent replacement of the fixing base and improving packaging efficiency. An anti-static pad on the lower surface of the flattening post prevents mechanical and electrostatic damage to the chip. Positioning and pressing are achieved through horizontal sliding and vertical pressing, reducing operational difficulty and improving packaging yield.

[0026] The packaging fixture of this invention is used to package high-performance MEMS pressure sensor chips. The operation is simple, reliable and repeatable. It can be adapted to packaging tubes of different sizes and shapes using bushings, so as to meet the packaging needs of high-performance MEMS pressure sensors for small batches and multiple varieties. Attached Figure Description

[0027] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0028] Figure 1 This is the front view of the packaging tooling of this utility model.

[0029] Figure 2 This is a top view of the packaging fixture of this utility model.

[0030] Figure 3 This is a cross-sectional view of the vertical card slot.

[0031] Figure 4 This is a schematic diagram of the flattening column.

[0032] Figure 5 This is a schematic diagram of the packaging fixture in its pre-working position.

[0033] Figure 6 This is a schematic diagram of the packaging fixture in its working position.

[0034] Figure 7 This is a cross-sectional schematic diagram of the encapsulation socket.

[0035] Figure 8 This is a flowchart of the MEMS pressure sensor chip packaging process.

[0036] Figure 9 This is a diagram showing the location of the adhesive application.

[0037] Figure 10 This is a schematic diagram of the installation and fixing of the encapsulation tube socket.

[0038] Figure 11 This is a schematic diagram of the MEMS pressure sensor chip installation.

[0039] Figure 12 This is a schematic diagram of a MEMS pressure sensor chip after it has been flattened.

[0040] Legend:

[0041] 100-Base; 110-Base plate; 120-Horizontal slide rail; 130-Stop; 200-Pipe seat fixing assembly; 210-Fixing base; 220-Pipe seat cavity; 230-Anti-overflow column; 231-Lower part of anti-overflow column; 232-Upper part of anti-overflow column; 240-Bushing; 250-Limit screw; 300-Vertical moving assembly; 301-Horizontal slider; 302-Horizontal slot; 303-Column; 304-Horizontal support plate; 305-Vertical slot; 306-Vertical guide rail; 307-Vertical guide hole; 308-Vertical guide column; 30 9-Reset spring; 310-Button; 311-Vertical connecting rod; 312-Horizontal arm; 313-Threaded hole; 314-Flattening post; 314a-Slotted groove; 314b-Flattening post bottom surface; 315-Fixing screw; 400-Encapsulation tube socket; 410-Tube socket thread; 420-Ventilation hole; 421-First vent; 422-Second vent; 430-Chip chamber; 431-Chip chamber wall; 500-Fixing adhesive; 600-MEMS pressure sensor chip; 610-Chip back side; 611-Chip vent; 620-Chip surface. Detailed Implementation

[0042] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0043] A packaging fixture for high-performance MEMS pressure sensor chips, such as Figure 1 — Figure 4As shown, it includes a base 100, a tube holder fixing assembly 200, and a vertical movable assembly 300;

[0044] The base 100 consists of a base plate 110, a horizontal slide rail 120, and a stop 130. It supports the pipe seat fixing assembly 200 and the vertical movable assembly 300 and provides a horizontal reference surface. The base plate 110 is a flat stainless steel plate. The horizontal slide rail 120 is fixed to the surface of the base plate 110 and consists of two parallel slide rails. The stop 130 is fixed at one edge of the base plate 110 and is located between the two horizontal slide rails 120. It is used to limit the extreme position of the vertical movable assembly 300 along the horizontal slide rail 120 and determine the pre-working position. The stop 130 is preferably made of plastic, which has a certain cushioning effect. It can also be made of materials such as steel, copper, or aluminum.

[0045] The tube socket fixing assembly 200 consists of a fixing base 210, a tube socket cavity 220, an anti-overflow post 230, and a limiting screw 250. The fixing base 210 is fixed to the side of the base plate 110 away from the stop block 130. The tube socket cavity 220 is formed inside the fixing base 210 and is a recessed cavity lower than the surface of the fixing base 210, used to fix the encapsulated tube socket. Its cross-sectional shape can be circular or other shapes, such as square, rectangle, triangle, pentagon, hexagon, octagon, star, etc., depending on the shape and size of the encapsulated tube socket. A bushing 240 can also be installed inside the tube socket cavity 220 to accommodate encapsulated tube sockets of different sizes or shapes. The anti-overflow post 230 is installed at the bottom of the tube socket cavity 220, usually located at the center of the tube socket cavity 220, and its shape and size can be determined according to the type of encapsulated tube socket. The anti-overflow column 230 typically consists of two parts: the lower part 231 is a cylinder with a larger diameter, and the upper part 232 is a cylinder with a smaller diameter. The anti-overflow column 230 is significantly higher than the pipe seat cavity 220. The lower part 231 may also be threaded, allowing it to be fixed to a threaded hole (not shown) at the bottom of the pipe seat cavity 220 via a threaded connection, enabling individual replacement of the anti-overflow column according to its dimensions. Two limiting screws 250 are installed on the side of the fixed base 210 facing the horizontal slide rail 120. The length of the limiting screws 250 extended can be adjusted by rotating them as needed to limit the sliding distance of the vertical movable component 300 along the horizontal slide rail 120, thus determining the working position of the vertical movable component 300.

[0046] The vertical movable component 300 includes a horizontal slider 301, with two horizontal slots 302 fixed below the horizontal slider 301. The vertical movable component 300 is mounted on the horizontal slide rail 120 of the base 100 via the horizontal slots 302 and can move along the horizontal slide rail 120. A column 303 is fixed above the horizontal slider 301, with a horizontal support plate 304 mounted on the top of the column 303 and two vertical slots 305 mounted on its side. The cross-sectional shape of the vertical slots 305 is as follows: Figure 3 As shown, a U-shaped groove is used to hold the vertical guide rail 306, allowing it to slide vertically up and down only, preventing horizontal movement and thus providing guidance. A vertical guide hole 307 is formed on the horizontal support plate 304 for the vertical guide post 308 to pass through. The vertical guide post 308 is a cylinder that passes through the vertical guide hole 307 for installation. A button 310 is formed on the top of the vertical guide post 308, and a return spring 309 is fitted onto the vertical guide post 308, located between the button 310 and the horizontal support plate 304. The lower part of the vertical guide post 308 is fixedly installed. A vertical connecting rod 311 is provided; a vertical guide rail 306 is installed on the side of the vertical connecting rod 311 facing the column 303, and the vertical guide rail 306 is fitted together with the vertical slot 305; a horizontal arm 312 is fixed on the side of the vertical connecting rod 311 facing the pipe seat fixing assembly 200, and a vertical threaded hole 313 is formed on the horizontal arm 312, in which a flattening column 314 is installed, which can be adjusted in height; the end of the horizontal arm 312 has a horizontal threaded through hole communicating with the threaded hole 313, and a fixing screw 315 is installed in the horizontal threaded through hole to fix the position of the flattening column 314. The structure of the flattening column 314 is as follows. Figure 4 As shown, the outer periphery has external threads, and a slot 314a is made on the top surface. Its height can be adjusted by rotating it with a screwdriver. The bottom surface 314b of the flattening post is a flat surface, on which an anti-static rubber sheet (not shown) is attached to prevent the flattening post 314, which is made of stainless steel, from directly contacting the chip and causing mechanical damage to the chip surface, as well as preventing damage to the chip's electrical performance caused by static electricity.

[0047] Figure 5 This is a schematic diagram of the vertical movable component 300 in the pre-working position. At this time, the horizontal slider 301 is close to the stop block 130 and away from the limit screw 250; the reset spring 309 is in a relaxed state; the flattening column 314 is in a raised state and is horizontally away from the tube seat fixing component 200; the encapsulation tube seat 400 of the pressure sensor product can be freely inserted into the tube seat cavity 220 or freely removed from the tube seat cavity 220.

[0048] Figure 6 This is a schematic diagram of the vertical moving component 300 in its working state. The horizontal slider 301 is close to the limit screw 250 and away from the stop block 130; the reset spring 309 is in a pressed state; the packaging tube 400 of the pressure sensor product is installed in the tube cavity 220, and the flattening post 314 is located directly above the packaging tube 400 and is in a downward pressing state, pressing against the MEMS chip 600 inside the packaging tube 400. Figure 12 As shown.

[0049] The following is based on Figure 7Taking a typical packaging socket 400 of a high-performance MEMS pressure sensor as an example, the usage method of the packaging fixture of this utility model is explained. The packaging socket 400 is made of stainless steel block through machining. It has a socket thread 410, a vent hole 420 and a chip chamber 430. The vent hole 420 is composed of a first vent 421 and a second vent 422 of different sizes. The first vent 421 is located above the second vent 422. The cross-sections of the first vent 421 and the second vent 422 are both circular. The diameter of the first vent 421 is significantly smaller than the diameter of the second vent 422. The first vent 421 communicates with the chip chamber 430 above the packaging socket 400 to form a pressure conduction channel for gas or fluid. The chip chamber 430 is surrounded by a chip chamber wall 431, which is usually circular in shape, but can also be other shapes. The function of the chip chamber wall 431 is to protect the chip and mount the PCB board, and to lead out the signal of the MEMS chip through bonding metal wires.

[0050] The process of packaging a high-performance MEMS pressure sensor chip using the packaging fixture of this invention is as follows: Figure 8 As shown, it includes the following steps:

[0051] Step 1: Apply a ring of fixing adhesive 500 around the vent hole 420 on the bottom surface of the chip chamber 430 of the packaging socket 400. Figure 9 As shown, this step is completed using an automated dispensing device. The shape, width D, thickness H, and distance L of the fixative 500 from the vent 420 can be precisely controlled according to the chip size, preventing clogging of the vent 420 and ensuring that the fixative 500 meets design requirements after curing. For example, if the diameter of the first vent 421 is 1.6mm, the distance L of the fixative 500 from the vent 420 is 0.7-0.8mm, the width D of the fixative 500 is 0.6-0.8mm, and the thickness H is 0.2-0.25mm.

[0052] Step 2: Confirm that the vertical moving component 300 is in position. Figure 5 In the pre-working position shown, align the vent 420 of the encapsulation tube seat 400 coated with fixing adhesive 500 with the anti-overflow post 230, and install the encapsulation tube seat 400 in the tube seat cavity 220 (or, if necessary, install the encapsulation tube seat 400 into the bushing 240 of the tube seat cavity 220). Figure 10 As shown, the lower part 231 of the anti-overflow column extends into the second vent 422 of the vent 420; the upper part 232 of the anti-overflow column passes through the first vent 421 of the vent 420 and extends into the chip chamber 430, and is significantly higher than the bottom of the chip chamber 430 and also significantly higher than the fixing adhesive 500.

[0053] Step 3: Align the anti-overflow post 230 with the MEMS pressure sensor chip 600 and place it into the chip chamber 430, with the back side 610 of the chip facing downwards and contacting the fixing adhesive 500. The back side 610 of the chip has chip vents 611. A portion of the upper part 232 of the anti-overflow post extends into the chip vents 611, but does not contact the MEMS pressure sensor chip 600. Figure 11 As shown, the MEMS pressure sensor chip 600 has not yet been flattened at this time, and the thickness of the fixing adhesive 500 is close to the original thickness H.

[0054] Step 4: Move the vertical movable component 300 horizontally along the horizontal slide rail 120. Figure 6 The working position shown is such that the flattening column 314 is directly above the MEMS pressure sensor chip 600, but the two are not yet in contact; the area of ​​the lower surface of the flattening column 314 is larger than the area of ​​the surface of the MEMS pressure sensor chip 600.

[0055] Step 5: Press button 310 down, as shown. Figure 6 As shown, the vertical guide post 308, vertical connecting rod 311, and horizontal arm 312 of the vertical moving assembly 300 move downwards together, causing the flattening post 314 to move downwards and contact the MEMS pressure sensor chip 600. At this time, the bottom surface 314b of the flattening post contacts the chip surface, pressing the MEMS pressure sensor chip 600 downwards until the lower surface of the horizontal arm 312 is blocked by the upper surface of the chip chamber wall 431. Figure 12 As shown, the height of the chip chamber wall 431 and the height difference between the bottom surface 314b of the flattening column and the lower surface of the horizontal arm 312 determine the final thickness of the fixing adhesive 500. After being compressed, the fixing adhesive 500 diffuses to the periphery. The outward diffusion is blocked by the chip chamber wall 431, and the inward diffusion is blocked by the anti-overflow column 230. Only a small portion may be squeezed into the first vent 421, and will not block the vent 420. Hold the button 310 in the depressed state for 3 seconds to ensure that the shape of the fixing adhesive 500 is stable. Then release the button 310, and the reset spring 309 returns from the compressed state to the relaxed state, which drives the vertical guide column 308, vertical connecting rod 311, horizontal arm 312 and flattening column 314 of the vertical moving component 300 to move upward together. The vertical moving component 300 disengages from the MEMS pressure sensor chip 600 and the packaging tube socket 400.

[0056] Step 6: Move the vertical movable component 300 horizontally back to the pre-working position along the horizontal slide rail 120. There are no components directly above the encapsulation socket 400. Remove the encapsulated encapsulation socket 400 from the socket cavity 220 to complete the chip installation.

[0057] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A packaging tool for high performance MEMS pressure sensor chips, characterized in that, include: The base (100) includes a base plate (110) on which a horizontal slide rail (120) is fixed; The tube socket fixing assembly (200) includes a fixing base (210), the upper surface of the fixing base (210) is formed with a tube socket cavity (220) for mounting the encapsulated tube socket, and an anti-overflow post (230) is installed in the tube socket cavity (220); A vertical movable component (300) is mounted on a horizontal slide rail (120) and can slide horizontally along the horizontal slide rail (120). It includes a column (303), a horizontal support plate (304) mounted on the top of the column (303), and two vertical slots (305) mounted on the side. A vertical guide hole (307) is formed on the horizontal support plate (304), and a vertical guide post (308) passes through the vertical guide hole (307). A button (310) is formed on the top of the vertical guide post (308), and the lower part is fixed. A vertical connecting rod (311) is installed, and a vertical guide rail (306) is installed on the side of the vertical connecting rod (311) facing the column (303). The vertical guide rail (306) is engaged with the vertical slot (305). A horizontal arm (312) is fixed on the side of the vertical connecting rod (311) facing the tube seat fixing assembly (200). A vertical threaded hole (313) is made on the horizontal arm (312), and a flattening column (314) for pressing down the MEMS pressure sensor chip is installed in the threaded hole (313).

2. The packaging tool for high performance MEMS pressure sensor chip of claim 1, wherein: A stop (130) is also fixed on the base plate (110). The stop (130) is fixed at the edge of the base plate (110) away from the tube seat fixing assembly (200) to determine the pre-working position of the vertical moving assembly (300).

3. The packaging tool for high performance MEMS pressure sensor chip of claim 1, wherein: A limit screw (250) is also installed on the side of the fixed base (210) facing the horizontal slide rail (120) to determine the working position of the vertical moving component (300).

4. The packaging tool for high performance MEMS pressure sensor chip of claim 1, wherein: The end of the horizontal arm (312) has a horizontal threaded through hole communicating with the threaded hole (313), and a fixing screw (315) is installed in the horizontal threaded through hole.

5. The packaging tool for high performance MEMS pressure sensor chip of claim 1, wherein: The overflow prevention column (230) consists of a lower part (231) and an upper part (232). Both the lower part (231) and the upper part (232) are cylindrical, and the cross-sectional diameter of the lower part (231) is larger than that of the upper part (232). The top of the overflow prevention column (230) extends above the bottom surface of the tube seat cavity (220).

6. The packaging tool for high performance MEMS pressure sensor chip of claim 5, wherein: The lower part (231) of the anti-overflow column has external threads and can be installed in the tube seat cavity (220) by means of threaded connection.

7. The packaging tool for high performance MEMS pressure sensor chip of claim 1, wherein: A groove (314a) is made on the top surface of the flattening column (314), the bottom surface (314b) of the flattening column is flat, and an antistatic pad is attached to the bottom surface (314b) of the flattening column.

8. The packaging tool for high performance MEMS pressure sensor chip of claim 1, wherein: A reset spring (309) is fitted on the vertical guide post (308), and the reset spring (309) is located between the button (310) and the horizontal support plate (304).

9. The packaging tool for high performance MEMS pressure sensor chip according to any one of claims 1 to 8, characterized in that: The tube seat cavity (220) is also equipped with a bushing (240) for adapting to tube seats of different shapes and sizes.

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