Spray head device for vapor deposition equipment and vapor deposition equipment

Abstract

The utility model discloses a spray header device for vapor deposition equipment and the vapor deposition equipment. The spray header device comprises a spray header and a mounting substrate, a temperature control chamber is formed between the spraying head and the mounting substrate; a movable heating disc is arranged in the temperature control cavity, cooling devices are connected to the two sides of the temperature control cavity, and a temperature measuring device is arranged below the spraying head. According to the utility model, temperature measurement data are set below the spray header, the temperature below the spray header is measured in real time, and the temperature is regulated and controlled in real time by arranging the movable heating disc and the cooling device, so that the balance state of the temperature of the cavity is realized, the influence of heat generated by radio frequency is eliminated, and the stability of the temperature in the process cavity is realized.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing, and in particular to a spray head device for a vapor deposition equipment and a vapor deposition equipment. Background Technology

[0002] Thin film deposition technology is a core process in chip manufacturing. As wafer dimensional accuracy continues to improve, the precision and uniformity of thin film deposition are also becoming increasingly important. PECVD (Plasma Enhanced Chemical Vapor Deposition) technology is used to deposit dielectric insulating layers and semiconductor materials, and it is the most widely used fabrication technology in recent years. Temperature control during the deposition process is a crucial factor affecting film formation.

[0003] In thin film deposition, radio frequency (RF) is used to ionize the process mixture reaction gases to form plasma, thereby promoting the deposition reaction. The RF carries a large amount of energy into the process chamber; besides the energy consumed by ionization, a portion of this energy is converted into heat. This heat can interfere with the stability of the chamber temperature.

[0004] In the process chamber, the temperature is mainly controlled by two parts: the upper air inlet spray head and the heating plate below the tray. The heating plate below the tray has high heat conduction efficiency and its structure is generally rarely altered. Therefore, this invention provides a spray head device for a vapor deposition equipment, which improves temperature control at the spray head location to achieve stable thin film deposition temperature. Utility Model Content

[0005] To address the aforementioned technical problems, this invention provides a spray head device for a vapor deposition equipment, comprising: a spray head and a mounting substrate; a temperature-controlled chamber is formed between the spray head and the mounting substrate; a movable heating plate is disposed inside the temperature-controlled chamber; cooling devices are connected to both sides of the temperature-controlled chamber; and a temperature measuring device is disposed below the spray head. This invention measures the temperature below the spray head in real time by setting a temperature measuring device below the spray head, and adjusts the temperature in real time by using a movable heating plate and cooling devices. When the measured temperature is lower than the target temperature, the heating plate descends to contact the spray head and heats it; when the measured temperature is higher than the target temperature, the heating plate rises, and the cooling devices dissipate heat from the spray head, thereby achieving a balanced temperature within the chamber, eliminating the influence of heat generated by radio frequency, and thus stabilizing the temperature within the process chamber.

[0006] The cooling device includes a cooling gas channel and valves. Cooling gas can enter the temperature control chamber through one side of the cooling device and exit through the other side to cool the spray head. When the measured temperature is higher than the target temperature and cooling is required, the valves on both sides of the temperature control chamber are opened. Cooling gas enters the temperature control chamber through one valve and exits through the other valve, utilizing gas cooling and convection heat dissipation. This avoids the risk of liquid leakage that may occur with traditional liquid cooling methods, while improving cleanliness.

[0007] It also includes a lifting unit that drives the heating plate closer to or further away from the spray head. Furthermore, the lifting unit includes a lifting rod and a lifting rod controller located outside the temperature control chamber. One end of the lifting rod is connected to the heating plate, and the other end passes through the mounting base plate and is connected to the lifting rod controller.

[0008] The temperature measuring device includes at least one temperature sensor. The temperature sensor transmits real-time temperature data to a remote computer system, which then outputs commands to control the cooling device and heating plate, adjusting the temperature at the spray head location in real time to ensure the stability of the thin film deposition temperature.

[0009] This utility model also provides a vapor deposition apparatus, including a reaction chamber, wherein the reaction chamber is provided with the spray head device described in any of the above claims.

[0010] It also includes an air intake pipe, which is connected to the spray head.

[0011] The reaction chamber also includes a tray assembly located below the spray head device. The tray assembly includes a tray for holding the wafers and a heating device located below the tray. The heating device directly heats the wafers on the tray, resulting in high heat transfer efficiency.

[0012] The tray assembly has a cooling channel at its bottom, located below the heating device. Cooling gas is introduced into the cooling channel to regulate the temperature of the tray and the wafers on it.

[0013] The reaction chamber is equipped with an exhaust channel, which is connected to a vacuum pump located outside the reaction chamber. The vacuum pump is used to remove thin film deposition byproducts and excess process gases from the reaction chamber.

[0014] The beneficial effects of this utility model are:

[0015] This invention measures the temperature below the spray head in real time by setting a temperature measuring device below the spray head, and adjusts the temperature in real time by setting a movable heating plate and a cooling device. When the measured temperature is lower than the target temperature, the heating plate descends to contact the spray head and heats it. When the measured temperature is higher than the target temperature, the heating plate rises and the cooling device dissipates heat from the spray head, eliminating the influence of heat generated by radio frequency, thereby stabilizing the temperature inside the process chamber. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the spray head device in Embodiment 1 of this utility model, where the spray head is in a heated state; Figure 2 This is a schematic diagram of the spray head device in Embodiment 1 of this utility model. At this time, the spray head is in a cooling state.

[0018] Figure 3 This is a schematic diagram of a vapor deposition device provided in Embodiment 2 of this utility model.

[0019] 1. Spray head; 2. Mounting base plate; 3. Temperature control chamber; 4. Heating plate; 5. Cooling device; 501. Valve; 6. Temperature measuring device; 7. Lifting unit; 701. Lifting rod; 8. Reaction chamber; 9. Air inlet pipe; 10. Tray assembly; 11. Tray; 12. Heating device; 13. Cooling channel; 14. Exhaust channel. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of this utility model clearer, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings. Examples of these preferred embodiments are illustrated in the drawings. The embodiments of this utility model shown in and described with reference to the drawings are merely exemplary, and this utility model is not limited to these embodiments.

[0021] It should also be noted that, in order to avoid obscuring the present invention with unnecessary details, only the structures and / or processing steps closely related to the solution according to the present invention are shown in the accompanying drawings, while other details that are not closely related to the present invention are omitted.

[0022] Example 1

[0023] Please see Figure 1 and Figure 2 This embodiment provides a spray head device for a vapor deposition apparatus, comprising: a spray head 1 and a mounting base 2. The mounting base 2 is located at the top of the vapor deposition apparatus. The reaction gas first enters the spray head 1 and then enters the reaction chamber through the spray head. A temperature control chamber 3 is formed between the spray head 1 and the mounting base 2, and a heating plate 4 that can move up and down is disposed inside the temperature control chamber 3.

[0024] The spray head device includes a lifting unit 7, which controls the heating plate 4 to move closer to or further away from the spray head 1. The lifting unit 7 includes a lifting rod 701 and a lifting rod controller (not shown in the figure) located outside the temperature control chamber. One end of the lifting rod 701 is connected to the heating plate 4, and the other end passes through the through hole of the mounting base plate 2 and is connected to the lifting rod controller.

[0025] Cooling devices 5 are connected to both sides of the temperature control chamber 3. Cooling gas can enter the temperature control chamber 3 through one side of the cooling device 5 and exit from the other side of the cooling device 5, thereby cooling the spray head 1. Figure 2 As shown, the arrow indicates the direction of cooling gas flow. When the measured temperature is higher than the target temperature and cooling is required, the valves on both sides of the temperature control chamber are opened. The cooling gas enters the temperature control chamber through one valve and is discharged through the other valve. The cooling gas is cooled by convection to dissipate heat and achieve cooling of the spray head.

[0026] A temperature measuring device 6 is installed below the spray head 1. The temperature measuring device 6 includes two temperature sensors. The temperature sensors transmit real-time temperature data to a remote computer system, which then outputs instructions to control the cooling device 5 and the heating plate 4 to adjust the temperature at the spray head location in real time.

[0027] The spray head device provided in this embodiment is used in the following way: the temperature sensor under the spray head measures the temperature of the spray head in real time. When the measured temperature is lower than the target temperature, the heating plate is controlled to descend and contact the spray head to heat it. When the measured temperature is higher than the target temperature, the heating plate is controlled to rise away from the spray head, and the valves of the cooling devices on both sides of the cavity are opened to introduce cooling gas into the temperature control cavity for heat dissipation, so as to avoid the influence of heat generated by radio frequency, thereby achieving the stability of the temperature in the process cavity.

[0028] Example 2

[0029] The mounting base plate 2 is provided with an air inlet pipe 9 that communicates with the spray head 1. This embodiment provides a vapor deposition device, such as... Figure 3As shown, the reaction chamber 8 includes a spray head device as described in Example 1, which is connected to an air inlet pipe 9. The reaction chamber 8 also includes a tray assembly 10 located below the spray head device. The tray assembly 10 includes a wafer-supporting tray 11 and a heating device 12 located below the tray 11. A cooling channel 13 is provided at the bottom of the tray assembly 10, located below the heating device 12. An exhaust channel 14 is provided on the reaction chamber 8, which is connected to a vacuum pump located outside the reaction chamber 8. The vacuum pump is used to exhaust thin film deposition byproducts and excess process gases from the reaction chamber.

[0030] Furthermore, it should be noted that in this specification, "comprising," "including," or any other variations thereof are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0031] It should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This way of describing the specification is only for clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A spray head device for a vapor deposition equipment, characterized in that, include: A spray head (1) and a mounting base plate (2); a temperature control chamber (3) is formed between the spray head (1) and the mounting base plate (2); a movable heating plate (4) is provided inside the temperature control chamber (3); cooling devices (5) are connected to both sides of the temperature control chamber (3); and a temperature measuring device (6) is provided below the spray head (1).

2. The spray head device for a vapor deposition equipment according to claim 1, characterized in that, The cooling device (5) includes a cooling gas passage and a valve (501). Cooling gas can enter the temperature control chamber (3) through the cooling device (5) on one side and be discharged from the cooling device (5) on the other side to cool the spray head (1).

3. A spray head device for a vapor deposition equipment according to claim 1, characterized in that, It also includes a lifting unit (7) that drives the heating plate (4) to move closer to or away from the spray head (1).

4. A spray head device for a vapor deposition equipment according to claim 3, characterized in that, The lifting unit (7) includes a lifting rod (701) and a lifting rod controller located outside the temperature control chamber (3). One end of the lifting rod (701) is connected to the heating plate (4), and the other end passes through the mounting base plate (2) and is connected to the lifting rod controller.

5. A spray head device for a vapor deposition equipment according to claim 1, characterized in that, The temperature measuring device (6) includes at least one temperature sensor.

6. A vapor deposition apparatus, characterized in that, It includes a reaction chamber (8), in which a spray head device as described in any one of claims 1 to 5 is provided.

7. A vapor deposition apparatus according to claim 6, characterized in that, It also includes an air intake pipe (9), which is connected to the spray head (1).

8. A vapor deposition apparatus according to claim 6, characterized in that, The reaction chamber (8) also includes a tray assembly (10) located below the spray head device. The tray assembly (10) includes a tray (11) for carrying wafers and a heating device (12) located below the tray (11).

9. A vapor deposition apparatus according to claim 8, characterized in that, The tray assembly (10) has a cooling channel (13) at its bottom, which is located below the heating device (12).

10. A vapor deposition apparatus according to claim 6, characterized in that, The reaction chamber (8) is provided with an exhaust channel (14), which is connected to a vacuum pump located outside the reaction chamber (8).

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