Electroplating contact conductive structure and electroplating equipment

Abstract

The utility model discloses an electroplating contact conductive structure and electroplating equipment, and the electroplating contact conductive structure comprises the following steps: a mounting box in which a dissolving tank is arranged; the front ends of the fixing blocks are installed in the dissolving tank, the rear ends of the fixing blocks are connected with an external circuit, the hanging tool contact blocks are in contact conduction with the fixing blocks to form a parallel circuit, the contact surfaces are submerged in dissolving liquid of the dissolving tank, the front ends of the fixing blocks are installed in the dissolving tank through the supporting blocks, the surfaces of the front ends of the fixing blocks are horizontal and flat, and the front ends of the fixing blocks are in contact conduction with the hanging tool contact blocks. The hanging tool contact block is electrically connected with an electroplating hanging tool of the electroplating technology through a wire, the rear end of the fixing block is electrically connected with a rectifying machine of the electroplating technology through a wire, and the rear end of the fixing block is electrically connected with the rectifying machine of the electroplating technology through a wire. And crystal particles are not easy to accumulate, the electroplating conduction current is stable, the liquid level is highly and dynamically balanced, and the normal electroplating effect is ensured.

Description

Technical Field

[0001] This utility model belongs to the field of electroplating technology, and in particular relates to an electroplating contact conductive structure and electroplating equipment. Background Technology

[0002] Electroplating is a process in which metal ions in a plating solution are reduced to metal atoms through electrode reactions under the influence of an external electric field, and then deposited on the cathode. Therefore, electroplating is a metal electrodeposition process that includes steps such as phase-liquid mass transfer, electrochemical reaction, and electrocrystallization. In the chip packaging field, the electroplating process involves placing the product into an electroplating rack. The contact blocks on the rack and the fixing blocks in the chemical bath make contact and are electrically connected, and are electrically connected to the cathode of the rectifier to form a cathode circuit. The anode titanium mesh of the chemical bath is electrically connected to the anode of the rectifier to form an anode circuit. Current is introduced through the rectifier. In the electroplating solution, through electrolytic reaction, the metal ions on the cathode gain electrons and are reduced to a metal layer deposited on the surface of the product, thus completing the electroplating of metal on the product.

[0003] In existing electroplating equipment, the contact blocks on the hangers and the fixing blocks of the chemical tank are in direct contact and electrically conductive. The contact surfaces are exposed to the air, and the electroplating chemicals evaporate or drip onto the conductive structures, reacting with oxygen and moisture in the air, chemically corroding the contact surfaces. Crystallized particles accumulate around the contact surfaces, leading to surface roughness, cracking, and even damage to electrical conductivity, affecting electroplating stability and results. When the contact surfaces are submerged in the electroplating chemicals, the selection of materials for the contact blocks and fixing blocks becomes more stringent, with higher requirements for corrosion resistance, increasing costs.

[0004] Therefore, there is an urgent need to design an electroplating contact conductive structure and electroplating equipment to solve the above problems. Utility Model Content

[0005] To achieve the above objectives, this utility model proposes an electroplating contact conductive structure and an electroplating device; the electroplating contact conductive structure includes:

[0006] The installation box contains a melting tank.

[0007] The fixing blocks are installed in the dissolving tank at their front ends and connected to the external circuit at their rear ends. The hanger contact blocks are in contact with the fixing blocks to form a parallel circuit, and the contact surfaces are submerged in the dissolving liquid in the dissolving tank.

[0008] The front end of the fixing block is installed in the dissolving tank via a support block. The front end surface of the fixing block is horizontal and flat. The support block is installed at the bottom of the dissolving tank. The height of the support block is customized according to the actual height required for the contact surface to be submerged in the dissolving tank.

[0009] The front end of the fixing block is in contact with the hanger contact block, and the hanger contact block is electrically connected to the electroplating hanger of the electroplating process through a wire.

[0010] The rear end of the fixed block is electrically connected to the rectifier of the electroplating process via a wire, specifically to the cathode of the rectifier, forming a cathode circuit.

[0011] The installation box is divided into a dissolving tank and an overflow tank by a baffle. The baffle is provided with an overflow port, through which the liquid level in the dissolving tank overflows into the overflow tank.

[0012] The dissolving tank is provided with an inlet, and the overflow tank is provided with an outlet. The dissolving liquid in the dissolving tank is a low conductivity liquid. RO water is used as the dissolving liquid. The RO water fills the dissolving tank from the inlet, submerges the contact surface, and overflows from the overflow outlet to the overflow tank before being discharged from the outlet.

[0013] The depth of the dissolving tank is less than the depth of the overflow tank.

[0014] The conductive structure maintains a dynamic balance in the liquid level of the dissolving tank by adjusting the opening and closing of the inlet and outlet valves, thus keeping the dissolving liquid in a low conductivity state.

[0015] An electroplating apparatus comprising the aforementioned electroplating contact conductive structure.

[0016] The electroplating contact conductive structure and electroplating equipment provided by this utility model have the following advantages:

[0017] 1. The contact surface is submerged, the fixing block is not easily corroded by volatile or dripping chemicals, and it is not easy to produce crystal particles. This extends the service life of the conductive structure, ensures the stability of the electroplating current, and guarantees the electroplating effect. In addition, the material selection conditions for the contact block and fixing block are relaxed, saving costs.

[0018] 2. The solution flows in and out in an overflow manner, the liquid level is dynamically balanced, and the contact surface is always submerged. There is no crystallization on the contact surface, and the solution maintains a low conductivity state to ensure normal electroplating effect. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of a conductive structure in the prior art;

[0020] Figure 2 This is a schematic diagram of the assembly of the conductive structure and the mounting contact block in the prior art;

[0021] Figure 3 This is a schematic diagram of an electroplated contact conductive structure according to the present invention;

[0022] Figure 4 This is a schematic diagram of the assembly of an electroplated contact conductive structure and a hanger contact block according to the present invention.

[0023] In the diagram: 1. Mounting box; 2. Dissolving tank; 3. Overflow tank; 4. Fixing block; 5. Baffle; 6. Overflow port. Detailed Implementation

[0024] To make the objectives, technical solutions, and advantages of this utility model clearer, the technical solutions of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model. The content of this utility model will be described below with reference to specific implementation methods. Examples of the implementation methods are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar components or components having the same or similar functions throughout.

[0025] The terms "first," "second," etc., used in the specification, claims, and accompanying drawings of this utility model are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments described herein can be implemented in a sequence other than that illustrated or described herein. Directional terms mentioned in this utility model, such as: up, down, left, right, front, back, inside, outside, front, back, side, etc., are only for reference to the accompanying drawings. The embodiments and directional terms used in the following description with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model. Furthermore, the various specific processes and materials provided in this utility model are examples of applications of other processes and / or the use of other materials that can be recognized by those skilled in the art.

[0026] Electroplating contact conductive structures in existing electroplating equipment (such as...) Figure 1 As shown), the fixing block 4 is installed on the base. One end of the fixing block 4 is electrically connected to the cathode of the rectifier via a wire. The driving component on the electroplating equipment drives the hanger contact block to move (as shown below) directly to contact the fixing block 4 and conduct electricity (as shown below). Figure 2 As shown, the contact block of the plating rack is electrically connected to the electroplating rack of the electroplating process through a wire to form a cathode circuit. The anode titanium mesh of the chemical bath is electrically connected to the anode of the rectifier to form an anode circuit. When the product is placed in the electroplating rack, the current is introduced through the rectifier. In the electroplating solution, through electrolysis, the metal ions of the cathode gain electrons and are reduced to a metal layer that is deposited on the surface of the product, thus completing the electroplating of metal on the product.

[0027] The fixing block 4 and the hanger contact block are each configured to have two separate contact parts, that is, two sets of the fixing block 4 and the hanger contact block are configured to form two contact surfaces, which constitute two parts of the parallel circuit. Multiple sets can also be configured. If a single contact surface becomes loose or has poor contact due to oxidation, wear, mechanical vibration, etc., the resistance will increase instantaneously or the circuit will be interrupted. The other contact surface can be used as a supplement to maintain the circuit conduction. The two sets of contact structures can share the current load, distribute the current evenly, prevent local overload, and ensure the uniform thickness of the electroplating layer. This "redundant design" ensures the electroplating effect, reduces the frequency of downtime maintenance, and improves production efficiency.

[0028] However, since the contact block and the fixing block 4 are in direct contact and electrically conductive, the contact surface is exposed to the air. The electroplating solution evaporates or drips onto the conductive structure and reacts with oxygen and moisture in the air, chemically corroding the contact surface. Crystallized particles accumulate around the contact surface, resulting in surface roughness, cracking, and even damage to electrical conductivity, affecting the stability and effect of electroplating. When the contact surface is submerged in the electroplating solution, the material selection conditions for the contact block and the fixing block 4 are more stringent, the corrosion resistance requirements are higher, and the cost increases.

[0029] To better understand the purpose, structure, and function of this utility model, the following description, in conjunction with the accompanying drawings, provides a more detailed account of an electroplating contact conductive structure and electroplating equipment proposed by this utility model. The electroplating contact conductive structure includes:

[0030] Installation box 1, which contains a melting tank 2;

[0031] The front end of the fixing block 4 is installed in the dissolving tank 2, and the rear end extends out of the mounting box 1 and is connected to the external circuit. The hanger contact block is in contact with the fixing block 4 to form a parallel circuit. The "redundant design" of the parallel circuit can ensure the continuity of the electroplating process, ensure the electroplating effect, reduce the frequency of downtime maintenance, and improve production efficiency. Moreover, the contact surface is submerged in the dissolving liquid in the dissolving tank 2.

[0032] The mounting box 1 is installed on the electroplating equipment to securely install the electroplating contact conductive structure. The front end of the fixing block 4 is horizontal and flat. It is installed in the dissolution tank 2 by the support block, which is installed at the bottom of the dissolution tank 2. The height of the support block is customized according to the actual height required for the contact surface to be submerged in the dissolution tank 2. There are two or more fixing blocks 4, which form multiple parallel circuits after being connected to the hanger contact block. The front ends of the fixing blocks 4 are installed parallel to each other in the dissolution tank 2 (e.g., Figure 3As shown), the rear end of the fixing block 4 extends out of the mounting box 1 and connects to the external circuit, such as being electrically connected to the cathode of the rectifier via a wire. The rectifier is a key power supply device of the electroplating equipment (not shown in the figure), converting the alternating current (AC) supplied by the grid into the direct current (DC) required for electroplating. Through voltage and current stabilization control, it ensures the stability of current and voltage during the electroplating process, meets the electrochemical requirements of cathode deposition of metal ions during the electroplating process, and ensures the uniformity of the electroplated coating. The anode of the rectifier is electrically connected to the metal anode plate of the electroplating equipment's chemical tank via a wire, such as an anode titanium mesh, forming an anode circuit. The cathode of the rectifier is electrically connected to the fixing block 4 via a wire. The front end of the fixing block 4 contacts and is electrically conductive with the hanger contact block (e.g., Figure 4 As shown, the hanger contact block is as follows Figure 4 The upper part of the plated plate (not shown in the figure) is connected to the electroplating rack via wires, forming a cathode circuit. The cathode circuit and the anode circuit form the cathode in the electroplating equipment. After the product to be electroplated is placed in the electroplating rack, the drive component of the electroplating equipment drives the plated plate contact block to move towards the fixed block 4, making contact with the horizontal flat part at the front end of the fixed block 4 and conducting electricity. The rectifier is connected to the current. The electroplating solution containing metal cations, such as copper sulfate solution, is electrolyzed in the solution tank. The metal cations, such as copper ions, of the cathode gain electrons and are reduced to copper atoms, which are deposited on the surface of the product, completing the electroplating of the copper layer on the product.

[0033] The interior of the installation box 1 is divided into a dissolving tank 2 and an overflow tank 3 by a baffle 5. The baffle 5 is equipped with an overflow port 6. The dissolving tank 2 has an inlet, and the overflow tank 3 has an outlet. By adjusting the opening and closing of the inlet and outlet valves, the liquid level in the dissolving tank 2 is kept in dynamic equilibrium, so that the contact surface between the hanger contact block and the fixing block 4 is submerged in the dissolving liquid in the dissolving tank 2. The dissolving liquid can be a low-conductivity liquid that can dissolve the crystal particles on the contact surface. The dissolving liquid in the dissolving tank is a low-conductivity liquid, such as RO water. The RO water enters from the inlet and fills the dissolving tank 2, submerging the contact surface. It flows through the overflow port 6 into the overflow tank 3 and then is discharged from the outlet. The depth of the dissolving tank 2 is less than the depth of the overflow tank 3, so the water surface in the overflow tank 3 will not flow back into the dissolving tank 2.

[0034] Before electroplating, RO water, used as a dissolving solution, enters through the inlet and fills the dissolving tank 2. The hanger contact block and the fixing block 4 make contact and conduction. The contact surface is submerged in the dissolving solution. The electroplating solution evaporates or drips onto the conductive structure, but the contact surface is submerged in the dissolving solution, isolating it from air. The contact surface is not easily corroded. The evaporated or dripping solution dissolves in the RO water, making it less likely to produce crystal particles to accumulate. The contact surface remains horizontal, flat, and smooth, ensuring stable conductive contact, extending the service life of the conductive structure, ensuring stable electroplating current, and guaranteeing electroplating effect. Moreover, the material selection conditions for the contact block and the fixing block 4 are flexible, saving costs.

[0035] RO water is water obtained through reverse osmosis technology. It has very high purity, removing almost all dissolved solids and most other impurities from the raw water except for water molecules themselves. Its conductivity is extremely low. Furthermore, by adjusting the opening and closing of the inlet and outlet valves, the liquid level in the dissolving tank 2 is kept in dynamic balance, maintaining the height to submerge the contact surface. The RO water dynamically overflows, maintaining a low conductivity state.

[0036] The height of the support blocks in the dissolving tank 2 is customized according to the actual product requirements. Then, the fixing blocks 4 are installed on the support blocks. The rear end of the fixing blocks 4 is electrically connected to the rectifier cathode via a wire. By adjusting the opening and closing of the valves at the inlet and outlet, the dissolving tank 2 is filled with dissolving liquid, which at this point submerges the top surface of the fixing blocks 5. The liquid level is maintained in dynamic equilibrium, overflowing through the overflow port 6 on the baffle 5 into the overflow tank 3 and then discharged. The height dimensions of the dissolving tank 2, overflow tank 3, baffle 5, and the overflow port 6 on the baffle 5 are determined according to the actual product requirements. Customized requirements ensure that the contact surfaces of the hanger contact block and the fixing block 4 are completely submerged, and the dissolving solution maintains a high dynamic balance overflow, keeping the conductivity low. The hanger contact block is electrically connected to the electroplating hanger of the electroplating process via wires. The product is also placed in the hanger and submerged in the chemical solution tank of the electroplating equipment. The chemical solution tank contains electroplating solution with metal cations. The anode titanium mesh of the chemical solution tank is electrically connected to the anode of the rectifier. The electroplating equipment drives the hanger contact block and the fixing block 4 to make contact and conduct electricity. The current is introduced through the rectifier to start the product electroplating.

[0037] An electroplating device includes the aforementioned electroplating contact conductive structure. The fixing block 4 of the electroplating contact conductive structure is in contact with the hanger contact block, and the contact surface is submerged in the dissolving liquid of the dissolving tank 2. The contact surface is not prone to crystallization, ensuring a stable electroplating current, guaranteeing the electroplating effect, and ensuring uniform electroplating. Moreover, the material selection conditions for the contact block and fixing block 4 are flexible, saving costs. The electroplating device as a whole does not require major modifications, and the electroplating process is not affected. The design is reasonable and effective. The dissolving liquid flows in and out in an overflow manner, and the liquid level is dynamically balanced, always submerging the contact surface. There is no crystallization on the contact surface, and the dissolving liquid maintains a low conductivity state, ensuring a normal electroplating effect.

[0038] This invention, without altering the electroplating equipment and process, involves installing the fixing block 4 within the dissolving tank 2. The dissolving liquid submerges the contact surfaces of the hanger contact block and the fixing block 4, isolating them from air. This prevents the contact surfaces from being corroded by volatile or dripping chemicals. The volatile or dripping chemicals dissolve in the RO water, reducing the likelihood of crystallization and particle accumulation, thus extending the lifespan of the conductive structure, ensuring stable electroplating current, and guaranteeing electroplating results. Furthermore, the material selection for the contact block and the fixing block 4 is flexible, saving costs.

[0039] It is understood that this utility model has been described through some embodiments, and those skilled in the art will recognize that various changes or equivalent substitutions can be made to these features and embodiments without departing from the spirit and scope of this utility model. Furthermore, under the teachings of this utility model, these features and embodiments can be modified to adapt to specific situations and materials without departing from the spirit and scope of this utility model. Therefore, this utility model is not limited to the specific embodiments disclosed herein, and all embodiments falling within the scope of the claims of this utility model are protected by this utility model.

Claims

1. An electroplated conductive contact structure, characterized in that, include: The installation box contains a melting tank. The fixing blocks are installed in the dissolving tank at their front ends and connected to the external circuit at their rear ends. The hanger contact blocks are in contact with the fixing blocks to form a parallel circuit, and the contact surfaces are submerged in the dissolving liquid in the dissolving tank.

2. The electroplated contact conductive structure according to claim 1, characterized in that, The front end of the fixing block is installed in the melting tank by a support block, and the front surface of the fixing block is horizontal and flat.

3. The electroplated contact conductive structure according to claim 2, characterized in that, The front end of the fixing block makes contact with the hanger contact block, and the hanger contact block is electrically connected to the electroplating hanger of the electroplating process through a wire.

4. The electroplated contact conductive structure according to claim 3, characterized in that, The rear end of the fixed block is electrically connected to the rectifier of the electroplating process via a wire.

5. The electroplated contact conductive structure according to claim 1, characterized in that, The installation box is divided into a dissolving tank and an overflow tank by a baffle, and the baffle is provided with an overflow port.

6. The electroplated contact conductive structure according to claim 5, characterized in that, The dissolving tank is provided with an inlet, and the overflow tank is provided with an outlet. The dissolving liquid in the dissolving tank is a low conductivity liquid. RO water is used as the dissolving liquid. The RO water fills the dissolving tank from the inlet, submerges the contact surface, and overflows from the overflow port to the overflow tank before being discharged from the outlet.

7. The electroplated contact conductive structure according to claim 6, characterized in that, The depth of the dissolving tank is less than the depth of the overflow tank.

8. The electroplated contact conductive structure according to claim 7, characterized in that, This conductive structure maintains a dynamic balance in the liquid level of the dissolving tank by adjusting the opening and closing of the inlet and outlet valves.

9. An electroplating device, characterized in that, Includes the electroplated contact conductive structure as described in any one of claims 1-8.

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