Computing system, connection assembly and conversion device

Abstract

The utility model discloses a computing system, a connection assembly and a conversion device.The computing system comprises a server, a storage and the conversion device connected between the server and the storage, and the conversion device comprises a first electric connector, a second electric connector and an optical connector; the first electric connector is used for connecting one of the server and the memory, the first electric connector comprises a first group of electric connection terminals and a second group of electric connection terminals, the second electric connector and the optical connector are used for connecting the other one of the server and the memory, and the second electric connector is connected with the first group of electric connection terminals. The conversion device further comprises a photoelectric conversion module, and the photoelectric conversion module is connected between the second group of electric connection terminals and the optical connector. The first group of electrical connection terminals and the second electrical connector are used for transmitting a first signal at a first rate, the second group of electrical connection terminals, the photoelectric conversion module and the optical connector are used for transmitting a second signal at a second rate, and the second rate is greater than the first rate.

Description

Technical Field

[0001] This application relates to the field of server technology, and in particular to a computing system, connection component, and conversion device. Background Technology

[0002] In existing server storage expansion technologies, servers typically meet the ever-increasing demand for storage capacity by connecting to memory. Current connections between servers and memory generally use electrical interfaces to ensure efficient data transfer between the server and memory. However, with the continuous increase in data transmission bandwidth and transmission distance, significant signal attenuation and distortion occur during transmission. Utility Model Content

[0003] The purpose of embodiments of this application is to provide a computing system, a connection component, and a conversion device for improving the stability and reliability of data transmission in server storage expansion technology.

[0004] To achieve the above objectives, embodiments of this application provide the following technical solutions:

[0005] In a first aspect, this application provides a computing system including a server, a memory, and a conversion device connecting the server and the memory. The conversion device includes a first electrical connector, a second electrical connector, and an optical connector. The first electrical connector is used to connect the server and one of the memory components, and includes a first set of electrical connection terminals and a second set of electrical connection terminals. The second electrical connector and the optical connector are used to connect the server and the other of the memory components, and the second electrical connector is connected to the first set of electrical connection terminals. The conversion device further includes a photoelectric conversion module connected between the second set of electrical connection terminals and the optical connector. The first set of electrical connection terminals and the second electrical connector are used to transmit a first signal at a first rate, and the second set of electrical connection terminals, the photoelectric conversion module, and the optical connector are used to transmit a second signal at a second rate, where the second rate is greater than the first rate.

[0006] Based on this, the conversion device provided in this application can provide two channels for signal transmission. A portion of the signal input from the server to the conversion device is transmitted to the second electrical connector via the first set of electrical connection terminals of the first electrical connector. This portion of the signal is transmitted as an electrical signal through the second electrical connector. The electrical signal channel between the first set of electrical connection terminals and the second electrical connector directly transmits low-speed electrical signals. The channel constructed by the first set of electrical connection terminals and the second electrical connector can be used for signals with low bandwidth requirements, such as control signals and management information, ensuring real-time performance and stability. Another portion of the signal input from the server to the conversion device is transmitted to the photoelectric conversion module via the second set of electrical connection terminals of the first electrical connector. The photoelectric conversion module converts the received electrical signal into an optical signal, which is then transmitted through an optical connector. The photoelectric conversion module converts high-speed electrical signals into optical signals and transmits them through the optical connector, solving the attenuation and distortion problems of high-speed signals during long-distance transmission. This channel can be used for signals with large data capacity and high bandwidth requirements. The optical signal is unaffected by electromagnetic interference, significantly improving the transmission efficiency of the conversion device and ensuring the reliability and stability of the signal transmitted through the second set of electrical connection terminals.

[0007] For high-speed signals, electrical signals are susceptible to factors such as resistance, capacitance, and inductance during long-distance transmission, leading to severe signal attenuation and distortion, making it difficult to guarantee transmission quality. A conversion device can convert high-speed signals into optical signals. Optical signals have advantages such as low loss and strong anti-interference capabilities in long-distance transmission, ensuring that high-speed signals can reach the receiving end stably and with high quality even over extended distances. As for low-speed signals, although electrical signals also experience some attenuation over long distances, their data volume is relatively small and transmission rate requirements are not high, so continuing to transmit them as electrical signals will not significantly affect the transmission effect. Based on this, this application can also meet the long-distance transmission requirements between servers and storage devices.

[0008] In one possible implementation, the first set of electrical connection terminals and the second electrical connector include at least one of a reset terminal, a detection terminal, a clock terminal, and a control terminal; the second set of electrical connection terminals includes at least one transmitting terminal and at least one receiving terminal.

[0009] Another possible implementation is that at least one transmitting terminal includes multiple pairs of transmitting terminals, each pair of transmitting terminals being used to transmit one differential signal; and at least one receiving terminal includes multiple pairs of receiving terminals, each pair of receiving terminals being used to transmit one differential signal, further optimizing the efficiency, reliability and anti-interference capability of signal transmission.

[0010] Another possible implementation involves an optical connector comprising a first optical connector and a second optical connector. The optoelectronic conversion module is connected between a second set of electrical connection terminals and the first optical connector, and also between the second set of electrical connection terminals and the second optical connector. The second electrical connector includes a third set of electrical connection terminals and a fourth set of electrical connection terminals. Both the third and fourth sets of electrical connection terminals are connected to the first set of electrical connection terminals. The first optical connector and the third set of electrical connection terminals form a first protocol port, and the second optical connector and the fourth set of electrical connection terminals form a second protocol port. By configuring different protocol ports, the conversion device can flexibly adapt to various application scenarios, and the integration of multiple protocol ports into the same conversion device reduces external wiring complexity and lowers equipment operating costs.

[0011] Another possible implementation is that the second set of electrical connection terminals includes a first part of electrical connection terminals and a second part of electrical connection terminals. The optoelectronic conversion module is connected between the first part of electrical connection terminals and the first optical connector, and between the second part of electrical connection terminals and the second optical connector. In this way, the optoelectronic conversion module can split the high-speed signal to two independent optical connectors. The conversion device supports dual-channel high-speed transmission, which significantly improves the overall bandwidth and signal transmission efficiency.

[0012] In another possible implementation, the conversion device further includes a circuit board. The first electrical connector, the second electrical connector, the optical connector, and the photoelectric conversion module are all mounted on the circuit board. The first set of electrical connection terminals is connected to the second electrical connector via the circuit board, and the second set of electrical connection terminals is connected to the photoelectric conversion module via the circuit board. The first and second electrical connectors are electrically connected through wiring on the circuit board to ensure stable transmission of low-speed signals. The second set of electrical connection terminals is connected to the photoelectric conversion module via the circuit board to convert high-speed electrical signals to optical signals. Furthermore, the optical connectors (including the first and second optical connectors) are connected to the photoelectric conversion module via the circuit board to complete the input and output of optical signals. The precise wiring on the circuit board optimizes the signal path, reduces signal attenuation and reflection, and improves signal integrity.

[0013] In another possible implementation, the circuit board includes a first surface and a second surface facing away from each other. The first set of electrical connection terminals, the second electrical connector, and the circuit connection structure between the first set of electrical connection terminals and the second electrical connector are disposed on the first surface, while the second set of electrical connection terminals, the photoelectric conversion module, and the optical connector are disposed on the second surface. Thus, by designing the circuit board with a dual-surface layout, arranging the first set of electrical connection terminals, the second electrical connector, and their circuit connection structure on the first surface, and arranging the second set of electrical connection terminals, the photoelectric conversion module, and the optical connector on the second surface, this application achieves physical isolation and optimization of the signal path.

[0014] Another possible implementation is that, along the thickness direction of the circuit board, the first set of electrical connection terminals and the second set of electrical connection terminals are arranged opposite to each other, and the second electrical connector and the optical connector are arranged opposite to each other. The relative arrangement in the thickness direction makes full use of the vertical space of the circuit board and reduces the planar area occupied by the conversion device.

[0015] In another possible implementation, the photoelectric conversion module includes an optical transmitting channel, an optical receiving channel, and a wavelength division multiplexer (WDM). The input and output of the optical transmitting channel are both connected to a second set of electrical connection terminals. The WDM is connected to the output of the optical transmitting channel, the input of the optical receiving channel, and the optical connector. The WDM transmits the optical signal output from the optical transmitting channel to the optical connector and transmits the optical signal input from the optical connector to the input of the optical receiving channel. The WDM achieves bidirectional optical signal transmission using different wavelengths, enabling bidirectional transmission from a single optical fiber, thus reducing the number of optical fibers and cabling costs. This application fully utilizes the bandwidth resources of optical fibers, significantly improving the overall transmission bandwidth.

[0016] Another possible implementation is that there are multiple first electrical connectors, multiple second electrical connectors, and multiple optical connectors. The photoelectric conversion module is connected between the second set of electrical connection terminals of the multiple first electrical connectors and the multiple optical connectors. The first set of electrical connection terminals of the multiple first electrical connectors and the multiple second electrical connectors are connected.

[0017] Based on this, this application designs the number of first electrical connectors, second electrical connectors and optical connectors to be multiple, and uses a photoelectric conversion module to realize the connection between the second set of electrical connection terminals of multiple first electrical connectors and multiple optical connectors. At the same time, the first set of electrical connection terminals of multiple first electrical connectors are connected to multiple second electrical connectors, thereby further optimizing the scalability, flexibility and signal transmission performance of the conversion device.

[0018] Another possible implementation involves multiple conversion devices, including a first conversion device and a second conversion device. The optical connectors of the first conversion device and the second conversion device are connected via an optical connection structure, and the second electrical connectors of the first conversion device and the second electrical connectors of the second conversion device are connected via an electrical connection structure. The first electrical connector of the first conversion device is connected to one of the server and the memory, and the first electrical connector of the second conversion device is connected to the other of the server and the memory.

[0019] Another possible implementation involves multiple memory units connected to the first electrical connector of the second conversion device. Connecting multiple memory units to the first electrical connector of the second conversion device further optimizes the storage expansion capability, data transfer efficiency, and system flexibility of the computing system.

[0020] In another possible implementation, the computing system further includes a splitter connected between the first electrical connector of the second conversion device of the connection component and multiple memories. The splitter includes multiple first electrical connection branches, each connected to one memory. The splitter supports the connection of multiple memories, significantly improving the scalability of the storage system and meeting the storage needs of large-scale data centers. Each memory is connected via an independent first electrical connection branch, supporting flexible storage configuration and management.

[0021] In another possible implementation, the computing system further includes connection components, which include a first conversion device and a second conversion device. There are multiple connection components, each including a first connection component and a second connection component. The first electrical connector of the first conversion device of the first connection component is connected to a server. The first electrical connector of the second conversion device of the first connection component is connected to the first electrical connector of the first conversion device of the second connection component. The first electrical connector of the second conversion device of the second connection component is connected to a memory. The first electrical connector of the first conversion device of each second connection component is connected to a first electrical connection branch of a splitter, and the first electrical connector of the second conversion device of each second connection component is also connected to a memory, further optimizing the computing system's storage expansion capability, signal transmission efficiency, and system flexibility.

[0022] In another possible implementation, there are multiple servers and multiple first connection components. Each server is connected to a first electrical connector of a first conversion device of a first connection component. The splitter includes multiple second electrical connection branches, and each second electrical connection branch is connected to a first electrical connector of a second conversion device of a first connection component. Multiple servers are respectively connected to the first electrical connectors of the first conversion devices of multiple first connection components, and simultaneously, the multiple second electrical connection branches of the splitter are respectively connected to the first electrical connectors of the second conversion devices of multiple first connection components. This further optimizes the computing power, storage expansion capability, signal transmission efficiency, and system flexibility of the computing system.

[0023] Secondly, this application provides a connection component including a conversion device. The conversion device includes a first electrical connector, a second electrical connector, and an optical connector. The first electrical connector is used to connect a server and a memory, and includes a first set of electrical connection terminals and a second set of electrical connection terminals. The second electrical connector and the optical connector are used to connect the server and the memory, with the second electrical connector connected to the first set of electrical connection terminals. The conversion device further includes a photoelectric conversion module connected between the second set of electrical connection terminals and the optical connector. The first set of electrical connection terminals and the second electrical connector are used to transmit a first signal at a first rate, and the second set of electrical connection terminals, the photoelectric conversion module, and the optical connector are used to transmit a second signal at a second rate, where the second rate is greater than the first rate.

[0024] The system includes multiple conversion devices, including a first conversion device and a second conversion device. The optical connectors of the first and second conversion devices are connected via an optical connection structure, and their second electrical connectors are connected via an electrical connection structure. This application's connection assembly converts high-speed signals into optical signals at the first conversion device, transmits them to the second conversion device via the optical connection structure, and then converts the optical signals back into electrical signals at the second conversion device for continued transmission, further optimizing the efficiency, flexibility, and reliability of signal transmission.

[0025] Thirdly, this application provides a conversion device comprising a first electrical connector, a second electrical connector, and an optical connector. The first electrical connector is used to connect a server and a memory, and includes a first set of electrical connection terminals and a second set of electrical connection terminals. The second electrical connector and the optical connector are used to connect the server and the memory, with the second electrical connector connected to the first set of electrical connection terminals. The conversion device also includes a photoelectric conversion module connected between the second set of electrical connection terminals and the optical connector. The first set of electrical connection terminals and the second electrical connector are used to transmit a first signal at a first rate, and the second set of electrical connection terminals, the photoelectric conversion module, and the optical connector are used to transmit a second signal at a second rate, where the second rate is greater than the first rate. The conversion device in this application can adopt differentiated transmission for signals of different rates. For high-speed signals, the conversion device can convert the high-speed signal into an optical signal for transmission, thereby ensuring the stability of the high-speed signal during transmission. Simultaneously, for low-speed signals, the conversion device allows them to continue to be transmitted as electrical signals. Thus, compared to using optical signals for all signals, this application not only ensures stable transmission of high-speed signals but also effectively reduces overall costs by allowing low-speed signals to maintain electrical signal transmission.

[0026] It should be noted that the technical effects of the implementation methods of the second and third aspects can be found in the technical effects of the corresponding implementation methods in the first aspect, and will not be repeated here.

[0027] The features, implementation, and corresponding beneficial effects of this application are described in detail below with reference to the accompanying drawings. Attached Figure Description

[0028] To more clearly illustrate the technical solutions in this application, the accompanying drawings used in some embodiments of this application will be briefly described below. Obviously, the drawings described below are only drawings of some embodiments of this application, and those skilled in the art can obtain other drawings based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams and are not intended to limit the actual size of the product, the actual flow of the method, the actual timing of the signals, etc. involved in the embodiments of this application.

[0029] Figure 1 This is a block diagram of the structure of a computing system in the prior art;

[0030] Figure 2 This is a structural diagram of a conversion device according to some embodiments of this application;

[0031] Figure 3 This is yet another structural diagram of the conversion device according to some embodiments of this application;

[0032] Figure 4 This is yet another structural diagram of the conversion device according to some embodiments of this application;

[0033] Figure 5 for Figure 4 Another structural diagram of the conversion device in the middle;

[0034] Figure 6 This is another structural diagram of the conversion apparatus according to some embodiments of this application;

[0035] Figure 7 This is another structural diagram of an electronic device according to some embodiments of this application;

[0036] Figure 8 This is a structural block diagram of a computing system according to some embodiments of this application;

[0037] Figure 9 for Figure 8 Another block diagram of the computing system shown;

[0038] Figure 10 This is another structural block diagram of the computing system according to some embodiments of this application;

[0039] Figure 11This is another structural block diagram of a computing system according to some embodiments of this application.

[0040] Figure label:

[0041] 100 - Server; 200 - Memory; 300 - Conversion device; 300a - First conversion device; 300b - Second conversion device; 301 - First electrical connector; 3011 - First set of electrical connection terminals; 3012 - Second set of electrical connection terminals; 302 - Second electrical connector; 3021 - Third set of electrical connection terminals; 3022 - Fourth set of electrical connection terminals; 303 - Optical connector; 303a - Optical interface; 3031 - First optical connector; 3032 - Second optical connector; 304 - Optoelectronic conversion module; 305 - Circuit board; 3051 - First surface; 3052 - Second surface; 400 - Splitter. Detailed Implementation

[0042] The technical solutions in some embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this disclosure, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments provided in this disclosure are within the scope of protection of this disclosure.

[0043] Unless the context otherwise requires, throughout the specification and claims, the term "comprise" and its other forms, such as the third-person singular "comprises" and the present participle "comprising," are interpreted as open-ended and encompassing, meaning "including, but not limited to." In the description of the specification, terms such as "some embodiments," "example," or "some examples" are intended to indicate that a particular feature, structure, material, or characteristic associated with that embodiment or example is included in at least one embodiment or example of this disclosure. The illustrative representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics mentioned may be included in any suitable manner in any one or more embodiments or examples.

[0044] Hereinafter, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of embodiments of this disclosure, unless otherwise stated, "a plurality of" means two or more.

[0045] The technical terms involved in the embodiments of this application are explained below.

[0046] Server: A server is a piece of computer hardware or software that provides one or more services to other computers or devices on a network. A server can be a standalone physical server, a server cluster or distributed system composed of multiple physical servers, or a cloud server providing cloud computing services such as cloud databases, cloud computing, cloud functions, cloud storage, network services, cloud communications, middleware services, domain name services, security services, content delivery networks (CDNs), and basic cloud computing services such as big data and artificial intelligence image recognition platforms. A server can be the backend server for the aforementioned target application, providing backend services to the client of the target application.

[0047] Memory: Memory is the storage device in a computer hardware system used to store programs (software) and various data. All information in a computer, including raw input data, computer programs, intermediate results, and final results, is stored in memory.

[0048] Optoelectronic conversion module: Also known as an optical module, an optoelectronic conversion module is a device that converts light energy into electrical energy or electrical signals into optical signals. It is primarily used for converting between optical and electrical signals. Optoelectronic conversion modules are integrated circuits, integrating multiple functional circuits onto a single semiconductor substrate to form a highly integrated system. An optoelectronic conversion module includes an optoelectronic conversion chip for the optoelectronic conversion function, as well as circuit modules for signal amplification, modulation, demodulation, and control. The optoelectronic conversion module can complete a series of complex operations from electrical signal input to optical signal output, and vice versa, all within a compact package.

[0049] Terminals: The terminals in this application are suitable for connecting conversion devices to other devices, and can also be used to connect different circuit boards or various components on a circuit board. Terminals can be pins, pads, or other forms, and this application does not limit them. For ease of explanation, this application uses terminals as pins as an example.

[0050] With technological advancements, servers are becoming increasingly functional and powerful. The demands on memory bandwidth and latency performance of server processor systems are rapidly growing. Therefore, servers require external storage to expand memory capacity and improve memory access performance to meet the high-bandwidth, low-latency memory access requirements of applications such as high-performance computing, artificial intelligence, and big data analytics. External storage effectively alleviates memory bottlenecks and improves data processing efficiency, thereby better supporting complex computing tasks and real-time data processing needs.

[0051] Figure 1 For a block diagram of the computing system in related technologies, please refer to [link / reference]. Figure 1 The computing system may include a server 100 and a storage device. The server 100 is connected to the storage device, thereby enabling signal transmission between them. For example, the storage device is a memory 200. In related technologies, the server 100 and the memory 200 are connected via a CXL (Compute Express Link) bus, utilizing the CXL bus for high-speed signal transmission. However, since the CXL bus relies on copper cables as the transmission medium, the communication distance of copper cables is relatively short and the signal anti-interference capability is weak, limiting the scalability of the server 100 and the memory 200 and the stability of signal transmission.

[0052] In some examples, please refer to Figure 2 , Figure 2 The following is a structural diagram of a conversion device according to some embodiments of this application. This application provides a conversion device 300, which includes a first electrical connector 301, a second electrical connector 302, and an optical connector. The first electrical connector 301 is used to connect one of the server 100 and the memory 200. The first electrical connector 301 includes a first set of electrical connection terminals 3011 and a second set of electrical connection terminals 3012. The first set of electrical connection terminals 3011 and the second set of electrical connection terminals 3012 are respectively used to transmit different signals. The second electrical connector 302 and the optical connector are used to connect the other of the server 100 and the memory 200. The second electrical connector 302 is connected to the first set of electrical connection terminals 3011.

[0053] The conversion device 300 also includes a photoelectric conversion module 304, which is connected between the second set of electrical connection terminals 3012 and the optical connector.

[0054] For example, the first electrical connector 301 in this application is used to connect to the server 100, and the second electrical connector 302 and the optical connector are used to connect to the memory 200. Of course, the first electrical connector 301 in this application can also be used to connect to the memory 200, and the second electrical connector 302 and the optical connector can also be used to connect to the server 100. This application uses the first electrical connector 301 to connect to the server 100 as an example for illustration.

[0055] The conversion device 300 in this application can provide two transmission channels for signals received from the server 100. The first signal transmission channel is as follows: a portion of the signals received by the server 100 with relatively small signal attenuation and distortion is transmitted through the electrical connection channel provided between the first set of electrical connection terminals 3011 and the second electrical connector 302. This portion of the signal is still transmitted in the form of an electrical signal, retaining the low cost and low latency advantages of the electrical interface. The second signal transmission channel is as follows: another portion of the signals received by the server 100 that are prone to loss in copper cable transmission is transmitted to the photoelectric conversion module 304 through the first set of electrical connection terminals 3011. At this time, the other portion of the signal is still an electrical signal. The photoelectric conversion module 304 converts this portion of the electrical signal into an optical signal, and the optical signal is transmitted through the optical connector.

[0056] For example, the optical connector 303 includes an optical interface 303a and an optical channel. The photoelectric conversion module 304 transmits the electrical signals from the first set of electrical connection terminals 3011 to the photoelectric conversion module 304. The photoelectric conversion module 304 can convert these electrical signals into optical signals, which can be transmitted to the optical channel of the optical interface 303a. The optical channel can be formed by optical fiber, thereby transmitting the signals to other electronic devices. These other electronic devices can also be a second conversion device 300b.

[0057] In this way, the signal received by the conversion device 300 from the server 100 is transmitted partly by optical signal and partly by electrical signal. This can take advantage of the high bandwidth and low attenuation characteristics of optical signal to avoid signal loss during transmission, while retaining the low cost and low latency advantages of electrical interface.

[0058] It should be noted that the conversion device 300 can be located inside the server 100 or the memory 200, or it can be located externally. This application does not limit this.

[0059] In some examples, please refer to [the relevant documentation]. Figure 2 In this application, an impedance matching part is provided between the second electrical connector 302 and the first set of electrical connection terminals 3011. The impedance matching part can ensure that the electrical signal transmission between the second electrical connector 302 and the first set of electrical connection terminals 3011 reaches the optimal state. By adjusting the impedance matching, signal reflection and attenuation can be effectively reduced, and the quality and efficiency of signal transmission can be improved.

[0060] In some examples, please refer to Figure 3 The first set of electrical connection terminals 3011 and the second electrical connector 302 are used to transmit a first signal at a first rate, and the second set of electrical connection terminals 3012, the photoelectric conversion module 304 and the optical connector 303 are used to transmit a second signal at a second rate, the second rate being greater than the first rate.

[0061] During signal transmission by server 100, the first signal can be a low-speed signal. Low-speed signals have lower bandwidth requirements and are typically low-speed, making them suitable for transmission via electrical conversion devices. Low-speed signals are usually auxiliary signals related to the main signal, used to transmit control information, status information, or management information (such as device status queries, command interactions, etc.). The second signal can be a high-speed signal, i.e., the main signal transmitted by server 100.

[0062] Therefore, this application achieves high efficiency, flexibility, and reliability in signal transmission by separating low-speed and high-speed signals onto different transmission paths and transmitting them using electrical and optical signals respectively. For example, low-speed signals can be transmitted via an electrical conversion device, which can be an electrical interface. In this way, the conversion device 300 retains the low cost and low latency advantages of an electrical interface, making it suitable for control signals and management information with lower bandwidth requirements. As another example, high-speed signals are converted into optical signals via a photoelectric conversion module 304. The optical signals can be transmitted using optical fibers, fully utilizing the high bandwidth, low attenuation, and anti-interference characteristics of optical signals, making them suitable for large-capacity data transmission with high bandwidth requirements. This design not only optimizes the signal transmission path but also significantly improves the overall system performance.

[0063] Furthermore, the conversion device 300 in this application avoids interference between signals and improves the overall transmission efficiency by transmitting low-speed signals and high-speed signals separately; secondly, the high bandwidth and low attenuation characteristics of optical signals significantly extend the transmission distance; and the low-speed signals are transmitted through electrical signals, reducing the number of photoelectric conversion modules 304 and lowering costs.

[0064] In some examples, please refer to Figure 3 The first set of electrical connection terminals 3011 and the second electrical connector 302 include at least one of a reset terminal, a detection terminal, a clock terminal and a control terminal. By integrating key signals such as reset, detection, clock and control into the electrical conversion device, the conversion device 300 can not only transmit data signals, but also realize functions such as control of equipment, status monitoring and timing synchronization, thereby improving the overall performance and reliability of the system.

[0065] Specifically, the reset terminal is used to transmit a reset signal to ensure that the device can quickly return to its initial state during startup or in case of an abnormality; the detection terminal is used to transmit device status information (such as temperature, voltage, power consumption, etc.) to enable real-time monitoring of the device; the clock terminal is used to transmit a clock signal to ensure the timing synchronization of various modules in the system; and the control terminal is used to transmit control commands (such as start, stop, configuration, etc.) to enable precise control of the device.

[0066] The second set of electrical connection terminals 3012 includes at least one transmitting terminal and at least one receiving terminal. The transmitting terminal is used to send high-speed electrical signals from the server 100 to the photoelectric conversion module 304. After conversion by the photoelectric conversion module 304, the high-speed electrical signals are converted into optical signals and transmitted through the optical interface 303a of the optical connector 303. The receiving terminal is used to receive the high-speed electrical signals converted back from the photoelectric conversion module 304 and transmit them to the server 100.

[0067] In some examples, the second signal in this application is a differential signal. A differential signal refers to a high-speed signal transmitted in a differential signal format, which ensures the stability of signal transmission. At least one transmitting terminal includes multiple pairs of transmitting terminals, each pair used to transmit one differential signal; at least one receiving terminal includes multiple pairs of receiving terminals, each pair used to transmit one differential signal. Each pair of differential signals is transmitted through two signal lines with opposite phases. The characteristics of a differential amplifier are used to extract the signal, effectively canceling external electromagnetic interference and crosstalk. The multi-pair differential signal design of the transmitting terminal supports multi-channel parallel transmission, significantly improving the overall bandwidth; the multi-pair differential signal design of the receiving terminal ensures the stability and reliability of signal reception.

[0068] For example, please refer to Figure 3 The second set of electrical connection terminals 3012 may include 16 pairs or 8 pairs of transmitting terminals, correspondingly. Alternatively, the second set of electrical connection terminals 3012 may include 16 pairs or 8 pairs of receiving terminals.

[0069] In one differential signal, one second set of electrical connection terminals 3012 is a transmitting terminal, and the other second set of electrical connection terminals 3012 is a corresponding receiving terminal. The transmitting terminal can transmit TXD (transmit data), while the receiving terminal can transmit RXD (receive data). After the second set of electrical connection terminals 3012 transmits the signal to the photoelectric conversion module 304, the photoelectric conversion module 304 converts the electrical signal into an optical signal and outputs it to the optical connector 303b of the optical connector 303. Here, an electrical signal may include one TXD and one RXD, and an electrical signal is sent to one differential signal.

[0070] The conversion device 300 can transmit the converted optical signal to other devices. Since optical signals have better transmission speed and lower signal attenuation, as well as better anti-interference ability, they can increase the signal transmission distance and maintain high data reliability during long-distance transmission, thereby improving the performance of the entire computing system.

[0071] In some examples, please refer to Figure 4 and combined Figure 5 , Figure 4 and Figure 5 For another structure of the conversion device in this application, please refer to [link / reference needed]. Figure 5 The optical connector 303 includes a first optical connector 3031 and a second optical connector 3032, compared to Figure 4 In the case where there is only one optical connector 303, Figure 5 The photoelectric conversion module 304 is connected between the second set of electrical connection terminals 3012 and the first optical connector 3031, and between the second set of electrical connection terminals 3012 and the second optical connector 3032. The second electrical connector 302 includes a third set of electrical connection terminals 3021 and a fourth set of electrical connection terminals 3022. Both the third set of electrical connection terminals 3021 and the fourth set of electrical connection terminals 3022 are connected to the first set of electrical connection terminals 3011. The first optical connector 3031 and the third set of electrical connection terminals 3021 form a first protocol port, and the second optical connector 3032 and the fourth set of electrical connection terminals 3022 form a second protocol port.

[0072] The photoelectric conversion module 304 converts high-speed electrical signals into optical signals. The first optical connector 3031 and the second optical connector 3032 are used to transmit optical signals respectively, supporting dual-channel parallel transmission. This provides multiple transmission channels for high-speed signals, significantly improving the overall bandwidth and transmission efficiency of the conversion device 300 during signal transmission.

[0073] The third set of electrical connection terminals 3021 and the fourth set of electrical connection terminals 3022 are respectively connected to the first set of electrical connection terminals 3011 for transmitting low-speed electrical signals. This provides multiple transmission channels for electrical signals, retains the low cost and low latency advantages of electrical interfaces, and matches the signals transmitted by optical signals.

[0074] In some examples, please refer to Figure 4 and combined Figure 5 The second set of electrical connection terminals 3012 includes a first part of electrical connection terminals and a second part of electrical connection terminals. The photoelectric conversion module 304 is connected between the first part of electrical connection terminals and the first optical connector 3031, and between the second part of electrical connection terminals and the second optical connector 3032.

[0075] The first set of electrical connection terminals is used to transmit a first high-speed electrical signal and is connected to the first optical connector 3031 via the photoelectric conversion module 304; the second set of electrical connection terminals is used to transmit a second high-speed electrical signal and is connected to the second optical connector 3032 via the photoelectric conversion module 304. The first optical connector 3031 and the second optical connector 3032 are used to transmit high-speed optical signals, supporting dual-channel parallel transmission and significantly improving the overall bandwidth.

[0076] In some examples, please refer to Figures 3-6This application also includes a circuit board 305, on which the first electrical connector 301, the second electrical connector 302, the optical connector 303 and the photoelectric conversion module 304 are all disposed. The first set of electrical connection terminals 3011 and the second electrical connector 302 are connected through the circuit board 305, and the second set of electrical connection terminals 3012 and the photoelectric conversion module 304 are connected through the circuit board 305.

[0077] For example, the first electrical connector 301 and the second electrical connector 302 can be gold fingers disposed on the circuit board 305.

[0078] As another example, the pins of the photoelectric conversion module 304 can be directly soldered to the pins on the circuit board 305, so that the photoelectric conversion module 304 can be directly mounted on the circuit board 305. The optical connector 303 can be directly or indirectly connected to the circuit board 305.

[0079] For example, the optical interface 303a of the optical connector 303 may include a QSFP-DD (quad small formfactor pluggable-double density) interface. When the optical interface of the photoelectric conversion module 304 is directly connected to the circuit board 305, the optical interface of the photoelectric conversion module 304 can be directly mounted on the circuit board 305.

[0080] In some examples, please refer to Figure 6 The circuit board 305 includes a first surface 3051 and a second surface 3052 facing each other. A first set of electrical connection terminals 3011, a second electrical connector 302, and a circuit connection structure between the first set of electrical connection terminals 3011 and the second electrical connector 302 are disposed on the first surface 3051. A second set of electrical connection terminals 3012, a photoelectric conversion module 304, and an optical connector 303 are disposed on the second surface 3052.

[0081] For example, the circuit board 305 is a printed circuit board, and the first surface 3051 is used to arrange components related to low-speed signals. The first surface 3051 includes a first set of electrical connection terminals 3011, a second electrical connector 302 and the circuit connection structure between them. The first set of electrical connection terminals 3011, the second electrical connector 302 and the circuit connection structure between them can be electrically connected directly through metal layer solder joints on the circuit board 305.

[0082] The second surface 3052 is used to arrange components related to high-speed signals, including a second set of electrical connection terminals 3012, a photoelectric conversion module 304, and an optical connector 303. The photoelectric conversion module 304 converts high-speed electrical signals into optical signals and transmits them through the optical connector 303, making full use of the high bandwidth and low attenuation characteristics of optical signals.

[0083] The dual-surface layout design physically isolates low-speed and high-speed signals, avoiding crosstalk and interference between signals and further improving the stability and reliability of signal transmission. Furthermore, the dual-surface layout design makes full use of the space on the circuit board 305, further improving the space utilization of the conversion device 300.

[0084] In some examples, please refer to Figure 6 Along the thickness direction of the circuit board 305, the first set of electrical connection terminals 3011 and the second set of electrical connection terminals 3012 are arranged opposite to each other, and the second electrical connector 302 and the optical connector 303 are arranged opposite to each other.

[0085] The first set of electrical connection terminals 3011 and the second set of electrical connection terminals 3012 are arranged opposite each other along the thickness direction of the circuit board 305, achieving physical isolation between low-speed and high-speed signals in the vertical direction and avoiding crosstalk and interference between signals. The second electrical connector 302 and the optical connector 303 are also arranged opposite each other along the thickness direction, further optimizing the signal path layout. Low-speed signals are transmitted through the first set of electrical connection terminals 3011 and the second electrical connector 302, with a short path and good impedance matching, ensuring signal integrity; high-speed signals are transmitted through the second set of electrical connection terminals 3012, the photoelectric conversion module 304, and the optical connector 303, making full use of the high bandwidth and low attenuation characteristics of optical signals.

[0086] In some examples, the photoelectric conversion module 304 includes an optical transmitting channel, an optical receiving channel, and a wavelength division multiplexer. The input end of the optical transmitting channel and the output end of the optical receiving channel are both connected to the second set of electrical connection terminals 3012. The wavelength division multiplexer is connected to the output end of the optical transmitting channel, the input end of the optical receiving channel, and the optical connector 303. The wavelength division multiplexer is used to transmit the optical signal output from the output end of the optical transmitting channel to the optical connector 303, and to transmit the optical signal input from the optical connector 303 to the input end of the optical receiving channel.

[0087] The optical transmitting channel converts the high-speed electrical signal from the second set of electrical connection terminals 3012 into an optical signal and transmits it to the optical connector 303 via a wavelength division multiplexer. The optical receiving channel converts the optical signal input from the optical connector 303 into an electrical signal and transmits it to the server 100 or the memory 200 via the second set of electrical connection terminals 3012. The wavelength division multiplexer enables bidirectional optical signal transmission using different wavelengths, making full use of the fiber optic bandwidth resources.

[0088] For example, the conversion device 300 may include a first operating state and a second operating state, wherein the number of signals transmitted by the conversion device 300 to the first electrical connector 301 in the first operating state is less than the number of signals transmitted by the conversion device 300 to the first electrical connector 301 in the second operating state.

[0089] Correspondingly, the number of first signals transmitted by the conversion device 300 in the first operating state to the first set of electrical connection terminals 3011 is less than the number of first signals transmitted by the conversion device 300 in the second operating state to the first set of electrical connection terminals 3011.

[0090] For example, in the first operating state, the conversion device 300 transmits 1-2 sets of reset signals and detection signals, and simultaneously transmits clock signals and control signals. In the second operating state, the conversion device 300 transmits 1-4 sets of reset signals and detection signals, and simultaneously transmits clock signals and control signals.

[0091] In addition, the number of second signals transmitted by the conversion device 300 in the first operating state to the second set of electrical connection terminals 3012 is less than the number of second signals transmitted by the conversion device 300 in the second operating state to the second set of electrical connection terminals 3012.

[0092] For example, in a first operating state, the conversion device 300 transmits 8 pairs of differential signal pairs at the second set of electrical connection terminals 3012, each differential signal pair including a TXD and an RXD. In a second operating state, the conversion device 300 transmits 16 pairs of differential signal pairs at the second set of electrical connection terminals 3012, each differential signal pair including a TXD and an RXD.

[0093] In some examples, there are multiple first electrical connectors 301, multiple second electrical connectors 302, and multiple optical connectors 303. The photoelectric conversion module 304 is connected between the second set of electrical connection terminals 3012 of the multiple first electrical connectors 301 and the multiple optical connectors 303. The first set of electrical connection terminals 3011 of the multiple first electrical connectors 301 and the multiple second electrical connectors 302 are connected.

[0094] Multiple first electrical connectors 301 allow the module to connect to multiple electrical signal sources or electrical signal receiving devices simultaneously, thereby improving the system's parallel processing capability and signal transmission efficiency.

[0095] By dividing the first electrical connector 301 into a first group and a second group, the first group of electrical connection terminals 3011 is directly connected to multiple second electrical connectors 302, which can realize the efficient distribution and transmission of electrical signals, while the second group of electrical connection terminals 3012 is connected to the photoelectric conversion module 304 to ensure seamless conversion between electrical signals and optical signals.

[0096] In some examples, please refer to Figure 7This application provides a connection component, which includes a first conversion device 300a and a second conversion device 300b. The first conversion device 300a is the conversion device 300 mentioned in any of the above embodiments, and the second conversion device 300b is the conversion device 300 mentioned in any of the above embodiments. The first electrical connector 301 of the first conversion device 300a of the first connection component is connected to the server 100, and the first electrical connector 301 of the second conversion device 300b of the first connection component is connected to the memory 200.

[0097] Based on this, please refer to Figure 8 and combined Figure 3 The high-speed signal input from server 100 to first conversion device 300a is transmitted in the form of an electrical signal through the second set of electrical connection terminals 3012 of first conversion device 300a to photoelectric conversion module 304. After the photoelectric conversion module 304 converts the electrical signal into an optical signal, it outputs it from the optical connector 303 of first conversion device 300a to the optical connector 303 of second conversion device 300b. After the photoelectric conversion module 304 of second conversion device 300b converts this part of the optical signal into an electrical signal, the electrical signal is transmitted to memory 200 through the first electrical connector 301 of second conversion device 300b, thereby realizing high-speed signal transmission between server 100 and memory 200.

[0098] The low-speed signal input from server 100 to first conversion device 300a is transmitted in the form of an electrical signal through the first set of electrical connection terminals 3011 of first conversion device 300a to second electrical connector 302. Second electrical connector 302 transmits the electrical signal to second electrical connector 302 of second conversion device 300b. Second electrical connector 302 of second conversion device 300b transmits the electrical signal to the first set of electrical connection terminals 3011 of second conversion device 300b, and then transmits it to memory 200 through the first set of electrical connection terminals 3011, thereby realizing low-speed signal transmission between server 100 and memory 200.

[0099] In some examples, please refer to Figure 9 There are multiple memory units 200, and the multiple memory units 200 are connected to the first electrical connector 301 of the second conversion device 300b.

[0100] The first electrical connector 301 of the second conversion device 300b may include multiple electrical interfaces to enable connection with multiple memories 200, thereby enabling efficient data interaction between the server 100 and the memories 200 to meet the storage capacity requirements of the server 100.

[0101] In some examples, please refer to Figure 10The computing system in this application also includes a splitter 400, which is connected between the first electrical connector 301 of the second conversion device 300b of the connection component and a plurality of memories 200. The splitter 400 includes a plurality of first electrical connection branches, one of which is connected to one memory 200.

[0102] For example, the splitter 400 can be a CXL (Compute Express Link) switch.

[0103] The splitter 400 can output the electrical signal transmitted from the second conversion device 300b to multiple first electrical connection branches to realize the connection with the memory 200 and meet the expansion needs of the server 100.

[0104] In some examples, the computing system of this application further includes a first connection component and a second connection component, wherein there are multiple second connection components, the first electrical connector 301 of the first conversion device 300a of a second connection component is connected to a first electrical connection branch, and the first electrical connector 301 of the second conversion device 300b of a second connection component is connected to a memory 200.

[0105] Correspondingly, the splitter 400 is connected between the first electrical connector 301 of the second conversion device 300b of the first connection component and the plurality of memories 200.

[0106] Based on this, server 100 and multiple storage devices 200 achieve efficient data interaction through a first connection component, a splitter 400, and multiple second connection components, meeting the requirements for high bandwidth and low latency. The multiple second connection components support connections to multiple storage devices 200, satisfying the expansion needs of server 100.

[0107] Furthermore, the arrangement of the first and second connecting components can avoid signal attenuation during transmission, further improving the transmission distance and efficiency between the server 100 and the memory 200.

[0108] In some examples, please refer to Figure 11 There are multiple servers 100 and multiple first connection components. One server 100 is connected to the first electrical connector 301 of the first conversion device 300a of the first connection component. The splitter 400 includes multiple second electrical connection branches. One second electrical connection branch is connected to the first electrical connector 301 of the second conversion device 300b of the first connection component.

[0109] Multiple servers 100 are respectively connected to the first electrical connector 301 of the first conversion device 300a of multiple first connection components. Each server 100 transmits information to the memory 200 through an independent first connection component. Each first connection component supports the split transmission of high-speed and low-speed signals, ensuring efficient data interaction between the server 100 and the memory 200. Of course, a first connection component can also be connected to the memory 200 through a second connection component, and a splitter 400 can also be set between the first connection component and the memory 200; this application does not limit this.

[0110] This application also provides a computer-readable storage medium. All or part of the processes in the above method embodiments can be executed by computer instructions instructing related hardware. The program can be stored in the aforementioned computer-readable storage medium, and when executed, it can include the processes of the above method embodiments. The computer-readable storage medium can be any of the foregoing embodiments or memory. The aforementioned computer-readable storage medium can also be an external storage device of the recovery device, such as a plug-in hard drive, smart media card (SMC), secure digital (SD) card, flash card, etc., equipped on the recovery device. Further, the aforementioned computer-readable storage medium can include both internal storage units of the recovery device and external storage devices. The aforementioned computer-readable storage medium is used to store the aforementioned computer program and other programs and data required by the recovery device. The aforementioned computer-readable storage medium can also be used to temporarily store data that has been output or will be output.

[0111] This application also provides a computer program product comprising a computer program that, when run on a computer, causes the computer to execute any of the operating system migration methods provided in the above embodiments.

[0112] Although this application has been described herein in conjunction with various embodiments, those skilled in the art, by reviewing the accompanying drawings, disclosure, and appended claims, will understand and implement other variations of the disclosed embodiments in carrying out the claimed application. In the claims, the word "comprising" does not exclude other components or steps, and "a" or "an" does not exclude multiple instances. A single processor or other unit can implement several functions listed in the claims. While different dependent claims may recite certain measures, this does not mean that these measures cannot be combined to produce good results.

[0113] Although this application has been described in conjunction with specific features and embodiments, it is obvious that various modifications and combinations can be made thereto without departing from the spirit and scope of this application. Accordingly, this specification and drawings are merely exemplary illustrations of this application as defined by the appended claims, and are considered to cover any and all modifications, variations, combinations, or equivalents within the scope of this application. Clearly, those skilled in the art can make various alterations and modifications to this application without departing from the spirit and scope of this application. Thus, if such modifications and modifications of this application fall within the scope of the claims of this application and their equivalents, this application is also intended to include such modifications and modifications.

[0114] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A computing system, characterized in that, include: A server, a storage device, and a conversion device connected between the server and the storage device, the conversion device comprising: A first electrical connector is used to connect the server and the memory, and the first electrical connector includes a first set of electrical connection terminals and a second set of electrical connection terminals. A second electrical connector and an optical connector are used to connect the server to the other of the memory, and the second electrical connector is connected to the first set of electrical connection terminals; A photoelectric conversion module, wherein the photoelectric conversion module is connected between the second set of electrical connection terminals and the optical connector; The first set of electrical connection terminals and the second electrical connector are used to transmit a first signal at a first rate, and the second set of electrical connection terminals, the photoelectric conversion module and the optical connector are used to transmit a second signal at a second rate, the second rate being greater than the first rate.

2. The computing system according to claim 1, characterized in that, The number of conversion devices is multiple, including a first conversion device and a second conversion device. The optical connector of the first conversion device is connected to the optical connector of the second conversion device through an optical connection structure, and the second electrical connector of the first conversion device is connected to the second electrical connector of the second conversion device through an electrical connection structure. The first electrical connector of the first conversion device is connected to one of the server and the memory, and the first electrical connector of the second conversion device is connected to the other of the server and the memory.

3. The computing system according to claim 1, characterized in that, The first set of electrical connection terminals and the second electrical connector include at least one of a reset terminal, a detection terminal, a clock terminal, and a control terminal; The second set of electrical connection terminals includes at least one transmitting terminal and at least one receiving terminal.

4. The computing system according to claim 1, characterized in that, The optical connector includes a first optical connector and a second optical connector. The photoelectric conversion module is connected between the second set of electrical connection terminals and the first optical connector, and is also connected between the second set of electrical connection terminals and the second optical connector. The second electrical connector includes a third set of electrical connection terminals and a fourth set of electrical connection terminals; both the third set of electrical connection terminals and the fourth set of electrical connection terminals are connected to the first set of electrical connection terminals. The first optical connector and the third set of electrical connection terminals form a first protocol port, and the second optical connector and the fourth set of electrical connection terminals form a second protocol port.

5. The computing system according to any one of claims 1-4, characterized in that, Also includes: The circuit board, the first electrical connector, the second electrical connector, the optical connector and the photoelectric conversion module are all disposed on the circuit board, the first set of electrical connection terminals and the second electrical connector are connected through the circuit board, and the second set of electrical connection terminals and the photoelectric conversion module are connected through the circuit board.

6. The computing system according to claim 5, characterized in that, The circuit board includes a first surface and a second surface facing away from each other. The first set of electrical connection terminals, the second electrical connector, and the circuit connection structure between the first set of electrical connection terminals and the second electrical connector are disposed on the first surface, and the second set of electrical connection terminals, the photoelectric conversion module, and the optical connector are disposed on the second surface.

7. The computing system according to claim 6, characterized in that, Along the thickness direction of the circuit board, the first set of electrical connection terminals and the second set of electrical connection terminals are arranged opposite to each other, and the second electrical connector and the optical connector are arranged opposite to each other.

8. The computing system according to claim 2, characterized in that, Also includes: A connection component, comprising a first conversion device and a second conversion device, wherein there are multiple connection components, each including a first connection component and a second connection component. The first electrical connector of the first conversion device of the first connection component is connected to the server, the first electrical connector of the second conversion device of the first connection component is connected to the first electrical connector of the first conversion device of the second connection component, and the first electrical connector of the second conversion device of the second connection component is connected to the memory.

9. A connection component, applied to the computing system according to any one of claims 1-8, characterized in that, Includes a conversion device, the conversion device comprising: A first electrical connector is used to connect the server and the memory, and the first electrical connector includes a first set of electrical connection terminals and a second set of electrical connection terminals. A second electrical connector and an optical connector are used to connect the server to the other of the memory, and the second electrical connector is connected to the first set of electrical connection terminals; A photoelectric conversion module, wherein the photoelectric conversion module is connected between the second set of electrical connection terminals and the optical connector; The first set of electrical connection terminals and the second electrical connector are used to transmit a first signal at a first rate, and the second set of electrical connection terminals, the photoelectric conversion module, and the optical connector are used to transmit a second signal at a second rate, wherein the second rate is greater than the first rate; The number of conversion devices is multiple, including a first conversion device and a second conversion device. The optical connector of the first conversion device is connected to the optical connector of the second conversion device through an optical connection structure, and the second electrical connector of the first conversion device is connected to the second electrical connector of the second conversion device through an electrical connection structure.

10. A conversion device, applied to the computing system according to any one of claims 1-8 or the connection component according to claim 9, characterized in that, include: A first electrical connector, used to connect a server and a storage device, the first electrical connector including a first set of electrical connection terminals and a second set of electrical connection terminals; A second electrical connector and an optical connector are used to connect the server to another device in the memory. The second electrical connector is connected to the first set of electrical connection terminals. A photoelectric conversion module, wherein the photoelectric conversion module is connected between the second set of electrical connection terminals and the optical connector; The first set of electrical connection terminals and the second electrical connector are used to transmit a first signal at a first rate, and the second set of electrical connection terminals, the photoelectric conversion module and the optical connector are used to transmit a second signal at a second rate, the second rate being greater than the first rate.

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