Heat dissipation device, display card and electronic equipment

Abstract

The utility model discloses a heat dissipation device, a display card and electronic equipment. The heat dissipation device comprises a heat dissipation assembly and a uniform temperature plate. The uniform temperature plate comprises at least two mounting positions, and the mounting positions are respectively used for being in contact with heat sources at different positions; the heat dissipation assembly is used for dissipating heat of the vapor chamber. In the application, the at least two mounting positions are formed on the vapor chamber to conduct heat for the corresponding number of heat sources respectively, and then the heat is dissipated through the heat dissipation component, so that the effect of simultaneously dissipating heat for the multiple GPU heat sources of the graphics card is achieved.

Description

Technical Field

[0001] This application relates to the field of computer hardware technology, and in particular to a heat dissipation device, a graphics card, and an electronic device. Background Technology

[0002] In the past, most graphics cards used in related technologies operated on a single GPU (Graphics Processing Unit) model, and their corresponding heatsinks were also typically single-heat-source designs. However, with market diversification and increasing demand for higher computing power, graphics cards now often feature multiple GPUs on a single card, leading to increased overall power consumption. In this case, heatsinks designed for single-heat-source models become less suitable. Utility Model Content

[0003] This application proposes a heat dissipation device to effectively solve the technical problems of high power consumption and insufficient heat dissipation capacity of multi-GPU graphics cards in related technologies.

[0004] This application also proposes a graphics card that includes the above-mentioned heat dissipation device.

[0005] This application also proposes an electronic device that includes the aforementioned graphics card.

[0006] The first aspect of this application provides a heat dissipation device, including: a heat dissipation component and a heat spreader;

[0007] The heat exchange plate includes at least two mounting positions, each of which is used to contact a heat source at a different location.

[0008] The heat dissipation component is used to dissipate heat from the vapor chamber.

[0009] Furthermore, at least two of the mounting positions are located at different or the same positions in the height direction.

[0010] Furthermore, the mounting position is provided with a protruding structure, which is used to set a heat source.

[0011] Furthermore, the heat dissipation device also includes a bracket, which is disposed on the heat spreader and located on the same surface as the protruding structure.

[0012] Furthermore, the heat dissipation component includes heat dissipation fins and a fan, the heat dissipation fins being disposed on the vapor chamber plate, and the fan being used to dissipate heat from the heat dissipation fins.

[0013] Furthermore, the heat dissipation fins and the fan are located on different surfaces of the vapor chamber, and at least one of the heat dissipation fins or the fan is disposed relative to the mounting position.

[0014] Furthermore, the heat dissipation device also includes an upper cover, the fan is mounted on the upper cover, the upper cover is mounted on the heat spreader and forms a cavity with the heat spreader, and the heat dissipation fins are located within the cavity.

[0015] Furthermore, the temperature distribution plate is provided with a bending structure so that at least two of the mounting positions are in different positions in the height direction.

[0016] As can be seen from the above technical solutions, the embodiments of this application have at least the following beneficial effects: at least two mounting positions are formed on the heat spreader, which are respectively the corresponding number of heat sources for heat conduction, and then the heat is dissipated through the heat dissipation components, thereby achieving the effect of simultaneously dissipating heat from multiple GPU heat sources of the graphics card.

[0017] A second aspect of this application provides a graphics card, including a heat dissipation device as described in the first aspect of this application.

[0018] A third aspect of this application provides an electronic device, including a graphics card as described in the second aspect of this application.

[0019] It is easy to understand that the graphics card in the second aspect embodiment of this application and the electronic device in the third aspect embodiment of this application both have the same technical effect as the heat dissipation device in the first aspect embodiment, and therefore will not be described again.

[0020] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a schematic diagram of a heat dissipation device provided in an embodiment of this application from a first direction.

[0023] Figure 2 This is a schematic diagram of a heat dissipation device provided in an embodiment of this application from a second direction.

[0024] Figure 3 An exploded view of a heat dissipation device and a graphics card provided in one embodiment of this application.

[0025] The first direction can be understood as the direction facing forward at a certain angle, and the second direction can be understood as the direction facing the opposite back at a certain angle.

[0026] Figure label:

[0027] 100. Heat dissipation components; 110. Heat dissipation fins; 120. Fan;

[0028] 200. Heat spreader; 201. Mounting position; 210. Raised structure; 220. Bending structure;

[0029] 300, bracket;

[0030] 400, top cover;

[0031] 500, graphics card. Detailed Implementation

[0032] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0033] See Figures 1 to 3 As shown, an embodiment of the first aspect of this application discloses a heat dissipation device, including a heat dissipation component 100 and a heat spreader 200.

[0034] The heat spreader 200 includes at least two mounting positions 201, each of which is used to contact a heat source at a different location; the heat dissipation assembly 100 is used to dissipate heat from the heat spreader 200.

[0035] In the embodiments of this application, by forming at least two mounting positions 201 on the heat spreader 200 to conduct heat to the corresponding number of heat sources, and then dissipating the heat through the heat dissipation component, the effect of simultaneously dissipating heat from more than 500 GPU heat sources of the graphics card is achieved.

[0036] It is understandable that each mounting position 201 can be adaptively adjusted according to the corresponding position and structural shape of each GPU on the specific graphics card 500, so that the heat spreader 200 can make contact with each GPU of the graphics card 500 through each mounting position 201, and then use the characteristics of the heat spreader 200 to transfer heat, and then the heat dissipation component 100 achieves the heat dissipation effect.

[0037] In some embodiments, the mounting position 201 may be configured to include, but not limited to, a slot, a mounting position defined or enclosed by structural members, or a mounting plane, wherein mounting holes, connectors, or positioning members may also be provided around the mounting position 201, and corresponding structural features are provided at the corresponding position of the graphics card 500, so that after the GPU of the graphics card 500 is set in the mounting position 201, the relative position of the graphics card 500 and the heat dissipation device of this application is maintained, thereby ensuring reliable connection and heat dissipation effect.

[0038] In some embodiments, after designing the structure or form of the mounting position 201 corresponding to each GPU of the graphics card 500, the structure of the mounting position 201 may be the same or different. It can be adapted according to the usage requirements to achieve better heat dissipation and fixation.

[0039] The following will combine Figures 1 to 3 The heat dissipation device disclosed in the embodiments of this application will be explained and described in detail.

[0040] It should be understood that, since the heat spreader 200's mounting positions 201 simultaneously contact multiple heat sources on the graphics card 500, in order to match the height positions of different heat sources, in some embodiments of this application, such as... Figure 3 At least two mounting positions 201 are located at different positions in the height direction. It can be understood that when the heat spreader 200 simultaneously contacts multiple heat sources on the graphics card 500, the aforementioned limitation on the mounting positions 201 ensures that the height of the heat sources is not limited to the same height, thus achieving the effect of simultaneously cooling multiple GPU heat sources on the graphics card 500.

[0041] In one specific embodiment, the vapor chamber 200 of this application is an irregularly shaped vapor chamber 200 with two mounting positions 201. By having the irregularly shaped vapor chamber 200 simultaneously contact the two heat sources on the graphics card 500, the effect of simultaneously dissipating heat from both GPU heat sources of the graphics card 500 is achieved. It should be understood that this application is applicable to the heat dissipation of multi-GPU graphics cards 500, but is not limited to dual-GPU graphics cards 500.

[0042] In some embodiments, when at least two heat sources on the graphics card 500 are at the same height, at least two mounting positions 201 are in the same position in the height direction, achieving the effect of simultaneously cooling multiple GPU heat sources on the graphics card 500. It is understood that the height positions of the heat sources on different models of graphics cards 500 may vary adaptively. The height position of each mounting position can be adaptively adjusted according to the height position of the heat sources on the graphics card 500. For example, when at least two heat sources on the graphics card 500 are at the same height, the corresponding number of mounting positions 201 are also in the same position in the height direction to ensure contact with each heat source and achieve a cooling effect. When some heat sources on the graphics card 500 are at the same height and some are at different heights, the position of each mounting position 201 in the height direction is also adjusted accordingly to meet usage requirements.

[0043] It should be understood that the structural design of the mounting position 201 is key to ensuring a more stable contact between the heat spreader 200 and the heat source on the graphics card 500, and to achieving better heat dissipation.

[0044] In this regard, in some embodiments of this application, reference is made to Figure 2 and Figure 3 The mounting position 201 is provided with a raised structure 210, which is used to set the heat source. It can be understood that the raised structure 210 is a boss or platform with a preset height protruding on the heat spreader 200. By using this raised structure 210 to contact the heat source of the graphics card 500, a better heat transfer effect can be achieved.

[0045] Understandable Figure 2 This is a schematic diagram shown from the bottom of the device, indicating that the bracket 300 is at the very bottom of the device. Figure 3 In the middle, the bracket 300 is positioned between the heat spreader 200 and the graphics card 600. Figure 3 The surface of the vapor chamber 200 shown is used to mount the heat dissipation assembly 100, while the back side actually has... Figure 2 The protruding structure 210 shown is used for contact. Figure 3 Two heat sources on the graphics card 600.

[0046] In some embodiments, the height of the protrusion 210 on each mounting position 201 relative to the protrusion of the heat spreader 200 can be adaptively adjusted to accommodate heat sources at different height positions.

[0047] In some embodiments of this application, reference is made to Figure 2 and Figure 3The heat dissipation device also includes a bracket 300, which is disposed on the heat spreader 200 and on the same surface as the raised structure 210. It is understood that the bracket 300 is used to improve ease of installation, enabling the heat dissipation device of this application to be easily installed on electronic products. Considering that the heat dissipation component 100 is located on the opposite surface of the raised structure 210, placing the bracket 300 on the same surface as the raised structure 210 does not affect the installation of the heat dissipation component 100 while facilitating the installation of the bracket 300 on the electronic product.

[0048] In some embodiments, the bracket 300 is provided with a clearance position to avoid the protrusion structure 210, so that the bracket 300 is placed on the heat exchange plate 200 without affecting the use of the protrusion structure 210.

[0049] In some embodiments of this application, reference is made to Figure 3 The heat dissipation assembly 100 includes heat sink fins 110 and a fan 120. The heat sink fins 110 are mounted on a vapor chamber 200, and the fan 120 is used to dissipate heat from the heat sink fins 110. It can be understood that the coordinated heat dissipation of the heat sink fins 110 and the fan 120 is a systematic engineering project involving heat conduction, convection optimization, and structural design. In summary, the heat sink fins 110 and the fan 120 work together through a physical mechanism of conduction-convection to achieve efficient heat transfer from the heat source to the environment.

[0050] The heat dissipation fins 110 are used to increase the heat dissipation area and optimize heat distribution. In some embodiments, the heat dissipation fins 110 significantly increase the surface area in contact with air through densely arranged thin metal sheets (such as aluminum or copper), thereby improving heat exchange efficiency. Specifically, the heat dissipation fins 110 can be cylindrical fins or folded fins, etc., to enhance convection. In some embodiments, the fins absorb heat from the heat source (such as CPU / GPU) through heat pipes or a copper base and evenly transfer it to the entire fin structure, avoiding excessively high local temperatures. Specifically, the combination of a copper base and aluminum fins can balance thermal conductivity and cost.

[0051] Furthermore, the fan 120 is used to generate airflow by rotation, quickly removing heat from the surface of the fins and achieving accelerated heat dissipation through forced convection. In some embodiments, an axial fan 120 (such as a common tower fan 120) is used to push airflow axially to cover the surface of the fins; in other embodiments, a centrifugal fan 120 is used, which is suitable for scenarios requiring high air pressure.

[0052] Understandably, the position of the fan 120 must match the fin structure. In some embodiments, the fan 120 is often placed on the side or top of the fins to create a "penetrating" or "side-blowing" airflow, ensuring sufficient airflow in the fin gaps. This allows heat generated by the heat source to be transferred to the fins through the copper base or heat pipes. The fan 120 drives the airflow through the fin gaps, and heat is diffused into the air through convection.

[0053] In other embodiments, the heat dissipation component 100 may also be a component structure in which at least one or at least two of the following are used in combination: heat pipe, fan 120, heat dissipation fins, etc. The way of using or combining these components can be adaptively adjusted based on commonly used heat dissipation components while meeting the heat dissipation requirements.

[0054] In some embodiments of this application, reference is made to Figure 3 The heat sink fins 110 and the fan 120 are located on different surfaces of the vapor chamber 200 relative to the mounting positions 201, and at least one of the heat sink fins 110 or the fan 120 is positioned relative to the mounting positions 201. It is understood that by positioning the heat sink fins 110 and the fan 120 relative to one of the mounting positions 201, a reasonable layout of the internal structure of the heat dissipation device is ensured while maintaining the heat dissipation effect.

[0055] In some embodiments of this application, reference is made to Figures 1 to 3 The heat dissipation device also includes a top cover 400, a fan 120 mounted on the top cover 400, and the top cover 400 mounted on the heat spreader 200 and forming a cavity with the heat spreader 200. Heat dissipation fins 110 are located within the cavity. It is understood that the top cover 400 not only protects the internal structure of the heat dissipation device, but the cavity it forms also allows for sufficient airflow and heat dissipation.

[0056] In some embodiments, the top cover 400 has an opening for mounting the fan 120, allowing sufficient airflow and improving heat dissipation.

[0057] To facilitate the formation of at least two mounting positions 201 at different heights, refer to Figure 3 In some embodiments of this application, the vapor chamber 200 is provided with a bending structure 220 so that at least two mounting positions 201 are located at different positions in the height direction. It can be understood that by processing the bending structure 220 on the vapor chamber 200, plate surfaces with different height positions can be formed on both sides of the bending structure 220 efficiently, and mounting positions 201 on both sides of the bending structure 220 can be designed to contact the heat source of the graphics card 500 respectively.

[0058] In some embodiments, when the graphics card 500 has multiple GPUs and multiple heat sources, multiple bending structures 220 can be provided on the heat spreader 200 to adapt the number of mounting positions 201 formed to the number of heat sources of the graphics card 500.

[0059] The heat dissipation device of this application embodiment is described in detail below with reference to a specific example. It should be noted that the following embodiment is merely an exemplary description and should not be construed as limiting the embodiments of this application.

[0060] See Figures 1 to 3 As shown, the heat dissipation device in this embodiment uses a vapor chamber 200 with an irregular structure to conduct heat to two heat sources at the same time, and then dissipates the heat through the heat dissipation fins 110 and the fan 120.

[0061] Specifically, the heatsink fins 110, vapor chamber 200, and bracket 300 are welded together and then assembled with the top cover 400 and fan 120 using screws to form a complete heatsink. Two protrusions on the vapor chamber 200 contact two heat sources on the graphics card 500 PCB board. Due to the bent structure 220, the height of the heat sources is not necessarily the same. The vapor chamber 200 transfers the heat from both heat sources to the heatsink fins 110, which, in conjunction with the fan 120, dissipates the heat, achieving simultaneous cooling for the dual GPU heat sources of the graphics card 500. Furthermore, the heatsink of this application is applicable to multi-GPU graphics cards 500, but not limited to dual-GPU graphics cards 500.

[0062] The second aspect of this application discloses a graphics card 500, including: a heat dissipation device according to the first aspect of this application.

[0063] The electronic device of the third aspect of this application may be a computer, a smart home device, a vehicle or an automated device, etc. The electronic device includes: the graphics card 500 of the second aspect of this application and the heat dissipation device of the first aspect of this application.

[0064] In some embodiments, the graphics card 500 is mounted on a heat sink to dissipate heat from the graphics card 500. The heat sink is mounted on the electronic device to enable the graphics card 500 to function properly.

[0065] It is easy to understand that the graphics card in the second aspect embodiment of this application and the electronic device in the third aspect embodiment of this application both have the same technical effect as the heat dissipation device in the first aspect embodiment, and therefore will not be described again.

[0066] In the description of this application, it should be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0067] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0068] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0069] In the description of this specification, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

Claims

1. A heat dissipation device, characterized in that, include: Heat dissipation components and vapor chambers; The heat exchange plate includes at least two mounting positions, each of which is used to contact a heat source at a different location. The heat dissipation component is used to dissipate heat from the heat exchange plate.

2. The heat dissipation device according to claim 1, characterized in that: At least two of the mounting positions are located at different or the same positions in the height direction.

3. The heat dissipation device according to claim 1, characterized in that: The mounting position is provided with a protruding structure, which is used to set a heat source.

4. The heat dissipation device according to claim 3, characterized in that: The heat dissipation device also includes a bracket, which is disposed on the heat spreader and located on the same surface as the protruding structure.

5. The heat dissipation device according to claim 1, characterized in that: The heat dissipation assembly includes heat dissipation fins and a fan. The heat dissipation fins are disposed on the heat spreader plate, and the fan is used to dissipate the heat on the heat dissipation fins.

6. The heat dissipation device according to claim 5, characterized in that: The heat dissipation fins and the fan are located on different surfaces of the heat spreader and the mounting position is respectively located on different surfaces of the heat spreader, and at least one of the heat dissipation fins or the fan is arranged relative to the mounting position.

7. The heat dissipation device according to claim 5, characterized in that: The heat dissipation device also includes an upper cover, the fan is mounted on the upper cover, the upper cover is mounted on the heat spreader and forms a cavity with the heat spreader, and the heat dissipation fins are located in the cavity.

8. The heat dissipation device according to claim 1, characterized in that: The temperature distribution plate is provided with a bending structure so that at least two of the mounting positions are in different positions in the height direction.

9. A graphics card, characterized in that, include: The heat dissipation device as described in any one of claims 1 to 8.

10. An electronic device, characterized in that, include: The graphics card as described in claim 9.

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