High-power GPU phase change liquid cooling radiator

Abstract

The utility model relates to a high-power GPU (Graphic Processing Unit) phase change liquid cooling radiator, which comprises a bottom plate, a GPU mainboard and a cover plate which are overlapped in sequence, a sealing groove and a cooling chamber are sequentially arranged on one side, close to the cover plate, of the bottom plate from outside to inside, and a liquid inlet and a liquid outlet which are respectively communicated with the cooling chamber are formed in the side surface of the bottom plate; the GPU phase change liquid cooling radiator further comprises a sealing ring and a cooling cold plate, the sealing ring is placed in the sealing groove, the cooling cold plate abuts against the sealing groove, and a micro rib column structure arranged on the cooling cold plate is located in the cooling chamber. According to the utility model, the phase change liquid cooling technology and the micro rib column structure are combined, and the heat conduction and heat dissipation efficiency is effectively improved. Due to the design of the heat dissipation cold plate, the contact area between the cooling working medium and the GPU core is optimized, the heat dissipation effect is further enhanced through the hydrophilic or hydrophobic modification layer, different cooling requirements are met, and the service life of the GPU can be prolonged.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation technology, specifically to a high-power GPU phase change liquid cooler. Background Technology

[0002] With the explosive growth in demand for high-power GPU computing power, traditional air cooling and liquid cooling technologies face severe challenges due to insufficient efficiency, uneven heat distribution, and lag in dynamic response. Air cooling is limited by the thermal capacity of air and is unable to cope with transient high heat loads, easily leading to core overheating and frequency throttling. While water cooling systems improve heat dissipation efficiency, they carry the risk of leakage, and the cold plate structure is not optimized for the differentiated heat source distribution of the GPU core and memory modules, resulting in uneven heat dissipation and the continuous expansion of local high-temperature areas.

[0003] While existing phase change liquid cooling technology has partially solved the thermal conductivity bottleneck, the insufficient thermal conductivity of organic phase change materials and the uneven flow of the working fluid in microchannels can easily lead to localized drying failure. The single rib structure of traditional cold plates and their unoptimized surface hydrophilic and hydrophobic properties also limit the phase change boiling efficiency. In addition, the interfacial thermal resistance caused by mechanical connections, the compatibility defects between the working fluid and metal materials, and the response hysteresis under dynamic loads further restrict the reliability and energy efficiency of the heat dissipation system. Utility Model Content

[0004] The purpose of this invention is to overcome at least one of the defects of the prior art and provide a high-power GPU phase change liquid cooler.

[0005] Phase change cooling technology offers a breakthrough solution to the aforementioned problems due to its unique advantages: Utilizing the latent heat absorption characteristics of phase change materials, it can efficiently dissipate heat in a very short time, significantly reducing core temperature and eliminating localized hotspots; the passive cooling mechanism does not rely on active power supply, and combined with a porous media composite structure and gradient micro-rib design, it greatly improves boiling heat transfer efficiency and working fluid flow uniformity; the adaptive interface characteristics, through material phase changes, tightly adhere to the chip surface, effectively reducing contact thermal resistance; and the synergistic design of hydrophilic / hydrophobic surface modification and porous media layers enhances liquid film coverage stability and solves the problems of working fluid corrosion and microchannel blockage. Simultaneously, the phase change cooling system optimizes the heat conduction path through a solid thermally conductive media layer, combined with a high-level liquid outlet layout and self-circulating flow channels, achieving rapid response and energy consumption optimization under dynamic loads. These innovations not only overcome the core defects of traditional cooling technologies but also provide efficient, compact, and long-term stable thermal management paths for scenarios such as high-power GPUs, AI computing clusters, and new energy vehicles, driving cooling technology towards intelligent control and high integration.

[0006] The objective of this utility model can be achieved through the following technical solutions:

[0007] A high-power GPU phase-change liquid cooling radiator includes a base plate, a GPU motherboard, and a cover plate stacked in sequence.

[0008] The bottom plate is provided with a sealing groove and a cooling chamber in sequence from the outside to the inside on the side near the cover plate. The side of the bottom plate is provided with an inlet and an outlet that are respectively connected to the cooling chamber.

[0009] The GPU phase change liquid cooler also includes a sealing ring and a heat dissipation plate. The sealing ring is placed in the sealing groove, and the heat dissipation plate abuts against the sealing groove. The micro rib structure provided on the heat dissipation plate is located in the cooling chamber.

[0010] Furthermore, the GPU motherboard has a heat sink, a memory module, and a GPU core on the side near the base plate; the vertical projection of the micro rib structure completely covers the GPU core.

[0011] Furthermore, a solid thermal conductive medium layer is provided between the GPU core and the heat dissipation plate, wherein the solid thermal conductive medium is silicone grease, thermal tape, liquid metal, graphite or a pad; the heat dissipation tape may also be silicone grease, thermal tape or graphite.

[0012] Furthermore, the micro-rib structure consists of micro-ribs arranged in an array on the heat dissipation plate.

[0013] Furthermore, the micro-ribs are rectangular, parallelogram, or triangular in shape, and the dimension of any side of the micro-ribs is 100μm to 2000μm.

[0014] Furthermore, the surface of the micro-ribs is provided with a hydrophilic modification layer and / or a hydrophobic modification layer.

[0015] Furthermore, the micro-ribs can be solid columns, solid columns with a surface partially covered by a first porous medium layer, solid columns with a surface completely covered by a first porous medium layer, hybrid columns that are partly solid and partly porous, or porous columns that are entirely porous.

[0016] The pore size of the first porous medium ranges from 0.1 μm to 800 μm, and the pore size of the porous structure ranges from 0.1 μm to 800 μm.

[0017] Furthermore, the heat dissipation plate is covered with a second porous medium layer on the side near the base plate. The thickness of the second porous medium layer is 0.01 to 10 mm, the porosity of the second porous medium is 5% to 99%, and the pore size ranges from 0.1 μm to 800 μm.

[0018] Furthermore, the base plate and the heat dissipation plate are connected by welding, threading, or snap-fit.

[0019] Furthermore, the liquid outlet is located above the liquid inlet, and the liquid outlet and the liquid inlet are located on the same side or opposite sides.

[0020] Further, the height of the micro-rib structure is denoted as H1, and the height of the heat exchange cavity formed by the combination of the heat dissipation plate and the cooling chamber on the base plate is denoted as H2, with the ratio of H1 / H2 being 0 to 1.

[0021] Compared with the prior art, the present invention has the following advantages:

[0022] (1) This utility model combines phase change liquid cooling technology and micro rib structure to effectively improve heat conduction and heat dissipation efficiency. The design of the heat dissipation plate optimizes the contact area between the cooling medium and the GPU core, and further enhances the heat dissipation effect through hydrophilic or hydrophobic modified layers, adapting to different cooling needs and extending the service life of the GPU;

[0023] (2) All components of this utility model are fastened with screws to ensure a tight fit between the heat sink, GPU motherboard, cover plate, etc. In particular, the multiple fixing methods between the base plate and the heat sink ensure the overall strength and durability of the device during operation, and it is not easy to loosen or shift;

[0024] (3) This utility model uses high thermal conductivity materials such as copper, aluminum, and silicon carbide, which have good thermal conductivity. The selection of cooling working fluid is flexible and diverse (such as water, refrigerant, mineral oil, electronic fluorinated liquid, etc.) to meet the heat dissipation needs of different application scenarios.

[0025] (4) This utility model introduces a phase change, which greatly improves heat dissipation efficiency;

[0026] (5) This utility model is simple, easy to process and assemble. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0028] Figure 2 This is an exploded view of the structure of this utility model;

[0029] Figure 3 This is a schematic diagram of the structure of the bottom plate in this utility model;

[0030] Figure 4 This is a schematic diagram of the bottom plate flow channel distribution (four cases) in this utility model;

[0031] Figure 5 This is a schematic diagram of the sealing ring structure in this utility model;

[0032] Figure 6 This is a schematic diagram of the heat dissipation cold plate structure in this utility model;

[0033] Figure 7 A schematic diagram of the structure formed by the micro-ribbed column structure (left: square, middle: parallelogram, right: triangle);

[0034] Figure 8 This is a schematic diagram of a micro-ribbed column structure;

[0035] Figure 9 This is a schematic diagram of the GPU motherboard structure in this utility model;

[0036] Figure 10 This is a schematic diagram of the cover plate structure in this utility model;

[0037] Figure 11 This is a schematic diagram of the connection (welding) structure between the bottom plate and the heat dissipation plate in this utility model;

[0038] Figure 12 This is a cross-sectional view of the connection (welding) between the bottom plate and the heat dissipation plate in this utility model;

[0039] The diagram shows the following labels: 1-Base plate; 2-Sealing ring; 3-Cooling plate; 4-Fasting screw; 5-GPU motherboard; 6-Cover plate; 7-Counterhead screw; 11-First threaded hole; 12-Sealing groove; 13-Second threaded hole; 14-Cooling chamber; 15-Outlet; 16-Inlet; 21-First through hole; 31-First countersunk hole; 32-Inner wall of cooling plate; 33-Micro rib structure; 34-Outer wall of cooling plate; 331-Solid micro rib structure; 332-Hybrid micro rib structure; 333-Porous dielectric structure; 51-Second through hole; 52-Heat strip; 53-Memory module; 54-GPU core; 61-Second countersunk hole; 62-Circular boss. Detailed Implementation

[0040] The present invention will now be described in detail with reference to the accompanying drawings and specific embodiments. These embodiments are implemented based on the technical solution of the present invention, providing detailed implementation methods and specific operating procedures. However, the scope of protection of the present invention is not limited to the following embodiments.

[0041] A high-power GPU phase-change liquid cooling radiator includes a base plate 1, a GPU motherboard 5, and a cover plate 6 stacked in sequence.

[0042] The bottom plate 1 is provided with a sealing groove 12 and a cooling chamber 14 from the outside to the inside on the side near the cover plate 6. The side of the bottom plate 1 is provided with an inlet 16 and an outlet 15 that are respectively connected to the cooling chamber 14.

[0043] The GPU phase change liquid cooler also includes a sealing ring 2 and a heat dissipation plate 3. The sealing ring 2 is placed in the sealing groove 12, and the heat dissipation plate 3 abuts against the sealing groove 12. The micro rib structure 33 provided on the heat dissipation plate 3 is located in the cooling chamber 14.

[0044] In some embodiments of this utility model, the GPU motherboard 5 is provided with a heat dissipation strip 52, a video memory module 53, and a GPU core 54 on the side near the base plate 1; the vertical projection of the micro rib structure 33 completely covers the GPU core 54. That is, the width of the coverage area of ​​the micro rib structure is greater than or equal to the width of the integrated heat sink area of ​​the CPU.

[0045] In some embodiments of this utility model, a solid thermal conductive medium layer is provided between the GPU core 54 and the heat dissipation plate 3. The solid thermal conductive medium is silicone grease, thermal tape, liquid metal, graphite or a gasket; the heat dissipation tape 53 can also be silicone grease, thermal tape or graphite.

[0046] In some embodiments of this utility model, the micro-rib structure 33 is composed of micro-ribs arranged in an array on the heat dissipation plate 3.

[0047] In some embodiments of this utility model, the micro ribs are rectangular, parallelogram, or triangular in shape, and the dimension of any side of the micro ribs is 100μm to 2000μm.

[0048] Furthermore, the planar projection feature of the micro-rib structure is an arbitrary polygon formed by the interlacing of multiple sets of parallel lines with the same spacing but different angles; the gap width of the micro-rib structure depends on the line width of the parallel lines in the parallel line sets, and the side length of the micro-rib structure depends on the spacing of the parallel lines in the parallel line sets; this utility model does not limit the shape of the micro-rib structure, and the shape of the micro-rib structure depends on the number of parallel line sets and the relative angle between the parallel line sets. For example, when the spacing of two sets of parallel line sets is the same and the relative angle is 90°, a square rib with an arbitrary spin angle can be formed.

[0049] In some embodiments of this invention, the surface of the micro-ribs is provided with a hydrophilic modification layer and / or a hydrophobic modification layer. Hydrophilic / hydrophobic modification of the micro-rib structure surface can further increase the boiling rate of the working fluid and improve heat removal efficiency. The choice of hydrophilic / hydrophobic modification for the micro-rib structure is based on the heat flux density under specific operating conditions: hydrophobic modification has a better heat transfer effect at low heat flux densities, while hydrophilic modification has a better heat transfer effect at high heat flux densities. This is because, generally speaking, a hydrophilic surface yields a larger heat transfer coefficient at high heat flux densities, while a hydrophobic surface yields a larger heat transfer coefficient at low heat flux densities.

[0050] In some embodiments of this utility model, the micro-ribs are solid columns, solid columns with a surface portion covered by a first porous medium layer, solid columns with a surface completely covered by a first porous medium layer, hybrid columns that are partly solid and partly porous, and porous columns that are entirely porous.

[0051] The pore size of the first porous medium ranges from 0.1 μm to 800 μm, and the pore size of the porous structure ranges from 0.1 μm to 800 μm.

[0052] Specifically, the micro-rib hybrid structure can be understood as a solid metal structure with the lower part of the micro-ribs machined by means of machining, and a porous structure with the upper part machined by means of metal sintering, etc.; the porous medium structure can be understood as a porous metal structure with all micro-ribs machined by metal sintering, or a solid metal structure machined inside and a porous metal structure covered outside.

[0053] In some embodiments of this utility model, the heat dissipation plate 3 is covered with a second porous medium layer on the side near the base plate 1. The thickness of the second porous medium layer is 0.01 to 10 mm, the porosity of the second porous medium is 5% to 99%, the pore size ranges from 0.1 μm to 800 μm, and the thickness at different positions or regions is adjusted differently according to design requirements.

[0054] In some embodiments of this utility model, the base plate 1 and the heat dissipation plate 3 are connected by welding, threading, or snap-fit.

[0055] In some embodiments of this utility model, the liquid outlet 15 is located above the liquid inlet 16, and the liquid outlet 15 and the liquid inlet 16 are located on the same side or opposite sides.

[0056] In some embodiments of this utility model, the height of the micro rib structure 33 is denoted as H1, and the height of the heat exchange cavity formed by the combination of the heat dissipation plate 3 and the cooling chamber 14 on the base plate 1 is denoted as H2. The ratio of H1 / H2 is 0 to 1. When the ratio is 0, the upper surface of the micro rib structure can be in contact with the bottom surface of the cooling chamber.

[0057] In some embodiments of this utility model, the base plate is made of copper, aluminum, aluminum alloy, stainless steel, aluminum nitride, silicon carbide, gallium nitride, plastic, or silicon.

[0058] In some embodiments of this utility model, the heat dissipation plate is made of copper, aluminum, aluminum alloy, stainless steel, aluminum nitride, silicon carbide, gallium nitride, plastic, or silicon.

[0059] In some embodiments of this utility model, the cover plate is made of acrylic, metal or plastic; the sealing ring is made of fluororubber, rubber or plastic.

[0060] In some embodiments of this utility model, the material of the micro-rib structure is selected from one of solid copper, powdered copper, silver, aluminum, stainless steel or graphene-reinforced metal composite materials.

[0061] In some embodiments of this utility model, the thermally conductive material between the GPU core and the outer wall of the cold plate is silicone grease, thermal tape, liquid metal, graphite, or a gasket; the thermal tape can also be silicone grease, thermal tape, or graphite.

[0062] In some embodiments of this utility model, the cooling medium introduced into the heat dissipation device during use includes water, alcohols, ammonia, hydrocarbons, refrigerants, mineral oil, nanofluids, transformer oil, or electronic fluorinated liquid.

[0063] Example 1

[0064] like Figures 1-10 As shown, this embodiment provides a high-power GPU phase change liquid cooling radiator, which includes a base plate 1, a sealing ring 2, a heat dissipation plate 3, a GPU motherboard 5, and a cover plate 6. The sealing ring 2 is pressed between the base plate 1 and the GPU motherboard, and the GPU motherboard 5 is pressed between the heat dissipation plate 3 and the cover plate 6.

[0065] The base plate 1 is characterized by a first threaded hole 11, a sealing groove 12, a second threaded hole 13, a cooling chamber 14, a liquid outlet 15, and a liquid inlet 16. Several first threaded holes 11 are distributed around the base plate 1 and in the center. A cooling chamber 14 is formed in the lower middle part of the base plate 1. A sealing groove 12 is formed in the upper part of the cooling chamber 14, and several second threaded holes 13 are distributed around it. A liquid outlet 15 and a liquid inlet 16 are formed on the side near the cooling chamber 14. The liquid outlet 15 and the liquid inlet 16 are connected to the cooling chamber 14. The size of the cooling chamber 14 can be any size smaller than the outer contour size of the base plate 1.

[0066] The sealing ring 2 has several first through holes 21 around its perimeter;

[0067] The heat dissipation plate 3 includes a first countersunk hole 31, an inner wall 32, a micro rib structure 33, and an outer wall 34. Several first countersunk holes 31 are distributed around the heat dissipation plate 3, and the micro rib structure 33 is disposed on the inner wall 32 of the plate.

[0068] The GPU motherboard 5 includes a second through hole 51, a heat sink 52, a video memory module 53, and a GPU core 54. Several second through holes 51 are formed on the GPU motherboard 5. The positions of the heat sink 52, the video memory module 53, and the GPU core 54 are distributed on the GPU motherboard 5. A heat sink 52 is attached directly above the video memory module 53.

[0069] The cover plate 6 is characterized in that a plurality of second countersunk holes 61 and circular bosses 62 are distributed on the cover plate 6, the countersunk surface of the second countersunk holes 61 is directly opposite the circular bosses 62, and the through hole size of the second countersunk holes 61 is smaller than the size of the circular bosses 62.

[0070] The sealing ring 2 is installed in the sealing groove 12 and all the first through holes 21 are aligned with the corresponding second threaded holes 13. The heat dissipation plate 3 is firmly installed on the base plate 1 by fastening screws 4 passing through the first countersunk holes 31, ensuring good sealing between the heat dissipation plate 3 and the base plate 1.

[0071] When installing the GPU motherboard 5, it is necessary to ensure that the surface of the GPU core 54 is properly bonded to the outer wall 34 of the cold plate after being coated with thermal conductive material, and at the same time ensure that the heat dissipation strip 53 is properly bonded to the memory module 53 and the base plate 1.

[0072] The cover plate 6 is installed on the outermost side of the entire device by passing through the second countersunk hole 61, the second through hole 51 and the first threaded hole 11 with countersunk screws 7, ensuring that the circular boss 62 fits perfectly with the GPU motherboard 5 during installation.

[0073] The thermal conductive material between the GPU core 54 and the outer wall of the cold plate 34 is silicone grease, thermal tape, liquid metal, or graphite thermal pad.

[0074] The heat dissipation strip 53 can also be made of silicone grease, graphite thermal pads, thermal tape, or graphite. The choice of different thermally conductive materials allows this heat dissipation device to adapt to different application scenarios, providing a flexible heat dissipation solution.

[0075] like Figure 4 As shown, the liquid inlet 16 in the base plate 1 is always located below the liquid outlet 15 during the entire installation and use of the radiator. The liquid inlet 16 and the liquid outlet 15 are located on the same side or opposite sides. It can be understood that when the radiator is in operation, the liquid inlet 16 is always below the liquid outlet 15 along the direction of gravity of the working fluid.

[0076] The heat dissipation plate 3 is provided with a micro rib structure 33, the coverage area of ​​which is rectangular. The length of the coverage area of ​​the micro rib structure 33 is greater than or equal to the length of the integrated heat dissipation top cover area of ​​the GPU core 54, and the width of the coverage area of ​​the micro rib structure 33 is also greater than or equal to the length of the coverage area of ​​the integrated heat dissipation top cover area of ​​the GPU core 54.

[0077] The microrib structure 33 has a natural surface, a hydrophilic modification layer, and / or a hydrophobic modification layer on its surface. Hydrophilic / hydrophobic modification of the microrib structure surface can further increase the boiling rate of the working fluid and improve heat removal efficiency. The choice of hydrophilic / hydrophobic modification for the microrib structure is based on the heat flux density under specific operating conditions: hydrophobic modification has a better heat transfer effect at low heat flux densities, while hydrophilic modification has a better heat transfer effect at high heat flux densities. This is because, generally speaking, a hydrophilic surface yields a larger heat transfer coefficient at high heat flux densities, while a hydrophobic surface yields a larger heat transfer coefficient at low heat flux densities.

[0078] like Figure 7 As shown, the planar projection feature of the micro-rib structure 33 is an arbitrary polygon formed by the interlacing of multiple sets of parallel lines with the same spacing but different angles; the gap width of the micro-rib structure 33 depends on the line width of the parallel lines in the parallel line sets, and the side length of the micro-rib structure 33 depends on the spacing of the parallel lines in the parallel line sets; the present invention does not limit the shape of the micro-rib structure 33, and the shape of the micro-rib structure 33 depends on the number of parallel line sets and the relative angle between the parallel line sets. For example, when the spacing of two sets of parallel line sets L1 and L2 is the same and the relative angle is 90°, a square rib with an arbitrary spin angle can be formed.

[0079] like Figure 7 As shown, the size of the gap b in the micro-rib structure is 100μm to 2000μm, and the size of the side length a of the micro-rib structure is 100μm to 2000μm.

[0080] The micro-rib structure 33 can be a solid micro-rib structure 331, a micro-rib hybrid structure 332, or a porous medium structure 333.

[0081] When the micro-rib structure 33 is a micro-rib hybrid structure, the porous medium covers the surface of the solid structure, with a surface coverage of 0 to 100%. The position and thickness of different regions can be adjusted according to the actual situation. The pore size range of the porous medium is 0.1 μm to 800 μm.

[0082] The inner wall 32 of the cold plate can be covered with a porous medium layer with a thickness of 0.01 to 10 mm, a porosity of 5% to 99%, and a pore size range of 0.1 μm to 800 μm. The thickness of the porous medium in different positions or regions can be adjusted according to design requirements.

[0083] The ratio of the height of the micro-rib structure 33 to the height of the heat exchange cavity formed by the combination of the inner wall of the cold plate 32 and the cooling chamber 14 on the bottom plate 1 is 0 to 1. When the ratio is 1, the upper end face of the micro-rib structure 33 can fit against the bottom face of the cooling chamber 14.

[0084] The base plate 1 is made of copper, aluminum, aluminum alloy, stainless steel, aluminum nitride, silicon carbide, gallium nitride, plastic, or silicon.

[0085] The heat dissipation plate 3 is made of copper, aluminum, aluminum alloy, stainless steel, aluminum nitride, silicon carbide, gallium nitride, plastic or silicon.

[0086] The cover plate 6 is made of acrylic, glass, metal or plastic;

[0087] The sealing ring is made of fluororubber, rubber, or plastic;

[0088] The material of the microrib structure 33 is selected from one of solid copper, powdered copper, silver, aluminum, stainless steel, or graphene-reinforced metal composite materials, for example, such as... Figure 8 The micro-rib structure 33 shown can be processed into a solid micro-rib structure 331, a hybrid micro-rib structure 332, or a porous media structure 333 as needed. The hybrid micro-rib structure 332 can be understood as a solid metal structure where the lower part of the micro-rib 33 is machined, and the upper part is a porous structure processed by metal sintering or other methods. The porous media structure 333 can be understood as a porous metal structure where all the micro-ribs 33 are machined, or where the interior is a machined solid metal structure and the exterior is a covered porous metal structure. Solid metal structures, due to their high thermal conductivity and stability, can quickly and effectively conduct heat, ensuring uniform heat dissipation and mechanical strength of the radiator, making them suitable for demanding heat dissipation applications. Sintered powder metal, on the other hand, utilizes its porous structure to increase surface area, improve heat exchange efficiency, and aids in the flow of the cooling medium through capillary effect, making it suitable for complex geometries and weight-sensitive designs, enhancing overall heat dissipation performance. Combining solid metal and sintered powder metal can leverage their respective advantages to improve heat dissipation performance. Solid metal provides rapid thermal conductivity and a stable structure, while sintered powder metal increases heat dissipation area through its porous structure, promoting coolant circulation. The combination of the two enables faster and more uniform heat dissipation, suitable for the cooling needs of high-performance equipment.

[0089] The inner wall 32 of the cold plate is a solid metal structure or a sintered metal structure.

[0090] The thermal conductive material between the GPU core 54 and the outer wall 34 of the cold plate is thermal grease, thermal tape, liquid metal, or graphite thermal pad; the heat dissipation tape 53 can also be thermal grease, thermal tape, or graphite thermal pad.

[0091] The cooling medium introduced into the heat dissipation device during use includes water, alcohols, ammonia, hydrocarbons, refrigerants, mineral oil, nanofluids, transformer oil, or electronic fluorinated liquid.

[0092] Working principle: First, the heat sink 3 is installed on the base plate 1 using fastening screws 4. During installation, the sealing ring 2 needs to be installed between the heat sink 3 and the base plate 1, and the airtightness of the device is checked through the inlet 16 and outlet. After completion, thermally conductive material is applied to the GPU core 54 and memory module 53. Then, the base plate 1, sealing ring 2, heat sink 3, GPU motherboard 5, and cover plate 6 are connected into a whole using countersunk screws 7. The liquid working fluid enters the cooling chamber 14 through the inlet 16 and fully combines with the micro-rib structure 33, carrying away the cooling fluid conducted from the GPU core 54 to the micro-rib structure 33. During the heat transfer process, the cooling fluid reaches its boiling point and changes to a gaseous state, and is then discharged from the heat dissipation device through the outlet 15.

[0093] Example 2

[0094] See Figures 1-12 This embodiment provides a high-density GPU phase-change liquid cooling radiator, including a base plate 1, a sealing ring 2, a heat dissipation plate 3, a GPU motherboard 5, and a cover plate 6. The sealing ring 2 is pressed between the base plate 1 and the GPU motherboard, and the GPU motherboard 5 is pressed between the heat dissipation plate 3 and the cover plate 6. The base plate 1 and the heat dissipation plate 3 can be connected by welding instead of threads, see [link to documentation]. Figure 11-12 When the base plate 1 and the heat dissipation plate 3 are connected by welding, the entire structure will no longer contain the three structures of fastening screw 4, second threaded hole 13 and first through hole 3, and the sealing groove 12 and the inner wall 32 of the cold plate are coated with solder.

[0095] Welding (such as brazing) provides better sealing than threaded connections, effectively preventing coolant leakage, improving heat dissipation efficiency, reducing thermal resistance, and ensuring efficient heat transfer. Welded structures are more robust and have a stronger ability to withstand mechanical and thermal stresses, preventing loosening and failure during long-term use. They also allow for a more compact design of the cold head, reducing maintenance requirements and thus improving the overall system reliability.

[0096] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model in any other way. Any person skilled in the art may make changes or modifications to the above-disclosed technical content to create equivalent embodiments. However, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of this utility model without departing from its technical solution shall still fall within the protection scope of this utility model.

Claims

1. A high-power GPU phase-change liquid cooling heatsink, characterized in that, It includes a base plate (1), a GPU motherboard (5), and a cover plate (6) stacked in sequence. The bottom plate (1) has a sealing groove (12) and a cooling chamber (14) arranged sequentially from the outside to the inside on the side near the cover plate (6). The bottom plate (1) has an inlet (16) and an outlet (15) that are respectively connected to the cooling chamber (14). The GPU phase change liquid cooler also includes a sealing ring (2) and a heat dissipation plate (3). The sealing ring (2) is placed in the sealing groove (12), and the heat dissipation plate (3) abuts against the sealing groove (12). The micro rib structure (33) provided on the heat dissipation plate (3) is located in the cooling chamber (14).

2. The high-power GPU phase-change liquid cooling radiator according to claim 1, characterized in that, The GPU motherboard (5) has a heat sink (52), a memory module (53) and a GPU core (54) on the side near the base plate (1); the vertical projection of the micro rib structure (33) completely covers the GPU core (54).

3. A high-power GPU phase-change liquid cooling radiator according to claim 2, characterized in that, A solid thermal conductive medium layer is present between the GPU core (54) and the heat dissipation plate (3).

4. A high-power GPU phase-change liquid cooler according to claim 1, characterized in that, The micro rib structure (33) is composed of micro ribs arranged in an array on the heat dissipation plate (3); the shape of the micro ribs is rectangular, parallelogram or triangular, and the dimension of any side of the micro ribs is 100μm~2000μm.

5. A high-power GPU phase-change liquid cooling radiator according to claim 4, characterized in that, The surface of the microribs is provided with a hydrophilic modification layer and / or a hydrophobic modification layer.

6. A high-power GPU phase-change liquid cooling radiator according to claim 4, characterized in that, The micro-ribs can be solid columns, solid columns with a surface partially covered by a first porous medium layer, solid columns with a surface completely covered by the first porous medium layer, hybrid columns that are partially solid and partially porous, or porous columns that are entirely porous.

7. A high-power GPU phase-change liquid cooling radiator according to claim 1, characterized in that, The heat dissipation plate (3) is covered with a second porous medium layer on the side near the base plate (1). The thickness of the second porous medium layer is 0.01~10mm, the porosity of the second porous medium is 5%~99%, and the pore size range is 0.1μm~800μm.

8. A high-power GPU phase-change liquid cooler according to claim 1, characterized in that, The base plate (1) is connected to the heat dissipation plate (3) by welding, threading, or snap-fit.

9. A high-power GPU phase-change liquid cooling radiator according to claim 1, characterized in that, The outlet (15) is located below the inlet (16) along the direction of gravity, and the outlet (15) and the inlet (16) are located on the same side or opposite sides.

10. A high-power GPU phase-change liquid cooling radiator according to claim 1, characterized in that, The height of the micro-rib structure (33) is denoted as H1, and the height of the heat exchange cavity formed by the combination of the heat dissipation plate (3) and the cooling chamber (14) on the base plate (1) is denoted as H2. The ratio of H1 / H2 is 0~1.

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