Double-layer uniform-temperature liquid cooling plate

Abstract

The utility model belongs to the technical field of liquid cooling plates, and discloses a double-layer uniform-temperature liquid cooling plate, which comprises a liquid cooling plate body, the liquid cooling plate body is formed by laminating a substrate, an upper cover plate and a lower cover plate, and a plurality of upper runner guide plates distributed at equal intervals are arranged on the upper surface of the substrate. The S-shaped upper cooling channels are arranged on the upper surface of the base plate, the S-shaped lower cooling channels are arranged on the lower surface of the base plate, the design of space staggered distribution and vertical flow direction cross flow is adopted, a three-dimensional net-shaped heat exchange path is formed, the structural design breaks through the existing temperature gradient of a traditional single-layer flow channel, and the heat exchange efficiency is improved. The cold and hot areas are complementary and offset in space, the controllable temperature of the surface of the liquid cooling plate is reduced, and the problem of cell aging caused by position temperature difference in the battery pack is solved; the flow direction of the cooling liquid of the upper cooling channel and the flow direction of the cooling liquid of the lower cooling channel are designed to be crossed and perpendicular, so that the cooling liquid forms a turbulence enhancement effect in the substrate, and thermal resistance of a boundary layer is destroyed.

Description

Technical Field

[0001] This utility model relates to the field of liquid cooling plate technology, and in particular to a double-layer uniform temperature liquid cooling plate. Background Technology

[0002] A liquid cooling plate is a metal heat-conducting device that guides the flow of coolant through internal channels and utilizes the properties of liquid's large specific heat capacity and high thermal conductivity to achieve uniform heat dissipation from heat sources (such as batteries and chips).

[0003] Existing liquid cooling plates mostly use a single-layer serpentine flow channel, with the coolant flowing in a single direction, resulting in a significant temperature difference between the upstream and downstream sides of the liquid cooling plate (often reaching 5–8℃). The cells in the battery pack experience temperature differences due to their different locations, which accelerates aging. Although a double-layer flow channel design exists, it usually uses unidirectional flow, resulting in low heat exchange efficiency and poor temperature uniformity. Summary of the Invention

[0004] To overcome the technical defects of the existing technology, this utility model provides a double-layer uniform temperature liquid cooling plate.

[0005] The technical solution adopted by this utility model is: a double-layer uniform temperature liquid cooling plate, including a liquid cooling plate body, which is composed of a substrate, an upper cover plate, and a lower cover plate stacked together. The upper surface of the substrate is provided with multiple equally spaced upper flow channel guide plates, forming an S-shaped upper cooling channel between adjacent upper flow channel guide plates. One end of the liquid cooling plate body is provided with an upper inlet nozzle and an upper outlet nozzle. The upper inlet nozzle is connected to the liquid inlet of the upper cooling channel, and the upper outlet nozzle is connected to the liquid outlet of the upper cooling channel. The lower surface of the substrate is provided with multiple equally spaced upper flow channel guide plates. The lower cooling channel is provided with distributed guide plates, and an S-shaped lower cooling channel is formed between two adjacent lower cooling channel guide plates. The lower part of one end of the liquid cooling plate body is provided with a lower inlet nozzle and a lower outlet nozzle. The lower inlet nozzle is connected to the liquid inlet of the lower cooling channel, and the lower outlet nozzle is connected to the liquid outlet of the lower cooling channel. The upper cooling channel and the lower cooling channel are spatially staggered. The coolant in the upper cooling channel flows from one side of the liquid cooling plate body to the other side, and the coolant in the lower cooling channel flows in a cross flow perpendicular to the coolant in the upper cooling channel.

[0006] Preferably, the inlet of the upper cooling channel and the outlet of the lower cooling channel are arranged to overlap on the projection plane.

[0007] Preferably, the distance between the upper flow channel guide plate and the lower flow channel guide plate is set to 10-15mm.

[0008] Preferably, the height of the upper flow channel guide plate and the lower flow channel guide plate is 0.8-1.2 times the thickness of the substrate.

[0009] Preferably, the upper cover plate is sealed to the upper surface of the substrate by laser welding, and the lower cover plate is sealed to the lower surface of the substrate by laser welding.

[0010] Preferably, the liquid cooling plate body has mounting and positioning holes at all four corners.

[0011] The beneficial effects of this utility model are as follows: By providing an S-shaped upper cooling channel on the upper surface of the substrate and an S-shaped lower cooling channel on the lower surface of the substrate, and adopting a spatially staggered distribution and vertical flow cross-flow design, a three-dimensional mesh heat exchange path is formed. This structural design breaks the existing temperature gradient of the traditional single-layer flow channel, so that the hot and cold areas complement and cancel each other in space, reducing the controllable temperature of the liquid cooling plate surface and solving the problem of cell aging caused by positional temperature difference in the battery pack. The cross-vertical design of the coolant flow direction of the upper cooling channel and the coolant flow direction of the lower cooling channel creates a turbulence enhancement effect in the coolant inside the substrate, which destroys the boundary layer thermal resistance. Attached Figure Description

[0012] One or more embodiments are illustrated by way of example with reference numerals in the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Elements with the same reference numerals in the drawings are denoted as similar elements. Unless otherwise stated, the figures in the drawings are not to be limited by scale.

[0013] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0014] Figure 2 This is a blasted cross-sectional view of the overall structure of this utility model;

[0015] Figure 3 This is a bottom view of the substrate structure of this utility model.

[0016] Explanation of reference numerals in the attached figures: 1. Liquid cooling plate body; 101. Substrate; 102. Upper cover plate; 103. Lower cover plate; 2. Upper flow channel guide plate; 3. Upper cooling channel; 4. Upper inlet nozzle; 5. Upper outlet nozzle; 6. Lower flow channel guide plate; 7. Lower cooling channel; 8. Lower inlet nozzle; 9. Lower outlet nozzle; 10. Mounting positioning hole. Detailed Implementation

[0017] To make the objectives, technical solutions, and advantages of this utility model clearer, the various embodiments of this utility model will be described in detail below with reference to the accompanying drawings. However, those skilled in the art will understand that many technical details have been provided in the various embodiments of this utility model to facilitate a better understanding of this application. However, the technical solutions claimed in the claims of this application can be implemented even without these technical details and with various variations and modifications based on the following embodiments.

[0018] like Figures 1-3 As shown, this embodiment provides a double-layer homogeneous liquid cooling plate, including a liquid cooling plate body 1. The liquid cooling plate body 1 is composed of a substrate 101, an upper cover plate 102, and a lower cover plate 103 stacked together. The upper surface of the substrate 101 is provided with multiple equally spaced upper flow channel guide plates 2. An S-shaped upper cooling channel 3 is formed between two adjacent upper flow channel guide plates 2. An upper inlet nozzle 4 and an upper outlet nozzle 5 are provided at the upper middle part of one end of the liquid cooling plate body 1. The upper inlet nozzle 4 and the liquid inlet of the upper cooling channel 3 are connected. The upper outlet nozzle 5 is connected to the liquid outlet of the upper cooling channel 3; the lower surface of the substrate 101 is provided with multiple equally spaced lower flow channel guide plates 6, and an S-shaped lower cooling channel 7 is formed between two adjacent lower flow channel guide plates 6; a lower inlet nozzle 8 and a lower outlet nozzle 9 are provided at the lower middle part of one end of the liquid cooling plate body 1, the lower inlet nozzle 8 is connected to the liquid inlet of the lower cooling channel 7, and the lower outlet nozzle 9 is connected to the liquid outlet of the lower cooling channel 7; the upper cooling channel 3 and the lower cooling channel 7 are connected to the liquid outlet of the upper cooling channel 3. The channels 7 are arranged in a spatially staggered pattern. The coolant in the upper cooling channel 3 flows from one side of the liquid cooling plate body 1 to the other side, while the coolant in the lower cooling channel 7 flows perpendicular to the coolant in the upper cooling channel 3. The dual-channel independent inlet and outlet design allows for flexible connection to parallel or series liquid cooling plates to meet different heat dissipation power requirements. When the coolant in the upper cooling channel 3 flows from left to right, the coolant in the lower cooling channel 7 flows from front to back. The two form a heat exchange network in the thickness direction of the substrate 101. Any local area of ​​the substrate 101 simultaneously contacts the transverse and longitudinal flow channels, avoiding the "heat zone superposition" caused by traditional unidirectional flow and eliminating high-temperature dead zones from the root. Compared with straight flow channels, the S-shaped channel design extends the coolant residence time and induces vortices through continuous bends, improving the convective heat transfer coefficient. The equally spaced upper flow channel guide plate 2 and lower flow channel guide plate 6 design ensures uniform flow distribution and avoids local overheating caused by flow deviation.

[0019] The inlet of the upper cooling channel 3 and the outlet of the lower cooling channel 7 are arranged to overlap on the projection surface, realizing direct thermal compensation between the low temperature zone at the inlet and the high temperature zone at the outlet, and further improving the overall heat exchange uniformity.

[0020] The distance between the upper flow channel guide plate 2 and the lower flow channel guide plate 6 is set to 10-15mm, which maximizes the heat exchange area while ensuring reasonable flow resistance.

[0021] The height of the upper flow channel guide plate 2 and the lower flow channel guide plate 6 is 0.8-1.2 times the thickness of the substrate 101, to ensure the strength of the flow channel structure and maintain the stability of the coolant flow rate.

[0022] The upper cover plate 102 is sealed to the upper surface of the substrate 101 by laser welding, and the lower cover plate 103 is sealed to the lower surface of the substrate 101 by laser welding, thus avoiding the risk of leakage and making it suitable for high vibration conditions.

[0023] The liquid cooling plate body 1 has mounting and positioning holes 10 at all four corners, which supports modular and rapid assembly.

[0024] Furthermore, any content not described in detail in this specification is existing technology known to those skilled in the art.

[0025] During operation, when the liquid cooling plate is placed at the bottom of the battery pack, high-temperature coolant is injected from the upper inlet nozzle 4 and flows from left to right along the S-shaped upper cooling channel 3, while low-temperature coolant is injected from the lower inlet nozzle 8 and flows from front to back along the S-shaped lower cooling channel 7. In the interlacing area in the middle of the substrate 101, the upper high-temperature liquid and the lower low-temperature liquid flow in opposite directions, achieving rapid heat conduction through the substrate 101. The dual-channel independent inlet and outlet design allows for flexible connection of parallel or series liquid cooling plates to meet different heat dissipation power requirements. When the coolant inside the upper cooling channel 3 flows from left to right, the lower cooling channel... The coolant inside channel 7 flows from front to back, and the two form a heat exchange network in the thickness direction of substrate 101. Any local area of ​​substrate 101 is in contact with both the transverse and longitudinal flow channels at the same time, avoiding the "heat zone superposition" caused by traditional unidirectional flow and eliminating high temperature dead zones from the root. Compared with straight flow channels, the S-shaped channel design extends the residence time of coolant and induces vortices through continuous bends, thereby improving the convective heat transfer coefficient. The design of the equally spaced upper flow channel guide plate 2 and lower flow channel guide plate 6 ensures the uniformity of flow distribution and avoids local overheating caused by flow deviation.

[0026] Those skilled in the art will understand that the above embodiments are specific examples of implementing the present invention, and in practical applications, various changes can be made to them in form and detail without departing from the spirit and scope of the present invention.

Claims

1. A double-layer uniform temperature liquid cooling plate, comprising a liquid cooling plate body (1), wherein the liquid cooling plate body (1) is composed of a substrate (101), an upper cover plate (102) and a lower cover plate (103) stacked together, characterized in that: The upper surface of the substrate (101) is provided with multiple equally spaced upper flow channel guide plates (2), and an S-shaped upper cooling channel (3) is formed between two adjacent upper flow channel guide plates (2). The upper part of one end of the liquid cooling plate body (1) is provided with an upper inlet nozzle (4) and an upper outlet nozzle (5). The upper inlet nozzle (4) is connected to the liquid inlet of the upper cooling channel (3), and the upper outlet nozzle (5) is connected to the liquid outlet of the upper cooling channel (3). The lower surface of the substrate (101) is provided with multiple equally spaced lower flow channel guide plates (6), and an S-shaped upper flow channel guide plate (6) is formed between two adjacent lower flow channel guide plates (6). The lower cooling channel (7) has a lower inlet nozzle (8) and a lower outlet nozzle (9) at the lower middle part of one end of the liquid cooling plate body (1). The lower inlet nozzle (8) is connected to the liquid inlet of the lower cooling channel (7), and the lower outlet nozzle (9) is connected to the liquid outlet of the lower cooling channel (7). The upper cooling channel (3) and the lower cooling channel (7) are arranged in a spatially staggered manner. The coolant in the upper cooling channel (3) flows from one side of the liquid cooling plate body (1) to the other side, and the coolant in the lower cooling channel (7) flows in a cross-flow perpendicular to the coolant in the upper cooling channel (3).

2. The double-layer uniform temperature liquid cooling plate according to claim 1, characterized in that: The inlet of the upper cooling channel (3) and the outlet of the lower cooling channel (7) are arranged to overlap on the projection plane.

3. The double-layer uniform temperature liquid cooling plate according to claim 1, characterized in that: The distance between the upper flow channel guide plate (2) and the lower flow channel guide plate (6) is set to 10-15mm.

4. The double-layer uniform temperature liquid cooling plate according to claim 1, characterized in that: The height of the upper flow channel guide plate (2) and the lower flow channel guide plate (6) is 0.8-1.2 times the thickness of the substrate (101).

5. A double-layer uniform temperature liquid cooling plate according to claim 1, characterized in that: The upper cover plate (102) and the upper surface of the substrate (101) are sealed by laser welding, and the lower cover plate (103) and the lower surface of the substrate (101) are sealed by laser welding.

6. The double-layer uniform temperature liquid cooling plate according to claim 1, characterized in that: The liquid cooling plate body (1) is provided with mounting and positioning holes (10) at all four corners.

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