Military Ethernet switch shell structure based on tsn chip

Abstract

The utility model discloses a military Ethernet switch shell structure based on a tsn chip, which belongs to the technical field of Ethernet switches, and comprises a shell with an open top surface, a switch assembly is fixedly arranged in the shell, a heat dissipation block is fixedly arranged on the top surface of the switch assembly, and the heat dissipation block is fixedly arranged on the top surface of the switch assembly. And the top surface of the heat dissipation block is fixedly connected with a plurality of heat dissipation fins extending to the upper part of the shell. According to the military Ethernet switch shell structure based on the tsn chip, heat dissipation of the heat dissipation fins is achieved through the ventilation holes when the top cover is not opened, at the moment, the top cover provides protection for the heat dissipation fins, photovoltaic power supply to the switch assembly is achieved through the photovoltaic cell panel when the top cover is opened, at the moment, the heat dissipation effect of the heat dissipation fins is improved by opening the top cover, and the heat dissipation effect of the heat dissipation fins is improved. Compared with an existing device, the problem of poor stability is solved, and the adaptability to complex and severe environments is improved.

Description

Technical Field

[0001] This utility model belongs to the field of Ethernet switch technology, and in particular relates to a housing structure for a military Ethernet switch based on a TSN chip. Background Technology

[0002] Time-Sensitive Networking (TSN) is a deterministic networking technology that integrates different application domains and is a unified international standardized deterministic technology. As an emerging deterministic networking technology, TSN technology, as a set of protocols located at the data link layer in time-sensitive networking, changes the uncertainty of Ethernet from the underlying architecture, transforming it into a deterministic network and triggering a self-iteration of Ethernet itself.

[0003] Existing Ethernet switches based on TSN chips suffer from poor stability in complex and harsh environments, resulting in suboptimal performance in military applications. Most existing Ethernet switches fall into two categories: active cooling and passive cooling. Active cooling solutions are prone to damage when subjected to impacts, while passive cooling solutions, due to the need to protect the heatsink fins, suffer from inadequate heat dissipation as they rely solely on airflow through ventilation holes in high-temperature, low-wind-speed environments.

[0004] To address these issues, we propose a military Ethernet switch housing structure based on a TSN chip. Utility Model Content

[0005] The purpose of this invention is to solve the problem of poor stability in complex and harsh environments in the prior art, and to propose a military Ethernet switch housing structure based on a TSN chip.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] A military Ethernet switch housing structure based on a TSN chip includes an open-top shell, a switch assembly fixedly installed inside the shell, a heat sink fixedly installed on the top surface of the switch assembly, and multiple heat sink fins extending to the top of the shell fixedly connected to the top surface of the heat sink.

[0008] A top cover is hinged to one side of the top surface of the outer shell. A photovoltaic panel is fixedly installed on the inner top wall of the top cover, and the photovoltaic panel is electrically connected to the switch assembly through wires. Multiple ventilation holes for heat dissipation fins are opened on both sides of the top cover.

[0009] Preferably, the inner side of the top surface of the outer casing has a flange extending downward, the top surface of the heat sink has a sealing ring inserted between the flange and the inner wall of the outer casing, and a sealing ring is provided between the sealing ring and the inner top wall of the outer casing.

[0010] Preferably, the airflow direction of the ventilation holes is parallel to the heat dissipation fins.

[0011] Preferably, the heat dissipation fins are located in the center of the ventilation holes.

[0012] Preferably, a support rod is rotatably provided on the side of the top cover facing away from the hinge, and an adjusting rod is threadedly fitted on the end of the support rod away from the rotating end, and a support plate is fixedly connected to the end of the adjusting rod away from the support rod.

[0013] Preferably, a locking frame that matches the support plate is fixedly connected to the side of the outer casing below the support rod.

[0014] In summary, the technical effects and advantages of this utility model are as follows: This military Ethernet switch housing structure based on the TSN chip allows for heat dissipation of the heat sink fins when the top cover is closed via ventilation holes, while the top cover provides protection for the heat sink fins. When the top cover is open, photovoltaic power is supplied to the switch components via a photovoltaic panel, which improves the heat dissipation effect of the heat sink fins. Compared with existing devices, this design avoids the problem of poor stability and improves adaptability to complex and harsh environments. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of this utility model;

[0016] Figure 2 This is a schematic diagram of the structure of the present invention with the top cover open;

[0017] Figure 3 This is a cross-sectional front view of the present invention.

[0018] In the diagram: 1. Outer shell; 2. Switch assembly; 3. Heat sink; 4. Heat sink fins; 5. Top cover; 6. Photovoltaic panel; 7. Wire; 8. Ventilation hole; 9. Flange; 10. Sealing ring; 11. Sealing ring; 12. Support rod; 13. Adjusting rod; 14. Support plate; 15. Locking bracket. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0020] Reference Figure 1-3 A military Ethernet switch housing structure based on TSN chip includes an open-top shell 1, a switch assembly 2 fixedly installed inside the shell 1, a heat sink 3 fixedly installed on the top surface of the switch assembly 2, and multiple heat sink fins 4 extending to the top of the shell 1 fixedly connected to the top surface of the heat sink 3.

[0021] A top cover 5 is hinged to one side of the top surface of the outer casing 1. A photovoltaic panel 6 is fixedly installed on the inner top wall of the top cover 5, and the photovoltaic panel 6 is electrically connected to the switch assembly 2 through a wire 7. Multiple ventilation holes 8 are opened on both sides of the top cover 5 to cooperate with the heat dissipation fins 4.

[0022] The photovoltaic panel 6, the switch assembly 2, and the wire 7 are existing technologies. It should be noted that after the photovoltaic panel 6 generates electricity, it should first be transmitted to the energy storage assembly through the wire 7. The energy storage assembly then provides the electricity to the switch assembly 2 after voltage stabilization. The above photovoltaic power generation scheme is existing technology and will not be elaborated further.

[0023] Reference Figure 1-3 The military Ethernet switch housing structure based on the TSN chip can be designed so that, in low ambient temperature and high wind speed conditions, the top cover 5 can be left closed. Air is blown in through the ventilation holes 8 and the temperature on the heat sink 4 is reduced. This allows the heat sink 3 to dissipate heat from the switch components 2 inside the housing 1. Keeping the top cover 5 closed at this time helps to improve the strength of the switch and prevents external forces from directly damaging the fragile heat sink 4, thereby improving stability.

[0024] In environments with high temperatures or where photovoltaic power is required, the top cover 5 can be opened, allowing the heat sink 3 and heat dissipation fins 4 to directly contact the outside air for heat dissipation, thus improving the heat dissipation effect. The photovoltaic panels 6 inside the top cover 5 provide power to the switch components 2 through sunlight, adapting to various harsh environments.

[0025] Reference Figure 3 The inner side of the top surface of the outer casing 1 is provided with a flange 9 extending downward. The top surface of the heat sink 3 is provided with a sealing ring 10 inserted between the flange 9 and the inner wall of the outer casing 1. A sealing ring 11 is provided between the sealing ring 10 and the inner top wall of the outer casing 1. In this way, the sealing ring 10 and the sealing ring 11 are used to seal the inside of the outer casing 1, preventing water from flowing into the inside of the outer casing 1 and causing damage, thereby improving the protection capability and stability of the switch.

[0026] To ensure the airtightness of the wire 7, a mounting hole should be provided on the top surface of the heat sink 3 for the wire 7 to pass through, and the mounting hole should be filled with sealant to fix the wire 7. Sufficient space should be left above the mounting hole for the top cover 5 to rotate. This solution is quite common and will not be elaborated further.

[0027] Reference Figure 1-3 The airflow direction of the ventilation hole 8 is parallel to that of the heat dissipation fin 4, so that the airflow passing through the ventilation hole 8 can cool the heat dissipation fin 4 as unobstructed as possible, thereby improving the heat dissipation capacity.

[0028] To facilitate airflow through the heat dissipation fins 4 and further improve heat dissipation capacity, the heat dissipation fins 4 are located in the middle of the ventilation holes 8.

[0029] A support rod 12 is rotatably provided on the side of the top cover 5 facing away from the hinge. An adjusting rod 13 is threaded onto the end of the support rod 12 away from the rotating end. A support plate 14 is fixedly connected to the end of the adjusting rod 13 away from the support rod 12. By rotating the adjusting rod 13, the support plate 14 can be stably supported on the ground, thereby improving the placement stability of the switch after the top cover 5 is opened.

[0030] A locking frame 15 that matches the support plate 14 is fixedly connected to the side of the outer shell 1 below the support rod 12. By rotating the support rod 12 and the adjusting rod 13, the support plate 14 is locked in conjunction with the locking frame 15, thereby enabling the switch to lock the top cover 5 without opening the top cover 5, avoiding the cost of adding additional locking components and reducing construction costs.

[0031] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A housing structure for a military Ethernet switch based on a TSN chip, comprising an open-top shell (1), characterized in that, The shell (1) is fixedly provided with a switch assembly (2), and the top surface of the switch assembly (2) is fixedly provided with a heat sink (3). The top surface of the heat sink (3) is fixedly connected with a plurality of heat sink fins (4) extending to the top of the shell (1). The top surface of the outer shell (1) is hinged to a top cover (5). A photovoltaic panel (6) is fixedly installed on the inner top wall of the top cover (5). The photovoltaic panel (6) is electrically connected to the switch assembly (2) through a wire (7). Multiple ventilation holes (8) are opened on both sides of the top cover (5) to cooperate with the heat dissipation fins (4).

2. The housing structure of a military Ethernet switch based on a TSN chip according to claim 1, characterized in that, The inner side of the top surface of the outer shell (1) is provided with a flange (9) extending downward, and the top surface of the heat sink (3) is provided with a sealing ring (10) inserted between the flange (9) and the inner wall of the outer shell (1), and a sealing ring (11) is provided between the sealing ring (10) and the inner top wall of the outer shell (1).

3. The housing structure of a military Ethernet switch based on a TSN chip according to claim 1, characterized in that, The airflow direction of the ventilation hole (8) is parallel to that of the heat dissipation fins (4).

4. The housing structure of a military Ethernet switch based on a TSN chip according to claim 3, characterized in that, The heat dissipation fins (4) are located in the middle of the ventilation holes (8).

5. The housing structure of a military Ethernet switch based on a TSN chip according to claim 1, characterized in that, The top cover (5) is provided with a support rod (12) on the side away from the hinge. An adjusting rod (13) is threaded on the end of the support rod (12) away from the rotating end. A support plate (14) is fixedly connected to the end of the adjusting rod (13) away from the support rod (12).

6. The housing structure of a military Ethernet switch based on a TSN chip according to claim 5, characterized in that, A locking frame (15) that matches the support plate (14) is fixedly connected to the side of the outer shell (1) below the support rod (12).

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