PCBA heat dissipation structure and electric device

Abstract

The utility model relates to the technical field of heat dissipation of electric devices, and provides a PCBA heat dissipation structure and an electric device, and the PCBA heat dissipation structure comprises a housing, a PCB, an MOS tube, and a heat dissipation member. Wherein an accommodating space is formed in the shell; the PCB is arranged in the shell; the MOS tube is installed on the PCB, the end face of the side, back to the PCB, of the MOS tube is attached to the side wall of the shell, and heat exchange can be conducted; the heat dissipation piece is installed on the peripheral side wall of the MOS tube and can exchange heat with the MOS tube, and the end face of the side, back to the PCB, of the heat dissipation piece is attached to the side wall of the shell and can exchange heat with the side wall of the shell. In this way, part of heat of the MOS tube can be directly released through the side wall of the shell, part of heat can be transmitted to the heat dissipation piece, part of heat entering the heat dissipation piece is directly released into the shell, part of heat is transmitted to the side wall of the shell through the heat dissipation piece, heat dissipation is conducted through the shell, and therefore the heat dissipation efficiency of the MOS tube can be improved.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation technology for electrical components, and in particular to a heat dissipation structure and electrical component for PCBA. Background Technology

[0002] A PCB (Printed Circuit Board) is a core component of electronic equipment, used for mechanical support and electrical connection of electronic components. A MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor) is a widely used semiconductor device in electronic circuits, primarily used for signal amplification, switching control, and power conversion. During operation, MOSFETs generate heat due to conduction losses and / or switching losses. Overheating can easily lead to performance degradation or even damage to the MOSFET.

[0003] Therefore, there is an urgent need for a PCBA heat dissipation structure to solve the above-mentioned technical problems. Utility Model Content

[0004] The purpose of this invention is to propose a PCBA heat dissipation structure and electrical components that can improve the heat dissipation efficiency of MOSFETs.

[0005] To achieve this objective, the present invention adopts the following technical solution:

[0006] PCBA heat dissipation structure includes:

[0007] A housing, within which an accommodating space is formed;

[0008] PCB board, the PCB board is installed in the housing;

[0009] The MOSFET is mounted on the PCB board, and the side of the MOSFET facing away from the PCB board is in contact with the side wall of the housing and can exchange heat.

[0010] The heat sink is mounted on the peripheral sidewall of the MOSFET and can exchange heat with the MOSFET. The side of the heat sink facing away from the PCB board is in contact with the sidewall of the housing and can also exchange heat.

[0011] As a preferred technical solution of the above-mentioned PCBA heat dissipation structure, a silicone grease layer is provided between the MOSFET and the side wall of the housing, and / or, a silicone grease layer is provided between the MOSFET and the heat sink.

[0012] As a preferred technical solution for the above-mentioned PCBA heat dissipation structure, a layer of thermal grease is provided between the heat dissipation component and the side wall of the housing.

[0013] As a preferred technical solution of the above-mentioned PCBA heat dissipation structure, the PCB board is equipped with a plurality of the above-mentioned MOSFETs, the plurality of the above-mentioned MOSFETs are distributed around a first straight line, the first straight line is perpendicular to the above-mentioned PCB board and passes through the center of the above-mentioned PCB board.

[0014] As a preferred technical solution for the above-mentioned PCBA heat dissipation structure, the heat dissipation components installed on different MOS transistors are spaced apart.

[0015] As a preferred technical solution for the above-mentioned PCBA heat dissipation structure, the heat dissipation component includes multiple heat sinks, which are connected in sequence and installed on the peripheral sidewall of the MOSFET.

[0016] As a preferred technical solution of the above-mentioned PCBA heat dissipation structure, the housing includes an end cover, which is attached to the MOS transistor and the heat sink, and a heat dissipation rib is provided on the side of the end cover facing away from the PCB board.

[0017] As a preferred technical solution for the above-mentioned PCBA heat dissipation structure, the PCB board is provided with gripping holes.

[0018] As a preferred technical solution of the above-mentioned PCBA heat dissipation structure, the PCB board is provided with insertion holes, and the housing is provided with support columns. The support columns are inserted into the insertion holes one by one, and the support columns make the PCB board and the housing spaced apart.

[0019] An electrical device is also provided, including an electric drive assembly and the aforementioned PCBA heat dissipation structure. The electric drive assembly is installed inside the housing, and the PCB board is located between the electric drive assembly and the side wall of the housing. The electric drive assembly includes a rotor and a stator. The stator is fixed to the housing, and the rotor is rotatable relative to the stator. Blades are installed on the side of the stator facing the PCB board.

[0020] The beneficial effects of this utility model are:

[0021] A PCBA heat dissipation structure is provided, including a housing, a PCB board, a MOSFET, and a heat sink. The housing forms an accommodating space; the PCB board is mounted inside the housing; the MOSFET is mounted on the PCB board, with its side facing away from the PCB board contacting the sidewall of the housing for heat exchange; the heat sink is mounted on the peripheral sidewall of the MOSFET, enabling heat exchange with the MOSFET, with its side facing away from the PCB board contacting the sidewall of the housing for heat exchange.

[0022] The internal space of the housing provides the mounting base. A PCB board is mounted inside the housing, and the MOSFET is mounted on and electrically connected to the PCB board. Specifically, the PCB board, MOSFET, and housing sidewalls are arranged sequentially along a first direction. The MOSFET is fixed to the PCB board on one sidewall in the first direction, and its other sidewall is in close contact with the housing sidewall. Heat generated by the MOSFET during operation can be transferred to the housing sidewall for dissipation. A heat sink is mounted on the peripheral sidewall of the MOSFET, perpendicular to the first direction. The heat sink has a higher thermal conductivity than the MOSFET, allowing heat from the MOSFET to be released, thus accelerating its heat dissipation efficiency. Specifically, some of the MOSFET's heat can be directly released through the housing sidewalls, while some is transferred to the heat sink. Of this heat entering the heat sink, some is directly released into the housing, and some is conducted through the heat sink to the housing sidewalls for further dissipation, thus improving the MOSFET's heat dissipation efficiency. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments of this utility model will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the content of the embodiments of this utility model and these drawings without creative effort.

[0024] Figure 1 This is a schematic diagram of the PCBA heat dissipation structure provided in this embodiment of the utility model;

[0025] Figure 2 This is an exploded schematic diagram of the electrical device provided in an embodiment of this utility model.

[0026] In the picture:

[0027] 100. Shell; 110. End cap; 111. Heat dissipation fins; 120. Shell body;

[0028] 200, PCB board; 210, gripping hole; 220, connector hole;

[0029] 300, MOSFET;

[0030] 400. Heat sink components;

[0031] 500, Electric drive assembly; 510, Stator; 520, Rotor; 521, Blade. Detailed Implementation

[0032] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, not the entire structure.

[0033] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0034] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0035] In the description of this embodiment, the terms "upper," "lower," "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.

[0036] like Figure 1 and Figure 2As shown, this utility model provides a PCBA heat dissipation structure, including a housing 100, a PCB board 200, a MOSFET 300, and a heat sink 400. The housing 100 forms an accommodating space; the PCB board 200 is installed inside the housing 100; the MOSFET 300 is installed on the PCB board 200, with its side facing away from the PCB board 200 in contact with the side wall of the housing 100, allowing for heat exchange; the heat sink 400 is installed on the peripheral side wall of the MOSFET 300, allowing for heat exchange with the MOSFET 300, with its side facing away from the PCB board 200 in contact with the side wall of the housing 100, allowing for heat exchange.

[0037] For example, the internal space of the housing 100 provides a mounting base. The PCB board 200 is mounted inside the housing 100, and the MOSFET 300 is mounted on and electrically connected to the PCB board 200. Specifically, the PCB board 200, the MOSFET 300, and the sidewall of the housing 100 are arranged sequentially along a first direction. The MOSFET 300 is fixed to the PCB board 200 on one sidewall in the first direction, and its other sidewall is in close contact with the sidewall of the housing 100. The heat generated by the MOSFET 300 during operation can be transferred to the sidewall of the housing 100 for heat dissipation. A heat sink 400 is mounted in a direction perpendicular to the first direction. The heat sink 400 is mounted on the peripheral sidewall of the MOSFET 300. The thermal conductivity of the heat sink 400 is higher than that of the MOSFET 300, so the heat from the MOSFET 300 can be released through the heat sink 400, accelerating the heat dissipation efficiency of the MOSFET 300. Specifically, some of the heat from the MOSFET 300 can be released directly through the side wall of the housing 100, and some heat can be transferred to the heat sink 400. Of the heat entering the heat sink 400, some heat is released directly into the housing 100, and some heat is conducted through the heat sink 400 to the side wall of the housing 100 for heat dissipation. In this way, the heat dissipation efficiency of the MOSFET 300 can be improved.

[0038] Optionally, a layer of thermal grease is provided between the MOSFET 300 and the sidewall of the housing 100, and / or, a layer of thermal grease is provided between the MOSFET 300 and the heat sink 400. This arrangement, by providing a layer of thermal grease between the MOSFET 300 and the sidewall of the housing 100, fills the gap between them, expels air, thereby improving heat transfer efficiency and reducing operating temperature. Similarly, providing a layer of thermal grease between the MOSFET 300 and the heat sink 400 also fills the gap between them, expels air, and thus improves heat transfer efficiency and reduces operating temperature.

[0039] Optionally, a layer of thermal paste is provided between the heat sink 400 and the side wall of the housing 100. This arrangement uses thermal paste to fill the gap between the heat sink 400 and the side wall of the housing 100, venting air and thereby improving the efficiency of heat transfer and reducing the operating temperature.

[0040] Optionally, the PCB board 200 is equipped with multiple MOSFETs 300, which are distributed around a first straight line perpendicular to the PCB board 200 and passing through the center of the PCB board 200. This arrangement allows the multiple MOSFETs 300 to be relatively dispersed on the PCB board 200, facilitating heat dissipation, reducing mutual interference, and preventing excessive heat concentration in a certain area of ​​the PCB board 200, thus avoiding increased heat dissipation burden.

[0041] Optionally, heat sinks 400 mounted on different MOSFETs 300 are spaced apart. With this arrangement, a heat dissipation channel can be formed between the heat sinks 400 of two adjacent MOSFETs 300. Generally, the heat dissipation channel has airflow, which can reduce the heat transfer efficiency of the two adjacent MOSFETs 300, thereby reducing the heat dissipation impact between them. This allows the heat of the MOSFETs 300 to be relatively concentrated and dissipated through their connection with the side wall of the housing 100 and the heat sinks 400.

[0042] Optionally, the heat sink 400 includes multiple heat sinks connected in sequence and mounted on the peripheral sidewall of the MOSFET 300. For example, the MOSFET 300 has a hexahedral structure, wherein a first end face and a second end face face opposite each other, the first end face is fixed to and electrically connected to the PCB board 200, the second end face is in close contact with the sidewall of the housing 100, and heat sinks can be selectively mounted on the other end faces of the MOSFET 300. Figure 2 As shown, the heat sink 400 includes a first heat sink, a second heat sink, and a third heat sink. In the projection of the first direction, one end of the first heat sink is connected to one end of the second heat sink, and the other end of the second heat sink is connected to the third heat sink. The first heat sink, the second heat sink, and the third heat sink form a U-shaped groove structure. The heat sink 400 can be inserted into the MOS transistor 300 along the opening direction of the U-shaped groove. The first heat sink is in contact with the third end face, the second heat sink is in contact with the fourth end face, and the third heat sink is in contact with the fifth end face.

[0043] Furthermore, in this embodiment, the other end of the first heat sink and the other end of the third heat sink form an opening in a U-shaped groove structure. The first heat sink is provided with a chamfer, and the third heat sink is provided with a chamfer. The two chamfers form a guide surface at the opening of the U-shaped groove structure. When the heat sink 400 is assembled with the MOS transistor 300, the MOS transistor 300 can enter the U-shaped groove structure along the guide surface.

[0044] Furthermore, the heat sink 400 is an integral structure, that is, multiple heat sinks are integrally formed to form a covering shape that is compatible with the corresponding model of MOSFET 300.

[0045] Furthermore, the heat sink 400 has a split structure, meaning that multiple heat sinks can be detachably connected, so that adjustments can be made according to different models of MOSFETs 300 or according to the installation environment.

[0046] Optionally, the housing 100 includes an end cap 110, which is attached to the MOSFET 300 and the heat sink 400. A heat sink 111 is provided on the side of the end cap 110 facing away from the PCB board 200.

[0047] For example, the housing 100 includes a housing body 120 and an end cap 110. The housing body 120 and the end cap 110 are detachably connected. After the housing body 120 and the end cap 110 are connected, they form an accommodating space. The side of the end cap 110 facing away from the PCB board 200, that is, the outer side of the end cap 110, is provided with heat dissipation fins 111. The heat dissipation fins 111 can increase the heat dissipation area, thereby improving the heat dissipation efficiency of the end cap 110.

[0048] Optionally, the PCB board 200 is provided with gripping holes 210. For example, in this embodiment, multiple gripping holes 210 are provided, all of which are provided at the edge of the PCB board 200. When the PCB board 200 is installed into the housing 100 or removed from the housing 100, the user can clamp the PCB board 200 through the gripping holes 210.

[0049] Optionally, the PCB board 200 has insertion holes 220, and the housing 100 has support pillars. The support pillars are inserted into the insertion holes 220 one by one, and the support pillars make the PCB board 200 and the housing 100 spaced apart.

[0050] For example, the support column is located on the side of the PCB board 200 facing away from the end cover 110. After the support column is connected to the insertion hole 220, the support column can support the PCB board 200 inside the housing 100, so that there is a gap between the side of the PCB board 200 facing away from the end cover 110 and the housing 100, so that the PCB board 200 can dissipate heat.

[0051] An electrical device is also provided, including an electric drive assembly 500 and the aforementioned PCBA heat dissipation structure. The electric drive assembly 500 is installed inside the housing 100, and the PCB board 200 is located between the electric drive assembly 500 and the side wall of the housing 100. The electric drive assembly 500 includes a rotor 520 and a stator 510. The stator 510 is fixed to the housing 100, and the rotor 520 is rotatable relative to the stator 510. Blades 521 are installed on the side of the stator 510 facing the PCB board 200.

[0052] With this configuration, when the electric drive assembly 500 starts, the rotor 520 rotates relative to the stator 510. When the blades 521 carried on the stator 510 rotate, they generate airflow. The airflow blows toward the PCB board 200, accelerating the airflow speed around the PCB board 200, thereby improving its heat dissipation efficiency.

[0053] Furthermore, the above description is merely a preferred embodiment of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and various obvious changes, readjustments, and substitutions can be made without departing from the protection scope of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments, and may include many other equivalent embodiments without departing from the concept of the present invention, the scope of which is determined by the scope of the appended claims.

Claims

1. A PCBA heat dissipation structure, characterized in that, include: A housing (100) having an accommodating space formed within it; PCB board (200), the PCB board (200) is installed inside the housing (100); MOS transistor (300) is mounted on the PCB board (200). The side face of the MOS transistor (300) facing away from the PCB board (200) is in contact with the side wall of the housing (100) and can exchange heat. A heat sink (400) is installed on the peripheral sidewall of the MOS transistor (300) and can exchange heat with the MOS transistor (300). The side face of the heat sink (400) facing away from the PCB board (200) is attached to the sidewall of the housing (100) and can exchange heat.

2. The PCBA heat dissipation structure according to claim 1, characterized in that, A silicone grease layer is provided between the MOS transistor (300) and the sidewall of the housing (100), and / or, a silicone grease layer is provided between the MOS transistor (300) and the heat sink (400).

3. The PCBA heat dissipation structure according to claim 1, characterized in that, A layer of silicone grease is provided between the heat sink (400) and the side wall of the housing (100).

4. The PCBA heat dissipation structure according to claim 1, characterized in that, The PCB board (200) is equipped with a plurality of MOS transistors (300), which are distributed around a first straight line, the first straight line being perpendicular to the PCB board (200) and passing through the center of the PCB board (200).

5. The PCBA heat dissipation structure according to claim 4, characterized in that, The heat sinks (400) mounted on different MOS transistors (300) are spaced apart.

6. The PCBA heat dissipation structure according to claim 1, characterized in that, The heat sink (400) includes multiple heat sinks connected in sequence and installed on the peripheral sidewall of the MOS transistor (300).

7. The PCBA heat dissipation structure according to claim 1, characterized in that, The housing (100) includes an end cap (110), which is attached to the MOS transistor (300) and the heat sink (400). A heat sink rib (111) is provided on the side of the end cap (110) facing away from the PCB board (200).

8. The PCBA heat dissipation structure according to any one of claims 1-7, characterized in that, The PCB board (200) has gripping holes (210).

9. The PCBA heat dissipation structure according to any one of claims 1-7, characterized in that, The PCB board (200) has insertion holes (220), and the housing (100) has a support column. The support column is inserted into the insertion hole (220) in a one-to-one correspondence. The support column makes the PCB board (200) and the housing (100) spaced apart.

10. An electrical component, characterized in that, The device includes an electric drive assembly (500) and a PCBA heat dissipation structure as described in any one of claims 1-9. The electric drive assembly (500) is installed inside the housing (100), and the PCB board (200) is located between the electric drive assembly (500) and the side wall of the housing (100). The electric drive assembly (500) includes a rotor (520) and a stator (510). The stator (510) is fixed to the housing (100), and the rotor (520) is rotatable relative to the stator (510). Blades (521) are installed on the side of the stator (510) facing the PCB board (200).

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