Circuit board capable of identifying layer deviation before lamination

Abstract

The utility model discloses a circuit board for layer deviation identification before lamination, and relates to the technical field of circuit boards, the circuit board for layer deviation identification before lamination comprises a plurality of layers of core boards stacked up and down, each layer of core board is provided with a first circular ring and a second circular ring, the outer diameters of the first circular rings of each layer of core board are different, and the outer diameters of the second circular rings of each layer of core board are different. The expansion and shrinkage compensation coefficient of the first circular ring is the same as the expansion and shrinkage compensation coefficient of the core plate where the first circular ring is located, the first circular ring is used for measuring the alignment degree of the multiple layers of core plates after the multiple layers of core plates are laminated, the outer diameters of the second circular rings of the multiple layers of core plates are different, and the second circular rings of the multiple layers of core plates are coaxially arranged; the second circular ring is used for measuring the alignment degree of the multiple layers of core plates before the multiple layers of core plates are laminated, the first circular ring and the second circular ring are arranged on each core plate, whether the multiple layers of core plates are aligned or not is judged through the second circular ring before lamination, and whether the multiple layers of core plates are aligned or not is judged through the first circular ring after lamination.

Description

Technical Field

[0001] This utility model relates to the field of circuit board technology, and in particular to a circuit board for identifying pre-lamination layer offset. Background Technology

[0002] Currently, circuit boards include multilayer core board structures. These structures are heated during lamination. Due to differences in the expansion and contraction coefficients of each core board layer and inaccurate alignment control, layer misalignment may occur after lamination, resulting in poor alignment of the multilayer core board structure. Existing technology typically involves setting concentric circles on the multilayer core board structure and adjusting the stretching ratio of these concentric circles according to the compensation coefficients of each core board layer. The laminated circuit board is then placed under X-ray inspection equipment, and inspectors can quickly determine the presence of interlayer misalignment by observing the alignment of the concentric circles of each core board layer. However, this method fails to detect whether the multilayer core board structure is aligned before lamination. Utility Model Content

[0003] This invention aims to solve the technical problems existing in the prior art. To this end, this invention proposes a circuit board for identifying layer misalignment before lamination. This is achieved by setting a first ring and a second ring on each core board. Before lamination, the second ring is used to determine whether each core board layer is aligned; after lamination, the first ring is used to determine whether each core board layer is aligned.

[0004] According to an embodiment of the present invention, a circuit board for identifying layer misalignment before lamination includes multiple core boards stacked in a vertical direction. Each core board has a first ring and a second ring. The outer diameter of the first ring of each core board is different, and the expansion and contraction compensation coefficient of the first ring is the same as that of the core board to which it is located. The first ring is used to measure the alignment of the multiple core boards after lamination. The outer diameter of the second ring of each core board is also different, and the second rings of the multiple core boards are coaxially arranged. The second ring is used to measure the alignment of the multiple core boards before lamination.

[0005] The circuit board for pre-lamination layer misalignment identification according to the embodiments of the present invention has at least the following beneficial effects: by setting a first ring and a second ring on each core board, the expansion and contraction compensation coefficient of the first ring is the same as that of the core board on which it is located, thereby adjusting the stretching ratio of the first ring, while the second ring is not subjected to compensation stretching treatment. Before lamination, the concentricity of the second ring of each core board can be used to determine whether each core board is aligned. In this way, it is possible to detect whether the multi-layer core board structure is aligned before lamination, and after lamination, the concentricity of the first ring of each core board can be used to determine whether each core board is aligned. This can eliminate the layer misalignment caused by the misalignment of each core board before lamination in advance.

[0006] In some embodiments, the core board has intersecting first and second diagonals, and each layer of the core board has two first rings, with the two first rings located at the two ends of the first diagonal. Each layer of the core board also has two second rings, with the two second rings located at the two ends of the second diagonal.

[0007] In some embodiments, the circuit board for identifying the pre-lamination layer further includes a positioning component. The positioning component includes an outer frame, which is an annular structure. An annular support boss is formed at the bottom of the outer frame. Multiple core boards are placed on the support boss. The support boss is provided with a plurality of upwardly extending positioning pins. The plurality of positioning pins extend circumferentially along the support boss. Each core board is provided with a plurality of pin holes that correspond one-to-one with the plurality of positioning pins.

[0008] In some embodiments, the top of the support boss is further provided with an annular support plate, the support plate is provided with a through hole, the through hole cooperates with the positioning pin, and a spring is provided between the support plate and the support boss, the spring being sleeved on the positioning pin.

[0009] In some embodiments, the outer frame has an upwardly extending platform at its periphery, the platform surrounds the outer periphery of the core plate, there is a gap between the core plate and the platform, the support plate is located inside the platform, and the through hole is configured as an oblong hole.

[0010] In some embodiments, the area of ​​the support plate is larger than the area of ​​the support boss.

[0011] In some embodiments, the support plate is square-shaped.

[0012] In some embodiments, the outer diameters of the plurality of first rings gradually increase from top to bottom.

[0013] In some embodiments, the outer diameters of the plurality of second rings gradually increase from top to bottom.

[0014] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0015] The present invention will be further described below with reference to the accompanying drawings and embodiments, wherein:

[0016] Figure 1 This is a schematic diagram of the circuit board structure according to some embodiments of the present invention;

[0017] Figure 2This is a schematic diagram of the circuit board structure according to some embodiments of the present invention;

[0018] Figure 3 This is a cross-sectional view of a circuit board according to some embodiments of the present invention;

[0019] Figure 4 This is a schematic diagram of the circuit board structure according to some embodiments of the present invention;

[0020] Figure 5 This is an exploded view of a circuit board according to some embodiments of the present invention;

[0021] Figure 6 This is a cross-sectional view of a circuit board according to some embodiments of the present invention;

[0022] Figure 7 This is a schematic diagram of the structure of the support plate of the circuit board in some embodiments of the present invention;

[0023] Figure 8 This is a bottom view of the outer frame and support plate of the circuit board in some embodiments of this utility model.

[0024] Figure label:

[0025] Core board 100, first ring 110, second ring 120, pin hole 130;

[0026] Outer frame 200, support boss 210, positioning pin 220, support plate 230, through hole 231, spring 240, platform 250. Detailed Implementation

[0027] Due to the complex structure of multilayer boards, many part numbers have multiple core thicknesses in their lamination structure. Internal compensation needs to be based on the different expansion and contraction patterns after lamination, which results in different internal layer compensations. Therefore, the alignment between layers cannot be confirmed before the core board is laminated.

[0028] Based on this, refer to Figures 1 to 3 As shown, a circuit board provided in an embodiment of the present invention includes multiple core boards 100 stacked in the vertical direction.

[0029] Specifically, each core board 100 is provided with a first ring 110 and a second ring 120, as shown in the reference. Figure 1 and Figure 2 The image shown is a pattern of the first ring 110 and the second ring 120 on the core plate 100 as observed under X-ray inspection equipment. Figure 1 The display shows the state of the annular pattern on the core board 100 before pressing. Figure 2 The display shows the state of the annular pattern of the core board 100 after pressing. Figure 1Since the core board 100 is in the pre-pressing state, the second rings 120 of each core board 100 can be moved to make them concentric. The second rings 120 of the multi-layer core boards 100 are coaxially arranged, which ensures that each layer of core boards 100 is aligned and avoids the layer misalignment caused by the core boards 100. It should be noted that the outer diameter of the first ring 110 of each core board 100 is different, and the outer diameter of the second ring 120 of each core board 100 is also different. The outer diameter of the multiple first rings 110 gradually increases from top to bottom, and the outer diameter of the multiple second rings 120 also gradually increases from top to bottom. The expansion and contraction compensation coefficient of the first ring 110 is the same as that of the core board 100 to which it belongs. The expansion and contraction compensation coefficients of each core board 100 can be obtained according to existing measurement methods. The longitudinal and transverse stretching ratio of the first ring 110 is adaptively set according to the expansion and contraction compensation coefficient of the corresponding core board 100. For example, in the circuit board design stage, the dimensions of each second ring 120 are pre-adjusted according to the expansion and contraction compensation coefficient of the material selected for each core board 100. If the expansion and contraction compensation coefficient of the material in the warp direction is α and the expansion and contraction compensation coefficient in the weft direction is β, then when designing concentric circles, the theoretical dimensions can be multiplied by (1+α) and (1+β) respectively to obtain the actual design dimensions, thereby offsetting the dimensional changes of the material during the pressing process. During the pressing of the core board 100, the first ring 110 will expand and contract together with the core board 100. The concentricity of each first ring 110 after expansion and contraction reflects the alignment of the multilayer core board 100.

[0030] In this embodiment, the second ring 120 is used to detect the alignment of the core plate 100 before pressing, mainly to measure the impact caused by misalignment of the core plates 100. The first ring 110 is used to detect the alignment of the core plate 100 after pressing, mainly to measure the impact caused by the different expansion and contraction coefficients of the core plates 100.

[0031] In some embodiments, the core board 100 is square and has intersecting first and second diagonals, which can be understood as auxiliary lines. Each core board 100 layer has two first rings 110, located at opposite ends of the first diagonal. Similarly, each core board 100 layer has two second rings 120, located at opposite ends of the second diagonal. This arrangement improves the alignment of the core board 100 before lamination and reduces the impact of layer misalignment caused by core board 100 misalignment.

[0032] Reference Figure 4 and Figure 5As shown, in some embodiments, the circuit board for pre-lamination layer misalignment identification further includes a positioning component. The positioning component includes an outer frame 200, which is annular in structure. An annular support boss 210 is formed at the bottom of the outer frame 200. The multilayer core board 100 is placed on the support boss 210. The support boss 210 has multiple upwardly extending positioning pins 220, which extend circumferentially along the support boss 210. Each core board 100 has multiple pin holes 130 that correspond one-to-one with the positioning pins 220. This ensures the multilayer core board 100 remains positioned. If, before lamination, it is observed that the concentricity of the second ring 120 of some core boards 100 is poor, and these core boards 100 need to be replaced, the alignment of each core board 100 can be ensured before lamination.

[0033] Reference Figures 4 to 8 As shown, in some embodiments, the top of the supporting boss 210 is further provided with an annular supporting plate 230. The supporting plate 230 is square-shaped and has a through hole 231, which cooperates with the positioning pin 220. A spring 240 is provided between the supporting plate 230 and the supporting boss 210, and the spring 240 is sleeved on the positioning pin 220. During the pressing process, when the pressing device applies a downward force to the core plate 100, the supporting plate 230 supports each layer of the core plate 100. The supporting plate 230 has a large area, which makes the core plate 100 more evenly stressed. The spring 240 can play a buffering role, which can prevent the pressing device from directly pressing each layer of the core plate 100.

[0034] In some embodiments, a cushioning pad is provided between the support plate 230 and the upper core plate 100. The cushioning pad can be made of high-temperature resistant kraft paper, composite paper, silicone rubber composite material, non-woven fabric, or woven fiberglass cloth, etc., to further improve the cushioning effect. The kraft paper cushioning pad can also absorb any small amount of resin that overflows from the edges during the pressing process.

[0035] Reference Figure 4 and Figure 5 As shown, in some embodiments, the periphery of the outer frame 200 is provided with an upwardly extending platform 250. The platform 250 is a square frame structure and surrounds the outer periphery of the core plate 100. There is a gap between the core plate 100 and the platform 250. The support plate 230 is located inside the platform 250. The platform 250 can limit the support plate 230 and prevent it from deviating. In this way, the through hole 231 can be set as an oblong hole. The oblong hole can accommodate positioning pins 220 in multiple positions, so that the support plate 230 can be adapted to various outer frames 200 used for positioning, saving manufacturing costs.

[0036] Reference Figures 4 to 8As shown, in some embodiments, the area of ​​the support plate 230 is larger than the area of ​​the support boss 210, which makes the support plate 230 provide better support for the core plate 100.

[0037] Examples of the embodiments described above are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described above with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0038] In the description of this utility model, it should be understood that the directional descriptions, such as up, down, front, back, left, right, etc., indicate the directional or positional relationship based on the directional or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0039] In the description of this utility model, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. If "first" or "second" is used in the description, it is only for the purpose of distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0040] In the description of this utility model, unless otherwise explicitly defined, terms such as "setting," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this utility model in conjunction with the specific content of the technical solution.

[0041] The embodiments of the present utility model have been described in detail above with reference to the accompanying drawings. However, the present utility model is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present utility model.

Claims

1. A circuit board for identifying pre-lamination layer offset, characterized in that, The device includes multiple core boards stacked vertically. Each core board has a first ring and a second ring. The outer diameter of the first ring of each core board is different. The expansion and contraction compensation coefficient of the first ring is the same as that of the core board it is located in. The first ring is used to measure the alignment of the multiple core boards after they are pressed together. The outer diameter of the second ring of each core board is also different. The second rings of the multiple core boards are coaxially arranged. The second ring is used to measure the alignment of the multiple core boards before they are pressed together.

2. The pressed front layer bias-identified circuit board according to claim 1, characterized by, The core board has a first diagonal and a second diagonal that intersect each other. Each layer of the core board has two first rings, which are located at the two ends of the first diagonal. Each layer of the core board has two second rings, which are located at the two ends of the second diagonal.

3. The pressed front layer bias-identified circuit board according to claim 1, wherein, The circuit board for identifying the pre-lamination layer also includes a positioning component. The positioning component includes an outer frame, which is a ring-shaped structure. A ring-shaped support boss is formed at the bottom of the outer frame. Multiple core boards are placed on the support boss. The support boss is provided with multiple upwardly extending positioning pins. The multiple positioning pins extend along the circumference of the support boss. Each core board is provided with multiple pin holes that correspond one-to-one with the multiple positioning pins.

4. The press-fit pre-layer skew-identified circuit board of claim 3, wherein, The top of the support boss is also provided with an annular support plate. The support plate has a through hole that cooperates with the positioning pin. A spring is provided between the support plate and the support boss, and the spring is sleeved on the positioning pin.

5. The pressed front layer bias-identified circuit board according to claim 4, wherein, The outer frame has an upwardly extending platform around its periphery, which surrounds the outer periphery of the core plate. There is a gap between the core plate and the platform. The support plate is located inside the platform, and the through hole is configured as an oblong hole.

6. The pressed front layer bias-identified circuit board according to claim 4, wherein, The area of ​​the support plate is larger than the area of ​​the support boss.

7. The pressed front layer bias-identified circuit board according to claim 4, wherein, The support plate is square-shaped.

8. The pressed front layer bias-identified circuit board of claim 1, wherein, The outer diameters of the multiple first rings gradually increase from top to bottom.

9. The pressed front layer bias-identified circuit board according to claim 1, wherein, The outer diameter of the multiple second rings gradually increases from top to bottom.

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