Conductive adhesive film attaching device for circuit board
By designing a conductive adhesive film bonding device for circuit boards and adopting a dual-station conveyor belt and airflow curing technology, the problem of low processing efficiency at a single station was solved, achieving efficient and reliable conductive film bonding and improving the overall efficiency of the production line and product quality.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- JIANGXI BAOKANG NEW MATERIALS CO LTD
- Filing Date
- 2025-05-29
- Publication Date
- 2026-05-19
AI Technical Summary
In the existing technology, the conductive film bonding of circuit boards is carried out in a single-station process, which results in low production efficiency, limits the throughput of the production line and increases costs.
Design a conductive adhesive film bonding device for circuit boards. It adopts a dual-station design, using two sets of motors to drive the conveyor belt to process two circuit boards simultaneously. It combines airflow cleaning and heated airflow to cure the conductive film, ensuring bonding quality and efficiency.
This technology enables efficient dual-station bonding of conductive films on circuit boards, improving the throughput and yield of the production line, reducing the defect rate and the rate of defective products, and enhancing the adaptability and flexibility of the production line.
Smart Images

Figure CN224265198U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of circuit board processing technology, and in particular to a conductive adhesive film attaching device for circuit boards. Background Technology
[0002] Printed circuit boards (PCBs) are an indispensable component of modern electronic devices, used to support and connect various electronic components. They achieve electrical connections by printing conductive patterns on the surface of an insulating substrate and etching the required circuit patterns. PCBs are classified as single-sided, double-sided, and multilayer boards, depending on complexity and application requirements. Multilayer boards, by stacking multiple double-sided circuit layers and separating them with insulating material, and then achieving electrical connections between the layers via vias, can support more complex circuit designs.
[0003] A primary function of conductive films is to provide reliable electrical connections between electronic components. However, current single-station processing methods for attaching conductive films to circuit boards are inefficient, as they can only process one board at a time, significantly limiting the overall throughput of the production line. Due to the slow processing speed at single stations, companies may have to extend working hours or increase the number of production machines to achieve a certain output. Both of these approaches directly lead to increased labor and equipment investment costs.
[0004] Therefore, it is necessary to design a conductive adhesive film bonding device for circuit boards to solve the above-mentioned technical problems. Utility Model Content
[0005] To overcome the aforementioned drawbacks, this utility model provides a conductive adhesive film bonding device for circuit boards.
[0006] The technical solution is as follows: A conductive adhesive film bonding device for circuit boards includes a support frame, a first motor, transmission wheels, a conveyor belt, a fixing plate, a wrapping wheel, a positioning wheel, and a conductive film. The first motor is symmetrically fixedly connected to the right side of the support frame. Transmission wheels are symmetrically rotatably connected to both sides inside the support frame. The two transmission wheels on one side are fixedly connected to the corresponding output shaft of the first motor. A conveyor belt is wound between the two transmission wheels on the same side. Fixing plates are fixedly connected to both sides of the middle of the support frame. A wrapping wheel is rotatably connected to one side of the upper part of the two fixing plates. A positioning wheel is rotatably connected to one side of the lower part of the two fixing plates. A conductive film that contacts and cooperates with the corresponding positioning wheel is wrapped on both wrapping wheels.
[0007] Furthermore, it also includes a second motor, fan blades, a first vent pipe, and a first nozzle. The second motor is fixedly connected to the rear of the support frame, and the fan blades are fixedly connected to the output shaft of the second motor. The first vent pipe is fixedly connected to the rear of the support frame, and the fan blades are located inside the first vent pipe. An air inlet is opened at the rear of the first vent pipe, and multiple first nozzles are connected in a linear array on the right side of the first vent pipe.
[0008] Furthermore, a filter frame is provided at the air inlet of the first vent pipe.
[0009] Furthermore, it also includes a heating module, a connecting block, a second vent pipe, a second nozzle, and an air baffle. The heating module is fixedly connected to the front of the support frame. Both ends of the heating module are connected and connected to the connecting blocks. The heating module is connected and connected to the first vent pipe through the connecting block at one end. The heating module is connected and connected to the second vent pipe through the connecting block at the other end. Multiple second nozzles are connected and connected to the right side of the second vent pipe in a linear array. An air baffle is fixedly connected to the rear of the second vent pipe.
[0010] Furthermore, both the first and second ventilators are L-shaped.
[0011] Furthermore, it also includes a connecting rod, rollers, sliders, guide rods, screws, and rockers. A connecting rod is slidably and rotatably connected between the two fixed plates. Rollers that contact and cooperate with the corresponding conductive films are fixedly connected to both sides of the connecting rod. Sliders are rotatably connected to both ends of the connecting rod. Guide rods are fixedly connected to both sides of the left side of the support frame. Both guide rods slide on the corresponding sliders. A column is fixedly provided on the left side of the support frame, which is symmetrically distributed with the front guide rod. The column is slidably connected to the front slider. A screw is rotatably connected to the left side of the support frame, which is symmetrically distributed with the column. The screw is threadedly connected to the rear slider. A rocker is fixedly connected to the top of the screw.
[0012] The beneficial effects are as follows: 1. This utility model achieves dual-station bonding processing of circuit boards by setting two sets of motors to drive two sets of conveyor belts. The dual-station allows two circuit boards to be processed at the same time, which greatly improves the overall throughput of the production line. Compared with single-station operation, there is no need to wait for one station to be completed before starting the next one, which reduces idle time, greatly improves work efficiency and production capacity, and also enhances the adaptability and flexibility of the production line.
[0013] 2. This utility model uses a second motor to drive the fan blades to generate a powerful airflow, which is then sprayed out directionally through the first vent pipe and the first nozzle. This effectively removes dust from the surface of the circuit board, ensuring the quality of conductive film adhesion. It not only improves the cleanliness and reliability of the product, but also reduces the defect rate caused by impurities, thereby improving the overall efficiency of the production line and the yield of high-quality finished products.
[0014] 3. This utility model generates airflow through the rotation of fan blades, which passes through the first air pipe, the heating module, and the second air pipe, and is then directionally sprayed out by the second nozzle. The heated airflow accelerates the curing of the conductive film, optimizes the bonding effect, avoids bubbles or wrinkles, improves the quality and efficiency of conductive film adhesion, reduces the defect rate, and can be adapted to different process requirements by adjusting the temperature and speed.
[0015] 4. This utility model maintains tension and flatness during the bonding process by having the roller contact the conductive film. The slider slides along the guide rod, allowing the connecting rod and roller to be adjusted up and down. The rotating rocker drives the screw to precisely control the slider position through threaded transmission, adapting to the bonding requirements of circuit boards of different thicknesses. This ensures high precision and consistency in conductive film bonding and reduces the need for manual adjustment. Attached Figure Description
[0016] Figure 1 This is a three-dimensional structural diagram of the present invention.
[0017] Figure 2 This is a partial cross-sectional view of the components of the first motor, transmission wheel, and conveyor belt of this utility model.
[0018] Figure 3 This is a partial cross-sectional view of the components of this utility model, including the second motor, fan blades, and first vent pipe.
[0019] Figure 4 This is a partial cross-sectional view of the heating module, connecting block, and second vent pipe of this utility model.
[0020] Figure 5 This is a partial cross-sectional structural diagram of the slider, screw, and rocker arm components of this utility model. The component names and numbers in the figure are as follows: 1_Support frame, 2_First motor, 3_Transmission wheel, 4_Conveyor belt, 5_Fixing plate, 6_Wrapping wheel, 7_Positioning wheel, 8_Conductive film, 9_Second motor, 10_Fan blade, 11_First vent pipe, 12_First nozzle, 13_Heating module, 14_Connecting block, 15_Second vent pipe, 16_Second nozzle, 17_Air baffle, 18_Roller, 19_Connecting rod, 20_Slider, 21_Screw, 22_Rocker arm, 23_Guide rod. Detailed Implementation
[0021] Example: A conductive adhesive film bonding device for circuit boards, such as... Figures 1-5As shown, the device includes a support frame 1, a first motor 2, transmission wheels 3, a conveyor belt 4, a fixing plate 5, a wrapping wheel 6, a positioning wheel 7, and a conductive film 8. The first motor 2 is symmetrically mounted on the right side of the support frame 1 via screws. Transmission wheels 3 are symmetrically rotatably connected to both sides of the support frame 1. The two transmission wheels 3 on the right side are welded to the corresponding output shafts of the first motor 2. A conveyor belt 4 is wound between the two transmission wheels 3 on the same side. Fixing plates 5 are welded to both sides of the middle of the support frame 1. A wrapping wheel 6 is rotatably connected to the upper, opposite sides of the two fixing plates 5. A positioning wheel 7 is rotatably connected to the lower, opposite sides of the two fixing plates 5. A conductive film 8 is wound on the surface of each of the two wrapping wheels 6 to contact and engage with the corresponding positioning wheel 7. When this device is needed, the first motor 2 is started first. The output shaft of the first motor 2 drives the two transmission wheels 3 to rotate counterclockwise. The rotation of the transmission wheels 3 drives the conveyor belt 4 connected to them to move. The circuit board placed on the conveyor belt 4 can then move along the set direction. At the same time, the wrapping wheel 6 begins to release the conductive film 8. The conductive film 8 unfolds from the wrapping wheel 6 and is accurately attached to the moving circuit board through the guidance of the positioning wheel 7, ensuring good contact and adhesion between the conductive film 8 and the circuit board. As the first motor 2 continues to run, new circuit boards are continuously fed into the conveyor belt 4 of the device, while the old ones have completed the attachment of the conductive film 8 and leave the conveyor belt 4. After attachment is complete, the first motor 2 can be turned off.
[0022] like Figure 1 and Figure 3 As shown, it also includes a second motor 9, a fan blade 10, a first vent pipe 11, and a first nozzle 12. The second motor 9 is mounted on the rear right side of the support frame 1 by screws. The fan blade 10 is welded to the output shaft of the second motor 9. The first vent pipe 11 is welded to the rear right side of the support frame 1. The first vent pipe 11 has an L-shaped structure. A filter frame is welded to the air inlet of the first vent pipe 11 to prevent impurities from being sucked into the first vent pipe 11. The fan blade 10 is located inside the first vent pipe 11. An air inlet is opened on the rear right side of the first vent pipe 11. The right side of the first vent pipe 11 is connected to a linear array of multiple first nozzles 12. At the same time, the second motor 9 is started. The output shaft of the second motor 9 drives the fan blades 10 to rotate at high speed, generating a strong airflow. The airflow generated by the rotation enters the first vent pipe 11 through the air inlet and flows along the pipe of the first vent pipe 11. After passing through the first vent pipe 11, the airflow is sprayed out in a direction through the first nozzles 12. The airflow can blow away the dust on the surface of the circuit board. After the conductive film 8 is applied to the circuit board, the second motor 9 can be turned off.
[0023] like Figure 1 and Figure 4As shown, it also includes a heating module 13, a connecting block 14, a second vent pipe 15, a second nozzle 16, and an air baffle 17. The heating module 13 is installed in the middle of the front part of the support frame 1 by screws. The heating module 13 is connected to the connecting block 14 at both ends of the left and right sides. The heating module 13 is connected to the first vent pipe 11 through the connecting block 14 at the right end and is connected to the second vent pipe 15 through the connecting block 14 at the left end. The second vent pipe 15 has an L-shaped structure. Multiple second nozzles 16 are connected in a straight array on the right side of the second vent pipe 15. An air baffle 17 is welded to the rear end of the second vent pipe 15. The fan blade 10 rotates to generate a strong airflow, and the airflow generated by its rotation enters the first vent pipe 11 through the air inlet. The airflow flows along the first vent pipe 11 and then enters the heating module 13 via the connecting block 14 on the right. The heating module 13 heats the airflow, raising its temperature. The heated airflow flows out from the connecting block 14 on the left side of the heating module 13 and enters the second vent pipe 15. The second nozzle 16 sprays the heated airflow in a direction that directly acts on the area where the conductive film 8 has just been attached. This heated airflow helps to accelerate the curing process of the conductive film 8, and the bonding effect of the conductive film 8 can be optimized by adjusting the temperature and speed of the airflow, avoiding the formation of bubbles or wrinkles. The air baffle 17 is used to block part of the airflow to achieve the best airflow distribution effect and ensure that the heated airflow can effectively act on the target area.
[0024] like Figure 5 As shown, it also includes a connecting rod 19, a roller 18, a slider 20, a guide rod 23, a screw 21, and a rocker arm 22. The connecting rod 19 is slidably and rotatably connected between the two fixed plates 5. Rollers 18 that contact and cooperate with the corresponding conductive films 8 are welded to both the front and rear sides of the connecting rod 19. Slider 20s are rotatably connected to both the front and rear ends of the connecting rod 19. Guide rods 23 are welded to both the front and rear sides of the left side of the support frame 1. Both guide rods 23 slide on the corresponding sliders 20. Columns symmetrically distributed with the front guide rods 23 are welded to the front side of the left side of the support frame 1, and the columns are slidably connected to the front sliders 20. The rear side of the left side of the support frame 1 is rotatably connected to... There are screws 21 symmetrically distributed with the column. The screws 21 are threadedly connected to the rear slider 20. A rocker arm 22 is welded to the top of the screws 21. The roller 18 is in direct contact with the conductive film 8 to ensure that the conductive film 8 maintains appropriate tension and flatness during the application process. The slider 20 slides on the guide rod 23, which allows the connecting rod 19 and the roller 18 on it to move up and down as needed. By rotating the rocker arm 22 clockwise or counterclockwise, the screws 21 can be driven to move the slider 20 up or down along the guide rod 23 through threaded transmission, thereby adjusting the position of the connecting rod 19 and ensuring that the conductive film 8 can be accurately applied to circuit boards of different thicknesses.
Claims
1. A conductive adhesive film bonding device for circuit boards, characterized in that, The device includes a support frame (1), a first motor (2), a transmission wheel (3), a conveyor belt (4), a fixed plate (5), a wrapping wheel (6), a positioning wheel (7), and a conductive film (8). The first motor (2) is symmetrically fixedly connected to the right side of the support frame (1). The transmission wheels (3) are symmetrically rotatably connected to both sides inside the support frame (1). The two transmission wheels (3) on one side are fixedly connected to the output shaft of the corresponding first motor (2). The two transmission wheels (3) on the same side are wrapped with a conveyor belt (4). The fixed plates (5) are fixedly connected to both sides of the middle part of the support frame (1). The wrapping wheel (6) is rotatably connected to one side of the upper part of the two fixed plates (5). The positioning wheel (7) is rotatably connected to one side of the lower part of the two fixed plates (5). The conductive film (8) that contacts and cooperates with the corresponding positioning wheel (7) is wrapped on the two wrapping wheels (6).
2. The conductive adhesive film bonding device for circuit boards according to claim 1, characterized in that, It also includes a second motor (9), a fan blade (10), a first vent pipe (11) and a first nozzle (12). The second motor (9) is fixedly connected to the rear of the support frame (1). The fan blade (10) is fixedly connected to the output shaft of the second motor (9). The first vent pipe (11) is fixedly connected to the rear of the support frame (1). The fan blade (10) is located inside the first vent pipe (11). An air inlet is opened at the rear of the first vent pipe (11). Multiple first nozzles (12) are connected in a straight array on the right side of the first vent pipe (11).
3. The conductive adhesive film bonding device for circuit boards according to claim 2, characterized in that, A filter frame is provided at the air inlet of the first vent pipe (11).
4. The conductive adhesive film bonding device for circuit boards according to claim 3, characterized in that, It also includes a heating module (13), a connecting block (14), a second vent pipe (15), a second nozzle (16), and an air baffle (17). The heating module (13) is fixedly connected to the front of the support frame (1). The heating module (13) is connected to and communicates with the connecting block (14) at both ends. The heating module (13) is connected to and communicates with the first vent pipe (11) through the connecting block (14) at one end. The heating module (13) is connected to and communicates with the second vent pipe (15) through the connecting block (14) at the other end. The right side of the second vent pipe (15) is connected to and communicates with multiple second nozzles (16) in a linear array. The air baffle (17) is fixedly connected to the rear of the second vent pipe (15).
5. The conductive adhesive film bonding device for circuit boards according to claim 4, characterized in that, Both the first ventilator (11) and the second ventilator (15) are L-shaped structures.
6. The conductive adhesive film bonding device for circuit boards according to claim 5, characterized in that, It also includes a connecting rod (19), a roller (18), a slider (20), a guide rod (23), a screw (21), and a rocker arm (22). The connecting rod (19) is slidably and rotatably connected between the two fixed plates (5). The connecting rod (19) is fixedly connected to the roller (18) on both sides, which is in contact with the corresponding conductive film (8). The connecting rod (19) is rotatably connected to the slider (20) at both ends. The support frame (1) is fixedly connected to the guide rod (23) on both sides on the left side. The two guide rods (23) slide on the corresponding slider (20). The support frame (1) is fixedly provided with a column that is symmetrically distributed with the front guide rod (23) on the left side. The column is slidably connected to the front slider (20). The support frame (1) is rotatably connected to the screw (21) that is symmetrically distributed with the column on the left side. The screw (21) is threadedly connected to the rear slider (20). The top of the screw (21) is fixedly connected to the rocker arm (22).