Single-sided multi-layer copper-based circuit board pressing device

Abstract

The utility model discloses a single-sided multi-layer copper-based circuit board pressing device. The device comprises a bottom plate; the rack is mounted on the bottom plate; the pressing drive is arranged on the rack; the male pressing die is connected with the pressing drive, and the pressing drive drives the male pressing die to move in the vertical direction; and the female pressing die is movably arranged on the bottom plate, and the female pressing die is provided with a pressing cavity matched with the male pressing die. A copper plate, an insulation heat conduction layer and a copper foil of the single-face multi-layer copper-based circuit board are sequentially placed into a pressing cavity of a female pressing die, the female pressing die is moved to the position under a male pressing die, a pressing drive is started and drives the male pressing die to be pressed into the pressing cavity, and therefore the insulation heat conduction layer and the copper foil are pressed on the copper plate. Through the steps, the placing and pressing processes of the copper plate, the insulating heat conduction layer and the copper foil can be completed on one station, the pressing efficiency is effectively improved, the copper plate does not need to be transferred, and the pressing quality is improved.

Description

Technical Field

[0001] This application relates to the field of circuit board lamination technology, and in particular to a lamination apparatus for single-sided multilayer copper-based circuit boards. Background Technology

[0002] Single-sided multilayer copper-based circuit boards are thermoelectrically separated circuit boards, such as... Figure 7 As shown, it includes a copper plate and multiple layers of copper foil. Circuits are etched on the copper foil. Insulating and heat-conducting layers are provided between the copper plate and the copper foil, and between the copper foils. The copper foil and the insulating and heat-conducting layers are applied to the copper plate by pressing.

[0003] In related technologies, the pressing process of copper foil and insulating thermal conductive layer with copper foil needs to be carried out in two different stations. Before pressing, the copper plate also needs to be transported to the master mold for subsequent pressing operations, resulting in low pressing efficiency.

[0004] Therefore, it is necessary to propose a single-sided multilayer copper-based circuit board lamination device that can effectively improve lamination efficiency, which has become an important technical problem that urgently needs to be solved. Utility Model Content

[0005] This application provides a single-sided multilayer copper-based circuit board lamination device, which aims to solve the problem that in the prior art, the lamination process of copper foil and insulating thermal conductive layer with copper foil needs to be carried out at two different stations, and the copper plate needs to be transported to the master mold before lamination for subsequent lamination operations, resulting in low lamination efficiency.

[0006] To achieve the above objectives, this application proposes a single-sided multilayer copper-based circuit board lamination device, comprising: a base plate; a frame mounted on the base plate; a lamination drive disposed on the frame; a male lamination mold connected to the lamination drive, the lamination drive driving the male lamination mold to move vertically; and a female lamination mold movably disposed on the base plate, the female lamination mold having a lamination cavity adapted to the male lamination mold.

[0007] In some embodiments, the system further includes: a slide rail disposed on a base plate, wherein the female mold is movably disposed on the slide rail; and a transverse drive connected to the female mold.

[0008] In some embodiments, the device further includes a pressing frame disposed on the female mold, the pressing frame and the female mold forming a pressing cavity with one end open.

[0009] In some embodiments, it further includes: a guide platform connected to a pressing drive, a male pressing mold disposed on the guide platform, and a guide hole provided on the guide platform; and a guide post disposed on a base plate, the guide post being adapted to the guide hole.

[0010] In some embodiments, the device further includes a connector disposed on a guide platform and connected to a male pressure mold.

[0011] In some embodiments, the system further includes: a second limiting post disposed on the guide platform; and a limiting platform disposed on the base plate, the limiting platform having a limiting blind hole adapted to the second limiting post.

[0012] In some embodiments, it further includes: a first limiting post, the first limiting post being disposed on the base plate.

[0013] In some embodiments, the device further includes a guard plate disposed on the frame.

[0014] This application proposes a single-sided multilayer copper-based circuit board lamination device, comprising: a base plate, a frame, a lamination drive, a male lamination mold, and a female lamination mold. The frame is mounted on the base plate; the lamination drive is disposed on the frame; the male lamination mold is connected to the lamination drive, and the lamination drive drives the male lamination mold to move vertically; the female lamination mold is movably disposed on the base plate, and the female lamination mold is provided with a lamination cavity adapted to the male lamination mold. Before lamination, the copper plate, insulating and thermally conductive layer, and copper foil of the single-sided multilayer copper-based circuit board are sequentially placed into the lamination cavity of the female lamination mold. The female lamination mold is moved so that it is directly below the male lamination mold. At this time, the lamination drive is activated, and the lamination drive drives the male lamination mold to press into the lamination cavity, thereby laminating the insulating and thermally conductive layer and copper foil onto the copper plate. The above steps are repeated to complete the lamination of the multilayer copper-based circuit board. Through the above steps, the placement and lamination processes of the copper plate, insulating and thermally conductive layer, and copper foil can be completed in one station, effectively improving the lamination efficiency. Furthermore, the copper plate does not need to be transferred, which is beneficial to improving the lamination quality. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort, wherein:

[0016] Figure 1 This is a three-dimensional structural schematic diagram of a single-sided multilayer copper-based circuit board laminating device according to an embodiment of this application;

[0017] Figure 2 This is a top view of a single-sided multilayer copper-based circuit board laminating apparatus according to an embodiment of this application;

[0018] Figure 3 This is a three-dimensional structural diagram of a single-sided multilayer copper-based circuit board laminating device for removing the protective plate in one embodiment of this application;

[0019] Figure 4 for Figure 3 Enlarged view of part A in the middle;

[0020] Figure 5This is a cross-sectional view of a single-sided multilayer copper-based circuit board laminating apparatus according to an embodiment of this application;

[0021] Figure 6 for Figure 5 Enlarged view of part B in the middle;

[0022] Figure 7 This is a cross-sectional view of a single-sided multilayer copper-based circuit board.

[0023] In the diagram: base plate 1, guide groove 101, positioning foot 2, hydraulic station 3, pressing drive 4, large hydraulic cylinder 41, hydraulic output rod 42, frame 5, guard plate 6, male pressing mold 7, groove 71, mounting foot 8, pressing frame 9, slide rail 10, connecting block 11, transverse output rod 12, driving hydraulic cylinder 13, connecting piece 14, guide platform 15, guide post 16, female pressing mold 17, second limit post 18, first limit post 19, limit blind hole 20, copper plate 21, copper foil 22, insulating and heat-conducting layer 23. Detailed Implementation

[0024] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0025] It should be noted that all directional indicators (such as up, down, left, right, front, back, etc.) in the embodiments of this application are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicator will also change accordingly.

[0026] It should also be noted that when a component is described as "fixed to" or "set on" another component, it can be directly on the other component or there may be an intervening component present. When a component is described as "connected to" another component, it can be directly connected to the other component or there may be an intervening component present.

[0027] Furthermore, the use of terms such as "first" and "second" in this application is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. Additionally, the technical solutions of the various embodiments can be combined with each other, but only on the basis of being achievable by those skilled in the art. When the combination of technical solutions is contradictory or impossible to implement, such a combination of technical solutions should be considered non-existent and not within the scope of protection claimed in this application.

[0028] See Figure 1 , Figure 2 , Figure 3 and Figure 5 As shown, this application proposes a single-sided multilayer copper-based circuit board lamination device, including: a base plate 1; a frame 5, the frame 5 being mounted on the base plate 1; a lamination drive 4, the lamination drive 4 being disposed on the frame 5; a male lamination mold 7, the male lamination mold 7 being connected to the lamination drive 4, the lamination drive 4 driving the male lamination mold 7 to move vertically; and a female lamination mold 17, the female lamination mold 17 being movably disposed on the base plate 1, the female lamination mold 17 being provided with a lamination cavity adapted to the male lamination mold 7.

[0029] The base plate 1 serves as the structural foundation of the single-sided multilayer copper-based circuit board laminating device, and all other components in the device are directly or indirectly mounted on the base plate 1. The frame 5 serves as the structural foundation for the laminating drive 4, the male laminating mold 7, etc. The laminating drive 4 drives the male laminating mold 7 to move, thereby pressing the male laminating mold 7 into the laminating cavity of the female laminating mold 17, thus laminating the copper foil 22 and the insulating layer onto the copper plate 21. Since the copper plate 21 is equipped with a heat-conducting platform, which is flush with the upper surface of the outer copper foil 22, it contacts the electronic components to achieve heat dissipation. The male laminating mold 7 is equipped with a groove 71 adapted to the heat-conducting platform to avoid interference between the male laminating mold 7 and the heat-conducting platform during the laminating process. The female mold 17 is movably mounted on the base plate 1. During non-pressing processes, the female mold 17 can be moved out to fill the copper plate 21, copper foil 22 and insulating and heat-conducting layer 23. During the pressing process, the female mold 17 is moved directly below the male mold 7 to perform the pressing process.

[0030] Specifically, before lamination, the copper plate 21, insulating and thermally conductive layer 23, and copper foil 22 of the single-sided multilayer copper-based circuit board are sequentially placed into the lamination cavity of the female mold 17. The female mold 17 is moved so that it is directly below the male mold 7. At this time, the lamination drive 4 is activated, which drives the male mold 7 to press into the lamination cavity, thereby pressing the insulating and thermally conductive layer 23 and copper foil 22 onto the copper plate 21. The above steps are repeated to complete the lamination of the multilayer copper-based circuit board. Through the above steps, the placement and lamination processes of the copper plate 21, insulating and thermally conductive layer 23, and copper foil 22 can be completed in one station, effectively improving the lamination efficiency. Furthermore, the copper plate 21 does not need to be transferred, which is beneficial to improving the lamination quality.

[0031] The male die 7 and the female die 17 are made of materials such as cemented carbide, high-speed steel, and tool steel to ensure that the male die 7 and the female die 17 have excellent mechanical properties and wear resistance, thus ensuring the service life and pressing quality of the single-sided multilayer copper-based circuit board pressing device.

[0032] Preferably, the pressing drive 4 includes a large hydraulic cylinder 41 and a hydraulic output rod 42 adapted to the large hydraulic cylinder 41. The hydraulic output rod 42 is movably disposed within the large hydraulic cylinder 41 and partially extends out of the large hydraulic cylinder 41. The portion of the hydraulic output rod 42 extending out of the large hydraulic cylinder 41 is connected to the male pressing mold 7. A hydraulic station 3 is also provided on the base plate 1, which is used to control the pressing drive 4. The base plate 1 is also provided with mounting feet 8 and positioning feet 2 to mount the base plate 1 onto the external component.

[0033] See Figure 2 and Figure 5 As shown, in some embodiments, the system further includes: a slide rail 10, which is disposed on the base plate 1 and is detachably connected to the base plate 1 via fasteners; a female pressing mold 17, which is movably disposed on the slide rail 10 and has a groove adapted to the slide rail 10; and a transverse drive connected to the female pressing mold 17. The transverse direction is the length direction of the base plate 1, and the transverse drive moves the base plate 1 to achieve the conversion between the pressing process and the feeding process.

[0034] In this embodiment, the lateral movement drive includes a driving hydraulic cylinder 13 and a lateral movement output rod 12. The lateral movement drive is connected to a hydraulic station 3, which controls the lateral movement drive. The lateral movement output rod 12 is connected to a connecting block 11. One end of the connecting block 11 is connected to the lateral movement output rod 12, and the other end of the connecting block 11 is connected to the female mold 17 via fasteners. The base plate 1 and the slide rail 10 are both provided with guide grooves 101 adapted to the connecting block 11. The moving direction of the female mold 17 is further defined by the connecting block 11 and the guide grooves 101. The fasteners are screws.

[0035] See Figure 5 and Figure 6 As shown, in some embodiments, it further includes a pressing frame 9, which is disposed on the female pressing mold 17, and the pressing frame 9 and the female pressing mold 17 enclose a pressing cavity with one end open. The pressing frame 9 is connected to the female pressing mold 17 by fasteners. During the pressing process, part of the material of the insulating and heat-conducting layer 23 will adhere to the female pressing mold 17. By providing a detachable pressing frame 9, the insulating and heat-conducting layer 23 can be adhered to the pressing frame 9. If necessary, the pressed frame 9 can be removed for cleaning to easily remove the adhered insulating and heat-conducting layer 23.

[0036] See Figure 3 and Figure 4 As shown, in some embodiments, the system further includes: a guide platform 15 connected to the pressing drive 4, a male pressing mold 7 disposed on the guide platform 15, and a guide hole provided on the guide platform 15; and a guide post 16 disposed on the base plate 1, the guide post 16 being adapted to the guide hole. The cooperation between the guide hole on the guide platform 15 and the guide post 16 restricts the movement direction of the male pressing mold 7, ensuring the normal progress of the pressing process and preventing positional deviation of the male pressing mold 7.

[0037] See Figure 3 , Figure 4 and Figure 5 As shown, in some embodiments, it further includes a connector 14, which is disposed on the guide platform 15 and connected to the male pressure mold 7. The connector 14 enables the connection between the guide platform 15 and the male pressure mold 7. The connector 14 is connected to the guide platform 15 by fasteners, and the connector 14 is also connected to the male pressure mold 7 by fasteners.

[0038] See Figure 3 and Figure 4 As shown, in some embodiments, the system further includes: a second limiting post 18 disposed on the guide platform 15; and a limiting platform disposed on the base plate 1, the limiting platform having a limiting blind hole 20 adapted to the second limiting post 18. The provision of the second limiting post 18 and the limiting blind hole 20 can effectively limit the stroke of the male pressing mold 7, preventing the male pressing mold 7 from damaging the female pressing mold 17, the base plate 1, and other structures.

[0039] See Figure 3 and Figure 4 As shown, in some embodiments, it further includes a first limiting post 19, which is disposed on the base plate 1. The first limiting post 19 can effectively limit the stroke of the male pressing mold 7 and prevent the male pressing mold 7 from damaging the female pressing mold 17, the base plate 1, and other structures.

[0040] See Figure 1 As shown, in some embodiments, a protective plate 6 is also included, which is disposed on the frame 5. The protective plate 6 serves as an isolation layer, preventing dust and other impurities from entering the pressing area to a certain extent, and in the event of an accident, the protective plate 6 can also protect the relevant personnel.

[0041] The above description is only a part or preferred embodiment of this application. Neither the text nor the drawings should limit the scope of protection of this application. All equivalent structural transformations made using the content of this application's specification and drawings under the overall concept of this application, or direct / indirect applications in other related technical fields, are included within the scope of protection of this application.

Claims

1. A single-sided multilayer copper-based circuit board laminating device, characterized in that, include: Base plate (1); The frame (5) is mounted on the base plate (1); Press drive (4), the press drive (4) is disposed on the frame (5); Male pressure mold (7), the male pressure mold (7) is connected to the pressing drive (4), the pressing drive (4) drives the male pressure mold (7) to move vertically; The female mold (17) is movably disposed on the base plate (1) and is provided with a pressing cavity adapted to the male mold (7).

2. The single-sided multilayer copper-based circuit board laminating device according to claim 1, characterized in that, Also includes: The slide rail (10) is disposed on the base plate (1), and the female mold (17) is movably disposed on the slide rail (10). A transverse drive is connected to the female mold (17).

3. The single-sided multilayer copper-based circuit board laminating device according to claim 1, characterized in that, Also includes: A pressing frame (9) is disposed on the female pressing mold (17), and the pressing frame (9) and the female pressing mold (17) enclose a pressing cavity with one end open.

4. The single-sided multilayer copper-based circuit board laminating device according to claim 1, characterized in that, Also includes; A guide platform (15) is connected to the pressing drive (4), and the male pressing mold (7) is disposed on the guide platform (15). The guide platform (15) is provided with a guide hole. Guide post (16), the guide post (16) is disposed on the base plate (1), and the guide post (16) is adapted to the guide hole.

5. The single-sided multilayer copper-based circuit board laminating device according to claim 4, characterized in that, Also includes: Connector (14), the connector (14) is disposed on the guide platform (15), the connector (14) is connected to the male pressure mold (7).

6. The single-sided multilayer copper-based circuit board laminating device according to claim 4, characterized in that, Also includes: The second limiting post (18) is disposed on the guide platform (15). A limiting platform is provided on the base plate (1), and the limiting platform is provided with a limiting blind hole (20) adapted to the second limiting post (18).

7. The single-sided multilayer copper-based circuit board laminating device according to claim 1, characterized in that, Also includes: The first limiting post (19) is disposed on the base plate (1).

8. The single-sided multilayer copper-based circuit board laminating device according to claim 1, characterized in that, Also includes: A protective plate (6) is disposed on the frame (5).

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