Electronic product wire waterproof structure
By incorporating a potting seal cap and a double potting groove structure at the electronic product's wires, the problem of waterproof buckles loosening due to repeated wire swinging is solved, achieving higher waterproof performance and stability, suitable for outdoor and underwater environments.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- ZHONGKE ZHIBO TECH (GUANGZHOU) CO LTD
- Filing Date
- 2025-06-05
- Publication Date
- 2026-05-19
AI Technical Summary
Existing waterproofing methods for electronic product wires are insufficient to withstand repeated swinging, causing waterproof clips or adhesive to loosen or fall off, failing to meet high waterproofing requirements, and making them prone to water intrusion, especially when used in outdoor or underwater environments.
The opening for wire threading is sealed with a glue-filling cap, and first and second glue-filling grooves are set on both sides of the wire pressure plate inside the housing to form a double sealing structure, ensuring that the glue is evenly filled and fixed to the wire, and enhancing the waterproof performance.
It effectively prevents moisture from entering through the wires and housing, improves the waterproof performance of electronic products, extends their service life, reduces maintenance costs, and meets the high waterproof requirements of humid or underwater environments.
Smart Images
Figure CN224265280U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of waterproofing electronic products, and in particular to a waterproof structure for electronic product wires. Background Technology
[0002] With the widespread use of electronic products, especially the increasing number of electronic products used outdoors or in humid environments, waterproof performance has gradually become an important technical indicator for measuring the quality and reliability of such electronic products. In many application scenarios requiring waterproofing, such as outdoor electronic devices needing to withstand wind and rain, and underwater electronic devices needing to be in a water environment for extended periods, reliable waterproofing technology is particularly crucial. Good waterproofing performance not only ensures the normal operation of electronic products and extends their lifespan, but also reduces malfunctions and damage caused by water intrusion, thereby reducing maintenance costs and replacement frequency, saving expenses for users, and also promoting the application and development of electronic products in more harsh environments. Currently, in the field of waterproofing electronic product wires, existing technologies mainly focus on several aspects. One common approach is to use waterproof clips, whose structural design prevents water from entering from the connection between the wire and the housing. Another common method is to apply adhesive to the wire hole between the wire and the housing, using the adhesive's adhesion and sealing properties to prevent water intrusion. However, these existing waterproofing methods have significant limitations. Neither waterproof clips nor adhesive application can withstand repeated wire movement. In actual use, wires inevitably swing due to various reasons, and waterproof clips and adhesive can easily loosen under the influence of this swing, creating gaps or even falling off. Especially for outdoor sports enthusiasts, who have high requirements for the waterproof performance of electronic and underwater electronic devices, once the waterproof clips or adhesive fall off, moisture can easily seep in through the gaps between the wires and the housing, making these methods unable to fully meet the requirements of high waterproof ratings, thus affecting the normal use of electronic products in humid or underwater environments. Utility Model Content
[0003] In order to prevent repeated swinging of the wires, which could cause moisture to easily penetrate from the connection point between the wires and the casing of electronic products, thereby improving the waterproof performance of electronic products, this application provides a waterproof structure for the wires of electronic products.
[0004] This application provides a waterproof structure for electronic product wires, including a housing, a pressure plate, and a potting seal cover. The pressure plate is disposed inside the housing on one side. The bottom of the housing has a wire-passing opening for wires to pass through. The wire-passing opening is located below the pressure plate. The potting seal cover is detachably installed on the bottom of the housing. The potting seal layer is used to seal the wire-passing opening. The pressure plate has a first potting groove and a second potting groove on both sides, respectively. Both the first potting groove and the second potting groove are in communication with the wire-passing opening. When the potting seal cover seals the wire-passing opening, a wire-passing gap is formed between the bottom of the pressure plate and the potting seal cover for wires to pass through. By adopting the above technical solution, in the waterproof structure of the electronic product's wires, before applying the adhesive, a sealing cap is installed. Since the sealing cap is detachably installed at the bottom of the housing and can seal the wire-passing opening, it not only further prevents moisture intrusion before applying the adhesive but also prevents adhesive leakage from the wire-passing opening. Because a pressure plate is provided on one side of the housing, and its two sides are respectively surrounded by a first adhesive-filling groove and a second adhesive-filling groove communicating with the wire-passing opening, when adhesive is poured into the first and second adhesive-filling grooves, the adhesive will flow along the connection with the wire-passing opening to the vicinity of the opening. Furthermore, after the sealing cap seals the wire-passing opening, a wire-passing gap is formed between the bottom of the pressure plate and the sealing cap. This ensures that the wire can pass through smoothly, avoiding damage caused by direct pressure between the wire and other components, while also allowing sufficient space for adhesive to circulate, so that the wire is completely wrapped in adhesive, enhancing its waterproof performance. This method, compared to existing methods using waterproof clips or applying adhesive to the wire insertion holes, better resists repeated swinging of the wires, preventing the waterproofing measures from loosening, creating gaps, or even falling off due to swinging. It effectively prevents moisture from entering the electronic product through the wire insertion point, significantly improving the waterproof performance of the electronic product, ensuring normal use in humid or underwater environments, extending the product's lifespan, reducing maintenance costs and replacement frequency, and saving users money. Preferably, the pressure plate divides the housing space into an outer wire cavity and an inner wire cavity, with the first adhesive filling groove located in the outer wire cavity and the second adhesive filling groove located in the inner wire cavity. By adopting the above technical solution, the pressure plate divides the housing space into an outer wire cavity and an inner wire cavity, so that the first and second adhesive filling grooves are located in different cavities. In this way, when applying adhesive to the wire insertion opening, the adhesive can flow and fill in the first and second adhesive filling grooves respectively. The first potting groove corresponding to the outer conductor cavity can form a sealed barrier on the outside of the conductor, preventing external moisture from entering the housing through the gap between the conductor and the wire opening; the second potting groove corresponding to the inner conductor cavity further enhances the internal sealing effect, so that even if a small amount of moisture breaks through the first barrier, it will be difficult to pass through the sealed area where the second potting groove is located.The double-sealing design significantly improves the waterproof performance of the wire penetration points in electronic products, thereby ensuring the normal operation of electronic products in humid or underwater environments, extending their service life, reducing malfunctions and damage caused by moisture intrusion, and lowering maintenance costs and replacement frequency. Preferably, the depth of the first potting groove is the same as the depth of the second potting groove. By adopting the above technical solution, the identical depth of the first and second potting grooves ensures that when potting glue into the two grooves, the flow resistance and filling situation of the glue are similar, allowing for more uniform filling of the wire penetration opening and surrounding space. This creates a more uniform and stable sealing structure at the wire penetration opening, further enhancing the sealing performance between the wire and the housing, effectively preventing moisture intrusion from this location, and thus better improving the waterproof performance of electronic products, meeting the high waterproof requirements for use in humid or underwater environments. Preferably, a wiring groove is recessed on the side wall of the housing near the first glue-filling groove, corresponding to the position of the first glue-filling groove. The bottom height of the wiring groove is greater than the depth of the first and second glue-filling grooves. By adopting the above technical solution, a wiring groove is recessed on the side wall of the housing near the first glue-filling groove, corresponding to the position of the first glue-filling groove, and the bottom height of the wiring groove is greater than the depth of the first and second glue-filling grooves. In this way, when glue is poured into the first and second glue-filling grooves, the glue will not flow into the wiring grooves because the bottom of the wiring grooves is higher. The wires can be placed in the wiring grooves, avoiding messy contact between the wires and the glue, preventing the glue from binding the wires during curing, allowing the wires to move more freely, reducing the possibility of the glue sealing effect being affected by the wire swinging, further improving the stability and waterproof performance of the electronic product's wire waterproof structure, and ensuring the normal use of the electronic product in humid or underwater environments. Preferably, both the walls of the first and second glue-filling grooves are provided with protrusions, which are used to indicate the horizontal position of the glue pouring. By adopting the above technical solution, the protrusions on the walls of the first and second glue-filling tanks can indicate the horizontal position of the glue filling. During the glue filling process, the operator can visually judge whether the glue filling amount has reached the appropriate standard based on the protrusions. If the amount of glue filling does not reach the indicated position, it indicates that the amount of glue filling is insufficient, which may not completely seal the gap between the wire and the wiring opening, and moisture may still invade. When the amount of glue filling reaches the horizontal position indicated by the protrusions, it can ensure that the glue filling fully fills the first and second glue-filling tanks and the wiring gap, effectively preventing moisture from invading from the wiring point between the electronic product's wire and the casing, thereby significantly improving the waterproof performance of the electronic product, meeting the high waterproof rating requirements for electronic products in humid environments such as outdoors and underwater, ensuring the normal operation of the electronic product and extending its service life. Preferably, the glue-filling sealing cap is a rubber sealing cap, and the edge of the rubber sealing cap is provided with an adhesive layer that can be bonded to the casing, so that the glue-filling sealing cap seals and covers the wiring opening.By adopting the above technical solution, the glue-filling sealing cap is made of rubber. Rubber itself has good elasticity and flexibility, which can better adapt to wire openings of different shapes and sizes. An adhesive layer that can be bonded to the shell is provided around the edge of the rubber sealing cap, making the connection between the glue-filling sealing cap and the shell tighter and more secure, further enhancing the sealing performance. Moreover, due to the adhesive effect, it can effectively prevent the glue-filling sealing cap from loosening, creating gaps, or falling off, and prevent glue from leaking from the wire opening between the wire and the shell during glue filling, ensuring the integrity of the glue filling, thereby greatly improving the waterproof performance of electronic products, ensuring the normal use of electronic products in humid or underwater environments, extending the service life of electronic products, reducing failures and damage caused by water intrusion, and reducing maintenance costs and replacement frequency. Preferably, the bottom of the pressure plate is an arc-shaped transition surface. By adopting the above technical solution, the bottom of the pressure plate is designed as an arc-shaped transition surface. Compared with sharp or angular surfaces, the arc-shaped transition surface will not cause scratch damage to the wire when the wire passes through the wire gap and during subsequent possible swinging. Since there is no wear from scratching, the integrity of the wires is ensured, effectively preventing moisture from seeping into the electronic product through the damaged area, thus greatly improving the waterproof performance and stability of the electronic product. Preferably, the bottom of the pressure plate is provided with a concave arc groove for the wire to pass through. By adopting the above technical solution, a concave arc groove is provided at the bottom of the pressure plate for the wire to pass through, and the wire can be accommodated within the concave arc groove. This serves two purposes: firstly, it positions the wire, making its position more fixed during threading and preventing random movement; secondly, it allows more wires to be confined within the concave arc groove, reducing friction between the wire and surrounding components, lowering the risk of damage to the wire sheath due to friction, thereby ensuring the normal function of the wire, improving the stability and reliability of the entire waterproof structure of the electronic product's wires, and further enhancing the waterproof performance, safety, and durability of the electronic product. Preferably, both the walls of the first and second potting tanks are provided with reinforcing ribs. By adopting the above technical solution, reinforcing ribs are provided in the walls of the first and second potting tanks, which enhances the structural strength of the tank walls. When adhesive is injected into the glue-filling tank, the reinforcing ribs effectively resist the pressure generated during injection and the stress changes during the subsequent curing process, preventing deformation or damage to the tank walls. This allows the glue-filling tank to better hold and fix the adhesive, resulting in a stable and reliable sealing structure after curing. This further enhances the sealing effect at wiring openings, effectively preventing moisture from entering through the wiring connections between electronic products and their casings, significantly improving the waterproof performance of electronic products.Moreover, the robust glue-filling tank ensures uniform glue distribution, making the entire waterproof structure more durable over long-term use. It reduces the risk of waterproof failure due to damage to the glue-filling tank, ensuring that electronic products can still operate normally in harsh environments such as humid or underwater conditions, extending the lifespan of electronic products and reducing maintenance costs.
[0005] In summary, this application includes at least one of the following beneficial technical effects:
[0006] 1. By setting a glue-filling sealing cap to block the wire-passing opening, and the pressure plate is surrounded on both sides by a first glue-filling groove and a second glue-filling groove that communicate with the wire-passing opening, when the glue-filling sealing cap blocks the wire-passing opening, a wire-passing gap is formed between the bottom of the pressure plate and the glue-filling sealing cap, so that glue can fill these parts, preventing moisture from entering from the wire-passing point between the electronic product's wires and the casing, thereby improving the waterproof performance of the electronic product.
[0007] 2. Since this structure does not rely solely on waterproof clips or adhesive that are easily affected by wire swinging, but achieves sealing through structures such as glue-filling sealing caps, first glue-filling grooves, and second glue-filling grooves, it can solve the problem that existing waterproofing methods are unable to resist the loosening, gaps, or even detachment caused by repeated wire swinging. Attached Figure Description
[0008] Figure 1 This is a schematic diagram of a waterproof structure for an electronic product wire according to this application;
[0009] Figure 2 This is a bottom view of a waterproof structure for an electronic product wire according to this application.
[0010] Explanation of reference numerals in the attached drawings: 1. Housing; 2. Pressure plate; 3. Glue sealing cap; 4. Wire opening; 5. Outer conductor cavity; 6. Inner conductor cavity; 7. First glue filling groove; 8. Second glue filling groove; 9. Protrusion; 10. Wiring groove; 11. Concave arc groove. Detailed Implementation
[0011] The following is in conjunction with the appendix Figure 1-2 This application will be described in further detail.
[0012] This application provides a waterproof structure for electronic product wires, referring to... Figure 1 and Figure 2The device includes a housing 1, a wire clamping plate 2, and a potting sealant cap 3. The wire clamping plate 2 is located inside the housing 1 on one side. A wire-passing opening 4 is provided at the bottom of the housing 1 corresponding to the position of the wire clamping plate 2, allowing the wire to pass through. The wire clamping plate 2 is positioned above the wire-passing opening 4. The potting sealant cap 3 is detachably installed at the bottom of the housing 1 to seal the wire-passing opening 4. When the potting sealant cap 3 is in place, a wire-passing gap is formed between the bottom of the wire clamping plate 2 and the potting sealant cap 3 for the wire to pass through. The housing in this embodiment also includes mounting holes and mounting grooves for installation, which will not be described in detail here. Figure 1 This is a schematic diagram of the structure with the glue-filled sealing cap 3 installed; Figure 2 This is a schematic diagram of the structure after the glue-filling sealing cap 3 has been disassembled.
[0013] In this embodiment, the housing 1 is a cuboid box structure. The wire pressure plate 2 is located on one side inside the cuboid box, dividing the internal space of the housing 1 into an outer wire cavity 5 and an inner wire cavity 6. Specifically, the wire threading steps are as follows: the wire is inserted from the outer wire cavity 5 on one side of the wire pressure plate 2 to the wire threading opening 4 below, and then the wire is threaded out from the wire threading opening 4 along the other side of the wire pressure plate 2 into the inner wire cavity 6.
[0014] In this embodiment, two enclosing plates are arranged opposite each other inside the outer conductor cavity 5. Each enclosing plate is connected at both ends to the side wall of the housing 1 and the pressure plate 2, respectively. The two enclosing plates, the pressure plate 2, and the side wall of the housing 1 together form a cuboid-shaped first glue-filling groove 7. In this embodiment, three enclosing plates are arranged inside the inner conductor cavity 6. The three enclosing plates and the pressure plate 2 together form a cuboid-shaped second glue-filling groove 8. Both the first glue-filling groove 7 and the second glue-filling groove 8 are connected to the wire-passing opening 4, allowing the conductor to pass sequentially through the first glue-filling groove 7, the wire-passing opening 4, and the second glue-filling groove 8. Notably, in this embodiment, the housing 1, the pressure plate 2, and the enclosing plates are all integrally molded from plastic.
[0015] In this embodiment, both the first glue-filling tank 7 and the second glue-filling tank 8 have protrusions 9 on their walls. These protrusions 9 are used to indicate the horizontal position of the glue being poured. During glue pouring, the operator can judge whether the glue has reached the appropriate height based on the position of the protrusions 9, thereby ensuring the effectiveness of the glue pouring. Both the first glue-filling tank 7 and the second glue-filling tank 8 have reinforcing ribs on their walls. These reinforcing ribs can enhance the strength of the tank walls and prevent deformation of the tank walls during the glue pouring process.
[0016] Furthermore, in this embodiment, the depth of the first glue-filling groove 7 is the same as the depth of the second glue-filling groove 8, which ensures that the glue can be evenly distributed around the wires during glue filling. In addition, a wiring groove 10 is recessed on the side wall of the housing 1 near the first glue-filling groove 7, corresponding to the position of the first glue-filling groove 7. The bottom height of the wiring groove 10 is greater than the depth of the first glue-filling groove 7 and the second glue-filling groove 8, and the bottom of the wiring groove 10 is an arc-shaped transition surface. The function of the wiring groove 10 is to facilitate the arrangement and organization of wires, making the wires neater and more orderly. At the same time, the wiring groove 10 also prevents glue from overflowing onto the outside of the housing 1, keeping the housing 1 clean.
[0017] Specifically, in this embodiment, the bottom of the wire clamping plate 2 is also provided with a concave arc groove 11 for the wire to pass through. The bottom of the concave arc groove 11 is an arc-shaped transition surface. This design can reduce the wear on the wire when it passes through, and also facilitate the flow and filling of glue. In addition, the arc length and groove depth of the concave arc groove 11 are reasonably designed according to the number of wires, so that it can better fix the wire and prevent the wire from shifting when swinging. Specifically, the glue-filling sealing cap 3 in this embodiment is a rubber sealing cap. Rubber has good elasticity and sealing performance. The edge ring of the rubber sealing cap is provided with an adhesive layer that can be bonded to the shell 1. It is bonded to the bottom of the shell 1 through the adhesive layer. The glue-filling sealing cap 3 can tightly seal and cover the wire opening 4 to prevent glue leakage. The rubber sealing cap can be installed on the bottom of the shell 1 by pressing. It is easy to disassemble and facilitates later maintenance and repair. This embodiment uses a rubber sealing cap. Other embodiments can also use silicone sealing rings, as long as they can effectively seal the wire opening 4. The implementation principle of this embodiment is:
[0018] First, the wires are threaded through. Based on the rectangular box-shaped structure of the housing 1, the internal pressure plate 2 divides the space into an outer wire cavity 5 and an inner wire cavity 6. The wire enters from the outer wire cavity 5, passes through the lower wire-passing opening 4, and then exits along the other side of the pressure plate 2 into the inner wire cavity 6. This process achieves the wire sequentially passing through the first glue-filling groove 7 (formed by the two enclosing plates inside the outer wire cavity 5, the pressure plate 2, and the side wall of the housing 1), the wire-passing opening 4, and the second glue-filling groove 8 (formed by the three enclosing plates inside the inner wire cavity 6 and the pressure plate 2).
[0019] Next, the sealing operation is performed. A rubber sealing cap is used as the glue-filling sealing cap 3. Its edge ring has an adhesive layer that can be bonded to the housing 1. It is installed on the bottom of the housing 1 by pressing, tightly sealing and covering the wire opening 4 to prevent glue leakage. The rubber sealing cap is easy to disassemble, facilitating later maintenance and repair. Other effective sealing methods, such as silicone sealing rings, can also be used depending on the actual situation.
[0020] Then, the wires are organized using the wiring groove 10. The side wall of the housing 1 near the first glue-filling groove 7 is recessed with a wiring groove 10. The bottom height of the groove is greater than the depth of the glue-filling groove, and it has an arc-shaped transition surface, facilitating wire arrangement and organization, keeping the wires neat and orderly, and preventing glue from overflowing onto the outside of the housing 1, thus keeping the housing 1 clean. The bottom of the wire clamping plate 2 has a concave arc groove 11 with an arc-shaped transition surface at the bottom, which reduces wear when the wires pass through and facilitates glue flow and filling. The arc length and depth of the concave arc groove 11 are rationally designed according to the number of wires, which can better fix the wires and prevent them from swinging or shifting.
[0021] Finally, the glue-filling operation is carried out. Glue is poured into the first glue-filling tank 7 and the second glue-filling tank 8. The operator judges whether the glue has reached the appropriate height based on the position of the protrusions 9 on the tank wall to ensure the glue-filling effect. The reinforcing ribs on the tank wall can enhance the strength of the tank wall and prevent deformation during the glue-filling process. In addition, the first glue-filling tank 7 and the second glue-filling tank 8 have the same depth to ensure that the glue is evenly distributed around the wire.
[0022] The above are all preferred embodiments of this application and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.
Claims
1. A waterproof structure for electronic product wires, characterized in that, The device includes a housing (1), a wire clamping plate (2), and a glue-filling sealing cap (3). The wire clamping plate (2) is disposed inside the housing (1) on one side. The bottom of the housing (1) has a wire-passing opening (4) for wires to pass through. The wire-passing opening (4) is located below the wire clamping plate (2). The glue-filling sealing cap (3) is detachably installed at the bottom of the housing (1). The glue-filling sealing layer is used to seal the wire-passing opening (4). The two sides of the wire clamping plate (2) are respectively surrounded by a first glue-filling groove (7) and a second glue-filling groove (8). The first glue-filling groove (7) and the second glue-filling groove (8) are both connected to the wire-passing opening (4). When the glue-filling sealing cap (3) seals the wire-passing opening (4), a wire-passing gap is formed between the bottom of the wire clamping plate (2) and the glue-filling sealing cap (3) for wires to pass through.
2. The waterproof structure for electronic product wires according to claim 1, characterized in that, The pressure plate (2) divides the space of the housing (1) into an outer wire cavity (5) and an inner wire cavity (6). The first glue pot (7) is located in the outer wire cavity (5), and the second glue pot (8) is located in the inner wire cavity (6).
3. The waterproof structure for electronic product wires according to claim 2, characterized in that, The depth of the first glue-filling tank (7) is the same as the depth of the second glue-filling tank (8).
4. The waterproof structure for electronic product wires according to claim 3, characterized in that, The housing (1) has a recessed wiring groove (10) on the side wall near the first glue-filling groove (7) corresponding to the position of the first glue-filling groove (7). The bottom height of the wiring groove (10) is greater than the depth of the first glue-filling groove (7) and the second glue-filling groove (8).
5. The waterproof structure for electronic product wires according to claim 1, characterized in that, The walls of the first glue-filling tank (7) and the second glue-filling tank (8) are both provided with protrusions (9), which are used to indicate the horizontal position of the glue-filling.
6. The waterproof structure for electronic product wires according to claim 1, characterized in that, The glue-filled sealing cap (3) is a rubber sealing cap, and the edge of the rubber sealing cap is provided with an adhesive layer that can be bonded to the housing (1) so that the glue-filled sealing cap (3) seals and covers the threading opening (4).
7. The waterproof structure for electronic product wires according to claim 1, characterized in that, The bottom of the pressure plate (2) is an arc-shaped transition surface.
8. The waterproof structure for electronic product wires according to claim 1, characterized in that, The bottom of the pressure plate (2) is provided with a concave arc groove (11) for the wire to pass through.
9. The waterproof structure for electronic product wires according to claim 1, characterized in that, The walls of the first glue-filling tank (7) and the second glue-filling tank (8) are both provided with reinforcing ribs.