Wireless charging device and vehicle

Abstract

The utility model belongs to the technical field of wireless charging, and discloses a wireless charging device and a vehicle, a semiconductor refrigeration structure of the wireless charging device is fixedly arranged in a first shell, and a refrigeration flow channel is formed between the semiconductor refrigeration structure and the inner wall of the first shell; the refrigeration flow channel is used for supplying air to the wireless charging electric device for heat dissipation; the charger body is fixed relative to the first shell. An inlet and an outlet of the refrigeration channel are located on the two sides of the charger body in the thickness direction, and the outlet of the refrigeration channel is close to the top of the charger body in the thickness direction relative to the inlet of the refrigeration channel. Or, the inlet of the refrigeration flow channel and the outlet of the refrigeration flow channel are located on the same side of the top of the charger body in the thickness direction, the refrigeration flow channel penetrates through the charger body, and the outlet of the refrigeration flow channel is flush with the top of the charger body in the thickness direction. A wireless charging coil of the charger body is located on the periphery of an outlet of the refrigeration flow channel. On the basis of not increasing energy consumption, the cooling effect and efficiency of the wireless charging electric device can be effectively improved.

Description

Technical Field

[0001] This utility model relates to the field of wireless charging technology, and in particular to wireless charging devices and vehicles. Background Technology

[0002] Wireless charging devices such as mobile phones and tablets typically have their wireless charging receiver coil located on the back, specifically on the side away from the display screen and close to the battery, inside the device's casing. Because these devices need to be thin, the wireless charging receiver coil is usually made of FPC (Flexible Printed Circuit). During wireless charging, the heat generated by the receiver coil rises rapidly, and this heat radiates and conducts to the battery. Therefore, the back cover of these devices is usually made of materials with good heat dissipation, such as glass or ceramic. Additionally, cool air is blown onto the back of the device during charging to help it cool down.

[0003] Current in-vehicle wireless charging devices typically consist of a charger body, a fan, a semiconductor cooling module, a heat sink, and a housing. The charger body is housed within the housing, and the heat sink is fixed to the semiconductor cooling module with thermally conductive adhesive, forming a flow channel between the heat sink and the housing. The airflow from the fan passes through the flow channel and is delivered to the exhaust vent, blowing towards the wireless charging device. While this method can cool the wireless charging device by blowing cool air, it cannot directly blow air onto the areas where heat is concentrated on the wireless charging device, resulting in poor cooling effect and low efficiency. Utility Model Content

[0004] The purpose of this invention is to provide a wireless charging device and a vehicle to solve the aforementioned problems existing in the wireless charging devices of the prior art.

[0005] To achieve this objective, the present invention adopts the following technical solution:

[0006] Wireless charging device, including:

[0007] A semiconductor cooling structure and a first housing, wherein the semiconductor cooling structure is fixedly disposed inside the first housing and forms a cooling channel between the semiconductor cooling structure and the inner wall of the first housing; the cooling channel is used to supply air to the wireless charging device for heat dissipation.

[0008] The charger body is fixed relative to the first shell;

[0009] The inlet and outlet of the cooling channel are located on opposite sides of the charger body in the thickness direction, and the outlet of the cooling channel is closer to the top of the charger body in the thickness direction than the inlet of the cooling channel; or, the inlet and outlet of the cooling channel are both located on the same side of the top of the charger body in the thickness direction, the cooling channel passes through the charger body, and the outlet of the cooling channel is flush with the top of the charger body in the thickness direction.

[0010] The wireless charging coil of the charger body is located on the outer periphery of the outlet of the cooling channel.

[0011] As a preferred embodiment of the aforementioned wireless charging device, the extending direction of the cooling channel is parallel to the thickness direction of the charger body, and the cooling channel passes through the charger body along its own extending direction.

[0012] As a preferred embodiment of the aforementioned wireless charging device, a heat dissipation channel is further formed between the semiconductor cooling structure and the inner wall of the first shell. The cooling channel and the heat dissipation channel are not connected to each other, and the outlet of the heat dissipation channel is located at the outer periphery of the charger body.

[0013] As a preferred embodiment of the above-mentioned wireless charging device, the wireless charging device further includes a fan, which is fixed relative to the first housing, and is used to deliver air to the cooling channel and the heat dissipation channel.

[0014] As a preferred embodiment of the aforementioned wireless charging device, the fan is located at the inlet of the cooling channel and the inlet of the heat dissipation channel, and the air outlet of the fan is sealed to the inlet of the cooling channel and sealed to the inlet of the heat dissipation channel.

[0015] As a preferred embodiment of the above-mentioned wireless charging device, the wireless charging device further includes two heat conduction components, one of which is fixedly attached to the cooling sidewall of the semiconductor cooling structure and located within the cooling channel, and the other heat conduction component is fixedly attached to the heat dissipation sidewall of the semiconductor cooling structure and located within the heat dissipation channel.

[0016] As a preferred embodiment of the above-mentioned wireless charging device, the first shell includes a first sub-shell and a first sub-cover, and the semiconductor cooling structure is fixedly disposed in the first sub-shell and divides the interior of the first sub-shell into a first through hole and a second through hole that are not interconnected.

[0017] The first sub-cover is provided with a third through hole and a fourth through hole. The first sub-cover is sealed and covered by the first sub-shell and the semiconductor cooling structure, so that the first through hole and the third through hole are connected to form the cooling channel, and the second through hole and the fourth through hole are connected to form the heat dissipation channel.

[0018] As a preferred embodiment of the above-mentioned wireless charging device, the wireless charging device further includes a second shell, the second shell having an installation cavity and a cooling output hole, the first shell and the charger body being fixedly disposed inside the second shell, and the outlet of the cooling channel communicating with the cooling output hole.

[0019] As a preferred embodiment of the above-mentioned wireless charging device, the second shell includes a second sub-shell and a second sub-cover, the second sub-cover being detachably mounted on the second sub-shell and forming the mounting cavity between the second sub-shell and the second sub-shell; the first shell and the charger body are both fixedly disposed inside the second sub-shell;

[0020] The second sub-cover has a placement groove and a cooling output hole. The cooling output hole connects the outlet of the cooling channel to the placement groove. The charger body is located directly below the placement groove along its own thickness direction. The placement groove is used to place wireless charging devices.

[0021] The vehicle, including the aforementioned wireless charging device.

[0022] The beneficial effects of this utility model are:

[0023] This utility model provides a wireless charging device and a vehicle. The wireless charging device includes a semiconductor cooling structure, a first shell, and a charger body. The semiconductor cooling structure is fixedly disposed within the first shell and forms a cooling channel between itself and the inner wall of the first shell. The cooling channel is used to supply airflow for heat dissipation to the wireless charging device. The charger body is fixed relative to the first shell. The inlet and outlet of the cooling channel are located on opposite sides of the charger body in the thickness direction, and the outlet of the cooling channel is closer to the top of the charger body in the thickness direction than the inlet; or, the inlet and outlet of the cooling channel are both located on the same side of the top of the charger body in the thickness direction, the cooling channel passes through the charger body, and the outlet of the cooling channel is flush with the top of the charger body in the thickness direction. The wireless charging coil of the charger body is located on the outer periphery of the outlet of the cooling channel.

[0024] When using this wireless charging device to charge a wireless charging device, the charger body is kept powered on, and the wireless charging device is placed close to the charger body so that the wireless charging device is located within the area where the wireless charging coil is located on the charger body, so that the wireless charging device can be charged.

[0025] During the charging process of the wireless charging device, the semiconductor cooling structure is simultaneously kept powered on and air is supplied to the cooling channel. The semiconductor cooling structure cools the air flowing through the cooling channel, making the air supplied from the cooling channel cold air. Secondly, by setting the wireless charging coil of the charger body to the outer periphery of the outlet of the cooling channel, the cold air supplied from the cooling channel can directly blow on the area on the wireless charging device where heat is concentrated. Thus, without increasing energy consumption, the cooling effect and efficiency of the wireless charging device can be effectively improved. Attached Figure Description

[0026] Figure 1 This is a cross-sectional view of a wireless charging device provided in a specific embodiment of this utility model. Figure 1 ;

[0027] Figure 2 This is a cross-sectional view of a wireless charging device provided in a specific embodiment of this utility model. Figure 2 ;

[0028] Figure 3 This is a cross-sectional view of a wireless charging device provided in a specific embodiment of this utility model. Figure 3 ;

[0029] Figure 4 This is a schematic diagram of the structure of the heat conduction element provided in a specific embodiment of this utility model;

[0030] Figure 5 This is a schematic diagram of the wireless charging device provided in a specific embodiment of the present invention from a first perspective.

[0031] Figure 6 This is a schematic diagram of the wireless charging device provided in a specific embodiment of the present invention from a second perspective.

[0032] Figure 7 This is a partial structural schematic diagram of the wireless charging device provided in a specific embodiment of this utility model.

[0033] In the picture:

[0034] 100. Wireless charging devices;

[0035] 1. Semiconductor cooling structure; 11. Semiconductor cooling body; 12. Thermal insulation component;

[0036] 2. First shell; 21. Cooling channel; 22. Heat dissipation channel; 23. First sub-shell; 231. First through hole; 232. Second through hole; 233. Wiring hole; 24. First sub-cover; 241. Insert post; 2411. Third through hole; 242. Fourth through hole;

[0037] 3. Charger body;

[0038] 4. Fan;

[0039] 5. Heat transfer components; 51. First heat sink; 52. Second heat sink;

[0040] 6. Second shell; 61. Mounting cavity; 62. Second sub-shell; 621. Ventilation opening; 622. First overlapping surface; 623. Second overlapping surface; 63. Second sub-cover; 631. Cooling output hole; 632. Placement slot; 633. Heat dissipation output hole. Detailed Implementation

[0041] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, not the entire structure.

[0042] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0043] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0044] In the description of this embodiment, the terms "upper," "lower," "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.

[0045] This utility model provides a wireless charging device, such as Figure 1-3 As shown, the wireless charging device includes a semiconductor cooling structure 1, a first shell 2, and a charger body 3. The semiconductor cooling structure 1 is fixedly disposed inside the first shell 2 and forms a cooling channel 21 between itself and the inner wall of the first shell 2. The cooling channel 21 is used to supply airflow for heat dissipation to the wireless charging device 100. The charger body 3 is fixed relative to the first shell 2. The inlet and outlet of the cooling channel 21 are located on opposite sides of the charger body 3 in the thickness direction, and the outlet of the cooling channel 21 is closer to the top of the charger body 3 in the thickness direction than the inlet of the cooling channel 21; or, the inlet and outlet of the cooling channel 21 are both located on the same side of the top of the charger body 3 in the thickness direction, the cooling channel 21 passes through the charger body 3, and the outlet of the cooling channel 21 is flush with the top of the charger body 3 in the thickness direction. The wireless charging coil of the charger body 3 is located on the outer periphery of the outlet of the cooling channel 21.

[0046] When the wireless charging device is used to charge the wireless charging device 100, the charger body 3 is kept powered on and the wireless charging device 100 is placed close to the charger body 3 so that the wireless charging device 100 is located within the area of ​​the wireless charging coil on the charger body 3, so that the wireless charging device 100 can be charged.

[0047] During the charging process of the wireless charging device 100, the semiconductor cooling structure 1 is simultaneously controlled to remain powered on and to supply air to the cooling channel 21. The semiconductor cooling structure 1 cools the air flowing through the cooling channel 21, making the air supplied from the cooling channel 21 cold air. Secondly, by setting the wireless charging coil of the charger body 3 to be located on the outer periphery of the outlet of the cooling channel 21, the cold air supplied from the cooling channel 21 can directly blow on the area of ​​the wireless charging device 100 where heat is concentrated. Thus, without increasing energy consumption, the cooling effect and efficiency of the wireless charging device 100 can be effectively improved.

[0048] In this configuration, the inlet and outlet of the cooling channel 21 are located on opposite sides of the charger body 3 along its thickness direction, with the outlet of the cooling channel 21 being closer to the top of the charger body 3 along its thickness direction than the inlet. Preferably, the extension direction of the cooling channel 21 is parallel to the thickness direction of the charger body 3, and the cooling channel 21 penetrates the charger body 3 along its extension direction. That is, the cooling channel 21 is a direct current channel, and the area on the first shell 2 corresponding to the cooling channel 21 is perpendicularly inserted into the charger body 3, such that the inlet and outlet of the cooling channel 21 are located on opposite sides of the charger body 3 along its thickness direction, with the outlet of the cooling channel 21 being closer to the top of the charger body 3 along its thickness direction than the inlet. This configuration shortens the path of the cooling channel 21 and the flow path of the cold air, further improving the cooling effect and efficiency of the wireless charging device 100.

[0049] As an alternative, the extension direction of the cooling channel 21 is not parallel to the thickness direction of the charger body 3, and the cooling channel 21 passes through the charger body 3 along its own extension direction, with the inlet and outlet of the cooling channel 21 located on opposite sides of the thickness direction of the charger body 3, and the outlet of the cooling channel 21 being closer to the top of the charger body 3 in the thickness direction than the inlet of the cooling channel 21.

[0050] As an alternative, the cooling channel 21 bypasses the outer periphery of the charger body 3, and the inlet and outlet of the cooling channel 21 are located on opposite sides of the charger body 3 in the thickness direction, with the outlet of the cooling channel 21 closer to the top of the charger body 3 in the thickness direction relative to the inlet. That is, the cooling channel 21 is approximately "U"-shaped, forming a "U"-shaped clearance groove in the first shell 2. The charger body 3 is partially inserted into the clearance groove, such that the inlet and outlet of the cooling channel 21 are located on opposite sides of the charger body 3 in the thickness direction, with the outlet of the cooling channel 21 closer to the top of the charger body 3 in the thickness direction relative to the inlet.

[0051] The inlet and outlet of the cooling channel 21 are both located on the same side of the top of the charger body 3 in the thickness direction. The cooling channel 21 passes through the charger body 3, and the outlet of the cooling channel 21 is flush with the top of the charger body 3 in the thickness direction. Figure 1-3As shown, preferably, the extension direction of the cooling channel 21 is parallel to the thickness direction of the charger body 3, and the cooling channel 21 passes through the charger body 3 along its own extension direction. That is, the cooling channel 21 is a direct current channel, and the area on the first shell 2 corresponding to the cooling channel 21 is perpendicularly inserted into the charger body 3. This arrangement also makes the path of the cooling channel 21 shorter, the flow path of the cold air shorter, and can further improve the cooling effect and efficiency of the wireless charging device 100. As an alternative, the extension direction of the cooling channel 21 is not parallel to the thickness direction of the charger body 3.

[0052] In this embodiment, as Figure 1-3 As shown, the preferred extension direction of the cooling channel 21 is parallel to the thickness direction of the charger body 3. The cooling channel 21 extends through the charger body 3 along its own extension direction, and both the inlet and outlet of the cooling channel 21 are located on the same side of the top of the charger body 3 in the thickness direction, with the outlet of the cooling channel 21 flush with the top of the charger body 3 in the thickness direction. This not only further improves the cooling effect and efficiency of the wireless charging device 100, but also allows for a smaller size of the assembled wireless charging device along the thickness direction of the charger body 3, thereby reducing the space occupancy of the wireless charging device. Especially for the application of this wireless charging device in vehicles, it can reduce the design difficulty and lower the design cost.

[0053] Among them, such as Figure 1-3 As shown, a heat dissipation channel 22 is also formed between the inner wall of the semiconductor cooling structure 1 and the first shell 2. The cooling channel 21 and the heat dissipation channel 22 are not connected to each other, and the outlet spacing of the heat dissipation channel 22 is located on the outer periphery of the charger body 3. By setting the outlet spacing of the heat dissipation channel 22 to be located on the outer periphery of the charger body 3, the semiconductor cooling structure 1 can effectively dissipate heat by using airflow during the process of keeping the semiconductor cooling structure 1 in a powered state, and can avoid affecting the heat dissipation of the wireless charging device 100.

[0054] Preferably, the inlet and outlet of the heat dissipation channel 22 are both located on the same side of the top in the thickness direction of the charger body 3. The inlet of the heat dissipation channel 22 is located on the same side as the inlet of the cooling channel 21, and the outlet of the heat dissipation channel 22 is flush with the top in the thickness direction of the charger body 3. This further ensures that the assembled wireless charging device has a small dimension along the thickness direction of the charger body 3, thereby reducing the space occupancy of the wireless charging device.

[0055] Among them, such as Figure 1-3As shown, the wireless charging device also includes a fan 4, which is fixed relative to the first housing 2. The fan 4 is used to deliver air to the cooling channel 21 and the heat dissipation channel 22. When the air delivered by the fan 4 flows through the cooling channel 21, it is cooled by the cold side of the semiconductor cooling structure 1 to form cold air that blows onto the wireless charging device 100 to cool it down. When the air delivered by the fan 4 flows through the heat dissipation channel 22, it carries away the heat dissipated by the hot side of the semiconductor cooling structure 1 to dissipate heat from the semiconductor cooling structure 1.

[0056] Preferably, such as Figure 1-3 As shown, fan 4 is located at the inlet of cooling channel 21 and the inlet of heat dissipation channel 22. The outlet of fan 4 is sealed to the inlet of both cooling channel 21 and heat dissipation channel 22. The inlet of heat dissipation channel 22 is located on the same side as the inlet of cooling channel 21, allowing fan 4 to directly supply air to both channels. Furthermore, compared to sealing the outlet of fan 4 to both the inlet of cooling channel 21 and the inlet of heat dissipation channel 22 via pipes, this effectively shortens the path of airflow to the outlet of heat dissipation channel 22, thereby further improving the efficiency and effectiveness of heat dissipation for the semiconductor cooling structure 1. Finally, compared to the prior art where separate fans are provided for the cooling and heat dissipation channels, this simplifies the structure, reduces costs, and further decreases energy consumption.

[0057] As an alternative, the air outlet of fan 4 is sealed and connected to the inlet of cooling channel 21 via a first conduit, and the air outlet of fan 4 is also sealed and connected to the inlet of heat dissipation channel 22. It is understood that the first conduit is a T-junction.

[0058] As an alternative, the number of fans 4 is set to two; the air outlet of one fan 4 is directly and sealed to the inlet of the cooling channel 21, or the air outlet of another fan 4 is sealed to the inlet of the cooling channel 21 through a second pipe; the air outlet of the other fan 4 is directly and sealed to the inlet of the heat dissipation channel 22, or the air outlet of the other fan 4 is sealed to the inlet of the heat dissipation channel 22 through a third pipe.

[0059] In this embodiment, as Figure 1-3 As shown, the fan 4 is fixedly connected to the first housing 2 and located at the inlet of the cooling channel 21 and the inlet of the heat dissipation channel 22. A first sealing ring is used to seal the air outlet of the fan 4 to the inlet of the cooling channel 21 and the inlet of the heat dissipation channel 22. The fan 4 is fixedly connected to the first housing 2 by means including but not limited to snap-fit ​​and threaded connection.

[0060] Preferably, such as Figure 1 and Figure 4As shown, the wireless charging device also includes two heat conduction components 5. One heat conduction component 5 is fixedly attached to the cooling sidewall of the semiconductor cooling structure 1 and located within the cooling channel 21, while the other heat conduction component 5 is fixedly attached to the heat dissipation sidewall of the semiconductor cooling structure 1 and located within the heat dissipation channel 22. The heat conduction component 5 located within the cooling channel 21 can further improve the efficiency of cooling the flowing air into cold air, thereby further improving the cooling effect and efficiency of the wireless charging device 100; the heat conduction component 5 located within the heat dissipation channel 22 can further improve the efficiency and effect of heat dissipation of the semiconductor cooling structure 1.

[0061] Specifically, the heat conduction component 5 is attached to the semiconductor cooling structure 1 through a thermally conductive medium layer such as thermally conductive silicone grease, and is fixedly connected to the semiconductor cooling structure 1 by means of snap-fit, threaded connection, etc.

[0062] More preferably, the heat transfer element 5 is a heat dissipation fin. This increases the heat exchange area and allows airflow to pass smoothly through the heat dissipation channel 22 and the cooling channel 21.

[0063] In this embodiment, as Figure 1 and Figure 4 As shown, an exemplary configuration of the heat dissipation fins includes a first heat dissipation fin 51 and a plurality of second heat dissipation fins 52. The plurality of second heat dissipation fins 52 are distributed at intervals along a directional direction and are all fixedly connected to the first heat dissipation fin 51. The first heat dissipation fin 51 is provided with a thermally conductive medium layer and is attached and fixed to the semiconductor cooling structure 1. It is understood that the specific structural form of the heat dissipation fins is not limited, as long as it can ensure an increased heat exchange area and allow airflow to pass smoothly through the heat dissipation channel 22 and the cooling channel 21.

[0064] In this embodiment, such as Figure 1-3As shown, the first shell 2 includes a first sub-shell 23 and a first sub-cover 24. A semiconductor cooling structure 1 is fixedly disposed within the first sub-shell 23, dividing the interior of the first sub-shell 23 into a first through-hole 231 and a second through-hole 232 that are not interconnected. The first sub-cover 24 has a third through-hole 2411 and a fourth through-hole 242. The first sub-cover 24 seals over the first sub-shell 23 and the semiconductor cooling structure 1, allowing the first through-hole 231 and the third through-hole 2411 to connect and form a cooling channel 21, and allowing the second through-hole 232 and the fourth through-hole 242 to connect and form a heat dissipation channel 22. In this embodiment, preferably, the second through-hole 232 is L-shaped, the fourth through-hole 242 is I-shaped, the formed heat dissipation channel 22 is stepped, and the outlet of the heat dissipation channel 22 is located on the outer periphery of the charger body 3, with the inlet of the heat dissipation channel 22 and the inlet of the cooling channel 21 located on the same side. Furthermore, both heat conduction elements 5 are located within the first sub-shell 23. Furthermore, a second sealing ring is used to seal the gap between the outer periphery of the semiconductor cooling structure 1 and the first sub-shell 23, and the gap between the outer periphery of the semiconductor cooling structure 1 and the first sub-cover 24; a third sealing ring is used to seal the gap between the first sub-shell 23 and the first sub-cover 24. Furthermore, the first sub-shell 23 and the first sub-cover 24 are detachably connected by means of snap-fit, threaded connection, or other methods. This arrangement facilitates the installation and removal of the semiconductor cooling structure 1 and the two heat conduction components 5 from the first sub-shell 23, and facilitates the formation of the cooling channel 21 and the heat dissipation channel 22 on the first shell 2.

[0065] It is understandable that the specific structural form of the first shell 2 is not limited and can be adapted according to the actual working conditions to form the above-mentioned cooling flow channel 21 and heat dissipation flow channel 22, and to meet the installation requirements of the semiconductor cooling structure 1.

[0066] Specifically, in this embodiment, such as Figure 1-3 As shown, the cover body 24 on the first sub-cover 24 forms an insertion post 241 located on the outer periphery of the third through hole 2411, and the charger body 3 is provided with an insertion hole extending along its own thickness direction. In this embodiment, the insertion post 241 is inserted into the insertion hole and the outlet of the cooling channel 21 is flush with the top of the charger body 3 in the thickness direction. It can be understood that the wireless charging coils are spaced on the outer periphery of the insertion hole.

[0067] Among them, such as Figure 1-3 As shown, the semiconductor cooling structure 1 includes a semiconductor cooling body 11, which has a cooling sidewall and a heat dissipation sidewall. The cooling sidewall and the heat dissipation sidewall are two sidewalls arranged at a relative interval. The specific structure and working principle of the semiconductor cooling body 11 are prior art and will not be described in detail here.

[0068] Optionally, such as Figure 1-3As shown, the semiconductor cooling structure 1 also includes a heat insulation element 12. The semiconductor cooling body 11 also has an outer peripheral wall connecting the cooling sidewall and the heat dissipation sidewall. The heat insulation element 12 covers the outer peripheral wall of the semiconductor cooling body 11. A second sealing ring is fitted around the outer periphery of the heat insulation element 12 and is used to seal the gap between the heat insulation element 12 and the first sub-shell 23, and the gap between the heat insulation element 12 and the first sub-cover 24. By setting the heat insulation element 12, the heat loss caused by heat conduction in the heat dissipation channel 22 and the cooling channel 21 can be reduced, and the heat loss caused by heat conduction between the semiconductor cooling body 11 and the first shell 2 can be reduced, thereby further improving the cooling effect and efficiency of the semiconductor cooling body 11 on the air in the cooling channel 21. Secondly, this setting allows the size of the semiconductor cooling structure 1 to be adjusted to fit the first shell 2 by replacing the heat insulation element 12, which is convenient for installation.

[0069] The preferred heat insulation component 12 is made of heat-insulating and non-conductive materials such as ceramic fiber cotton and ceramic fiber board.

[0070] Specifically, such as Figure 2 and Figure 3 As shown, the first sub-shell 23 is provided with a wire-through hole 233, which is used for the semiconductor cooling body 11 to pass wires and make electrical connections with the power supply. The wire-through hole 233 communicates with the first through hole 231 and / or the second through hole 232. In this embodiment, as... Figure 2 and Figure 3 As shown, in an exemplary configuration, both the first through hole 231 and the second through hole 232 are connected to the wire through hole 233.

[0071] Furthermore, preferably, a fourth sealing ring is provided on the inner peripheral wall of the wire-passing hole 233. The fourth sealing ring is used to seal the gap between the wire of the semiconductor cooling body 11 and the inner peripheral wall of the wire-passing hole 233. In this embodiment, air leakage in the cooling channel 21 can be avoided, thereby further improving the cooling effect and efficiency of the wireless charging device 100; and air leakage in the heat dissipation channel 22 can be avoided, thereby further improving the heat dissipation efficiency and effect of the semiconductor cooling structure 1.

[0072] Among them, such as Figure 1 and Figure 5-7 As shown, the wireless charging device also includes a second shell 6, which has a mounting cavity 61 and a cooling output hole 631. The first shell 2 and the charger body 3 are both fixedly disposed inside the second shell 6, and the outlet of the cooling channel 21 is connected to the cooling output hole 631. The second shell 6 also has a heat dissipation output hole 633, and the outlet of the heat dissipation channel 22 is connected to the heat dissipation output hole 633.

[0073] Understandably, the wireless charging coil of the charger body 3 is located on the outer periphery of the heat dissipation output hole 633.

[0074] When charging the wireless charging device 100, the wireless charging device 100 is placed on the second shell 6 and positioned within the area of ​​the wireless charging coil on the charger body 3 to achieve charging. Cool air output from the cooling channel 21 blows directly onto the area of ​​the wireless charging device 100 where heat is concentrated through the cooling output hole 631. Hot air output from the heat dissipation channel 22 is exhausted to the outside through the heat dissipation output hole 633.

[0075] In this embodiment, as Figure 1 , Figure 2 and Figure 5-7 As shown, the second shell 6 includes a second sub-shell 62 and a second sub-cover 63. The second sub-cover 63 is detachably mounted on the second sub-shell 62 and forms a mounting cavity 61 between the two. The first shell 2 and the charger body 3 are both fixedly disposed within the second sub-shell 62. The second sub-cover 63 has a placement groove 632 and a cooling output hole 631. The cooling output hole 631 connects the outlet of the cooling channel 21 to the placement groove 632. The charger body 3 is located directly below the placement groove 632 along its thickness direction. The placement groove 632 is used to place the wireless charging device 100. A heat dissipation output hole 633 is formed in the second sub-cover 63. It is convenient to install and remove the fan 4, the first shell 2 and the charger body 3 into the second shell 6; secondly, the placement slot 632 can limit the placement position of the wireless charging device 100, which is convenient for charging the wireless charging device 100, and allows the cold air output from the cooling channel 21 to blow directly onto the area of ​​the wireless charging device 100 where the heat is concentrated through the cooling output hole 631.

[0076] In this embodiment, as Figure 1 and Figure 7 As shown, the exemplary cooling output port 631 is an elongated hole, and there are four cooling output ports 631. It can be understood that the shape and number of cooling output ports 631 can be adjusted according to the practicality of actual working conditions.

[0077] In this embodiment, as Figure 1 , Figure 5 and Figure 7 As shown, the exemplary heat dissipation output hole 633 is an elongated hole, and there are four heat dissipation output holes 633. It can be understood that the shape and number of heat dissipation output holes 633 can be adjusted according to the practicality of actual working conditions.

[0078] In this embodiment, as Figure 1 , Figure 2 and Figure 6As shown, the second sub-shell 62 is also provided with a vent 621, which is connected to both the air inlet of the fan 4 and the mounting cavity 61. This allows the fan 4 to deliver air to the cooling channel 21 and the heat dissipation channel 22.

[0079] In this embodiment, a fifth sealing ring is provided between the insertion post 241 and the second sub-cover 63. The fifth sealing ring is used to seal the gap between the insertion post 241 and the second sub-cover 63, thereby further improving the cooling effect and efficiency of the wireless charging device 100.

[0080] Optionally, in this embodiment, as Figure 1 and Figure 2 As shown, the second sub-shell 62 has a first overlapping surface 622, and the first sub-cover 24 overlaps the first overlapping surface 622 and is fixedly connected to the second sub-shell 62. This allows the first shell 2 to be fixed within the mounting cavity 61. Further, as... Figure 1 and Figure 2 As shown, the first sub-cover 24 overlaps the first overlapping surface 622, so that the air inlet and vent 621 of the fan 4 are spaced apart and connected, resulting in good air intake effect of the fan 4. The first sub-cover 24 and the second sub-shell 62 are fixedly connected by means including but not limited to snap-fit, threaded connection, etc.

[0081] Optionally, in this embodiment, as Figure 1 and Figure 2 As shown, the second sub-shell 62 also has a second overlapping surface 623. The charger body 3 overlaps the second overlapping surface 623, and the top of the charger body 3 along its thickness direction is fitted against the bottom wall of the second sub-cover 63. This achieves the purpose of clamping the charger body 3 between the second sub-cover 63 and the second overlapping surface 623, thereby defining the installation position of the charger body 3. Furthermore, fasteners pass through the second sub-cover 63 and the charger body 3 and are fixedly connected to the second sub-shell 62. This further enhances the effect of fixing the installation position of the charger body 3 within the mounting cavity 61. The fasteners are screws or snap-fit ​​parts provided on the second sub-cover 63, etc.

[0082] As an alternative, the first shell 2 can be directly fixed inside the second shell 6 by snap-fit ​​or threaded connection; the charger body 3 can also be directly fixed inside the second shell 6 by snap-fit ​​or threaded connection.

[0083] The charger body 3 is the wireless charging printed circuit board, and the wireless charging coil is the main power transmitting coil. The specific structure and working principle of the wireless charging printed circuit board are existing technologies, so they will not be described in detail here.

[0084] This utility model also provides a vehicle including the aforementioned wireless charging device. By adopting the aforementioned wireless charging device, the safety and reliability of charging the wireless charging device 100 in the vehicle can be effectively improved, and the energy consumption, design cost, and production cost of the vehicle can be effectively reduced.

[0085] The wireless charging device 100 is a mobile phone or tablet computer, etc. In this embodiment, a mobile phone is used as an example of the wireless charging device 100.

[0086] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating the present utility model, and are not intended to limit the implementation of the present utility model. Those skilled in the art can make various obvious changes, readjustments, and substitutions without departing from the protection scope of this utility model. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of the claims of this utility model.

Claims

1. A wireless charging device, characterized in that, include: A semiconductor cooling structure (1) and a first shell (2) are provided. The semiconductor cooling structure (1) is fixedly disposed inside the first shell (2) and forms a cooling channel (21) between itself and the inner wall of the first shell (2). The cooling channel (21) is used to supply air to the wireless charging device (100) for heat dissipation. The charger body (3) is fixed relative to the first shell (2); The inlet and outlet of the cooling channel (21) are located on opposite sides of the charger body (3) in the thickness direction, and the outlet of the cooling channel (21) is closer to the top of the charger body (3) in the thickness direction than the inlet of the cooling channel (21); or, the inlet and outlet of the cooling channel (21) are both located on the same side of the top of the charger body (3) in the thickness direction, the cooling channel (21) passes through the charger body (3), and the outlet of the cooling channel (21) is flush with the top of the charger body (3) in the thickness direction; The wireless charging coil of the charger body (3) is located on the outer periphery of the outlet of the cooling channel (21).

2. The wireless charging device according to claim 1, characterized in that, The extension direction of the cooling channel (21) is parallel to the thickness direction of the charger body (3), and the cooling channel (21) passes through the charger body (3) along its own extension direction.

3. The wireless charging device according to claim 1, characterized in that, A heat dissipation channel (22) is also formed between the semiconductor cooling structure (1) and the inner wall of the first shell (2). The cooling channel (21) and the heat dissipation channel (22) are not connected to each other, and the outlet of the heat dissipation channel (22) is located on the outer periphery of the charger body (3).

4. The wireless charging device according to claim 3, characterized in that, The wireless charging device also includes a fan (4) which is fixed relative to the first housing (2) and is used to deliver air to the cooling channel (21) and the heat dissipation channel (22).

5. The wireless charging device according to claim 4, characterized in that, The fan (4) is located at the entrance of the cooling channel (21) and the entrance of the heat dissipation channel (22). The air outlet of the fan (4) is sealed and connected to the entrance of the cooling channel (21) and the entrance of the heat dissipation channel (22).

6. The wireless charging device according to any one of claims 3-5, characterized in that, The wireless charging device further includes two heat conduction components (5), one of which is fixedly attached to the cooling sidewall of the semiconductor cooling structure (1) and located in the cooling channel (21), and the other heat conduction component (5) is fixedly attached to the heat dissipation sidewall of the semiconductor cooling structure (1) and located in the heat dissipation channel (22).

7. The wireless charging device according to any one of claims 3-5, characterized in that, The first shell (2) includes a first sub-shell (23) and a first sub-cover (24). The semiconductor cooling structure (1) is fixedly disposed in the first sub-shell (23) and divides the interior of the first sub-shell (23) into a first through hole (231) and a second through hole (232) that are not interconnected. The first sub-cover (24) is provided with a third through hole (2411) and a fourth through hole (242). The first sub-cover (24) is sealed on the first sub-shell (23) and the semiconductor cooling structure (1) so that the first through hole (231) and the third through hole (2411) are connected to form the cooling channel (21), and the second through hole (232) and the fourth through hole (242) are connected to form the heat dissipation channel (22).

8. The wireless charging device according to any one of claims 1-5, characterized in that, The wireless charging device also includes a second shell (6), which has an installation cavity (61) and a cooling output hole (631). The first shell (2) and the charger body (3) are both fixedly disposed in the second shell (6), and the outlet of the cooling channel (21) is connected to the cooling output hole (631).

9. The wireless charging device according to claim 8, characterized in that, The second shell (6) includes a second sub-shell (62) and a second sub-cover (63). The second sub-cover (63) is detachably covered by the second sub-shell (62) and forms the mounting cavity (61) between the second sub-shell (62). The first shell (2) and the charger body (3) are both fixedly disposed inside the second sub-shell (62). The second sub-cover (63) has a placement groove (632) and the cooling output hole (631). The cooling output hole (631) connects the outlet of the cooling channel (21) and the placement groove (632). The charger body (3) is located directly below the placement groove (632) along its own thickness direction. The placement groove (632) is used to place the wireless charging device (100).

10. A vehicle, characterized in that, Includes the wireless charging device according to any one of claims 1-9.

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