Semiconductor chip packaging base with pin protection structure

Abstract

The utility model discloses a semiconductor chip packaging pedestal with a pin protection structure, comprising a pedestal block, the upper side of the pedestal block is fixedly connected with a fixed block and a protection structure, the front side of the fixed block is provided with a chute, the chute is internally provided with a substrate block, the left side and the right side of the substrate block are fixedly connected with pin blocks, and the pin blocks are fixedly connected with the protection structure. A square groove is formed in the upper side of the substrate block, a chip block is arranged in the square groove, the protection structure comprises support blocks, the support blocks are fixedly connected to the upper side of the substrate block, the number of the support blocks is two, and grooves are formed in the upper sides of the two support blocks. Compared with the prior art, through the arrangement of the base block, the fixing block, the protection structure, the clamping groove, the clamping block, the rotating groove, the rotating shaft and the stopping block, a worker can conveniently protect the pins in the chip packaging process, the pins cannot be mistakenly touched and bent, and the workload of replacing the pins due to the fact that the pins are broken is reduced.

Description

Technical Field

[0001] This utility model relates to the field of chip packaging base technology, and in particular to a semiconductor chip packaging base with a protective pin structure. Background Technology

[0002] Chip packaging is an important step in the semiconductor manufacturing process. It involves encasing integrated circuit chips in a protective shell to provide physical protection, electrical connection, and heat dissipation.

[0003] The utility model of a semiconductor chip packaging base with application number "CN202321117611.5" has the following problem: the pins on the outside of the base are not protected during use and are easily broken by workers during the chip packaging process. In this case, the pins need to be replaced in time, which increases the workload of the workers. Utility Model Content

[0004] The purpose of this invention is to provide a semiconductor chip packaging base with a protective pin structure, which can overcome the shortcomings of the chip pins on the upper side of the base being easily broken during packaging.

[0005] To achieve the above objectives, a semiconductor chip packaging base with a protective pin structure is provided, including a base block, a fixing block and a protective structure are fixedly connected to the upper side of the base block, a sliding groove is provided on the front side of the fixing block, a substrate block is disposed inside the sliding groove, pin blocks are fixedly connected to the left and right sides of the substrate block, a square groove is provided on the upper side of the substrate block, and a chip block is disposed inside the square groove.

[0006] The protective structure includes two support blocks, each fixedly connected to the upper side of a base block. Each support block has a groove on its upper side, inside which a rotating rod is positioned. A rotating block is fixedly connected to the outer side of each rotating rod, and a cover plate is fixedly connected to the outer side of each rotating block. A movable plate is fixedly connected to the outer side of each cover plate, with a circular hole on its front side. The base block has a circular groove on its front side, and threaded rods are positioned inside both the groove and the hole. This design prevents the pin block from being accidentally bent by workers.

[0007] According to the semiconductor chip packaging base with a protective pin structure, the thickness of the substrate block is set to be greater than the depth of the groove, the substrate block and the fixing block are slidably connected, and the substrate block and the base block are slidably connected. This facilitates the sliding of the substrate block.

[0008] According to the semiconductor chip packaging base with a protective pin structure, a plurality of pin blocks are provided. The right end of the left pin block and the left end of the right pin block pass through a fixing block and are fixedly connected to the chip block. The pin blocks and the fixing block are movably connected. This facilitates the protection of the pin blocks.

[0009] According to the semiconductor chip packaging base with a protective pin structure, the substrate block has slots on its left and right sides, and locking blocks are fixedly connected to the left and right sides inside the slots. The locking blocks are disposed inside the slots and slidably connected to the substrate block, which facilitates the sliding of the locking blocks.

[0010] According to the semiconductor chip packaging base with a protective pin structure, a rotating groove is provided on the front side of the fixing block, and a rotating shaft is provided inside the rotating groove. A blocking block is fixedly connected to the front end of the rotating shaft. This prevents the substrate block from sliding out of the groove at will.

[0011] According to the semiconductor chip packaging base with a protective pin structure, the rotating shaft and the fixed block are rotatably connected, the blocking block and the fixed block are slidably connected, and the blocking block and the base block are movably connected. This facilitates the rotation of the blocking block.

[0012] According to the semiconductor chip packaging base with a protective pin structure, the rotating rod and the support block are rotatably connected, and the cover plate and the pin block are movably connected. This facilitates the rotation of the rotating rod.

[0013] According to the semiconductor chip packaging base with a protected pin structure, the front end of the threaded rod passes through a movable plate and is fixedly connected to a cylindrical block. The threaded rod and the movable plate are threadedly connected, and the threaded rod and the base block are threadedly connected. This facilitates the rotation of the threaded rod.

[0014] The present invention has the following advantages: Compared with the prior art, the arrangement of the base block, fixing block, protective structure, card slot, card block, rotating slot, rotating shaft and blocking block makes it easier for staff to protect the pins during the chip packaging process, so that the pins are not accidentally touched and bent, and the workload of replacing the pins due to pin breakage is reduced. Attached Figure Description

[0015] The present invention will be further described below with reference to the accompanying drawings and embodiments;

[0016] Figure 1 This is a schematic diagram of the overall front view of a semiconductor chip packaging base with a protective pin structure according to the present invention;

[0017] Figure 2This is a schematic diagram of the protective structure of the base portion of a semiconductor chip package with a protective pin structure, including a fixing block, a substrate block, a pin block, a chip block, a square groove, and a blocking block.

[0018] Figure 3 This is a schematic diagram of the structure of a base portion of a semiconductor chip packaging device with a protective pin structure according to the present invention;

[0019] Figure 4 This is a schematic diagram of another part of the protective structure of a semiconductor chip packaging base with a protective pin structure according to the present invention.

[0020] Legend:

[0021] 1. Base block; 2. Fixing block; 3. Slide groove; 4. Base plate block; 5. Pin block; 6. Square groove; 7. Chip block; 8. Protective structure; 801. Support block; 802. Groove; 803. Rotating rod; 804. Rotating block; 805. Cover plate; 806. Moving plate; 807. Circular hole; 808. Circular groove; 809. Threaded rod; 810. Cylindrical block; 9. Slot; 10. Locking block; 11. Rotating groove; 12. Rotating shaft; 13. Blocking block. Detailed Implementation

[0022] This section will describe in detail the specific embodiments of the present utility model. The preferred embodiments of the present utility model are shown in the accompanying drawings. The purpose of the drawings is to supplement the textual description with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the present utility model, but they should not be construed as limiting the scope of protection of the present utility model.

[0023] Reference Figure 1-4This utility model discloses a semiconductor chip packaging base with a protective pin structure, comprising a base block 1, a fixing block 2 and a protective structure 8 fixedly connected to the upper side of the base block 1, a sliding groove 3 formed on the front side of the fixing block 2, a substrate block 4 disposed inside the sliding groove 3, pin blocks 5 fixedly connected to the left and right sides of the substrate block 4, a square groove 6 formed on the upper side of the substrate block 4, a chip block 7 disposed inside the square groove 6, the thickness of the substrate block 4 being greater than the depth of the sliding groove 3, the substrate block 4 and the fixing block 2 being slidably connected, the substrate block 4 and the base block 1 being slidably connected, and a plurality of pin blocks 5 being provided, with the left side being a pin block 5. The right end of the foot block 5 and the left end of the right pin block 5 pass through the fixing block 2 and the chip block 7 and are fixedly connected. The pin block 5 and the fixing block 2 are movably connected. The left and right sides of the substrate block 4 are provided with slots 9. The left and right sides of the sliding groove 3 are fixedly connected with the slots 10. The slots 10 are set inside the slots 9 and are slidably connected to the substrate block 4. The front side of the fixing block 2 is provided with a rotating groove 11. The rotating groove 11 is provided with a rotating shaft 12. The front end of the rotating shaft 12 is fixedly connected with a blocking block 13. The rotating shaft 12 and the fixing block 2 are rotatably connected. The blocking block 13 and the fixing block 2 are slidably connected. The blocking block 13 and the base block 1 are movably connected.

[0024] The protective structure 8 includes a support block 801, which is fixedly connected to the upper side of the base block 1. There are two support blocks 801, and the upper side of the two support blocks 801 is provided with a groove 802. A rotating rod 803 is provided inside the groove 802. A rotating block 804 is fixedly connected to the outer side of the rotating rod 803. A cover plate 805 is fixedly connected to the outer side of the rotating block 804. A movable plate 806 is fixedly connected to the outer side of the two cover plates 805. A circular hole 807 is provided on the front side of the movable plate 806. A circular groove 808 is provided on the front side of the base block 1. A threaded rod 809 is provided inside the circular groove 808 and the circular hole 807. The rotating rod 803 is rotatably connected to the support block 801. The cover plate 805 is movably connected to the pin block 5. The front end of the threaded rod 809 passes through the movable plate 806 and is fixedly connected to a cylindrical block 810. The threaded rod 809 is threadedly connected to the movable plate 806 and the base block 1.

[0025] When the pin block 5 is not secured by the cover plate 805 of the protective structure 8, the operator holds the cylindrical block 810 and controls the threaded rod 809 to rotate, creating a groove 808 and a hole 807. Then, the operator controls the moving block to move the cover plate 805, which in turn moves the rotating block 804 around the rotating rod 803, eventually releasing the cover plate 805 from the pin block 5. When the operator needs to secure the pin block 5, they control the cover plate 805 to move the rotating block 804. Rotating around the rotating rod 803, the cover plate 805 moves along with the moving block, aligning the circular hole 807 of the moving block with the circular groove 808. Then, the cylindrical block 810 is held and the threaded rod 809 is rotated into the circular groove 808 and the circular hole 807. This is how the pin block 5, base block 1, fixing block 2, protective structure 8, slot 9, locking block 10, rotating groove 11, rotating shaft 12, and blocking block 13 are set up. This makes it easier for staff to protect the pins during the chip packaging process, preventing them from being accidentally touched and bent, and reducing the workload of replacing pins due to breakage.

[0026] Working principle: When packaging the chip, firstly, while opening the cover plate 805 of the protective structure 8, the operator holds and rotates the blocking block 13, then holds the substrate block 4 and slides it into the slide groove 3. At the same time, the locking block 10 is slid into the locking groove 9, and then the blocking block 13 is rotated to prevent the substrate block 4 from sliding out of the slide groove 3. After that, the operator fixes the pin block 5 with the cover plate 805 of the protective structure 8, and then uses the threaded rod 809 to fix the moving block. Finally, the chip block 7 is placed into the square groove 6, so that the chip block 7 and the pin block 5 are connected together. Finally, the chip is packaged. During this process, the cover plate 805 of the protective structure 8 and the fixing block together clamp and fix the pin block 5 to prevent the pin block 5 from being accidentally touched and broken by the operator, thus reducing the workload of the operator in replacing the pin block 5 due to breakage.

[0027] The embodiments of the present utility model have been described in detail above with reference to the accompanying drawings. However, the present utility model is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present utility model.

Claims

1. A semiconductor chip packaging base with a protective pin structure, characterized in that, Includes a base block (1), a fixing block (2) and a protective structure (8) are fixedly connected to the upper side of the base block (1), a sliding groove (3) is opened on the front side of the fixing block (2), a substrate block (4) is arranged inside the sliding groove (3), pin blocks (5) are fixedly connected to the left and right sides of the substrate block (4), a square groove (6) is opened on the upper side of the substrate block (4), and a chip block (7) is arranged inside the square groove (6). The protective structure (8) includes a support block (801), which is fixedly connected to the upper side of the base block (1). There are two support blocks (801), and the upper side of the two support blocks (801) is provided with a groove (802). A rotating rod (803) is provided inside the groove (802). A rotating block (804) is fixedly connected to the outer side of the rotating rod (803). A cover plate (805) is fixedly connected to the outer side of the rotating block (804). A movable plate (806) is fixedly connected to the outer side of the two cover plates (805). A round hole (807) is provided on the front side of the movable plate (806). A round groove (808) is provided on the front side of the base block (1). A threaded rod (809) is provided inside the round groove (808) and the round hole (807).

2. A semiconductor chip packaging base with a protective pin structure according to claim 1, characterized in that, The thickness of the substrate block (4) is greater than the depth of the groove (3), the substrate block (4) and the fixing block (2) are slidably connected, and the substrate block (4) and the base block (1) are slidably connected.

3. A semiconductor chip packaging base with a protective pin structure according to claim 1, characterized in that, The pin block (5) is provided in several ways. The right end of the left pin block (5) and the left end of the right pin block (5) pass through the fixing block (2) and the chip block (7) and are fixedly connected. The pin block (5) and the fixing block (2) are movably connected.

4. A semiconductor chip packaging base with a protective pin structure according to claim 1, characterized in that, The base plate (4) has slots (9) on the left and right sides. The sliding groove (3) has a block (10) fixedly connected to the left and right sides. The block (10) is set inside the slot (9) and is slidably connected to the base plate (4).

5. A semiconductor chip packaging base with a protective pin structure according to claim 1, characterized in that, The front side of the fixed block (2) is provided with a rotating groove (11), and a rotating shaft (12) is provided inside the rotating groove (11). A blocking block (13) is fixedly connected to the front end of the rotating shaft (12).

6. A semiconductor chip packaging base with a protective pin structure according to claim 5, characterized in that, The rotating shaft (12) and the fixed block (2) are rotatably connected, the blocking block (13) and the fixed block (2) are slidably connected, and the blocking block (13) and the base block (1) are movably connected.

7. A semiconductor chip packaging base with a protective pin structure according to claim 1, characterized in that, The rotating rod (803) and the support block (801) are rotatably connected, and the cover plate (805) and the pin block (5) are movably connected.

8. A semiconductor chip packaging base with a protective pin structure according to claim 1, characterized in that, The front end of the threaded rod (809) passes through the movable plate (806) and is fixedly connected to a cylindrical block (810). The threaded rod (809) and the movable plate (806) are threadedly connected, and the threaded rod (809) and the base block (1) are threadedly connected.

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