Circuit board pattern electroplating device and electroplating equipment

Abstract

The utility model discloses a circuit board pattern electroplating device and electroplating equipment, the circuit board pattern electroplating device comprises an electroplating bath, a sterilization mechanism and a control mechanism, and the electroplating bath is used for accommodating electroplating liquid; the sterilization mechanism comprises a release assembly, a conveying assembly and a storage assembly, the release assembly is arranged in the electroplating bath or above the electroplating bath, and the storage assembly, the conveying assembly and the release assembly are sequentially connected; the control mechanism comprises a logic control assembly, and the logic control assembly is electrically connected with the conveying assembly so as to control the conveying assembly to convey the sterilization liquid stored in the storage assembly to the release assembly. The circuit board pattern electroplating device is applied to the electroplating equipment, the automation level of electroplating bath disinfection is improved, and microbial pollution to the electroplating bath is reduced.

Description

Technical Field

[0001] This utility model relates to the field of circuit board manufacturing technology, and in particular to a circuit board pattern electroplating device and electroplating equipment. Background Technology

[0002] Electroplating is a process used in printed circuit boards (PCBs) to deposit a thin layer of metal onto the metal surface of the PCB, increasing the copper thickness. Pattern electroplating is a type of PCB electroplating process that deposits a metal layer (such as copper, tin, nickel, or gold) onto specific circuit patterns on the PCB surface, forming a suitable metal plating layer. This thickens the copper layer within the circuitry and holes, improving the circuit's conductivity and ensuring its stability and reliability. The electroplating solution required for pattern electroplating is typically placed in an electroplating tank, making it susceptible to microbial contamination. This microbial contamination decomposes organic matter in the solution, affecting plating quality and causing pinholes, spots, or reduced plating adhesion. In such cases, the electroplating solution in the tank needs to be replaced, resulting in higher costs. Adding bactericides to the electroplating tank can reduce the risk of microbial contamination and decrease the frequency of solution replacement. However, the current method of manually adding bactericides is prone to errors such as untimely addition, omissions, or incorrect addition, leading to microbial contamination of the electroplating tank. Utility Model Content

[0003] This utility model aims to solve at least one of the technical problems existing in the prior art. To this end, this utility model proposes a circuit board pattern electroplating apparatus and electroplating equipment, wherein the electroplating equipment utilizes the circuit board pattern electroplating apparatus provided in this application. The circuit board pattern electroplating apparatus can automatically spray disinfectant into the electroplating tank, reducing microbial contamination of the electroplating tank.

[0004] In a first aspect, a circuit board pattern electroplating apparatus according to an embodiment of the present utility model includes:

[0005] Electroplating tank, used to hold electroplating solution;

[0006] The sterilization mechanism includes a release component, a conveying component, and a storage component. The release component is located inside or above the electroplating tank, and the storage component, the conveying component, and the release component are connected in sequence.

[0007] The control mechanism includes a logic control component electrically connected to the delivery component to control the delivery component to deliver the disinfectant stored in the storage component to the release component.

[0008] A circuit board pattern electroplating apparatus according to an embodiment of the present invention has at least the following beneficial effects:

[0009] The conveying component extracts the sterilizing solution stored in the storage component and delivers it to the release component, which then releases it into the electroplating tank. This eliminates the need for manual addition of sterilizing agent, saving manpower. The entire conveying process uses pipelines, preventing the sterilizing solution from spilling onto the ground, saving solution and avoiding contamination of the production workshop. A logic control component manages the conveying component's operation, controlling the delivery and release of the sterilizing solution according to a preset logic program, eliminating the need for manual intervention and preventing issues such as untimely addition, omissions, or incorrect placement, thus reducing the risk of microbial contamination of the electroplating tank. This achieves automated sterilization of graphic electroplating tanks, improving production efficiency, reducing the frequency of electroplating solution replacement, and lowering production costs.

[0010] According to an embodiment of the present invention, a circuit board pattern electroplating apparatus includes a logic control component comprising a logic processing module and an electrical control module. The logic processing module is electrically connected to the signal input terminal of the electrical control module, and the conveying component is electrically connected to the output terminal of the electrical control module.

[0011] According to an embodiment of the present invention, a circuit board pattern electroplating apparatus includes a logic control component that further includes an interaction module, which is electrically connected to the logic processing module.

[0012] According to an embodiment of the present invention, a circuit board pattern electroplating device includes a conveying component comprising a liquid pump, a first conveying pipe, and a second conveying pipe; a storage component, the first conveying pipe, the liquid pump, the second conveying pipe, and a release component are sequentially connected; and a logic control component is electrically connected to the liquid pump.

[0013] According to an embodiment of the present invention, a circuit board pattern electroplating device includes a control mechanism that further includes a power switch assembly, which is electrically connected to a logic control assembly and a liquid pump.

[0014] According to an embodiment of the present invention, a circuit board pattern electroplating apparatus includes a control mechanism that further includes an indicator component, which is electrically connected to a power switch component.

[0015] According to an embodiment of the present invention, a circuit board pattern electroplating device is provided with a one-way valve at the end of the second delivery pipe near the liquid pump to prevent disinfectant from flowing back into the liquid pump.

[0016] According to an embodiment of the present invention, a circuit board pattern electroplating device is provided with a shut-off valve at the end of the first delivery pipe near the liquid pump.

[0017] According to an embodiment of the present invention, a circuit board pattern electroplating device includes a release component comprising a spray head, wherein a plurality of spray heads are spaced apart above the electroplating tank.

[0018] Secondly, according to an embodiment of the present invention, an electroplating apparatus utilizes the aforementioned circuit board pattern electroplating device.

[0019] An electroplating apparatus according to an embodiment of the present utility model has at least the following beneficial effects:

[0020] The pump extracts the sterilizing solution stored in the storage component and pumps it to the release component, which then releases it into the electroplating tank. This eliminates the need for manual addition of sterilizing agent, saving manpower. The entire transport process uses pipelines, preventing the sterilizing solution from spilling onto the ground, conserving the solution and avoiding contamination of the production workshop. A logic control component controls the pump's operation, allowing for the extraction and release of the sterilizing solution according to a preset logic program, eliminating the need for manual intervention and preventing issues such as untimely addition, omissions, or incorrect release, thus reducing the risk of microbial contamination of the electroplating tank. This achieves automated sterilization of patterned electroplating tanks, improving production efficiency, reducing the frequency of electroplating solution replacement, and lowering production costs.

[0021] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0022] The above and / or additional aspects and advantages of this utility model will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0023] Figure 1 This is a schematic diagram of the structure of a circuit board pattern electroplating device according to an embodiment of the present utility model.

[0024] Explanation of reference numerals in the attached figures:

[0025] Electroplating tank 100;

[0026] Release component 200; spray head 210;

[0027] Delivery assembly 300; liquid pump 310; first delivery pipe 320; second delivery pipe 330; check valve 340; shut-off valve 350;

[0028] Storage component 400; Seal 410;

[0029] Logic control component 500; logic processing module 510; electrical control module 520; interaction module 530;

[0030] Power switch assembly 600;

[0031] Indicator component 700;

[0032] Traffic monitoring component 800;

[0033] Installation cabinet 900. Detailed Implementation

[0034] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0035] In the description of this utility model, it should be understood that the directional descriptions, such as up, down, front, back, left, right, etc., indicate the directional or positional relationship based on the directional or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0036] In the description of a utility model, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. If the terms "first" and "second" are used, they are merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly specifying the number of indicated technical features or the order of the indicated technical features.

[0037] In the description of this utility model, unless otherwise explicitly defined, terms such as "setting," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this utility model in conjunction with the specific content of the technical solution.

[0038] Reference Figure 1 This utility model provides a circuit board pattern electroplating apparatus, including an electroplating tank 100, a sterilization mechanism, and a control mechanism. The electroplating tank 100 is used to contain electroplating solution, and the circuit board undergoes pattern electroplating treatment in the electroplating solution. The sterilization mechanism includes a release component 200, a conveying component 300, and a storage component 400. The release component 200 is disposed inside or above the electroplating tank 100. The storage component 400, the conveying component 300, and the release component 200 are connected in sequence to convey the sterilization solution stored in the storage component 400 to the release component 200. Specifically, the storage component 400 is a storage tank with an opening at the top, and the conveying component 300 is connected to the opening at the top of the storage tank. The control mechanism includes a logic control component 500, which is electrically connected to the conveying component 300 to control the conveying component 300 to convey the sterilization solution stored in the storage component 400 to the release component 200, and then release it into the electroplating tank through the release component 200. Specifically, the control mechanism is located on the mounting cabinet 900.

[0039] The disinfectant stored in the storage component 400 is transported to the release component 200 by the conveying component 300, and then released into or above the electroplating tank 100 by the release component 200. This eliminates the need for manual addition of disinfectant to the electroplating tank 100, saving manpower. The entire conveying process uses pipelines, preventing the disinfectant from spilling onto the ground, conserving disinfectant and avoiding soiling the production workshop. The logic control component 500 controls the operation of the conveying component 300, controlling the delivery and release of the disinfectant according to a preset logic program, eliminating the need for manual intervention and preventing issues such as untimely addition, omissions, or incorrect placement, thus reducing the risk of microbial contamination of the electroplating tank 100. This achieves automated disinfection of the graphic electroplating tank 100, improving production efficiency, reducing the frequency of electroplating solution replacement in the electroplating tank 100, and lowering production costs.

[0040] According to some embodiments of this application, the logic control component 500 includes a logic processing module 510 and an electrical control module 520. The logic processing module 510 is electrically connected to the signal input terminal of the electrical control module 520, and the transmission component 300 is electrically connected to the output terminal of the electrical control module 520. Specifically, the logic processing module 510 is a logic processor with program calculation and signal output functions; the electrical control module 520 is a relay, the logic processor is electrically connected to the signal input terminal of the relay, and the transmission component 300 is electrically connected to the output terminal of the relay. The logic processor controls the relay to operate, thereby controlling the operation of the transmission component 300, resulting in fast response speed and high reliability in multiple switching operations.

[0041] Furthermore, the logic control component 500 also includes an interaction module 530, which is electrically connected to the logic processing module 510. The interaction module 530 allows modification of the program settings in the logic processor, facilitating changes to the specific time or interval for extracting and releasing the disinfectant solution.

[0042] Optionally, the interaction module 530 includes a display screen and a control keyboard. The program settings of the logic processor can be modified via the control keyboard, and the current program setting parameters can be displayed on the display screen. Optionally, the interaction module 530 is a touch screen that combines the functions of a display screen and a control keyboard.

[0043] According to some embodiments of this application, the delivery assembly 300 includes a pump 310, a first delivery pipe 320, and a second delivery pipe 330. The storage assembly 400, the first delivery pipe 320, the pump 310, the second delivery pipe 330, and the release assembly 200 are sequentially connected. The logic control assembly 500 is electrically connected to the pump 310. Specifically, the pump 310 is mounted on the mounting cabinet 900.

[0044] Understandably, referring to Figure 1In some other embodiments, a flow monitoring component 800 is installed on the mounting cabinet 900. The flow monitoring component 800 is electrically connected to the logic control component 500. The flow monitoring component 800 is located in the middle of the second delivery pipe 330. The disinfectant flowing in the second delivery pipe 330 flows through the flow monitoring component 800 and is monitored by the flow monitoring component 800. When the logic control component 500 controls the liquid pump 310 to start, the flow monitoring component 800 monitors the disinfectant flowing in the second delivery pipe 330 in real time and feeds back the monitoring signal to the logic control component 500 to realize real-time monitoring of the working status of the delivery component 300.

[0045] According to some embodiments of this application, the control mechanism further includes a power switch assembly 600, which is mounted on the mounting cabinet 900. The power switch assembly 600 is electrically connected to the logic control assembly 500 and the liquid pump 310, providing power to both. Specifically, the positive terminal of the power switch assembly 600 is electrically connected to the positive terminal of the liquid pump 310, the negative terminal of the liquid pump 310 is electrically connected to the normally open terminal of a relay, and the common terminal of the relay is electrically connected to the negative terminal of the power switch assembly 600. Specifically, the power switch assembly 600 includes a power module (not shown) and a switch module (not shown). The switch module can control the on / off state of the power module to facilitate the control of the power supply to the logic control assembly 500 and the liquid pump 310 for maintenance during shutdown.

[0046] Furthermore, the control mechanism also includes an indicator component 700, which is mounted on the mounting cabinet 900 and electrically connected to the power switch assembly 600. Specifically, the indicator component 700 includes two indicator lights of different colors, used to indicate whether the power switch assembly 600 is operating normally or malfunctioning.

[0047] According to some embodiments of this application, a one-way valve 340 is provided at one end of the second delivery pipe 330 near the pump 310 to prevent the disinfectant from flowing back into the pump 310.

[0048] Furthermore, a shut-off valve 350 is provided at one end of the first delivery pipe 320 near the pump 310. When maintenance of the pump 310 is required, closing the shut-off valve 350 can prevent the disinfectant and its evaporated gas from entering the pump 310. In conjunction with the check valve 340, it can further ensure that no disinfectant enters the pump 310, so as to carry out maintenance of the pump 310.

[0049] Understandably, referring to Figure 1In some other embodiments, a seal 410 is provided at the connection between the first delivery pipe 320 and the storage component 400 to prevent moisture, dust or debris from entering the storage component 400 from the opening, thus ensuring the effectiveness and purity of the disinfectant; at the same time, it prevents the disinfectant and its evaporated gas from leaking to the outside of the storage component 400.

[0050] According to some embodiments of this application, the release component 200 includes spray heads 210, with multiple spray heads 210 spaced apart above the electroplating tank 100. The multiple spray heads 210 spray disinfectant at multiple locations above the electroplating tank 100, improving the uniformity of spraying and avoiding disinfection dead zones. Preferably, the multiple spray heads 210 are evenly spaced apart above the electroplating tank 100.

[0051] This application also provides an electroplating apparatus using the circuit board pattern electroplating device of this application, including a circuit board pattern electroplating apparatus, an electrolysis device, a stirring device, and a feeding / discharging device. The feeding / discharging device places the circuit board to be patterned into the electroplating tank 100. At this time, the stirring device and the electrolysis device work. Under the combined action of the stirred electroplating solution and the electrolysis device, the circuit board in the electroplating tank 100 achieves electroplating treatment. The electroplated circuit board is then removed from the electroplating tank 100 by the feeding / discharging device. The circuit board pattern electroplating apparatus can automatically add bactericidal solution to the electroplating tank 100, eliminating the need for manual addition of bactericidal agent, thus saving manpower. The logic control component 500 controls the operation of the liquid pump 310, which can control the extraction and release of bactericidal solution according to a preset logic program without manual intervention, avoiding situations where it cannot be added on time or is missed or misplaced, and reducing the risk of microbial contamination of the electroplating tank 100. The high degree of automation improves the production efficiency of pattern electroplating and saves the production cost of the pattern electroplating process.

[0052] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0053] Although embodiments of the present invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A circuit board pattern electroplating apparatus, characterized in that, include: Electroplating tank (100) is used to hold electroplating solution; The sterilization mechanism includes a release component (200), a conveying component (300), and a storage component (400). The release component (200) is disposed inside or above the electroplating tank (100). The storage component (400), the conveying component (300), and the release component (200) are connected in sequence. The control mechanism includes a logic control component (500) electrically connected to the delivery component (300) to control the delivery component (300) to deliver the bactericidal liquid stored in the storage component (400) to the release component (200).

2. The circuit board pattern electroplating apparatus according to claim 1, characterized in that, The logic control component (500) includes a logic processing module (510) and an electrical control module (520). The logic processing module (510) is electrically connected to the signal input terminal of the electrical control module (520), and the transmission component (300) is electrically connected to the output terminal of the electrical control module (520).

3. The circuit board pattern electroplating apparatus according to claim 2, characterized in that, The logic control component (500) further includes an interaction module (530), which is electrically connected to the logic processing module (510).

4. The circuit board pattern electroplating apparatus according to claim 1, characterized in that, The delivery assembly (300) includes a pump (310), a first delivery pipe (320), and a second delivery pipe (330). The storage assembly (400), the first delivery pipe (320), the pump (310), the second delivery pipe (330), and the release assembly (200) are connected in sequence. The logic control assembly (500) is electrically connected to the pump (310).

5. The circuit board pattern electroplating apparatus according to claim 4, characterized in that, The control mechanism further includes a power switch assembly (600) that is electrically connected to the logic control assembly (500) and the liquid pump (310).

6. The circuit board pattern electroplating apparatus according to claim 5, characterized in that, The control mechanism also includes an indicator component (700) electrically connected to the power switch component (600).

7. The circuit board pattern electroplating apparatus according to claim 4, characterized in that, A one-way valve (340) is provided at one end of the second delivery pipe (330) near the liquid pump (310) to prevent the disinfectant from flowing back into the liquid pump (310).

8. The circuit board pattern electroplating apparatus according to claim 7, characterized in that, A shut-off valve (350) is provided at one end of the first delivery pipe (320) near the liquid pump (310).

9. The circuit board pattern electroplating apparatus according to claim 1, characterized in that, The release assembly (200) includes spray heads (210), and a plurality of spray heads (210) are spaced apart above the electroplating tank (100).

10. An electroplating device, characterized in that, The invention includes a circuit board pattern electroplating apparatus as described in any one of claims 1 to 9.

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