Testing pressure head, crimping mechanism and chip testing device

By designing a test head with a floating structure, the problem of poor contact caused by different grain height differences was solved, achieving higher test accuracy and reliability.

CN224266867UActive Publication Date: 2026-05-22HANGZHOU CHANGCHUAN TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
HANGZHOU CHANGCHUAN TECH CO LTD
Filing Date
2025-05-30
Publication Date
2026-05-22

AI Technical Summary

Technical Problem

During chip testing, the uneven height of different chips can lead to poor contact between some chips and the pressure head, affecting the test results.

Method used

A test indenter was designed, including a main indenter and a secondary indenter. The secondary indenter is connected to the assembly base plate through a floating structure, which can float in the pressing direction to compensate for the height difference between the main grain and the secondary grain, ensuring that all grains can reliably contact each other.

Benefits of technology

This improves the accuracy and reliability of chip testing, ensuring that each die can make full contact and enhancing the accuracy of test results.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of semiconductor testing, and provides a testing pressure head, a crimping mechanism and a chip testing device. The test pressure head comprises an assembly bottom plate, an inner pressure head structure and a floating structure, the inner pressing head structure comprises a main pressing head and auxiliary pressing heads which are arranged in a spaced mode, the main pressing head is connected to the assembly bottom plate, and the auxiliary pressing heads comprise the first auxiliary pressing head and the second auxiliary pressing head which are arranged on the peripheral side of the main pressing head in a spaced mode. And the floating structure is connected between the first auxiliary pressure head and the assembly bottom plate and / or between the second auxiliary pressure head and the assembly bottom plate, and is used for driving the first auxiliary pressure head and / or the second auxiliary pressure head to generate a floating amount in the crimping direction. The utility model provides a test pressure head, which can make up for the height difference between a main crystal grain and an auxiliary crystal grain, alleviate the problem of poor contact in a crimping test process, and further improve the test precision.
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Description

Technical Field

[0001] This application relates to the field of semiconductor testing technology, and in particular to a test head, a crimping mechanism, and a chip testing device. Background Technology

[0002] With the gradual development of chip technology, the technology has evolved from one die per chip to multiple dies per chip. Among these multiple dies, one master die provides core computing power, while the other dies provide computing power for data preprocessing and other tasks, thereby reducing the computational burden on the master die.

[0003] However, during chip testing, the uneven height of different chips often leads to poor contact between some chips and the pressure head, which in turn affects the test results. Utility Model Content

[0004] Therefore, it is necessary to provide a test indenter that can compensate for the height difference between the main grain and the auxiliary grain, alleviate the problem of poor contact during the crimping test, and thus improve the test accuracy.

[0005] A test indenter includes an assembly base plate, an inner indenter structure, and a floating structure. The inner indenter structure includes a main indenter and a secondary indenter, which are arranged at intervals. The main indenter is connected to the assembly base plate. The secondary indenter includes a first secondary indenter and a second secondary indenter, which are arranged at intervals on the outer periphery of the main indenter. The floating structure is connected between the first secondary indenter and the assembly base plate and / or between the second secondary indenter and the assembly base plate, and is used to drive the first secondary indenter and / or the second secondary indenter to generate a floating amount in the pressing direction.

[0006] Understandably, the main pressure head corresponds to the crimping test of the main die, while the first and second auxiliary pressure heads work together to meet the crimping test requirements of auxiliary dies in different regions. Since the main die primarily provides core computing power, the crimping maintenance between the main pressure head and the main die is used as a benchmark. While maintaining precise crimping between the main pressure head and the main die, floating structures corresponding to the first and second auxiliary pressure heads are utilized. This allows both the first and second auxiliary pressure heads to float relative to the mounting base and the main pressure head along the crimping direction, thereby matching and compensating for the height difference between the main die and different auxiliary dies, alleviating poor contact problems during crimping tests, and ultimately improving test accuracy.

[0007] In some embodiments, at least one of the first and second auxiliary pressure heads includes a contact body, a heating element, and a floating plate. The floating plate is connected to the side of the contact body facing the assembly base plate. The floating plate is provided with a mounting groove for mounting the heating element. The mounting groove is adapted to the heating element. The floating structure is connected between the floating plate and the assembly base plate.

[0008] In some embodiments, the floating structure includes a locking member and a first elastic member; the locking member passes through the mounting base plate and is connected to the floating plate; the elastic member is pressed between the floating plate and the mounting base plate to drive the floating plate to float in the pressing direction, and the contact body floats synchronously with the corresponding floating plate.

[0009] In some embodiments, the first elastic element is an elastic thermally conductive pad.

[0010] In some embodiments, the floating structure further includes a second elastic element, which is pressed between the floating plate and the mounting base plate and is spaced apart from the first elastic element.

[0011] In some embodiments, a plurality of second elastic elements are provided, and the plurality of second elastic elements are arranged in pairs and symmetrically on opposite sides of the first elastic element.

[0012] In some embodiments, the mounting base plate is provided with mounting holes for the locking member to pass through, and the floating plate has a guide protrusion protruding on one side facing the mounting base plate. The guide protrusion is inserted into the mounting hole and connected to the locking member.

[0013] In some embodiments, the floating structure further includes a guide sleeve, which is installed in the mounting hole and sleeved on the outside of the guide protrusion and / or the locking member.

[0014] In some embodiments, there are two of each of the first and second auxiliary pressure heads. The two first auxiliary pressure heads are arranged at intervals on both sides of the main pressure head along a first direction, and the two second auxiliary pressure heads are arranged at intervals on both sides of the main pressure head along a second direction.

[0015] In some embodiments, the assembly base plate has a first region and a second region, the first region corresponding to the main pressure head and the second region corresponding to the auxiliary pressure head;

[0016] The assembly base plate has a heat insulation groove between the first region and the second region, and / or the assembly base plate has an assembly protrusion in the first region, the assembly protrusion being connected to the main pressure head.

[0017] This application also provides a crimping mechanism, including an outer crimping head structure and the aforementioned test crimping head. The outer crimping head structure includes an outer crimping head seat and a suction nozzle connected to the outer crimping head seat. The outer crimping head seat is mounted on the assembly base plate of the test crimping head and surrounds the outer periphery of the inner crimping head structure. The suction nozzle is located on the side of the outer crimping head seat facing the inner crimping head structure along the crimping direction.

[0018] This application also provides a chip testing apparatus, including a test socket, a pickup mechanism and the aforementioned crimping mechanism. The crimping mechanism is arranged opposite to and spaced apart from the test socket. The pickup mechanism is connected to the crimping mechanism and is used to drive the crimping mechanism to move closer to or further away from the test socket. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this application or the conventional technology, the drawings used in the description of the embodiments or the conventional technology will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 A schematic diagram of a test pressure head provided in another embodiment of this application;

[0021] Figure 2 A cross-sectional view of a test pressure head provided in an embodiment of this application;

[0022] Figure 3 A cross-sectional view of a test pressure head provided in another embodiment of this application;

[0023] Figure 4 A cross-sectional view of a test pressure head provided in yet another embodiment of this application;

[0024] Figure 5 A partial schematic diagram of a test indenter provided in an embodiment of this application from a top-down view;

[0025] Figure 6 A partial schematic diagram of a test indenter provided in an embodiment of this application from a low-angle view;

[0026] Figure 7 A partial cross-sectional view of a test pressure head provided in an embodiment of this application;

[0027] Figure 8 for Figure 7 A magnified view of a section at point A in the middle;

[0028] Figure 9 A partial cross-sectional view of a test pressure head provided in another embodiment of this application;

[0029] Figure 10 for Figure 9 A magnified view of a section at point B in the middle;

[0030] Figure 11 This is a partial schematic diagram of the test indenter at the assembly base plate according to an embodiment of this application;

[0031] Figure 12 for Figure 11 A magnified view of a section at point C;

[0032] Figure 13 A bottom view of a test pressure head provided in an embodiment of this application;

[0033] Figure 14 This is a schematic diagram of a crimping mechanism provided in an embodiment of this application.

[0034] Reference numerals: 10. Assembly base plate; 20. Inner pressure head structure; 21. Main pressure head; 22. Secondary pressure head; 30. Floating structure; 31. Locking element; 32. First elastic element; 33. Second elastic element; 33a. Butterfly spring; 33b. Wave spring; 34. Guide sleeve; 41. Positioning pin; 42. Positioning groove; 43. Cavity; 44. Pressing groove; 50. Heating element; 100. Test pressure head; 101. Heat insulation groove; 102. Assembly protrusion; 103. Assembly hole; 104. 105. Limiting end face; 106. Recess; 200. External pressure head structure; 210. External pressure head seat; 211. Pressing frame; 212. Assembly arm; 220. Suction nozzle; 230. Air connector; 221. First auxiliary pressure head; 222. Second auxiliary pressure head; 341. Mounting protrusion; 2201. Contact body; 2202. Heating element; 2203. Floating plate; 2204. Guide protrusion; 2205. Threaded hole; 2206. Mounting groove; 3101. Limiting protrusion. Detailed Implementation

[0035] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0036] It should be noted that when a component is referred to as being "fixed to" or "attached to" another component, it can be directly on the other component or there may be an intermediate component. When a component is considered to be "connected to" another component, it can be directly connected to the other component or there may be an intermediate component present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application's specification are for illustrative purposes only and do not represent the only possible implementation.

[0037] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0038] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature and the second feature are in indirect contact through an intermediate medium. Furthermore, "above," "over," and "on top" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0039] Unless otherwise defined, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and / or" as used in this application includes any and all combinations of one or more of the associated listed items.

[0040] Please see Figures 1 to 4 One embodiment of this application provides a test indenter, including an assembly base plate 10, an inner indenter structure 20, and a floating structure 30. The inner indenter structure 20 includes a main indenter 21 and a secondary indenter 22, which are arranged at intervals between each other. The main indenter 21 is connected to the assembly base plate 10. The secondary indenter 22 includes a first secondary indenter 221 and a second secondary indenter 222, which are arranged at intervals on the outer periphery of the main indenter 21. A floating structure 30 is connected between the first secondary indenter 221 and the assembly base plate 10, and a floating structure 30 is also connected between the second secondary indenter 222 and the assembly base plate 10. Each floating structure 30 is used to drive the corresponding first secondary indenter 221 or second secondary indenter 222 to generate a floating amount in the pressing direction.

[0041] It should be noted in advance that the pressing direction in this embodiment is vertical, i.e., the Z-axis direction. The length directions of the two adjacent sides of the main pressing head 21 are the X-axis and Y-axis directions, respectively. In some specific embodiments, the first auxiliary pressing head 221 and the second auxiliary pressing head 222 are arranged at intervals on the two adjacent sides of the main pressing head 21. For example, the first auxiliary pressing head 221 is located on one side of the main pressing head 21 along the X-axis direction, and the second auxiliary pressing head 222 is located on one side of the main pressing head 21 along the Y-axis direction. Alternatively, the first auxiliary pressing head 221 and the second auxiliary pressing head 222 are arranged at intervals on two opposite sides of the main pressing head 21. For example, the first auxiliary pressing head 221 and the second auxiliary pressing head 222 are arranged at intervals on opposite sides of the main pressing head 21 along the Y-axis direction, or on opposite sides of the main pressing head 21 along the X-axis direction.

[0042] Understandably, the assembly base plate 10 is used for the integrated assembly of the main pressure head 21 and the auxiliary pressure head 22. The main pressure head 21 corresponds to the pressing test of the main die, and the auxiliary pressure head 22 corresponds to the pressing test of the auxiliary die. Specifically, the cooperation of the first auxiliary pressure head 221 and the second auxiliary pressure head 222 can meet the pressing test of the auxiliary dies in different areas, further improving the pressing test accuracy. Since the main die mainly provides core computing power, the pressing maintenance between the main pressure head 21 and the main die is taken as the benchmark. On the basis of maintaining the precise pressing between the main pressure head 21 and the main die, the floating structures 30 corresponding to the first auxiliary pressure head 221 and the second auxiliary pressure head 222 are used respectively. This allows the first auxiliary pressure head 221 and the second auxiliary pressure head 222 to float relative to the assembly base plate 10 and the main pressure head 21 along the pressing direction, thereby matching and compensating for the height difference between the main die and different auxiliary dies, alleviating the problem of poor contact during the pressing test, and thus improving the test accuracy.

[0043] Alternatively, only the first pressure head 221 may have a floating structure 30, or only the second pressure head 222 may have a floating structure 30. As long as it can compensate for the height difference of different grains during the pressing test to improve the test accuracy, it is acceptable. This is just an example.

[0044] The following example illustrates how the first auxiliary pressure head 221 and the second auxiliary pressure head 222 are respectively equipped with floating structures 30.

[0045] Please continue reading. Figures 1 to 5 In some embodiments, both the first auxiliary pressure head 221 and the second auxiliary pressure head 222 include a contact body 2201, a heating element 2202, and a floating plate 2203. The floating plate 2203 is connected to the side of the contact body 2201 facing the mounting base plate 10, and the floating plate 2203 is provided with a mounting groove 2206 for mounting the heating element 2202, the mounting groove 2206 being adapted to the heating element 2202. A floating structure 30 is connected between the floating plate 2203 and the mounting base plate 10.

[0046] Understandably, the contact body 2201 is used to contact the auxiliary grain for pressing tests, the heating element 2202 is used for temperature control during grain testing, and the floating plate 2203 is used to cooperate with the corresponding floating structure 30. The floating plate 2203 can be fixed to the contact body 2201 with screws; therefore, when the floating plate 2203 floats under the action of the floating structure 30, it will drive the corresponding contact body 2201 to move synchronously. Of course, the floating plate 2203 can also be welded, bonded, or snap-fitted to the contact body 2201, as long as it allows for a secure connection. Simultaneously, the floating plate 2203 also has a mounting groove 2206 for accommodating the heating element 2202, thus satisfying the assembly of the heating element 2202 and meeting the temperature control requirements of the contact body 2201.

[0047] In other words, the floating plate 2203 not only meets the requirements for cooperation with the floating structure 30, but also meets the requirements for the assembly of the heating element 2202. There is no need for the contact body 2201 to be directly connected to the floating structure 30. The contact body 2201 only needs to ensure the pressure contact with the grain, thereby improving the structural strength of the contact body 2201 itself and further improving the test accuracy.

[0048] like Figure 2 and Figure 5 As shown, in some specific embodiments, the floating plate 2203 has a recessed mounting groove 2206 on the side facing the contact body 2201, so that the heating element 2202 can directly contact the contact body 2201, reducing thermal resistance. Simultaneously, a mounting groove 2206 can also be recessed on the side of the contact body 2201 facing the floating plate 2203, with the two mounting grooves 2206 arranged opposite each other to achieve assembly of the heating element 2202.

[0049] It should be noted that, as Figure 2 As shown, the main pressure head 21 is provided with a heating element 50 for temperature control, and the heating element 50 is pressed between the main pressure head 21 and the assembly base plate 10. Specifically, the main pressure head 21 and the assembly base plate 10 may both have recessed grooves on opposite sides, and the two grooves are arranged opposite each other to achieve the assembly of the heating element 50.

[0050] Both the heating element 2202 and the heating plate 50 can be ceramic heating plates.

[0051] Please see Figures 2 to 8 In some embodiments, the floating structure 30 includes a locking member 31 and a first elastic member 32. The locking member 31 passes through the mounting base plate 10 and is connected to the floating plate 2203. The first elastic member 32 is pressed between the floating plate 2203 and the mounting base plate 10 to drive the floating plate 2203 to float in the pressing direction, and the contact body 2201 floats synchronously with the corresponding floating plate 2203.

[0052] Specifically, the assembly base plate 10 is provided with an assembly hole 103 for the locking member 31 to pass through. The axial direction of the assembly hole 103 is along the Z-axis, and a limiting end face 104 is provided on the hole wall of the assembly hole 103 away from the floating plate 2203 along the Z-axis. The locking member 31 passes through the assembly hole 103 and is threadedly connected to the floating plate 2203, and a limiting protrusion 3101 is provided radially outward on one end of the locking member 31 away from the floating plate 2203 along the Z-axis. When the contact body 2201 is located below the assembly base plate 10, the limiting protrusion 3101 can abut against the limiting end face 104 to realize the assembly of the floating plate 2203 relative to the assembly base plate 10. At this time, the first auxiliary pressure head 221 and the second auxiliary pressure head 222 protrude downward from the main pressure head 21 along the Z-axis under the action of their own gravity and the action of the elastic element. There is a floating gap between the floating plate 2203 and the assembly base plate 10.

[0053] like Figures 1 to 4 As shown, during the crimping test, as the test indenter moves downward, the first sub-indenter 221 and the second sub-indenter 222 can move upward along the Z-axis to compensate for the height difference between the main grain and the auxiliary grain; and, under the action of their respective corresponding first elastic members 32, the first sub-indenter 221 and the second sub-indenter 222 have a tendency to move downward along the Z-axis, thereby ensuring that each indenter is in reliable and sufficient contact with the corresponding grain.

[0054] The size of the floating gap can be adjusted by adding a shim to the limiting protrusion 3101 of the locking member 31.

[0055] like Figure 1 , Figures 7 to 12 As shown, in some specific embodiments, the mounting base plate 10 is provided with a mounting hole 103 for the locking member 31 to pass through. The floating plate 2203 has a guide protrusion 2204 protruding from one side facing the mounting base plate 10. The guide protrusion 2204 is inserted into the mounting hole 103 and connected to the locking member 31. Specifically, the floating plate 2203 is provided with a threaded hole 2205 for threaded connection with the locking member 31, and the guide protrusion 2204 protrudes from the edge of the threaded hole 2205 toward the mounting base plate 10.

[0056] In other words, by utilizing the insertion and engagement of the guide protrusion 2204 with the assembly hole 103, when the floating plate 2203 floats relative to the assembly base plate 10 along the Z-axis, the guide protrusion 2204 can move within the assembly hole 103 along the Z-axis, thereby guiding the floating of the floating plate 2203. This ensures the stability of the first and second auxiliary pressure heads 221 and 222 during the floating process, reduces the horizontal offset of the first and second auxiliary pressure heads 221 and 222, and improves the alignment accuracy with the auxiliary die. Simultaneously, the guide protrusion 2204 increases the connection area between the floating plate 2203 and the locking member 31, thereby improving the connection reliability.

[0057] like Figures 7 to 12 As shown, the floating structure 30 further includes a guide sleeve 34, which is installed inside the mounting hole 103 and sleeved on the outside of the guide protrusion 2204 and / or the locking member 31. That is, by utilizing the cooperation of the guide sleeve 34 with the guide protrusion 2204 and the locking member 31, the guiding effect is further enhanced, thereby increasing the stability of the floating plate 2203 during floating and reducing the risk of swaying or displacement during floating. The guide sleeve 34 can also reduce the friction between the guide protrusion 2204 and the wall of the mounting hole 103, and between the locking member 31 and the wall of the mounting hole 103, thereby extending the service life.

[0058] like Figure 8 As shown, the guide sleeve 34 has a radially outward protruding mounting protrusion 341 at one end away from the floating plate 2203, which is adapted to the upper limit protrusion 3101 of the locking member 31. The mounting protrusion 341 is pressed against the limiting end face 104 of the assembly hole 103 and abuts against the limiting protrusion 3101. It can also buffer and absorb vibration when the limiting protrusion 3101 abuts against the limiting end face 104, further improving the stability of the entire test head.

[0059] Please see Figure 1 , Figure 9 and Figure 10 Alternatively, a groove 105 is provided on the side of the mounting hole 103 facing the floating plate 2203, and a mounting protrusion 341 is provided radially outward on one end of the guide sleeve 34 facing the floating plate 2203, with the mounting protrusion 341 confined within the groove 105. It is understandable that because the secondary pressure head 22 moves towards the side closer to the mounting base plate 10 along the Z-axis due to contact with the grains during pressing, the guide protrusion 2204 and the guide sleeve 34 are in a state of sliding friction. With the increase in the number of pressing tests, the guide sleeve 34 may slide out towards the mounting base plate 10 away from the secondary pressure head 22 under the friction of the guide protrusion 2204, affecting the assembly stability of the guide sleeve 34. Therefore, the abutment between the mounting protrusion 341 and the bottom wall of the groove 105 can be used to limit the slippage of the guide sleeve 34 along the Z-axis away from the secondary pressure head 22, improving the assembly reliability of the guide sleeve 34.

[0060] In some embodiments, the first elastic element 32 is an elastic thermally conductive pad. It is understood that the elastic thermally conductive pad not only satisfies the requirement for elastic floating but also provides thermal conductivity, thereby simplifying the structure. The elastic thermally conductive pad can be made of a thermal interface material, such as thermally conductive rubber, thermally conductive silicone rubber, indium-based alloy sheets, graphene thermally conductive pads, etc.; or the elastic thermally conductive pad may include a sponge and a graphite layer covering the outside of the sponge. It is only necessary to achieve both elastic floating and thermal conductivity; this is merely an example.

[0061] like Figure 1 , Figure 6 and Figure 11 As shown, specifically, both the floating plate 2203 and the mounting base plate 10 may have pressing grooves 44 on opposite sides for positioning and assembling the elastic thermal pad. Alternatively, only the floating plate 2203 or only the mounting base plate 10 may have pressing grooves 44, as long as it ensures that the elastic thermal pad is stably pressed between the floating plate 2203 and the mounting base plate 10 and reduces offset.

[0062] Please see Figure 1 , Figure 3 and Figure 4 In some embodiments, multiple first elastic elements 32 are provided and arranged at intervals. Alternatively, the multiple first elastic elements 32 can be arranged symmetrically with respect to the central axis of the pressing surface of the secondary pressure head 22, that is, symmetrically with respect to the central axis of the contact body 2201 in the secondary pressure head 22. Taking the first secondary pressure head 221 as an example, two first elastic elements 32 are provided, and the two first elastic elements 32 are arranged symmetrically along the X-axis with respect to the central axis of the corresponding contact body 2201. Alternatively, multiple first elastic elements 32 can be evenly distributed at intervals along the length direction (i.e., the Y-axis direction) of the first secondary pressure head 221, and the multiple first elastic elements 32 can be arranged symmetrically along the Y-axis with respect to the central axis of the corresponding contact body 2201. Taking the second auxiliary pressure head 222 as an example, two first elastic elements 32 can be arranged at intervals along the Y-axis direction, and the two first elastic elements 32 are also arranged symmetrically; or, three first elastic elements 32 can be arranged at intervals along the Y-axis direction, with the two first elastic elements 32 on both sides symmetrically arranged on both sides of the middle first elastic element 32 along the Y-axis direction, and the central axis of the middle first elastic element 32 coincides with the central axis of the contact body 2201 corresponding to the second auxiliary pressure head 222.

[0063] Please see Figure 6 , Figure 7 , Figure 8 , Figure 11 and Figure 12 In some embodiments, the floating structure 30 further includes a second elastic element 33, which is pressed between the floating plate 2203 and the mounting base plate 10 and spaced apart from the first elastic element 32. It is understood that the second elastic element 33 and the first elastic element 32, operating independently yet in cooperation, provide more stable floating support for the floating plate 2203, further enhancing the floating effect. This allows the test indenter to make more accurate contact with the grains during the pressing test, thereby improving the accuracy and reliability of the test.

[0064] The second elastic element 33 is a spring, such as a disc spring, a linear spring, or a wave spring.

[0065] like Figure 1 , Figure 6 and Figure 11 As shown, in some embodiments, multiple second elastic elements 33 are provided, and two of the multiple second elastic elements 33 are arranged symmetrically on both sides of the first elastic element 32. This arrangement is more conducive to the uniform force distribution on the first auxiliary pressure head 221 and the second auxiliary pressure head 222, thereby improving the pressing stability. Taking the first auxiliary pressure head 221 located on one side of the main pressure head 21 along the X-axis and the second auxiliary pressure head 222 located on one side of the main pressure head 21 along the Y-axis as an example, the shape of the first elastic element 32 is adapted to the shape of the first auxiliary pressure head 221, and the second elastic elements 33 are provided on both sides of the first auxiliary pressure head 221 along the Y-axis, with the two second elastic elements 33 arranged symmetrically about the central axis of the first elastic element 32. As for the second auxiliary pressure head 222, the corresponding first elastic element 32 is provided on both sides along the X-axis.

[0066] The line connecting the two symmetrical second elastic elements 33 can pass through the central axis of the first elastic element 32, or it can be located in two parallel planes separate from the central axis of the first elastic element 32. This is only an example.

[0067] like Figure 1 , Figure 6 , Figure 11 and Figure 12 As shown, in some specific embodiments, there are two first auxiliary pressure heads 221 and two auxiliary pressure heads 222. The two first auxiliary pressure heads 221 are arranged at intervals on both sides of the main pressure head 21 along a first direction, and the two second auxiliary pressure heads 222 are arranged at intervals on both sides of the main pressure head 21 along a second direction. The first direction is the X-axis direction, and the second direction is the Y-axis direction. The cross-sections of the first auxiliary pressure head 221 and the second auxiliary pressure head 222 are both rectangular. The length of the first auxiliary pressure head 221 extends along the Y-axis direction, and the length of the second auxiliary pressure head 222 extends along the X-axis direction. The two second elastic elements 33 can be respectively disposed on both sides of the corresponding auxiliary pressure head 22 along its length direction and arranged symmetrically.

[0068] Based on the two first auxiliary pressure heads 221 symmetrically arranged on opposite sides of the main pressure head 21, and the two second auxiliary pressure heads 222 symmetrically arranged on the other opposite sides of the main pressure head 21, the sides of the main pressure head 21 can apply force evenly to each side during the pressing test, which is beneficial to improving the overall force application or unloading effect of the structure.

[0069] In some other specific embodiments, the second elastic element 33 corresponding to the first auxiliary pressure head 221 can be a butterfly spring 33a, and the second elastic element 33 corresponding to the second auxiliary pressure head 222 can be a wave spring 33b.

[0070] like Figure 7 , Figure 8 , Figure 11and Figure 12 As shown, in some embodiments, one of the mounting base plate 10 and the floating plate 2203 is provided with a positioning post 41, and the other is provided with a positioning groove 42. The positioning post 41 is inserted into the positioning groove 42, and the second elastic member 33 is sleeved on the outside of the positioning post 41. That is to say, by using the insertion and cooperation of the positioning post 41 and the positioning groove 42, the guiding effect is further enhanced; and, through the cooperation of the positioning post 41 and the second elastic member 33, the second elastic member 33 plays a radial support role, reducing the risk of the second elastic member 33 tilting during the floating process, thereby improving the floating stability.

[0071] Furthermore, one of the assembly base plate 10 and the floating plate 2203 is provided with a cavity 43, and a portion of the second elastic element 33 is accommodated within the cavity 43 and abuts against the bottom wall of the cavity 43. That is, by utilizing the combined action of the cavity 43 and the positioning post 41, the radial tilt of the second elastic element 33 is limited in both directions, further improving stability. Simultaneously, the cavity 43 increases the assembly space between the floating plate 2203 and the assembly base plate 10 for assembling the second elastic element 33; thus, it not only avoids excessive compression of the second elastic element 33 but also facilitates overcoming the elastic effect of the second elastic element 33 during pressing, thereby extending its service life while facilitating floating.

[0072] In some specific embodiments, the mounting base plate 10 has a recessed cavity 43 on the side facing the floating plate 2203, and the positioning post 41 protrudes from the bottom wall of the cavity 43 along the Z-axis direction and extends out of the cavity 43. The floating plate 2203 has a recessed positioning groove 42 on the side facing the mounting base plate 10, and the end of the positioning post 41 away from the cavity 43 is inserted into the positioning groove 42.

[0073] like Figure 1 , Figure 11 and Figure 13 As shown, in some embodiments, the assembly base plate 10 has a first region and a second region, the first region corresponding to the main pressure head 21 and the second region corresponding to the auxiliary pressure head 22. A heat insulation groove 101 is provided between the first and second regions of the assembly base plate 10 to reduce the heat control impact between the main pressure head 21 and the auxiliary pressure head 22. Simultaneously, an assembly protrusion 102 is provided on the first region of the assembly base plate 10, and the assembly protrusion 102 is connected to the main pressure head 21. The assembly protrusion 102 can be fastened to the main pressure head 21 with screws. Both sides of the assembly protrusion 102 along the X-axis direction are provided with bosses for matching and limiting the main pressure head 21, improving assembly reliability and accuracy. At the same time, the assembly bosses compensate for the height gap at the main pressure head 21 where there is no floating plate 2203, thereby reducing the height difference between the pressing surfaces of the main pressure head 21 and the auxiliary pressure head 22 in the Z-axis direction.

[0074] The pressing surface is the side that directly contacts the grain.

[0075] Alternatively, an insulation groove may not be installed between the first and second zones. This is merely an example.

[0076] like Figure 1 and Figure 4 As shown, in some embodiments, the mounting protrusion 102 on the mounting base plate 10 for connecting the main pressure head 21 has recesses 106 on both sides along the Y-axis direction. The recesses 106 are recessed in the Y-axis direction away from the second auxiliary pressure head 222. By setting the recesses 106, the space occupied by the mounting protrusion 102 in the Y-axis direction is reduced, thereby increasing the assembly space between the second auxiliary pressure head 222 and the mounting base plate 10. The end of the second auxiliary pressure head 222 that is connected to the mounting base plate 10 protrudes in the Y-axis direction towards the main pressure head 21, which is more conducive to pressing more first elastic members 32 between the second auxiliary pressure head 222 and the mounting base plate 10.

[0077] Specifically, the floating plate 2203 corresponding to the second auxiliary pressure head 222 may extend along the Y-axis toward the side closer to the main pressure head 21 and extend into the aforementioned recess 106. At the same time, the recess 106 is located at the position where the mounting protrusion 102 is away from the main pressure head 21 along the Z-axis, ensuring that the mating range between the mounting protrusion 102 and the main pressure head 21 is not affected.

[0078] like Figure 1 and Figure 14 Furthermore, another embodiment of this application provides a crimping mechanism, including an outer crimping head structure 200 and the aforementioned test crimping head 100. The outer crimping head structure 200 includes an outer crimping head base 210 and a suction nozzle 220 connected to the outer crimping head base 210. The outer crimping head base 210 is mounted on the mounting base plate 10 of the test crimping head 100 and surrounds the outer periphery of the inner crimping head structure 20. The suction nozzle 220 is located on the side of the outer crimping head base 210 facing the inner crimping head structure 200 along the crimping direction. In actual use, the chip is placed inside the frame, and the frame can be crimped and positioned by the outer crimping head structure 200, thereby improving the crimping accuracy between the chip and the inner crimping head structure 20.

[0079] Specifically, the external pressure head base 210 includes a pressing frame 211 and an assembly arm 212 connected to the pressing frame 211. The projection of the pressing frame 211 along the Z-axis is annular, and it protrudes from the assembly arm 212 along the Z-axis. Multiple suction nozzles 220 are connected to the protruding ends of the pressing frame 211 relative to the assembly arm 212, and are symmetrically arranged on opposite sides of the main pressure head 21 to ensure uniform force distribution. The pressing frame 211 and the assembly arm 212 are integrally formed and have air passages connecting to the suction nozzles 220. These air passages are connected to an external air source via air connectors 230. The assembly arm 212 is connected to the assembly base plate 10 and is used for connection to other structures connected to the test pressure head.

[0080] In some specific embodiments, the crimping frame 211 has assembly arms 212 on both sides along the X-axis, and the length of each assembly arm 212 extends along the Y-axis. The assembly base plate 10 has a first slot on the side facing the inner pressure head structure 20 along the crimping direction, and each assembly arm 212 has a corresponding second slot. The assembly and positioning of the assembly arm 212 and the assembly base plate 10 are achieved through the engagement of the first and second slots. Furthermore, the assembly arm 212 and the assembly base plate 10 are fixed by screws or other structures. This satisfies the assembly requirements of the outer pressure head structure 200 and the test pressure head 100.

[0081] like Figure 1 and Figure 14 As shown, this application also provides a chip testing device, including a test socket, a pickup mechanism and the aforementioned test head. The test head is opposite to the test socket and the pickup mechanism is arranged at intervals on the mounting base 10 of the test head, which is used to drive the test head to move closer to or further away from the test socket.

[0082] In practical use, the test holder is positioned below the test head along the Z-axis. The test holder has a test cavity where the chip can be placed, for example, by vacuum adsorption. When testing is required, the test head moves downward along the Z-axis, causing the main pressure head 21 and the secondary pressure head 22 to face the main die and auxiliary die respectively, thus satisfying the crimping test. Because the secondary pressure head 22 has a corresponding floating structure 30, it can compensate for the height difference between the main die and the auxiliary die, ensuring reliable and sufficient contact between the main pressure head 21 and the secondary pressure head 22 and their respective dies, thereby improving test accuracy.

[0083] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0084] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the scope of protection of this application. Therefore, the patent protection scope of this application should be determined by the appended claims.

Claims

1. A test pressure head, characterized in that, include: Assemble the base plate (10); The internal pressure head structure (20) includes a main pressure head (21) and a secondary pressure head (22), which are arranged at intervals. The main pressure head (21) is connected to the assembly base plate (10). The secondary pressure head (22) includes a first secondary pressure head (221) and a second secondary pressure head (222), which are arranged at intervals on the outer periphery of the main pressure head (21). A floating structure (30) is connected between the first auxiliary pressure head (221) and the assembly base plate (10) and / or between the second auxiliary pressure head (222) and the assembly base plate (10), for driving the first auxiliary pressure head (221) and / or the second auxiliary pressure head (222) to float in the pressing direction.

2. The test indenter according to claim 1, characterized in that, At least one of the first auxiliary pressure head (221) and the second auxiliary pressure head (222) includes a contact body (2201), a heating element (2202) and a floating plate (2203). The floating plate (2203) is connected to the side of the contact body (2201) facing the assembly base plate (10). The floating plate (2203) is provided with a mounting groove (2206) for mounting the heating element (2202). The mounting groove (2206) is adapted to the heating element (2202). The floating structure (30) is connected between the floating plate (2203) and the assembly base plate (10).

3. The test indenter according to claim 2, characterized in that, The floating structure (30) includes: The locking element (31) passes through the mounting base plate (10) and is connected to the floating plate (2203); The first elastic element (32) is pressed between the floating plate (2203) and the assembly base plate (10) to drive the floating plate (2203) to float in the pressing direction, and the contact body (2201) floats synchronously with the corresponding floating plate (2203).

4. The test indenter according to claim 3, characterized in that, The first elastic element (32) is an elastic thermally conductive pad.

5. The test indenter according to claim 3, characterized in that, The floating structure (30) further includes a second elastic element (33), which is pressed between the floating plate (2203) and the assembly base plate (10) and is arranged at intervals from the first elastic element (32).

6. The test indenter according to claim 5, characterized in that, The second elastic element (33) is provided in multiple ways, and among the multiple second elastic elements (33), two are arranged in pairs and symmetrically on opposite sides of the first elastic element (32).

7. The test indenter according to claim 3, characterized in that, The mounting base plate (10) is provided with mounting holes (103) for the locking member (31) to pass through. The floating plate (2203) has a guide protrusion (2204) protruding on one side facing the mounting base plate (10). The guide protrusion (2204) is inserted into the mounting hole (103) and connected to the locking member (31).

8. The test indenter according to claim 7, characterized in that, The floating structure (30) also includes a guide sleeve (34), which is installed in the assembly hole (103) and sleeved on the outside of the guide protrusion (2204) and / or the locking member (31).

9. The test indenter according to claim 1, characterized in that, There are two of each of the first auxiliary pressure head (221) and the second auxiliary pressure head (222). The two first auxiliary pressure heads (221) are arranged at intervals on both sides of the main pressure head (21) along the first direction, and the two second auxiliary pressure heads (222) are arranged at intervals on both sides of the main pressure head (21) along the second direction.

10. The test indenter according to claim 1, characterized in that, The assembly base plate (10) has a first region and a second region, the first region corresponding to the main pressure head (21) and the second region corresponding to the auxiliary pressure head (22). The assembly base plate (10) is provided with a heat insulation groove (101) between the first region and the second region, and / or, the assembly base plate (10) is provided with an assembly protrusion (102) in the first region, and the assembly protrusion (102) is connected to the main pressure head (21).

11. A crimping mechanism, characterized in that, include: The test indenter according to any one of claims 1 to 10; The external pressure head structure (200) includes an external pressure head seat (210) and a suction nozzle (220) connected to the external pressure head seat (210). The external pressure head seat (210) is mounted on the mounting base plate (10) of the test pressure head (100) and surrounds the outer periphery of the inner pressure head structure (20). The suction nozzle (220) is located on the side of the external pressure head seat (210) facing the inner pressure head structure (20) along the pressing direction.

12. A chip testing device, characterized in that, The device includes a test base, a pickup mechanism, and a crimping mechanism as described in claim 11. The crimping mechanism is arranged opposite to and spaced apart from the test base. The pickup mechanism is connected to the crimping mechanism and is used to drive the crimping mechanism to move closer to or further away from the test base.