A solder paste uniform mixing device

Abstract

This invention provides a solder paste uniform mixing device, belonging to the technical field of mixing equipment. It includes a frame and a mounting plate installed on top of the frame, and further includes: a reciprocating oscillating mechanism mounted on the mounting plate, with a fixed ring connected to the oscillating end of the mechanism; an outer cylinder detachably connected to the inner wall of the fixed ring; and an inner cylinder fixedly installed on the inner wall of the outer cylinder, forming a closed chamber between them. A uniformly distributed distribution pipe is fixedly connected to the outer wall of the inner cylinder. The inner cylinder wall has a first unidirectional air outlet communicating with the distribution pipes. A hollow ventilation pipe is fixedly connected to the center of the bottom of the inner cylinder, with one end of the hollow ventilation pipe passing through the inner cylinder and communicating with the distribution pipes. This invention, through its unique double-layer structure design and airflow mixing method, achieves uniform mixing and stable temperature control of the solder paste, improving its performance and soldering quality.

Description

Technical Field

[0001] This utility model relates to the field of mixing equipment technology, and more specifically, to a solder paste uniform mixing device. Background Technology

[0002] Solder paste is a very important and indispensable raw material, as it is mainly composed of tiny spherical metallic lead-tin alloy or other tin alloys and flux.

[0003] In the electronics manufacturing industry, the uniformity and temperature stability of solder paste directly affect soldering quality. Traditional mixing devices often focus only on mechanical stirring, neglecting temperature control of the solder paste during storage and mixing. Too low a temperature leads to increased viscosity and reduced flowability, affecting printing results; while too high a temperature may accelerate solder paste oxidation, reducing soldering performance. Furthermore, the structural design of existing devices may result in solder paste residue and uneven mixing, failing to meet the demands of high-precision electronics manufacturing.

[0004] Therefore, there is an urgent need for a solder paste mixing device that can simultaneously achieve uniform mixing and precise temperature control. Utility Model Content

[0005] The purpose of this invention is to achieve uniform mixing and stable temperature control of solder paste through a unique double-layer structure design and airflow stirring method, thereby improving the performance of solder paste and the quality of soldering.

[0006] To achieve the above-mentioned objectives, this utility model provides the following technical solution:

[0007] A solder paste mixing device is used to improve the above-mentioned problems.

[0008] The present invention is as follows:

[0009] Including the rack and the mounting plate mounted on top of the rack, and also including:

[0010] A reciprocating swing mechanism is mounted on a mounting plate, and a fixed ring is connected to the swing end of the reciprocating swing mechanism;

[0011] The outer cylinder is detachably connected to the inner wall of the fixing ring;

[0012] The inner cylinder is fixedly installed on the inner side wall of the outer cylinder, forming a closed chamber between the inner cylinder and the outer cylinder. The outer side wall of the inner cylinder is fixedly connected with evenly distributed diversion pipes. The inner cylinder wall has a first one-way air outlet communicating with the diversion pipes. The bottom center of the inner cylinder is fixedly connected with a hollow ventilation pipe. One end of the hollow ventilation pipe passes through the inner cylinder and communicates with the diversion pipes. The outer side wall of the hollow ventilation pipe is provided with evenly distributed second one-way air outlets.

[0013] An air blowing mechanism is installed on the top of the mounting plate, and the air outlet of the air blowing mechanism is connected to the diversion pipe.

[0014] As a preferred technical solution of this utility model, the reciprocating swing mechanism includes a U-shaped rod rotatably connected to one end of the mounting plate, a fixing ring fixedly installed on the vertical section of the U-shaped rod, and a drive rotating arm driven by a servo motor provided at the end of the mounting plate away from the U-shaped rod. A connecting rod is rotatably connected between the drive rotating arm and the vertical section of the U-shaped rod.

[0015] As a preferred technical solution of this utility model, the inner wall of the outer cylinder is fixedly connected with uniformly distributed electric heating tubes.

[0016] As a preferred technical solution of this utility model, the air blowing mechanism includes a transfer box installed on the top of the mounting plate. A booster pump is fixedly connected to the top of the transfer box. A booster pipe is connected between the air outlet of the booster pump and the air inlet of the transfer box. An air supply pipe is connected to the air outlet of the transfer box. A positioning groove is provided on the outer wall of the outer cylinder. The end of the air supply pipe away from the transfer box passes through the positioning groove and communicates with the diversion pipe. A wear-resistant layer is provided on the groove wall of the positioning groove.

[0017] As a preferred technical solution of this utility model, the inner sidewall of the transfer box is provided with staggered heating plates.

[0018] As a preferred technical solution of this utility model, the bottom of the frame is provided with leveling feet.

[0019] As a preferred technical solution of this utility model, the airflows flowing out of the first unidirectional air outlet and the second unidirectional air outlet both form swirling flow.

[0020] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0021] In the solution of this utility model:

[0022] 1. The reciprocating swing mechanism drives the outer and inner cylinders to swing back and forth. At the same time, the first and second one-way air outlets on the inner cylinder emit swirling airflows in opposite directions, which stir the solder paste from different directions. This breaks the limitations of the traditional single stirring method and makes the solder paste subject to stirring in multiple dimensions, effectively improving the uniformity of solder paste stirring.

[0023] 2. The heating element on the inner wall of the outer cylinder heats the chamber between the inner and outer cylinders, forming an insulation layer to reduce heat loss from the solder paste inside the inner cylinder. The heating plate on the inner wall of the transfer box in the air blowing mechanism preheats the incoming airflow, ensuring a suitable temperature for the gas entering the inner cylinder. This dual temperature control method precisely regulates and maintains the temperature of the solder paste during the mixing process, preventing changes in solder paste properties due to unsuitable temperature and ensuring the performance of the solder paste.

[0024] 3. The detachable connection between the outer cylinder and the fixing ring facilitates cleaning, maintenance, and component replacement, improving ease of use and extending the device's lifespan. The leveling feet at the bottom of the frame allow for horizontal adjustment of the device according to actual usage scenarios, enhancing its adaptability and stability. Attached Figure Description

[0025] Figure 1 One of the overall structural schematic diagrams of the solder paste uniform stirring device provided by this utility model;

[0026] Figure 2 A second schematic diagram of the overall structure of the solder paste uniform stirring device provided by this utility model;

[0027] Figure 3 This is a front view of the solder paste uniform mixing device provided by this utility model;

[0028] Figure 4 One of the schematic diagrams showing the connection structure between the inner cylinder and the distribution pipe of the solder paste uniform stirring device provided by this utility model;

[0029] Figure 5 Schematic diagram 2 of the connection structure between the inner cylinder and the distribution pipe of the solder paste uniform stirring device provided by this utility model;

[0030] Figure 6 A cross-sectional view of the transfer box of the solder paste uniform mixing device provided by this utility model;

[0031] Figure 7 A schematic diagram of the outer cylinder of the solder paste uniform stirring device provided by this utility model.

[0032] The image shows:

[0033] 10. Frame; 110. Reciprocating swing mechanism of mounting plate; 210. Fixing ring; 220. U-shaped rod; 230. Drive rotating arm; 240. Connecting rod; 30. Outer cylinder; 310. Heating tube; 40. Inner cylinder; 410. Diverter pipe; 420. First one-way air outlet; 430. Hollow ventilation pipe; 440. Second one-way air outlet; 50. Air blowing mechanism; 510. Transfer box; 520. Booster pump; 530. Booster pipe; 540. Air delivery pipe; 550. Heating plate. Detailed Implementation

[0034] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model.

[0035] Therefore, the following detailed description of the embodiments of this utility model is not intended to limit the scope of the claimed utility model, but merely to illustrate some embodiments of the utility model. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without inventive effort are within the scope of protection of this utility model.

[0036] It should be noted that, unless otherwise specified, the embodiments and features and technical solutions in the present invention can be combined with each other.

[0037] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0038] like Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 and Figure 7 As shown, this embodiment proposes a solder paste uniform mixing device, including a frame 10 and a mounting plate 110 mounted on the top of the frame 10, and further including:

[0039] A reciprocating swing mechanism 20 is mounted on a mounting plate 110, and a fixed ring 210 is connected to the swing end of the reciprocating swing mechanism 20.

[0040] The outer cylinder 30 is detachably connected to the inner wall of the fixing ring 210;

[0041] The inner cylinder 40 is fixedly installed on the inner side wall of the outer cylinder 30, forming a closed chamber between the inner cylinder 40 and the outer cylinder 30. The outer side wall of the inner cylinder 40 is fixedly connected with a uniformly distributed diversion pipe 410. The inner cylinder 40 has a first one-way air outlet 420 that communicates with the diversion pipe 410 on its cylinder wall. The bottom center of the inner cylinder 410 is fixedly connected to a hollow ventilation pipe 430. One end of the hollow ventilation pipe 430 passes through the inner cylinder 40 and communicates with the diversion pipe 410. The outer side wall of the hollow ventilation pipe 430 is provided with a uniformly distributed second one-way air outlet 440.

[0042] The air blowing mechanism 50 is installed on the top of the mounting plate 110, and the air outlet of the air blowing mechanism 50 is connected to the diversion pipe 410.

[0043] like Figure 1 , Figure 2 and Figure 3 As shown, the reciprocating oscillating mechanism 20 includes a U-shaped rod 220 rotatably connected to one end of the mounting plate 110. A fixing ring 210 is fixedly installed on the vertical section of the U-shaped rod 220. A drive rotating arm 230 driven by a servo motor is provided at the end of the mounting plate 110 away from the U-shaped rod 220. A connecting rod 240 is rotatably connected between the drive rotating arm 230 and the vertical section of the U-shaped rod 220. When the servo motor in the reciprocating oscillating mechanism 20 is started, the servo motor drives the drive rotating arm 230 to rotate. Under the action of the connecting rod 240, the U-shaped rod 220 drives the fixing ring 210, the outer cylinder 30 and the inner cylinder 40 to perform reciprocating oscillating motion, which further enhances the stirring effect of the solder paste.

[0044] like Figure 7 As shown, evenly distributed heating elements 310 are fixedly connected to the inner wall of the outer cylinder 30. Based on the characteristics of the solder paste and usage requirements, the heating temperature of the heating elements 310 on the inner wall of the outer cylinder 30, and the preheating temperature of the heating plate 550 on the inner wall of the transfer box 510 are set. The heating elements 310 and the heating plate 550 are turned on to preheat the chamber between the inner cylinder 40 and the outer cylinder 30, as well as the air blowing mechanism, so that the inner cylinder reaches a suitable temperature.

[0045] like Figure 1 , Figure 2 and Figure 3 As shown, the air blowing mechanism 50 includes a transfer box 510 mounted on the top of the mounting plate 110. A booster pump 520 is fixedly connected to the top of the transfer box 510. A booster pipe 530 is connected between the air outlet of the booster pump 520 and the air inlet of the transfer box 510. An air supply pipe 540 is connected to the air outlet of the transfer box 510. A positioning groove is provided on the outer wall of the outer cylinder 30. The end of the air supply pipe 540 away from the transfer box 510 passes through the positioning groove and communicates with the diversion pipe 410. The groove wall of the positioning groove is provided with a wear-resistant layer. When the booster pump 520 in the air blowing mechanism 50 is turned on, the booster pump 520 pressurizes the gas into the transfer box 510 through the booster pipe 530. The gas, after being preheated by the heating plate 550, enters the diversion pipe 410 through the air supply pipe 540 and then flows out from the first unidirectional air outlet 420 and the second unidirectional air outlet 440 respectively, forming a swirling airflow to stir the solder paste.

[0046] like Figure 6 As shown, the inner wall of the transfer box 510 is provided with staggered heating plates 550.

[0047] like Figure 1 , Figure 2 and Figure 3As shown, the bottom of the frame 10 is equipped with leveling feet.

[0048] like Figure 5 As shown, the airflows from the first one-way air outlet 420 and the second one-way air outlet 440 both form swirling flow.

[0049] Specifically, when this solder paste uniform mixing device is in operation: place the frame 10 on a horizontal ground, adjust the leveling feet at the bottom of the frame 10 to make the device horizontal and ensure stable operation, install the outer cylinder 30 on the inner wall of the fixing ring 210 to ensure a firm connection, check whether the connections between each component are secure, whether the electrical wiring is connected correctly, and ensure that the electrical components such as the booster pump 520 in the air blowing mechanism 50, the heating tube 310 on the inner wall of the outer cylinder 30, and the heating plate 550 on the inner wall of the transfer box 510 can work normally;

[0050] Based on the characteristics and usage requirements of the solder paste, the heating temperature of the heating element 310 on the inner wall of the outer cylinder 30 and the preheating temperature of the heating plate 550 on the inner wall of the transfer box 510 are set. The heating element 310 and the heating plate 550 are turned on to preheat the chamber between the inner and outer cylinders and the air blowing mechanism, so that the inner cylinder reaches a suitable temperature.

[0051] The solder paste to be mixed is loaded into the inner cylinder 40 through the feed port at the top of the inner cylinder 40, and the feed port is sealed after the filling is completed.

[0052] The booster pump 520 in the air blowing mechanism 50 is turned on. The booster pump 520 forces gas into the transfer box 510 through the booster pipe 530. After being preheated by the heating plate 550, the gas enters the split pipe 410 through the air supply pipe 540, and then flows out from the first one-way air outlet 420 and the second one-way air outlet 440 respectively, forming a swirling airflow to stir the solder paste. At the same time, the servo motor in the reciprocating swing mechanism 20 is started. The servo motor drives the drive rotating arm 230 to rotate. Under the action of the connecting rod 240, the U-shaped rod 220 drives the fixed ring 210, the outer cylinder 30 and the inner cylinder 40 to perform reciprocating swing motion, further enhancing the stirring effect of the solder paste.

[0053] After mixing is complete, turn off the booster pump 520, servo motor, heating element 310, and heating plate 550. Open the discharge port 460 at the top of the inner cylinder 40 and pour out the mixed solder paste;

[0054] Periodically remove the outer cylinder 30 from the retaining ring 210 and clean all parts of the device for future use.

[0055] All technical features in this embodiment can be freely combined according to actual needs.

[0056] The above embodiments are preferred implementations of this utility model. In addition, this utility model can also be implemented in other ways. Any obvious substitutions without departing from the concept of this technical solution are within the protection scope of this utility model.

Claims

1. A solder paste uniform mixing device, comprising a frame (10) and a mounting plate (110) mounted on the top of the frame (10), characterized in that, Also includes: A reciprocating swing mechanism (20) is mounted on a mounting plate (110), and a fixed ring (210) is connected to the swing end of the reciprocating swing mechanism (20). Outer cylinder (30), which is detachably connected to the inner wall of the fixing ring (210); The inner cylinder (40) is fixedly installed on the inner side wall of the outer cylinder (30), forming a closed chamber between the inner cylinder (40) and the outer cylinder (30). The outer side wall of the inner cylinder (40) is fixedly connected with a uniformly distributed diversion pipe (410). The inner cylinder (40) has a first one-way air outlet (420) communicating with the diversion pipe (410) on its cylinder wall. The bottom center of the inner cylinder (40) is fixedly connected with a hollow ventilation pipe (430). One end of the hollow ventilation pipe (430) passes through the inner cylinder (40) and communicates with the diversion pipe (410). The outer side wall of the hollow ventilation pipe (430) is provided with a uniformly distributed second one-way air outlet (440). An air blowing mechanism (50) is installed on the top of the mounting plate (110), and the air outlet of the air blowing mechanism (50) is connected to the diversion pipe (410).

2. The solder paste uniform mixing device according to claim 1, characterized in that, The reciprocating swing mechanism (20) includes a U-shaped rod (220) rotatably connected to one end of the mounting plate (110), a fixing ring (210) fixedly installed on the vertical section of the U-shaped rod (220), and a drive rotating arm (230) driven by a servo motor is provided at the end of the mounting plate (110) away from the U-shaped rod (220). A connecting rod (240) is rotatably connected between the drive rotating arm (230) and the vertical section of the U-shaped rod (220).

3. The solder paste uniform mixing device according to claim 1, characterized in that, The inner wall of the outer cylinder (30) is fixedly connected with uniformly distributed electric heating tubes (310).

4. The solder paste uniform mixing device according to claim 1, characterized in that, The air blowing mechanism (50) includes a transfer box (510) installed on the top of the mounting plate (110). A booster pump (520) is fixedly connected to the top of the transfer box (510). A booster pipe (530) is connected between the air outlet of the booster pump (520) and the air inlet of the transfer box (510). An air supply pipe (540) is connected to the air outlet of the transfer box (510). A positioning groove is provided on the outer wall of the outer cylinder (30). The end of the air supply pipe (540) away from the transfer box (510) passes through the positioning groove and communicates with the diversion pipe (410). A wear-resistant layer is provided on the groove wall of the positioning groove.

5. The solder paste uniform mixing device according to claim 4, characterized in that, The inner wall of the transfer box (510) is provided with staggered heating plates (550).

6. The solder paste uniform stirring device according to claim 1, characterized in that, The bottom of the frame (10) is provided with leveling feet.

7. The solder paste uniform mixing device according to claim 1, characterized in that, The airflows from the first one-way air outlet (420) and the second one-way air outlet (440) both form swirling flow.

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