A semiconductor rack plate spray coating device with intelligent temperature control and pressure sensing

The semiconductor rack plate-type spraying device with intelligent temperature control and pressure sensing solves the problem of reduced fixation effect caused by coating liquid adhesion, realizes stable rack fixation and temperature control, and improves spraying quality and device life.

CN224271785UActive Publication Date: 2026-05-26TONGZHOU DONGDA MASCH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
TONGZHOU DONGDA MASCH CO LTD
Filing Date
2025-07-09
Publication Date
2026-05-26

AI Technical Summary

Technical Problem

In existing semiconductor rack spraying equipment, the plating solution easily escapes and adheres to the adjusting rod during the spraying process, resulting in a decrease in the fixing effect, which affects the spraying quality and the service life of the equipment.

Method used

The semiconductor rack plate spraying device adopts intelligent temperature control and pressure sensing. Through the design of bidirectional lead screw and movable plate, combined with pressure sensor and PLC controller, the rack is stably fixed. The L-shaped mounting groove prevents the spraying liquid from contaminating the lead screw. Temperature control is achieved with heating frame and infrared temperature sensor.

Benefits of technology

It improves the stability and fixation effect of the spraying process, extends the service life of the equipment, ensures uniform coating adhesion, and enhances the spraying quality.

✦ Generated by Eureka AI based on patent content.

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Abstract

This utility model relates to the field of semiconductor rack plating technology, and discloses a semiconductor rack pressure plate plating device with intelligent temperature control and pressure sensing. It includes a chamber, inside which a conveyor table is fixed. The chamber also contains a fixing structure for fixing the semiconductor rack and a plating structure for plating the rack. The fixing structure includes a turntable rotatably mounted on the top surface of the conveyor table. Through the fixing and plating structures, the operator places the rack on the turntable. A first motor drives a bidirectional lead screw to rotate, pushing a movable plate to tension and fix the rack. Spring compression ensures uniform force distribution. A pressure sensor monitors the clamping force and transmits it to a PLC. Once a preset value is reached, the force remains stable. Subsequently, a heating frame preheats the rack to improve plating adhesion. A plating robot performs the plating. An L-shaped mounting groove prevents plating liquid from contaminating the lead screw, ensuring the device's stability and durability, and optimizing the plating effect.
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Description

Technical Field

[0001] This utility model relates to the field of semiconductor rack spraying technology, and in particular to a semiconductor rack pressure plate spraying device with intelligent temperature control and pressure sensing. Background Technology

[0002] Semiconductor rack spraying is a key surface treatment technology in semiconductor manufacturing. It is mainly used to form a uniform metal or alloy coating on the rack surface. During the spraying process, the rack needs to be firmly fixed to prevent vibration or displacement from affecting the coating quality.

[0003] An existing composite coating spraying device (publication number: CN211801863U) has at least the following drawbacks: Although the above device connects the clamping plate to the adjusting rod by thread, and the adjusting plate is rotated to make the clamping plate press and fix the workpiece, the coating liquid is easy to escape and adhere to the adjusting rod during the spraying process. Long-term use can easily cause the adjusting rod to become stuck, thereby reducing the fixing effect on the workpiece, and thus the device has poor performance. Therefore, we propose this utility model. Utility Model Content

[0004] The purpose of this invention is to address the shortcomings of existing technologies by proposing a semiconductor rack plate spraying device with intelligent temperature control and pressure sensing.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A semiconductor rack plate-type spray coating device with intelligent temperature control and pressure sensing includes a chamber, a conveyor table fixed inside the chamber, a fixing structure for fixing the semiconductor rack inside the chamber, and a spray coating structure for spray coating the semiconductor rack inside the chamber. The fixing structure includes a turntable rotatably mounted on the top surface of the conveyor table. The top surface of the turntable has an L-shaped mounting groove. A bidirectional lead screw is rotatably mounted inside the mounting groove. The positive and negative threads of the bidirectional lead screw are respectively threaded to movable plates.

[0007] As a further embodiment of this utility model, two springs are fixed on the sides of the two movable plates that are far apart from each other. A pressure plate is fixed to one end of each spring, and a pressure sensor is fixed to one side of the pressure plate. A first motor is fixed to one side of the turntable, and the output end of the first motor passes through the turntable and is fixed to one end of the bidirectional lead screw.

[0008] As a further embodiment of this utility model, the spraying structure includes a spraying robot fixed to the bottom surface inside the chamber, a heating frame fixed inside the chamber, and a PLC controller fixed to one side of the chamber. The spraying robot, the first motor, and the pressure sensor are all electrically connected to the PLC controller.

[0009] As a further embodiment of this utility model, the top surface of the turntable is fixed with an electric slide rail, the slider of the electric slide rail is fixed with a fixing plate, the top surface of the fixing plate is provided with a fixing groove, and the turntable is rotatably arranged inside the fixing groove.

[0010] As a further embodiment of this utility model, a second motor is fixed inside the fixing groove, a gear is fixed at the output end of the second motor, and an external gear ring is fixed on the outer circular wall of the turntable, with the external gear ring meshing with the gear.

[0011] As a further embodiment of this utility model, a plurality of heating rods are fixed inside the heating frame, and the plurality of heating rods are evenly distributed along the height direction of the heating frame. An infrared temperature sensor is fixed on the top surface of the heating frame, and both the infrared temperature sensor and the heating rods are electrically connected to the PLC controller.

[0012] Compared with the prior art, the present invention has the following beneficial effects:

[0013] This spray plating device, through the setting of a fixed structure and a spray plating structure, allows the operator to place the frame on a turntable. The first motor drives the bidirectional lead screw to rotate, pushing the movable plate to tension and fix the frame. Spring compression ensures uniform force distribution. A pressure sensor monitors the clamping force and transmits it to the PLC. Once the preset value is reached, the device remains stable. Subsequently, a heating frame preheats the frame to improve the spray plating adhesion. The spray plating robot then performs the electroplating. An L-shaped mounting groove prevents the spray plating liquid from contaminating the lead screw, ensuring the device's stability and durability, and optimizing the spray plating effect. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the structure of a semiconductor rack plate spraying device with intelligent temperature control and pressure sensing proposed in this utility model.

[0015] Figure 2 This is a schematic diagram showing the disassembled structure of a semiconductor rack plate type spray coating device with intelligent temperature control and pressure sensing proposed in this utility model.

[0016] Figure 3 This is a schematic diagram showing the disassembled structure of the turntable of a semiconductor rack plate type spray coating device with intelligent temperature control and pressure sensing proposed in this utility model.

[0017] Figure 4 This is a schematic diagram showing the disassembled structure of the pressure plate of a semiconductor rack-type spray coating device with intelligent temperature control and pressure sensing proposed in this utility model.

[0018] In the diagram: 1. Chamber body; 2. Conveyor table; 201. Turntable; 202. Bidirectional lead screw; 203. Movable plate; 204. Spring; 205. Pressure plate; 206. Pressure sensor; 207. Mounting slot; 3. Spray coating robot; 301. Heating frame; 4. Electric slide rail; 5. Fixing plate; 501. Fixing slot; 6. Gear; 601. Gear; 602. Heating rod; 603. Infrared temperature sensor. Detailed Implementation

[0019] To make the technical means, creative features, objectives and effects of this utility model easier to understand, the present utility model will be further described below in conjunction with specific embodiments.

[0020] In the description of this utility model, it should be noted that the terms "upper," "lower," "inner," "outer," "front end," "rear end," "both ends," "one end," and "the other end," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0021] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installed," "equipped with," and "connected," etc., should be interpreted broadly. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0022] Reference Figures 1-4 A semiconductor rack plate-type spray coating device with intelligent temperature control and pressure sensing includes a chamber 1, a conveyor table 2 fixed inside the chamber 1, a fixing structure for fixing the semiconductor rack inside the chamber 1, and a spray coating structure for spray coating the semiconductor rack inside the chamber 1. The fixing structure includes a turntable 201 rotatably mounted on the top surface of the conveyor table 2. The top surface of the turntable 201 has an L-shaped mounting groove 207. A bidirectional lead screw 202 is rotatably mounted inside the mounting groove 207. The positive and negative threads of the bidirectional lead screw 202 are respectively threaded to a movable plate 203.

[0023] In this embodiment, two springs 204 are fixed on the side of the two movable plates 203 that are far apart from each other. A pressure plate 205 is fixed to one end of the spring 204. A pressure sensor 206 is fixed to one side of the pressure plate 205. A first motor is fixed to one side of the turntable 201. The output end of the first motor passes through the turntable 201 and is fixed to one end of the bidirectional lead screw 202. The pressure sensor 206 is existing technology.

[0024] In this embodiment, the spraying structure includes a spraying robot 3 fixed to the bottom surface inside the chamber 1. A heating frame 301 is fixed inside the chamber 1, and a PLC controller is fixed to one side of the chamber 1. The spraying robot 3, the first motor, and the pressure sensor 206 are all electrically connected to the PLC controller. The spraying robot 3 is existing technology. Through the setting of the fixing structure and the spraying structure, the operator places the frame on the turntable 201, so that the two pressure plates 205 are located inside the frame. Subsequently, the first motor drives the bidirectional lead screw 202 to rotate, pushing the two movable plates 203 to move outward, so that the pressure plates 205 apply tension force inside the frame to achieve stable fixation. As the clamping force increases, the spring 204 is gradually compressed to ensure the force distribution applied to the surface of the frame. Uniform clamping force is achieved by pressure sensor 206 monitoring the clamping force in real time and transmitting the data to the PLC controller. Once the clamping force reaches the preset range, the PLC maintains the current clamping state to ensure a stable and reliable fixing effect. After fixing, heating frame 301 preheats the frame surface uniformly to ensure better material adhesion during the spraying process. Subsequently, the spraying robot 3 drives the spraying head to spray the frame surface. To prevent the spraying liquid from spreading and contaminating the lead screw, an L-shaped mounting groove 207 is designed to effectively block the spraying liquid from entering the chamber where the bidirectional lead screw 202 is located, thus avoiding the spraying liquid from adhering and causing the moving plate 203 to be obstructed. This optimization not only improves the stability of clamping and spraying but also significantly enhances the overall service life and spraying effect of the device.

[0025] In this embodiment, an electric slide rail 4 is fixed on the top surface of the turntable 201, and a fixing plate 5 is fixed on the slider of the electric slide rail 4. A fixing groove 501 is opened on the top surface of the fixing plate 5. The turntable 201 and the fixing groove 501 are rotated inside. The electric slide rail 4 is the prior art. When the turntable 201 is transported into the silo 1, the fixing plate 5 and the turntable 201 can be driven into the silo 1 by activating the electric slide rail 4.

[0026] In this embodiment, a second motor is fixed inside the fixing slot 501, and a gear 6 is fixed at the output end of the second motor. An external gear ring 601 is fixed on the outer circular wall of the turntable 201. The external gear ring 601 meshes with the gear 6. When the turntable 201 is transported into the chamber 1, the heating frame 301 inside the chamber 1 heats one side of the frame. When the temperature is reached, the second motor drives the turntable 201 to rotate through the transmission of the gear 6 and the external gear ring 601, so that the heated side of the frame sprays the plating robot 3, while the other side of the frame continues to heat the heating frame 301.

[0027] In this embodiment, a plurality of heating rods 602 are fixed inside the heating frame 301. The plurality of heating rods 602 are evenly distributed along the height direction of the heating frame 301. An infrared temperature sensor 603 is fixed on the top surface of the heating frame 301. Both the infrared temperature sensor 603 and the heating rods 602 are electrically connected to the PLC controller. Both the infrared temperature sensor 603 and the heating rods 602 are existing technologies. During heating, the frame can be heated by the heating rods 602. At the same time, the infrared temperature sensor 603, the heating rods 602 and the PLC controller work together to monitor and control the heating temperature.

[0028] Working Principle: During use, the operator places the frame on the turntable 201, positioning the two pressure plates 205 inside the frame. Then, the first motor drives the bidirectional lead screw 202 to rotate, pushing the two movable plates 203 outwards. This applies tension to the pressure plates 205 inside the frame, achieving stable fixation. As the clamping force increases, the spring 204 gradually compresses, ensuring uniform force distribution on the frame surface. At this time, the pressure sensor 206 monitors the clamping force in real time and transmits the data to the PLC controller. When the clamping force reaches the preset range, the PLC maintains the current clamping state, ensuring stable and reliable fixation. After fixation, the heating frame 301 uniformly preheats the frame surface, ensuring better material adhesion during the spraying process. Subsequently, the spraying robot 3 drives the spraying head to perform spraying treatment on the frame surface. To prevent the spraying solution from spreading and contaminating the wire... The rod is designed with an L-shaped mounting groove 207 to effectively prevent the plating liquid from entering the chamber where the bidirectional lead screw 202 is located, thus avoiding the plating liquid from adhering and obstructing the operation of the movable plate 203. When the turntable 201 is transported into the chamber 1, the fixed plate 5 and the turntable 201 can be driven into the chamber 1 by starting the electric slide rail 4. When the turntable 201 is transported into the chamber 1, the heating frame 301 in the chamber 1 heats one side of the frame. When the temperature is reached, the second motor drives the turntable 201 to rotate through the transmission of the gear 6 and the external gear ring 601, so that the heated side of the frame performs plating on the plating robot 3. At the same time, the other side of the frame continues to heat the heating frame 301. During heating, the frame can be heated by the heating rod 602. At the same time, the infrared temperature sensor 603, the heating rod 602 and the PLC controller work together to monitor and control the heating temperature.

[0029] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model.

Claims

1. A semiconductor rack plate type spray coating device with intelligent temperature control and pressure sensing, comprising a chamber (1), characterized in that: The internal structure of the chamber (1) is fixed with a conveyor table (2). The internal structure of the chamber (1) is provided with a fixing structure for fixing the semiconductor rack. The internal structure of the chamber (1) is provided with a spraying structure for spraying the semiconductor rack. The fixing structure includes a turntable (201) rotatably mounted on the top surface of the conveyor table (2). The top surface of the turntable (201) is provided with an installation groove (207). The installation groove (207) is L-shaped. A bidirectional lead screw (202) is rotatably mounted inside the installation groove (207). The positive and negative threads of the bidirectional lead screw (202) are respectively threaded to a movable plate (203).

2. The semiconductor rack platen spraying device with intelligent temperature control and pressure sensing according to claim 1, characterized in that, Two springs (204) are fixed on the opposite sides of the two movable plates (203). A pressure plate (205) is fixed to one end of the spring (204). A pressure sensor (206) is fixed to one side of the pressure plate (205). A first motor is fixed to one side of the turntable (201). The output end of the first motor passes through the turntable (201) and is fixed to one end of the bidirectional lead screw (202).

3. The semiconductor rack platen spraying device with intelligent temperature control and pressure sensing according to claim 2, characterized in that, The plating structure includes a plating robot (3) fixed inside the bottom surface of the chamber (1), a heating frame (301) fixed inside the chamber (1), and a PLC controller fixed on one side of the chamber (1). The plating robot (3), the first motor and the pressure sensor (206) are all electrically connected to the PLC controller.

4. The semiconductor rack platen spraying device with intelligent temperature control and pressure sensing according to claim 3, characterized in that, The top surface of the turntable (201) is fixed with an electric slide rail (4), and the slider of the electric slide rail (4) is fixed with a fixing plate (5). The top surface of the fixing plate (5) is provided with a fixing groove (501), and the turntable (201) and the fixing groove (501) are rotated inside each other.

5. The semiconductor rack platen spraying device with intelligent temperature control and pressure sensing according to claim 4, characterized in that, The second motor is fixed inside the fixed groove (501), and a gear (6) is fixed at the output end of the second motor. An external gear ring (601) is fixed on the outer circular wall of the turntable (201), and the external gear ring (601) meshes with the gear (6).

6. The semiconductor rack platen spraying device with intelligent temperature control and pressure sensing according to claim 5, characterized in that, The heating frame (301) has several heating rods (602) fixed inside. The heating rods (602) are evenly distributed along the height direction of the heating frame (301). An infrared temperature sensor (603) is fixed on the top surface of the heating frame (301). The infrared temperature sensor (603) and the heating rods (602) are both electrically connected to the PLC controller.