Workbench for wafer processing

Abstract

The utility model discloses a workbench for wafer processing, and relates to the technical field of workbenches. Comprising a mounting base, a mounting mechanism used for wafer processing is arranged on the mounting base, the mounting mechanism comprises an adjusting assembly, the adjusting assembly comprises a supporting column arranged on the upper end face of the mounting base and connected through a gear assembly, four sets of fixing rods are fixed to the upper end face of the supporting column, and a workbench body is fixed to the top ends of the fixing rods; linear movement of the electric push rod is converted into synchronous radial movement of the four sets of clamping plates, the clamping device can adapt to wafers of different sizes, elastic buffering of the rubber plates reduces the risk of wafer edge cracks, improves friction force, prevents sliding in the machining process, can meet the clamping requirements of the wafers of different sizes, does not need to be replaced, and is convenient to use. And the rubber plates on the outer walls of the clamping plates have elasticity, so that flexible buffering is provided when the wafer is clamped, hard damage to the surface of the wafer is avoided, and the surface quality of the wafer is protected.

Description

Technical Field

[0001] This utility model relates to the field of workbench technology, specifically a workbench for wafer processing. Background Technology

[0002] In the semiconductor manufacturing field, wafers are the key basic material for making silicon semiconductor circuits, and their processing is crucial. Wafer processing must be carried out on a high-precision worktable, and the performance of the worktable directly affects the processing quality and efficiency. With the rapid development of the semiconductor industry, the demand for wafer processing precision, efficiency, and the diversity of wafer size and shape is increasing, which places higher demands on wafer processing worktables.

[0003] Reference patent (publication number: CN221603531U; publication date: 2024-08-27) discloses a wafer laser grooving machine, including an operating table and a wafer. Clamping blocks are movably connected in a ring array on the operating table. One end of each clamping block is fixed to one end of a rotating rod. The other end of each rotating rod passes through the operating table and is fixed to a gear. The structure of clamping blocks, rotating rod, spring, gear and gear ring makes the device highly adaptable. The spring force can drive the rotating rod to rotate, and the rotating rod drives the clamping blocks to rotate, so that the clamping blocks can rotate outward and unfold. The wafer is placed in the middle of several clamping blocks. By rotating the turntable, the gear drives the rotating rod to rotate, so that the clamping blocks can rotate to clamp and limit the outer edge of the wafer. Then, by rotating and tightening the clamping shaft, the turntable and the clamping shaft are pressed together. By rotating the turntable at different angles, the clamping blocks can clamp wafers of different specifications, so that the device has a good fixing effect and high adaptability.

[0004] Based on the aforementioned patent, the clamping force is controlled by using the spring force to control the angle of the rotating disk. However, the spring force may decrease over time, affecting long-term stability. Furthermore, the adaptability of traditional worktables is significantly insufficient for situations where the wafer edge has slight warping or different thicknesses. Their clamping plate angles are usually fixed and cannot be flexibly adjusted to closely fit the wafer edges of different shapes and thicknesses, resulting in uneven clamping force distribution and excessive local stress, which may damage the wafer. Therefore, this utility model provides a worktable for wafer processing. Utility Model Content

[0005] To address the shortcomings of existing technologies, this invention provides a worktable for wafer processing. It solves the problem of controlling the clamping force by adjusting the angle of the rotating disk using the spring force of a spring. However, the spring force of the spring may decrease over time, affecting long-term stability. Furthermore, traditional worktables are not adaptable to wafers with slight warping or varying thicknesses. Their clamping plate angles are usually fixed and cannot be flexibly adjusted to closely fit wafer edges of different shapes and thicknesses, resulting in uneven clamping force distribution, excessive local stress, and potential damage to the wafer.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a worktable for wafer processing, comprising a mounting base, wherein the mounting base is provided with a mounting mechanism for wafer processing, the mounting mechanism comprising:

[0007] The adjustment assembly includes a support column connected by a gear assembly on the upper surface of the mounting base, four sets of fixing rods fixed on the upper surface of the support column, and a worktable body fixed to the top of the fixing rods;

[0008] The clamping assembly includes four sets of sliding grooves inside the main body of the workbench. The sliding grooves are equipped with adjustment plates connected by a pushing assembly. The adjustment plates are equipped with clamping plates connected by a support assembly on both sides. The outer walls of the clamping plates are fixed with rubber plates.

[0009] Preferably, the gear assembly includes a motor fixed to the bottom of the mounting base, the output end of the motor extending to the top of the mounting base and fixed with a transmission gear, the support column located on the upper end face of the mounting base in a rotatable connection, and tooth blocks uniformly fixed on the outer wall of the support column, the tooth blocks being meshed with the transmission gear.

[0010] Preferably, the toothed blocks form a gear-like structure around the outer wall of the support column, and the size of the transmission gear is smaller than that of the support column.

[0011] Preferably, the push assembly includes an electric push rod fixed at the center of the lower end face of the workbench body, a push block fixed at the telescopic end of the electric push rod, and first support rods rotatably connected to the four side walls of the push block via a rotating shaft. The adjusting plate is slidably connected inside the slide groove, and the bottom of the adjusting plate is connected to the other end of the first support rod via a rotating shaft.

[0012] Preferably, the support assembly includes an adjustment plate with a slide rail bracket fixed on the side away from the main body of the workbench. A screw is rotatably connected inside the slide rail bracket, and a slider is slidably connected inside the slide rail bracket. The slider is threadedly connected to the screw. Second support rods are provided on both sides of the slider and rotatably connected by a rotating shaft. The other end of the second support rod is rotatably connected to a rubber plate by a rotating shaft.

[0013] Preferably, the clamping plates are configured in two sets, and the two sets of clamping plates are symmetrically distributed about the adjusting plate.

[0014] Beneficial effects

[0015] This invention provides a worktable for wafer processing. Compared with the prior art, it has the following advantages:

[0016] Firstly, the linear motion of the electric push rod of this utility model is converted into the synchronous radial movement of four sets of clamping plates, which can adapt to wafers of different sizes. The elastic buffer of the rubber plate reduces the risk of wafer edge cracks, increases friction, and prevents slippage during processing. It can adapt to the clamping requirements of wafers of different sizes without the need to change the clamps, thus improving the versatility of the worktable. The rubber plate on the outer wall of the clamping plate is elastic and provides flexible buffer when clamping the wafer, avoiding hard damage to the wafer surface and protecting the wafer surface quality.

[0017] Secondly, when the motor of this utility model starts, it drives the transmission gear at the output end to rotate. The transmission gear meshes with the tooth block on the outer wall of the support column, transmitting the rotational motion to the support column. The support column drives the main body of the worktable to rotate synchronously through the fixed rod, thereby realizing the adjustment of the processing angle. The gear assembly realizes the precise adjustment of the angle of the main body of the worktable, meeting the high-precision requirements for different processing angles in wafer processing. It eliminates the need for disassembly and reassembly, improving the practicality of the device.

[0018] Thirdly, this invention allows for precise adjustment of the clamping plate angle via a rotating screw, with a wide adjustment range to accommodate minor warping of the wafer edge or varying thicknesses. This ensures a tight fit between the clamping plate and the wafer edge. After adjusting the clamping plate angle, the rubber plate makes full contact with the wafer edge, distributing the clamping force evenly across the edge and preventing excessive local stress that could damage the wafer. Simultaneously, it guarantees the stability of the wafer during processing. The flexible and adjustable angle allows the worktable to handle wafers of various shapes and sizes, achieving stable clamping regardless of whether the wafer has minor edge defects or varies in thickness. This expands the processing range of the equipment and enhances its application scenarios. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0020] Figure 2 This is a schematic diagram of the support column connection structure of this utility model;

[0021] Figure 3 This is a schematic diagram of the main structure of the workbench of this utility model;

[0022] Figure 4 This is a schematic diagram of the adjustment plate connection structure of this utility model;

[0023] Figure 5 This is a schematic diagram of the clamp connection structure of this utility model.

[0024] In the diagram: 1. Mounting base; 2. Support column; 201. Tooth block; 202. Motor; 203. Transmission gear; 3. Fixing rod; 301. Workbench body; 302. Slide groove; 303. Adjusting plate; 304. Electric push rod; 305. Push block; 306. First support rod; 4. Clamping plate; 401. Rubber plate; 5. Slide rail bracket; 501. Screw; 502. Slider; 503. Second support rod. Detailed Implementation

[0025] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0026] Please see Figures 1-5 This utility model provides a technical solution: a worktable for wafer processing, including a mounting base 1, on which a mounting mechanism for wafer processing is provided, the mounting mechanism including:

[0027] The adjustment assembly includes a support column 2 connected by a gear assembly on the upper end face of the mounting base 1, four sets of fixing rods 3 fixed on the upper end face of the support column 2, and a worktable body 301 fixed at the top of the fixing rods 3.

[0028] The clamping assembly includes four sets of slides 302 inside the workbench body 301. The slides 302 are equipped with adjustment plates 303 connected by a push assembly. The adjustment plates 303 are equipped with clamping plates 4 connected by a support assembly on both sides. The outer wall of the clamping plates 4 is fixed with rubber plates 401.

[0029] In a preferred embodiment, the gear assembly includes a motor 202 fixed to the bottom of the mounting base 1, with the output end of the motor 202 extending to the top of the mounting base 1 and a transmission gear 203 fixed thereon. The support column 2 is rotatably connected to the upper end face of the mounting base 1, and tooth blocks 201 are uniformly fixed to the outer wall of the support column 2. The tooth blocks 201 are meshed with the transmission gear 203, and the tooth blocks 201 form a gear-like structure around the outer wall of the support column 2. The size of the transmission gear 203 is smaller than that of the support column 2, forming a short-path transmission, reducing energy loss in intermediate links, and improving transmission efficiency. At the same time, the gear meshing method can precisely control the rotation angle, ensuring the accuracy of the adjustment of the workbench body 301.

[0030] When the motor 202 starts, it drives the transmission gear 203 at the output end to rotate. The transmission gear 203 meshes with the tooth block 201 on the outer wall of the support column 2, transmitting the rotational motion to the support column 2. The support column 2 drives the worktable body 301 to rotate synchronously through the fixed rod 3, thereby adjusting the processing angle.

[0031] The gear assembly enables precise adjustment of the 301-degree angle of the main body of the worktable, meeting the high-precision requirements for different processing angles in wafer processing. This eliminates the need for disassembly and reassembly, improving the practicality of the device.

[0032] In a preferred embodiment, the push assembly includes an electric push rod 304 fixed at the center of the lower end face of the workbench body 301. A push block 305 is fixed at the telescopic end of the electric push rod 304. The four side walls of the push block 305 are provided with first support rods 306 rotatably connected by a rotating shaft. An adjusting plate 303 is slidably connected inside the slide groove 302. The bottom of the adjusting plate 303 is connected to the other end of the first support rod 306 via a rotating shaft. The support assembly includes a slide rail bracket 5 fixed on the side of the adjusting plate 303 away from the workbench body 301. A screw 501 is rotatably connected inside the slide rail bracket 5. A slider 502 is slidably connected inside the slide rail bracket 5. The slider 502 is threadedly connected to the screw 501. Second support rods 503 are rotatably connected to both sides of the slider 502 via a rotating shaft. The other end of the second support rod 503 is rotatably connected to the rubber plate 401 via a rotating shaft. The clamping plates 4 are set in two groups, and the two groups of clamping plates 4 are symmetrically distributed about the adjusting plate 303.

[0033] The electric push rod 304 is extended, and the push block 305 moves downward. The push block 305 pushes the adjusting plate 303 to slide outward along the slide groove 302 through the first support rod 306, realizing the radial expansion of the clamping plate 4. The adjusting plate 303 drives the clamping plate 4 to contact the edge of the wafer. The rubber plate 401 provides flexible buffering to avoid hard contact damage. The linear movement of the electric push rod 304 is converted into the synchronous radial movement of the four sets of clamping plates 4, which can adapt to wafers of different sizes. The elastic buffering of the rubber plate 401 reduces the risk of wafer edge cracks, increases friction, and prevents slippage during processing. It can adapt to the clamping requirements of wafers of different sizes without changing the fixture, improving the versatility of the worktable. The rubber plate 401 on the outer wall of the clamping plate 4 is elastic and provides flexible buffering when clamping the wafer to avoid hard damage to the wafer surface and protect the wafer surface quality.

[0034] Furthermore, rotating the screw 501 inside the slide rail bracket 5 causes the slider 502 to slide within the slide rail bracket 5 due to its threaded connection with the screw 501. The rotation of the screw 501 drives the slider 502 to move linearly along the slide rail bracket 5. The second support rods 503 connected to both sides of the slider 502 via rotating shafts change their tilt angle as the slider 502 moves. The other end of the second support rod 503 is rotatably connected to the rubber plate 401, thereby adjusting the angle of the clamping plate 4 so that the clamping plate 4 can better fit wafers of different thicknesses or edge shapes.

[0035] By rotating the screw 501, the angle of the clamping plate 4 can be finely adjusted. The adjustment range is large, which can adapt to the slight warping of the wafer edge or different thicknesses. This ensures that the clamping plate 4 fits tightly with the wafer edge. After adjusting the angle of the clamping plate 4, the rubber plate 401 can make full contact with the wafer edge, so that the clamping force is evenly distributed on the wafer edge, avoiding excessive local stress that could damage the wafer. At the same time, it ensures the stability of the wafer during processing. The flexible and adjustable angle allows the worktable to handle wafers of various shapes and sizes. Whether it is a wafer with slight edge defects or a wafer of different thicknesses, it can achieve stable clamping, expanding the processing range of the equipment and improving its application scenarios.

[0036] Furthermore, any content not described in detail in this specification is existing technology known to those skilled in the art.

[0037] During operation, when using this wafer processing worktable, firstly, the motor 202 fixed at the bottom of the mounting base 1 is started. The transmission gear 203 at the output end of the motor 202 begins to rotate, meshing with the gear-shaped toothed block 201 on the outer wall of the support column 2, driving the support column 2 to rotate on the upper surface of the mounting base 1. Then, through the four sets of fixed rods 3, the main body of the worktable 301 is rotated synchronously, completing the precise adjustment of the processing angle. Subsequently, the electric push rod 304 at the center of the lower end surface of the main body of the worktable 301 is started. Its telescopic end drives the push block 305 to move downward. The four side walls of the push block 305 are connected to the first support rod 306 through the rotating shaft, pushing the adjusting plate 303 to slide outward along the slide groove 302, realizing clamping. The radial expansion of plate 4 continues until the rubber plate 401 on the outer wall of clamping plate 4 contacts the edge of the wafer. The flexible buffer of rubber plate 401 prevents hard damage to the wafer. At the same time, the synchronous radial movement of the four sets of clamping plates 4 adapts to wafers of different sizes. If further adjustment is needed, the screw 501 inside the slide rail bracket 5 can be rotated, which drives the slider 502 threadedly connected to the screw 501 to move linearly along the slide rail bracket 5. The second support rods 503 on both sides of the slider 502 change their tilt angle accordingly, realizing the fine adjustment of the angle of clamping plate 4, so that it fits wafers of different thicknesses or edge shapes, ensuring that the rubber plate 401 is in full contact with the edge of the wafer, and evenly distributing the clamping force to ensure the stability of the wafer during the processing.

[0038] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0039] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A worktable for wafer processing, comprising a mounting base (1), characterized in that: The mounting base (1) is provided with a mounting mechanism for wafer processing, the mounting mechanism including: The adjustment assembly includes a support column (2) connected by a gear assembly on the upper surface of the mounting base (1), and four sets of fixing rods (3) are fixed on the upper surface of the support column (2), and the workbench body (301) is fixed at the top of the fixing rods (3). The clamping assembly includes four sets of slides (302) inside the workbench body (301). The slides (302) are provided with an adjustment plate (303) connected by a push assembly. The adjustment plate (303) is provided with clamping plates (4) connected by a support assembly on both sides. The outer wall of the clamping plate (4) is fixed with a rubber plate (401).

2. A worktable for wafer processing according to claim 1, characterized in that: The gear assembly includes a motor (202) fixed to the bottom of the mounting base (1), the output end of the motor (202) extends to the top of the mounting base (1) and a transmission gear (203) is fixed thereon, the support column (2) is located on the upper end face of the mounting base (1) and is rotatably connected, and tooth blocks (201) are uniformly fixed on the outer wall of the support column (2), and the tooth blocks (201) are meshed with the transmission gear (203).

3. A worktable for wafer processing according to claim 2, characterized in that: The toothed block (201) forms a gear-like structure around the outer wall of the support column (2), and the size of the transmission gear (203) is smaller than that of the support column (2).

4. A worktable for wafer processing according to claim 1, characterized in that: The push assembly includes an electric push rod (304) fixed at the center of the lower end face of the workbench body (301). The telescopic end of the electric push rod (304) is fixed with a push block (305). The four side walls of the push block (305) are provided with a first support rod (306) rotatably connected by a rotating shaft. The adjusting plate (303) is located inside the slide groove (302) and is slidably connected. The bottom of the adjusting plate (303) is connected to the other end of the first support rod (306) through a rotating shaft.

5. A worktable for wafer processing according to claim 1, characterized in that: The support assembly includes an adjustment plate (303) with a slide rail bracket (5) fixed on the side away from the workbench body (301). The slide rail bracket (5) is rotatably connected to a screw (501) and slidably connected to a slider (502). The slider (502) is threadedly connected to the screw (501). The slider (502) is provided with second support rods (503) on both sides of the slider (502) and rotatably connected to the second support rods (503) via a rotating shaft. The other end of the second support rods (503) is rotatably connected to a rubber plate (401) via a rotating shaft.

6. A worktable for wafer processing according to claim 1, characterized in that: The clamping plates (4) are configured in two sets, and the two sets of clamping plates (4) are symmetrically distributed about the adjusting plate (303).

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