Chip glass substrate image data acquisition device

CN224286764UActive Publication Date: 2026-05-26GUANGDONG WEIHUA INTELLIGENT TECHNOLOGY CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
GUANGDONG WEIHUA INTELLIGENT TECHNOLOGY CO LTD
Filing Date
2025-07-16
Publication Date
2026-05-26

AI Technical Summary

Technical Problem

Existing glass substrate inspection equipment requires manual sampling and inspection, cannot achieve online inspection, has a long inspection cycle and unavoidable errors, and cannot accurately determine whether the size of the through hole is within the error range.

Method used

A chip glass substrate image data acquisition device was designed. It adopts longitudinal and transverse motion guides and multiple sensors to realize automated detection. It can perform comprehensive data acquisition and analysis on the glass substrate. The device uses a combination of longitudinal and transverse motion guides and multiple sensors to realize automated transmission and detection of the glass substrate.

Benefits of technology

It enables efficient and accurate testing of glass substrates, reduces testing errors, and allows for comprehensive testing of each glass substrate, thus improving testing efficiency and accuracy.

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Abstract

The utility model relates to the technical field of image acquisition, in particular to a chip glass substrate image data acquisition device. Comprising a longitudinal movement guide rail, a sample bearing base plate is arranged above the longitudinal movement guide rail in a sliding mode, a transverse movement guide rail is arranged above the sample bearing base plate, and a first detection moving rail and a second detection moving rail are fixed to the front side of the transverse movement guide rail; a first sensor is fixed to the front side of the first detection moving rail, and a second sensor, a third sensor and a fourth sensor are fixed to the front side of the second detection moving rail. According to the device, the chip glass substrate can be automatically detected, and the situation that the through hole of the glass substrate is abnormal and blocked can be identified.
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