Circuit board assemblies, adapters and testing equipment

Abstract

This utility model discloses a circuit board assembly, an adapter, and a testing device. The circuit board assembly includes a circuit board, a switching transistor, and an insulating component. The switching transistor includes a package and pins. The package is connected to the circuit board via the pins. The insulating component is located on the portion of the pins between the package and the circuit board. The insulating component has test holes configured for the insertion of an electrical connector from the testing device, allowing the testing device to electrically connect to the pins via the connectors. In this circuit board assembly, the insulating component located on the portion of the pins between the package and the circuit board, and the test holes configured for the insertion of an electrical connector from the testing device, optimizes the signal transmission path, reduces the influence of parasitic resistance and inductance to a certain extent, lowers signal attenuation and interference, and improves test quality.

Description

Technical Field

[0001] This utility model relates to the field of switching transistor technology, and in particular to a circuit board assembly, an adapter, and a testing device. Background Technology

[0002] In related technologies, to ensure the reliability of switching transistors, it is necessary to test them to determine if they meet design requirements. Currently, during product testing, an oscilloscope is connected to the pins of the switching transistor, and the oscilloscope displays the corresponding waveform. However, during testing, due to limitations imposed by the switching transistor or testing conditions, the waveform on the switching transistor cannot be accurately displayed on the oscilloscope, thus preventing the most accurate testing of the product. Utility Model Content

[0003] This utility model provides a circuit board assembly, an adapter, and a testing device to solve at least one of the aforementioned technical problems.

[0004] An embodiment of the present invention provides a circuit board assembly comprising a circuit board, a switching transistor, and an insulating component. The switching transistor includes a package and pins. The package is connected to the circuit board via the pins. The insulating component is disposed on the portion of the pins located between the package and the circuit board. The insulating component has a test hole configured to allow an electrical connector of a testing device to be inserted, thereby electrically connecting the testing device to the pins via the electrical connector.

[0005] In the aforementioned circuit board assembly, an insulating component is located on the portion where the pins are situated between the package and the circuit board. The insulating component has test holes configured to allow the electrical connector of the test equipment to be inserted, enabling the test equipment to be electrically connected to the pins via the electrical connector. This optimizes the transmission path of the electrical signal, reduces the influence of parasitic resistance and inductance to a certain extent, lowers signal attenuation and interference, and improves test quality.

[0006] In some embodiments, the circuit board assembly includes a magnetic ring disposed on the portion of the pins located between the package and the circuit board, and the insulating element is closer to the package than the magnetic ring.

[0007] In some embodiments, the switching transistor includes a plurality of said pins, the circuit board assembly includes a single said insulating element disposed on the portion of the pins located between the package and the circuit board, the single said insulating element connects all the pins, and the insulating element has a plurality of said test holes, each of the test holes corresponding to one of the pins.

[0008] In some embodiments, the circuit board assembly includes a plurality of the switching transistors and at least one of the insulating elements, wherein the at least one insulating element is disposed on the portion of the at least two switching transistors whose pins are located between the package and the circuit board.

[0009] In some embodiments, the circuit board assembly includes a pin with at least a portion located within the test hole, the pin being electrically connected to the pin, and the pin being configured to electrically connect the electrical connector to the pin via the pin.

[0010] In some embodiments, the insulating element is attached to the pin by snap-fit ​​and / or adhesive.

[0011] An adapter according to an embodiment of the present invention includes a sleeve and an electrical connector. The electrical connector is connected to the sleeve and is configured to be inserted into a test hole of an insulating component on a switch pin for electrical connection with the pin. The sleeve is configured to allow a test probe of a testing device to be inserted so that the test probe is electrically connected to the pin through the electrical connector.

[0012] In some embodiments, the electrical connector includes a first electrical connector and a second electrical connector, the first electrical connector being electrically connected to the sleeve, and the second electrical connector being insulated from the sleeve. The sleeve is configured such that, after the test pen is inserted into the sleeve, the sleeve is connected to the side wall of the test pen such that the side wall of the test pen is electrically connected to the first electrical connector through the sleeve, and the tip of the test pen is electrically connected to the second electrical connector.

[0013] In some embodiments, the first electrical connector and the second electrical connector are twisted together to form a twisted pair, or...

[0014] The first electrical connector and the second electrical connector are arranged in parallel.

[0015] One embodiment of the present invention provides a testing device comprising the adapter and testing device described in any of the above claims, wherein the testing device is electrically connected to the pin via the adapter to test the switching transistor.

[0016] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0017] The above and / or additional aspects and advantages of this invention will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0018] Figure 1This is a front view of the circuit board assembly according to an embodiment of the present invention;

[0019] Figure 2 This is a perspective view of the circuit board assembly according to an embodiment of the present utility model;

[0020] Figure 3 This is a schematic diagram showing the connection between the adapter and the test pen according to an embodiment of this utility model;

[0021] Figure 4 This is a schematic diagram showing the connection between the circuit board assembly and the test pen according to an embodiment of this utility model;

[0022] Figure 5 This is a schematic diagram showing the connection between the circuit board assembly and the adapter according to an embodiment of the present invention.

[0023] Explanation of key component symbols:

[0024] Circuit board assembly 1000, circuit board 100, switching transistor 200, insulating component 300, magnetic ring 400, adapter 500, package 201, pin 202, test hole 301, ejector pin 302, sleeve 501, electrical connector 502, insulating connection 503, test pen 601, first snap 3031, second snap 3041, first electrical connector 5021, second electrical connector 5022, first pin 2021, second pin 2022. Detailed Implementation

[0025] The embodiments of this utility model are described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the embodiments of this utility model, and should not be construed as limiting the embodiments of this utility model.

[0026] Please see Figure 1 and Figure 2 This utility model provides a circuit board assembly 1000, which includes a circuit board 100, a switching transistor 200, and an insulating component 300. The switching transistor 200 includes a package 201 and a pin 202. The package 201 is connected to the circuit board 100 through the pin 202. The insulating component 300 is disposed on the portion of the pin 202 located between the package 201 and the circuit board 100. The insulating component 300 has a test hole 301, which is configured to allow an electrical connector 502 of a test device to be inserted, so that the test device is electrically connected to the pin 202 through the electrical connector 502.

[0027] In the above embodiment, the insulating member 300 is disposed on the portion of the pin 202 located between the package 201 and the circuit board 100. The insulating member 300 is provided with a test hole 301, which is configured to allow the electrical connector 502 of the test equipment to be inserted so that the test equipment can be electrically connected to the pin 202 through the electrical connector 502. This can optimize the transmission path of the electrical signal, reduce the influence of parasitic resistance and parasitic inductance to a certain extent, reduce signal attenuation and interference, and improve test quality.

[0028] As an example of the optimization effect, when testing the waveform of the switching transistor 200, the insulating component 300 is provided on the portion of the pin 202 located between the package 201 and the circuit board 100. The insulating component 300 is provided with a test hole 301, which is configured to allow the electrical connector 502 of the test equipment to be inserted so that the test equipment is electrically connected to the pin 202 through the electrical connector 502. This can optimize the transmission path of the electrical signal, reduce the influence of parasitic resistance and parasitic inductance to a certain extent, reduce signal attenuation and interference, improve waveform quality, and improve waveform distortion.

[0029] Specifically, the circuit board assembly 1000 may include a circuit board 100, a switching transistor 200, and an insulating component 300. The circuit board 100 (PCB) is a carrier composed of an insulating substrate and a conductive layer, which can be used to provide electrical connection paths and mechanically fix electronic components (e.g., the switching transistor 200). Optionally, in one embodiment, the circuit board assembly 1000 may be the circuit board assembly 1000 of an inverter, and the switching transistor 200 may be used in the inverter. When testing the waveform of the switching transistor 200 of the inverter, the electrical connector 502 of the test equipment can be inserted into the test hole 301 to electrically connect the test equipment to the pin 202 through the electrical connector 502.

[0030] A switching transistor 200 is a semiconductor device that achieves efficient electrical conversion and control by rapidly switching between on and off states. The switching transistor 200 may include a package 201 and pins 202. The package 201 is the main structure for the switching transistor 200 to perform its switching function. The pins 202 can be electrically connected to the circuitry inside the package 201 and extend from inside the package 201 to the outside to facilitate electrical connection between the switching transistor 200 and other devices.

[0031] The switching transistor 200 may include, but is not limited to, metal-oxide-semiconductor field-effect transistors (MOSFETs), insulated-gate bipolar transistors (IGBTs), gallium nitride (GaN) devices, and silicon carbide (SiC) devices. The package type of the package 201 may include, but is not limited to, surface mount technology (SMT), dual in-line packages (DIPs), and module packages.

[0032] Package 201 can be electrically connected to circuit board 100 via pins 202. Optionally, pins 202 can be electrically connected to circuit board 100 by means of soldering, plugging, or surface mounting to ensure reliable electrical contact and mechanical fixation.

[0033] In related technologies, to ensure the reliability of switching transistors, it is necessary to test them to determine if they meet design requirements. Currently, during product testing, an oscilloscope is connected to the pins of the switching transistor, and the oscilloscope displays the corresponding waveform. However, during testing, due to limitations imposed by the switching transistor or testing conditions, the waveform on the switching transistor cannot be accurately displayed on the oscilloscope, thus preventing the most accurate testing of the product.

[0034] In this embodiment of the present invention, the circuit board assembly 1000 includes an insulating member 300. The insulating member 300 is disposed on the portion of the pin 202 located between the package 201 and the circuit board 100. The insulating member 300 is provided with a test hole 301, which is configured to allow an electrical connector 502 of a test device to be inserted so that the test device is electrically connected to the pin 202 through the electrical connector 502.

[0035] It is understandable that the insulating component 300 is located on the part of the pin 202 between the package 201 and the circuit board 100. When testing the switching transistor 200 through the test hole 301 of the insulating component 300, the electrical connector 502 of the test equipment can be brought closer to the pin 202 of the switching transistor 200, thereby avoiding signal attenuation and distortion caused by wiring or other connections to a certain extent.

[0036] Optionally, the insulating element 300 can be disposed on the pin 202 of the switching transistor 200 that is not installed on the circuit board 100, that is, the insulating element 300 can be disposed on the pin 202 of the switching transistor 200 that is not connected to the circuit board 100.

[0037] It should be noted that the present invention aims to optimize the transmission path of the electrical signal at pin 202 of the switching transistor 200, reduce signal attenuation and distortion, and improve the waveform quality of the switching transistor 200 as an example of the optimization effect, and should not be regarded as a limiting factor of the present invention.

[0038] In some implementations, please refer to Figure 5 The circuit board assembly 1000 includes a magnetic ring 400, which is disposed on the portion of the pin 202 located between the package 201 and the circuit board 100. An insulating element (not shown) is closer to the package 201 than the magnetic ring 400.

[0039] In the above embodiment, the magnetic ring 400 is disposed on the portion of the pin 202 located between the package 201 and the circuit board 100. The insulating component 300 is closer to the package 201 than the magnetic ring 400. On the one hand, it can suppress the electromagnetic interference generated by the switching transistor 200, and on the other hand, it can avoid the direct interference of the magnetic ring 400 to the test signal to a certain extent, thereby reducing signal attenuation and interference and improving test quality.

[0040] Specifically, the magnetic ring 400 is a ring-shaped or cylindrical element made of ferrite material, which can be used in the circuit board assembly 1000 to suppress electromagnetic interference and improve signal quality.

[0041] When the switching transistor 200 is operating, the current change at its pin 202 can easily generate high-frequency harmonics and electromagnetic interference, which can then affect surrounding electronic components. However, in traditional solutions, when testing the pin signal of the switching transistor with a probe, the measurement point is located at the end of the magnetic ring away from the package. During the transmission of the electrical signal from the package to the probe, it will be affected by the magnetic ring, resulting in attenuation and distortion.

[0042] The insulating component 300 of this invention is closer to the package 201 than the magnetic ring 400. This reduces the transmission path of the electrical signal and, to a certain extent, avoids direct interference of the magnetic ring 400 to the test signal, thereby reducing signal attenuation and distortion and improving test quality.

[0043] In some implementations, please refer to Figure 1 , Figure 2 and Figure 4 The switching transistor 200 includes multiple pins 202, and the circuit board assembly 1000 includes a single insulating member 300. The single insulating member 300 is disposed on the portion of the pins 202 located between the package 201 and the circuit board 100. The single insulating member 300 connects all the pins 202. The insulating member 300 has multiple test holes 301, and each test hole 301 corresponds to one pin 202.

[0044] In the above embodiments, a single insulating element 300 is disposed on the portion of the pin 202 located between the package 201 and the circuit board 100. The single insulating element 300 connects all the pins 202, which can reduce installation steps and lower costs.

[0045] Specifically, the switching transistor 200 includes multiple pins 202, that is, the switching transistor 200 has multiple conductive terminals for electrical connection. A single insulating member 300 can connect to all the pins 202 of the switching transistor 200. The insulating member 300 has multiple test holes 301, each test hole 301 corresponding to one pin 202. The electrical connector 502 of the test equipment can be inserted into the test hole 301 to make the test equipment electrically connected to the corresponding pin 202.

[0046] Understandably, a single insulating element 300 connects all pins 202, that is, a single insulating element 300 is placed on all pins 202, which can reduce installation steps and lower costs.

[0047] In one embodiment, the circuit board assembly 1000 may include a single switch 200 and a single insulator 300, the single insulator 300 being connected to all pins 202 of the single switch 200.

[0048] In one embodiment, the circuit board assembly 1000 may include a plurality of switching transistors 200 and a single insulating element 300, the single insulating element 300 being connected to all pins 202 of the plurality of switching transistors 200.

[0049] In some implementations, please refer to Figure 1 , Figure 2 and Figure 4 The circuit board assembly 1000 includes a plurality of switching transistors 200 and at least one insulating member 300, wherein the at least one insulating member 300 is disposed on the portion of the pins 202 of at least two switching transistors 200 located between the package 201 and the circuit board 100.

[0050] In the above embodiments, at least one insulating element 300 is disposed on the portion of the pins 202 of at least two switching transistors 200 located between the package 201 and the circuit board 100. When the circuit board assembly 1000 includes multiple switching transistors 200, it can simplify assembly and reduce costs while improving the flexibility of application scenarios.

[0051] Specifically, in one embodiment, the circuit board assembly 1000 may include a plurality of switching transistors 200 and an insulating member 300. The insulating member 300 may be disposed on the portions of all pins 202 of at least two switching transistors 200 located between the package 201 and the circuit board 100. In one embodiment, the circuit board assembly 1000 may include a plurality of switching transistors 200 and an insulating member 300. The insulating member 300 may be disposed on portions of the pins 202 of at least two switching transistors 200 located between the package 201 and the circuit board 100.

[0052] In one embodiment, the circuit board assembly 1000 may include a plurality of switching transistors 200 and a plurality of insulating members 300, wherein at least one insulating member 300 is disposed on a portion of all pins 202 of at least two switching transistors 200 located between the package 201 and the circuit board 100. In another embodiment, the circuit board assembly 1000 may include a plurality of switching transistors 200 and a plurality of insulating members 300, wherein at least one insulating member 300 is disposed on a portion of the pins 202 of at least two switching transistors 200 located between the package 201 and the circuit board 100.

[0053] In some implementations, please refer to Figure 2 and Figure 4 The circuit board assembly 1000 includes a pin 302, at least a portion of which is located within a test hole 301. The pin 302 is electrically connected to a pin 202 and is configured to electrically connect an electrical connector 502 to the pin 202 via the pin 302.

[0054] In the above embodiments, the ejector pin 302 is configured to electrically connect the electrical connector 502 to the pin 202 through the ejector pin 302, which can reduce measurement errors to a certain extent to improve test quality, while reducing mechanical damage to the surface of the pin 202 and improving service life.

[0055] Specifically, pin 302 is a metal pin that enables electrical connection between electrical connector 502 and pin 202.

[0056] At least a portion of the ejector pin 302 is located within the test hole 301 and is electrically connected to the pin 202. When the electrical connector 502 of the test device is inserted into the test hole 301, the electrical connector 502 can be electrically connected to the ejector pin 302, thereby electrically connecting to the pin 202 to form a signal transmission path from the pin 202 to the test device.

[0057] In one embodiment, a portion of the ejector pin 302 is located inside the test hole 301, and another portion is located outside the test hole 301, so that the electrical connector 502 can contact the ejector pin 302 and make the electrical connector 502 electrically connected to the ejector pin 302.

[0058] In one embodiment, the electrical connector 502 is inserted into the test hole 301 so that the pin 302 is completely located within the test hole 301.

[0059] In one embodiment, the ejector pin 302 may include a needle tip and a spring. The needle tip can be used for electrical connection to the electrical connector 502 and the pin 202, respectively. The spring can be disposed between the wall of the test hole 301 and the needle tip and provide elasticity to ensure stable contact between the needle tip and the pin 202. When the electrical connector 502 contacts the needle tip, a contact pressure can be generated towards the pin 202, causing the needle tip to move towards the pin 202 to contact it. At the same time, the spring can keep the contact pressure constant, thereby improving the contact stability between the needle tip and the pin 202.

[0060] It should be noted that the electrical connector 502 can be electrically connected to the pin 202 through the ejector pin 302, which can reduce the measurement error caused by factors such as position deviation and contact angle to a certain extent, and can also avoid the problem of pin 202 being worn due to direct contact between the electrical connector 502 and the pin 202.

[0061] In some implementations, please refer to Figure 1 , Figure 2 and Figure 4The insulating component 300 is attached to the pin 202 by means of a snap and / or adhesive.

[0062] In the above embodiments, the insulating component 300 is attached to the pin 202 by a snap and / or adhesive, which can improve the stability of the insulating component 300 and thus avoid loosening due to vibration or external force during use to a certain extent.

[0063] Specifically, in one embodiment, the insulating member 300 may include a first portion and a second portion, with the second portion rotatably connected to the first portion. The first portion includes a first latch 3031, and the second portion includes a second latch 3041. When the insulating member 300 is assembled onto the pin 202, the first latch 3031 can engage between the first pin 2021 and the circuit board 100 and abut against the first pin 2021. The second portion can rotate in a direction close to the first portion until the second latch 3041 engages between the second pin 2022 and the circuit board 100 and abuts against the second pin 2022. Optionally, in one embodiment, the first pin 2021 and the second pin 2022 may be the same pin 202, that is, the insulating member 300 is disposed on the portion of a pin 202 located between the package 201 and the circuit board 100. The insulating member 300 is provided with a test hole 301 for electrically connecting the electrical connector 502 to the corresponding pin 202. In one embodiment, the first pin 2021 and the second pin 2022 are adjacent pins 202, that is, the insulating member 300 is disposed on the portion of the two pins 202 located between the package 201 and the circuit board 100. The insulating member 300 is provided with two test holes 301 for electrically connecting the electrical connector 502 to the corresponding pin 202. In another embodiment, the first pin 2021 and the second pin 2022 are non-adjacent pins 202, that is, the insulating member 300 is disposed on the portion of at least three pins 202 located between the package 201 and the circuit board 100. The insulating member 300 is provided with at least three test holes 301 for electrically connecting the electrical connector 502 to the corresponding pin 202.

[0064] In one embodiment, the insulating element 300 can be attached to the pin 202 by means of insulating adhesive.

[0065] Please see Figure 3 This utility model provides an adapter 500, which includes a sleeve 501 and an electrical connector 502. The electrical connector 502 is connected to the sleeve 501 and is configured to be inserted into the test hole 301 of the insulating member 300 on the pin 202 of the switch tube 200 to be electrically connected to the pin 202. The sleeve 501 is configured to allow the test pen 601 of the test equipment to be inserted so that the test pen 601 is electrically connected to the pin 202 through the electrical connector 502.

[0066] In the above embodiments, the adapter 500 enables electrical connection with pin 202 of the switching transistor 200, which can be adapted to various test equipment and operating environments while reducing measurement errors.

[0067] Specifically, the adapter 500 is a device for establishing an electrical connection between the testing equipment and the pin 202 of the switching transistor 200. The sleeve 501 is made of metal.

[0068] The test pen 601 can be electrically connected to the pin 202 through the adapter 500. The sleeve 501 can be used to fix the test pen 601 and prevent the measurement value from fluctuating due to the shaking of the test pen 601 to a certain extent.

[0069] In some implementations, please refer to Figure 3 The electrical connector 502 includes a first electrical connector 5021 and a second electrical connector 5022. The first electrical connector 5021 is electrically connected to the sleeve 501, and the second electrical connector 5022 is insulated from the sleeve 501. The sleeve 501 is configured such that after the test pen 601 is inserted into the sleeve 501, the sleeve 501 is connected to the side wall of the test pen 601 so that the side wall of the test pen 601 is electrically connected to the first electrical connector 5021 through the sleeve 501, and the top end of the test pen 601 is electrically connected to the second electrical connector 5022.

[0070] In the above embodiments, through the electrical connection between the first electrical connector 5021 and the sleeve 501, and the insulating connection between the second electrical connector 5022 and the sleeve 501, when the test pen 601 is inserted into the sleeve 501, the side wall of the test pen 601 is stably electrically connected to the first electrical connector 5021 and is not affected by the second electrical connector 5022, while the top of the test pen 601 is stably electrically connected to the second electrical connector 5022, thereby ensuring the stability and reliability of the electrical connection to a certain extent.

[0071] Specifically, in one embodiment, the first electrical connector 5021 is electrically connected to the sleeve 501. The inner diameter of the sleeve 501 matches the outer diameter of the test pen 601, allowing the test pen 601 to be smoothly inserted into the sleeve 501 and contact the inner wall of the sleeve 501 so that the test pen 601 is electrically connected to the first electrical connector 5021, thereby realizing the electrical connection between the test pen 601 and the corresponding pin 202 of the first electrical connector 5021.

[0072] In one embodiment, the second electrical connector 5022 is insulated from the sleeve 501. An insulating connection portion 503 is provided between the second electrical connector 5022 and the sleeve 501, through which the second electrical connector 5022 is insulated from the sleeve 501.

[0073] Optionally, the insulating connection 503 and the sleeve 501 can be connected by means of adhesive, clips, screws, welding, or plugging. Optionally, the insulating connection 503 and the sleeve 501 are integrally formed.

[0074] Optionally, the insulating connection 503 and the second electrical connection 5022 can be connected by means of adhesive, snap-fit, screw, plug-in, etc.

[0075] In one embodiment, the second electrical connector 5022 is at least partially located inside the sleeve 501. After the test pen 601 is inserted into the sleeve 501, the tip of the test pen 601 can contact the second electrical connector to make the test pen 601 electrically connected to the second electrical connector 5022.

[0076] In one embodiment, after the test pen 601 is inserted into the sleeve 501, the tip of the test pen 601 can extend out of the sleeve 501 and contact the second electrical connector 5022 to make the test pen 601 electrically connected to the second electrical connector 5022.

[0077] In some implementations, please refer to Figure 3 The first electrical connector 5021 and the second electrical connector 5022 are intertwined to form a twisted pair, or...

[0078] The first electrical connector 5021 and the second electrical connector 5022 are arranged in parallel.

[0079] In the above embodiments, the first electrical connector 5021 and the second electrical connector 5022 are twisted together to form a twisted pair, or the first electrical connector 5021 and the second electrical connector 5022 are arranged in parallel, so that the corresponding setting method can be selected according to different application scenarios.

[0080] Specifically, the first electrical connector 5021 and the second electrical connector 5022 can be wires.

[0081] It is understandable that after the first electrical connector 5021 and the second electrical connector 5022 are twisted together to form a twisted pair, the impact of external electromagnetic interference on signal transmission can be reduced to a certain extent.

[0082] Understandably, the parallel arrangement of the first electrical connector 5021 and the second electrical connector 5022 simplifies the wiring process.

[0083] This utility model provides a testing device, which includes an adapter 500 and a testing device as described above. The testing device is electrically connected to pin 202 through the adapter 500 to test the switching transistor 200.

[0084] Specifically, the testing equipment may include at least one testing device and at least one adapter 500. One testing device may correspond to at least one adapter 500. The testing device may include, but is not limited to, oscilloscopes, power module testers, automotive inverter module testers, motor drive testers, robot power module testers, smart grid module testers, biomedical testing equipment power module testers, power supply module testers, MOSFET / IGBT / GaN / Silicon Nitride transistor material detectors, and 5G / 4G base station power transistor detection and repair testers.

[0085] In one embodiment, the testing equipment includes a testing device and three adapters 500. The testing device includes three test pens 601, which may be from the same testing device or different testing devices. Please refer to... Figure 5 The circuit board assembly 1000 includes a circuit board 100, a switching transistor 200, and an insulating component (not shown). The switching transistor 200 includes three pins 202, and three adapters 500 are electrically connected to two pins 202 respectively.

[0086] After the test pen 601 is inserted into the sleeve 501 of the adapter 500, the side wall of the test pen 601 is electrically connected to one pin 202 via the first electrical connector 5021, and the tip of the test pen 601 is electrically connected to another pin 202 via the second electrical connector 5022. Optionally, the testing device is an oscilloscope, with the side wall of the test pen 601 electrically connected to the negative terminal of the oscilloscope, and the tip of the test pen 601 electrically connected to the positive terminal of the oscilloscope.

[0087] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with an embodiment or example is included in at least one embodiment or example of this utility model. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0088] Any process or method described in the flowchart or otherwise herein can be understood as representing a module, segment, or portion of code comprising one or more steps for implementing a particular logical function or process, and the scope of the preferred embodiments of the present invention includes additional implementations in which functions may be performed not in the order shown or discussed, including substantially simultaneously or in reverse order according to the functions involved, as should be understood by those skilled in the art to which embodiments of the present invention pertain.

[0089] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, combinations, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A circuit board assembly, characterized in that, The device includes a circuit board, a switching transistor, and an insulating component. The switching transistor includes a package and pins. The package is connected to the circuit board via the pins. The insulating component is located on the portion of the pins between the package and the circuit board. The insulating component has a test hole configured to allow an electrical connector of a test device to be inserted, enabling the test device to be electrically connected to the pins via the electrical connector.

2. The circuit board assembly according to claim 1, characterized in that, The circuit board assembly includes a magnetic ring disposed on the portion of the pin located between the package and the circuit board, and the insulating element is closer to the package than the magnetic ring.

3. The circuit board assembly according to claim 1, characterized in that, The switching transistor includes a plurality of pins, and the circuit board assembly includes a single insulating element disposed on the portion of the pins located between the package and the circuit board. The single insulating element connects all the pins and has a plurality of test holes, each test hole corresponding to one pin.

4. The circuit board assembly according to claim 1, characterized in that, The circuit board assembly includes a plurality of the switching transistors and at least one of the insulating elements, wherein at least one of the insulating elements is disposed on the portion of the at least two switching transistors whose pins are located between the package and the circuit board.

5. The circuit board assembly according to claim 1, characterized in that, The circuit board assembly includes a pin, at least a portion of which is located within the test hole, the pin being electrically connected to the pin, and the pin being configured to allow the electrical connector to be electrically connected to the pin via the pin.

6. The circuit board assembly according to claim 1, characterized in that, The insulating element is attached to the pin by clips and / or adhesive.

7. A switching device, characterized in that, The device includes a sleeve and an electrical connector connected to the sleeve. The electrical connector is configured to be inserted into a test hole in an insulator on a switch pin for electrical connection to the pin. The sleeve is configured to allow a test probe from a testing device to be inserted so that the test probe is electrically connected to the pin via the electrical connector.

8. The adapter according to claim 7, characterized in that, The electrical connector includes a first electrical connector and a second electrical connector. The first electrical connector is electrically connected to the sleeve, and the second electrical connector is insulated from the sleeve. The sleeve is configured such that after the test pen is inserted into the sleeve, the sleeve is connected to the side wall of the test pen so that the side wall of the test pen is electrically connected to the first electrical connector through the sleeve, and the tip of the test pen is electrically connected to the second electrical connector.

9. The adapter according to claim 8, characterized in that, The first electrical connector and the second electrical connector are twisted together to form a twisted pair, or the first electrical connector and the second electrical connector are arranged in parallel.

10. A testing device, characterized in that, The device includes the adapter and test apparatus as described in any one of claims 7-9, wherein the test apparatus is electrically connected to the pin via the adapter to test the switching transistor.

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